Conferences related to Flash memory
Back to Top2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)
Ferroelectric materials and applications
- 2017 Joint IEEE–International Symposium on the Applications of Ferroelectric (ISAF)/International Workshop on Acoustic Transduction Materials and Devices (IWATMD)/Piezoresponse Force Microscopy (PFM)
The conference will cover a wide range of topics around ferroelectric & piezoelectric materials and their applications as piezoelectrics, pyroelectrics, electro-optics, capacitors, etc.
- 2016 Joint IEEE International Symposium on the Applications of Ferroelectrics, European Conference on Application of Polar Dielectrics, and Piezoelectric Force Microscopy Workshop (ISAF/ECAPD/PFM)
The conference will cover a wide range of topics around ferroelectric & piezoelectric materials and their applications as piezoelectrics, pyroelectrics, electro-optics, capacitors, and memory devices.
- 2015 Joint IEEE International Symposium on the Applications of Ferroelectric (ISAF), International Symposium on Integrated Functionalities (ISIF), and Piezoelectric Force Microscopy Workshop (PFM)
The conference will cover a wide range of topics on ferroelectric, piezoelectric and multifunctional materials, and their integrations and applications for memory devices, capacitors, sensors, transducers, electro-optic devices, medical devices, and energy harvesting and storage. The synergy that will result from co-hosting ISAF, ISIF and PFM will enable participants from industry, research institutes, and academia to gather in a highly interactive environment for technical exchange.
- 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM)
This conference covers the development of ferroelectric materials for a wide range of applications, including piezoelectrics, dielectrics, electro-optics, pyroelectrics, flexoelectrics, energy harvesting, non-volatile memory, and logic elements.
- 2013 Joint IEEE Int'l Symp on Applications of Ferroelectrics & Workshop on Piezoresponse Force Microscopy (ISAF/PFM)
- 2012 Joint 21st IEEE ISAF / 11th IEEE ECAPD / IEEE PFM (ISAF/ECAPD/PFM)
ISAF-ECAPD-PFM aims to provide a forum to present and discuss the state-of-the-art developments in the field of ferroelectrics and related materials and their applications, including novel nanoscale methods of their investigation.
- 2011 Joint IEEE Int'l Symp on Applications of Ferroelectrics/Int'l Symp on Piezoresponse Force Microscopy & Nanoscale Phenomena in Polar Materials
The scope of the conference is to provide an international forum to discuss the latest developments in the field of ferroelectrics and related materials and their applications, including theory and modelling, materials preparation and characterization and device physics and processing.
- 2010 IEEE International Symposium on the Applications of Ferroelectrics (ISAF) & European Conference on the Applications of Polar Dielectrics (ECAPD)
Reports on the latest developments in the field of ferroelectric materials and their applications.
- 2009 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
The meeting covers a broad range of physics, processing, characterization and applications of ferroelectric and related materials.
- 2008 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
- 2007 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
- 2006 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
- 2002 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
- 2000 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
- 1998 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
- 1996 IEEE International Symposium on the Applications of Ferroelectrics (ISAF)
2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM
- 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R
- 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)
Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R
- 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD
- 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .
- 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)
- 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)
- 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)
2018 31st International Conference on VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID)
This conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, EDA, embedded systems, and enabling technologies. The program will consist of regular paper sessions, special sessions, embedded tutorials, panel discussions, design contest, industrial exhibits and tutorials. This is the premier conference/exhibition in this area in India, attracting designers, EDA professionals, and EDA tool users. The program committee for the conference has a significant representation from the EDA research community and a large fraction of the papers published in this conference are EDA-related
- 2017 30th International Conference on VLSI Design and 2017 16th International Conference on Embedded Systems(VLSID)
This conference is a forum for researchers and designers to present and discuss variousaspects of VLSI design, EDA, embedded systems, and enabling technologies. The program willconsist of regular paper sessions, special sessions, embedded tutorials, panel discussions,design contest, industrial exhibits and tutorials. This is the premier conference/exhibition in thisarea in India, attracting designers, EDA professionals, and EDA tool users. The programcommittee for the conference has a significant representation from the EDA researchcommunity and a large fraction of the papers published in this conference are EDA-related
- 2016 29th International Conference on VLSI Design and 2016 15th International Conference on Embedded Systems (VLSID)
This conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, EDA, embedded systems, and enabling technologies. The program will consist of regular paper sessions, special sessions, embedded tutorials, panel discussions, design contest, industrial exhibits and tutorials. This is the premier conference/exhibition in this area in India, attracting designers, EDA professionals, and EDA tool users. The program committee for the conference has a significant representation from the EDA research community and a large fraction of the papers published in this conference are EDA-related
- 2015 28th International Conference on VLSI Design (VLSID)
This conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, EDA, embedded systems, and enabling technologies. The program will consist of regular paper sessions, special sessions, embedded tutorials, panel discussions, design contest, industrial exhibits and tutorials. This is the premier conference/exhibition in this area in India, attracting designers, EDA professionals, and EDA tool users. The program committee for the conference has a significant representation from the EDA research community and a large fraction of the papers published in this conference are EDA-related. Theme: Sensors, Wearables, IoT
- 2014 27th International Conference on VLSI Design
The 27th International Conference on VLSI Design: concurrently with the 13th International Conference on Embedded Systems Design is a forum for researchers and designers to present and discuss current topics in VLSI design, electronic design automation, embedded systems, and enabling technologies. Two days of tutorials will be followed by three days of regular paper sessions, special sessions, and embedded tutorials. Industry presentation sessions along with exhibits, panel discussions, Design Contest, and Education Forum round off the program
- 2013 26th International Conference on VLSI Design: concurrently with the 12th International Conference on Embedded Systems
The conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry.
- 2012 25th International Conference on VLSI Design
The conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry.
- 2011 24th International Conference on VLSI Design: concurrently with the 10th International Conference on Embedded Systems Design
The conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry.
- 2010 23rd International Conference on VLSI Design: concurrently with the 9th International Conference on Embedded Systems Design
This joint conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), enabling technologies, and embedded systems. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry. The five-day technical program will consist of three days of regular paper sessions, special sessions, embedded tutorials, industry presentati
- 2009 22nd International Conference on VLSI Design: concurrently with the 8th International Conference on Embedded Systems Design
This joint-conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation, enabling technologies, and embedded systems. It covers the entire spectrum of activities in the two vital areas of VLSI and embedded systems, which underpin the semiconductor industry. The five-day program will consist of regular paper sessions, special sessions, embedded tutorials, panel discussions, design contest, industrial exhibits and two days of tutorials
- 2008 21st International Conference on VLSI Design: concurrently with the 7th International Conference on Embedded Systems Design
All aspects of VLSI Design
- 2007 20th International Conference on VLSI Design: concurrently with the 6th International Conference on Embedded Systems Design
- 2006 19th International Conference on VLSI Design: concurrently with the 5th International Conference on Embedded Systems Design
- 2005 18th International Conference on VLSI Design: concurrently with the 4th International Conference on Embedded Systems Design
2018 Annual Reliability and Maintainability Symposium (RAMS)
Scope:Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics
- 2017 Annual Reliability and Maintainability Symposium (RAMS)
Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics
- 2016 Annual Reliability and Maintainability Symposium (RAMS)
Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics
- 2015 Annual Reliability and Maintainability Symposium (RAMS)
This conf covers all facets of the assurance sciences.
- 2014 Annual Reliability and Maintainability Symposium (RAMS)
Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics
- 2013 Annual Reliability and Maintainability Symposium (RAMS)
The Annual Reliability and Maintainability Symposium is the premier event in the reliability, availability, and maintainability engineering disciplines. Combining tutorials, presentations, CEUs, certifications, and networking into one week-long program, the RAMS delivers cutting edge R&M information to all technical industries.
- 2012 Annual Reliability and Maintainability Symposium (RAMS)
Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics.
- 2011 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics.
- 2010 Annual Reliability and Maintainability Symposium (RAMS)
Tutorials and original papers on reliability, maintainability, safety, risk management and logistics.
- 2009 Annual Reliability and Maintainability Symposium (RAMS)
Includes tutorials and current papers on reliability, maintainability, logistics and safety. Covers diverse industries and organizations.
- 2008 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
All facets of the Assurance Sciences
- 2007 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2006 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2005 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2004 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2003 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2002 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2001 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 2000 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 1999 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 1998 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 1997 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
- 1996 Annual Reliability and Maintainability Symposium (RAMS)
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)
The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops.
- 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE)
The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops.
- 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
The DATE conference addresses all aspects of research into technologies for electronic andembedded system engineering. It covers the design process, test, and automation tools forelectronics ranging from integrated circuits to distributed embedded systems. This includes bothhardware and embedded software design issues. The conference scope also includes theelaboration of design requirements and new architectures for challenging application fields suchas telecoms, wireless communications, multimedia, healthcare, smart energy and automotivesystems. Companies also present innovative industrial designs to foster the feedback from realworlddesign to research. DATE also hosts a number of special sessions, events within the maintechnical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops
- 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE)
The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback from realworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops.
- 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE)
The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback from real-world design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops
- 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE 2013)
DATE is the complete event for the European electronic and test community. A leading world conference and exhibition, DATE unites 2,000 professionals with approximately 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.
- 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE 2012)
DATE is the complete event for the European electronic system and test community. A leading world conference and exhibition, DATE unites 2,000 professionals with some 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.
- 2011 Design, Automation & Test in Europe Conference & Exhibition (DATE 2011)
DATE is the complete event for the European electronic system and test community. A world leading conference and exhibition, DATE unites 2,000 professionals with some 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.
- 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)
All aspects of research into technologies for electronic and (embedded) systems engineering. It covers the design process, test, and tools for design automation of electronic products ranging from integrated circuits to distributed large-scale systems.
- 2009 Design, Automation & Test in Europe Conference & Exhibition (DATE 2009)
The Design, Automation, and Test in Europe (DATE) conference is the world's premier conference dedicated to electronics system design & test. The technical programme features: Four distinctive and integrated themes, covering all aspects of systems design and engineering. Two special days are focusing on SoC Development Strategies and Multicore Applications.
- 2008 Design, Automation & Test in Europe Conference & Exhibition (DATE 2008)
The 11th DATE conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software. The five-day event consists of a conference with plenary invited papers, regular papers, panels, hot-topic sessions, tutorials.
- 2007 Design, Automation & Test in Europe Conference & Exhibition (DATE 2007)
DATE is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on both ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software.
- 2006 Design, Automation & Test in Europe Conference & Exhibition (DATE 2006)
- 2005 Design, Automation & Test in Europe Conference & Exhibition (DATE)
- 2004 Design, Automation & Test in Europe Conference & Exhibition (DATE)
- 2003 Design, Automation & Test in Europe Conference & Exhibition (DATE)
- 2002 Design, Automation & Test in Europe Conference & Exhibition (DATE)
- 2001 Design, Automation & Test in Europe Conference & Exhibition (DATE)
- 2000 Design, Automation & Test in Europe Conference & Exhibition (DATE)
- 1999 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Periodicals related to Flash memory
Back to TopCircuits and Systems for Video Technology, IEEE Transactions on
Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...
Circuits and Systems II: Express Briefs, IEEE Transactions on
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
Communications Letters, IEEE
Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)
Communications, IEEE Transactions on
Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...
Components and Packaging Technologies, IEEE Transactions on
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
More Periodicals Xplore Articles related to Flash memory
Back to TopEffect of substrate bias on the performance and reliability of the split-gate source-side injected flash memory
[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan', u'full_name': u'Kuo-Ching Huang'}, {u'author_order': 2, u'full_name': u'Yean-Kuen Fang'}, {u'author_order': 3, u'full_name': u'Dun-Nian Yaung'}, {u'author_order': 4, u'full_name': u'Chii-Wen Chen'}, {u'author_order': 5, u'full_name': u'Hung-Cheng Sung'}, {u'author_order': 6, u'full_name': u'Di-Son Kuo'}, {u'author_order': 7, u'full_name': u'C.S. Wang'}, {u'author_order': 8, u'full_name': u'Mong-Song Liang'}] IEEE Electron Device Letters, 1999
The effects of the substrate bias on the characteristics of split-gate EEPROM/Flash memory cells have been investigated. It is experimentally demonstrated that applying negative substrate bias (NSB) can improve the programming and erasing speed significantly. The improvements can be attributed that NSB effectively increase the needed electrical fields for fast programming and erasing, respectively. Furthermore, the cycling endurance is improved ...
A 3.42 /spl mu/m/sup 2/ Flash Memory Cell Technology Conformable to a Sector Erase
[{u'author_order': 1, u'affiliation': u'Hitachi Device Engineering Co., Japan', u'full_name': u'H. Kume'}, {u'author_order': 2, u'full_name': u'T. Tanaka'}, {u'author_order': 3, u'full_name': u'T. Adachi'}, {u'author_order': 4, u'full_name': u'N. Miyamoto'}, {u'author_order': 5, u'full_name': u'S. Saeki'}, {u'author_order': 6, u'full_name': u'Y. Ohji'}, {u'author_order': 7, u'full_name': u'M. Ushiyama'}, {u'author_order': 8, u'full_name': u'T. Kobayashi'}, {u'author_order': 9, u'full_name': u'T. Nishida'}, {u'author_order': 10, u'full_name': u'Y. Kawamoto'}, {u'author_order': 11, u'full_name': u'K. Seki'}] 1991 Symposium on VLSI Technology, 1991
None
Split-gate NAND flash memory at 120nm technology node featuring fast programming and erase
[{u'author_order': 1, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'Cheng-Yuan Hsu'}, {u'author_order': 2, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'Chi-Wei Hung'}, {u'author_order': 3, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'Da Sung'}, {u'author_order': 4, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'Chi-Shan Wu'}, {u'author_order': 5, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'S.C. Chen'}, {u'author_order': 6, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'H.H. Kuo'}, {u'author_order': 7, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'J.Y. Pan'}, {u'author_order': 8, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'C.L. Chen'}, {u'author_order': 9, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'I.C. Chuang'}, {u'author_order': 10, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'V. Huang'}, {u'author_order': 11, u'affiliation': u'PowerChip Semicond. Corp., Hsin-Chu, Taiwan', u'full_name': u'C.C. Hsue'}, {u'author_order': 12, u'full_name': u'D.-T. Fan'}, {u'author_order': 13, u'full_name': u'Jung-Chang Lu'}, {u'author_order': 14, u'full_name': u'C.Y.-S. Cho'}, {u'author_order': 15, u'full_name': u'K. Tseng'}, {u'author_order': 16, u'full_name': u'A. Hsu'}, {u'author_order': 17, u'full_name': u'B. Sheen'}, {u'author_order': 18, u'full_name': u'P. Tuntasood'}, {u'author_order': 19, u'full_name': u'Chiou-Feng Chen'}] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., 2004
For the first time, split-gate NAND flash memory featuring interpoly erase and mid-channel programming is demonstrated at 120nm technology node. The cell array operates at single polarity voltages lower than 12V. Erase and programming can be accomplished in 0.5ms and 10/spl mu/s, respectively.
Stress-induced leakage current of tunnel oxide derived from flash memory read-disturb characteristics
[{u'author_order': 1, u'affiliation': u'Microelectron. Eng. Lab., Toshiba Corp., Yokohama, Japan', u'full_name': u'S. Satoh'}, {u'author_order': 2, u'full_name': u'G. Hemink'}, {u'author_order': 3, u'full_name': u'K. Hatakeyama'}, {u'author_order': 4, u'full_name': u'S. Aritome'}] IEEE Transactions on Electron Devices, 1998
This paper describes the characteristics of the stress-induced leakage current of tunnel oxide derived from flash memory read-disturb characteristics. The following three items were newly observed. First, the threshold voltage shift (/spl Delta/V/sub th/) of the memory cell under the gate bias condition (read disturb condition) consists of two regions, a decay region and a steady-state region. The decay region ...
Observations of single electron trapping/detrapping events in tunnel oxide of SuperFlash/spl trade/ memory cell
[{u'author_order': 1, u'affiliation': u'Silicon Storage Technol. Inc., Sunnyvale, CA, USA', u'full_name': u'Y. Tkachev'}, {u'author_order': 2, u'affiliation': u'Silicon Storage Technol. Inc., Sunnyvale, CA, USA', u'full_name': u'Xian Liu'}, {u'author_order': 3, u'affiliation': u'Silicon Storage Technol. Inc., Sunnyvale, CA, USA', u'full_name': u'A. Kotov'}, {u'author_order': 4, u'affiliation': u'Silicon Storage Technol. Inc., Sunnyvale, CA, USA', u'full_name': u'V. Markov'}, {u'author_order': 5, u'affiliation': u'Silicon Storage Technol. Inc., Sunnyvale, CA, USA', u'full_name': u'A. Levi'}] Proceedings. 2004 IEEE Computational Systems Bioinformatics Conference, 2004
Erase instabilities and erase performance degradation due to single-electron trapping events in tunnel oxide of SST split-gate SuperFlash/spl trade/ memory cells have been detected and analyzed for the first time. Whereas the instabilities of erase characteristics in stacked-gate flash memories ("erratic erase") are attributed to hole trapping/detrapping associated with anode hole injection, SuperFlash/spl trade/ cell does not show any hole- ...
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Neural Cognitive Robot: Learning, Memory and Intelligence 
Jaynie Shorb from Broadcom at WIE ILC 2016 
IEEE Medal of Honor Recipient (2009): Dr. Robert Dennard 
IEEE Expert Now 
Rebooting Computing Panel - Stan Williams: 2016 Technology Time Machine 
Erasing Logic-Memory Boundaries in Superconductor Electronics - Vasili Semenov: 2016 International Conference on Rebooting Computing