Conferences related to Films

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 25th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

The conference for researchers and experts has been providing good opportunitiesto exchange scientific and technological knowledge on active-matrix flatpanel displays(AMFPDs), thin-film transistors (TFTs), thin-film materials and devices (TFMD), photovoltaics(PV) technologies, and other related topics. Papers are solicited on, but not limited to, thefollowing topics: Flat Panel Display (FPD): flexible display, LCDs, OLED, e-papers, 3D displays,touch screens, driving methods, integrated drivers, and display materials and systems. TFTsTechnologies (TFT): amorphous, microcrystalline and polycrystalline Si-based TFTs, organicTFTs, oxide TFTs, such as graphene, semiconductor nanowires, carbon nanotubes, and device modeling, device & circuit simulation, and their reliability.Photovoltaics (PV): thin-film solar cells, amorphous /crystalline Si heterojunction, transparent conductive oxides.

  • 2017 24th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

    Conference for researchers and experts, this workshop has been providing good opportunities to exchange scientific and technological knowledge on active-matrix flatpanel displays (AMFPDs), thin-film transistors (TFTs), thin-film materials and devices (TFMD), photovoltaics (PV) technologies, and other related topics. Paper are solicited on, but not limited to, the following topics: Flat Panel Display (FPD): flexible display, LCDs, OLED, e-papers, 3D displays, touch screens, driving methods, integrated drivers, and display materials and systems. TFT Technologies (TFT): amorphous, microcrystalline and polycrystalline Si-based TFTs, organic TFTs, oxide TFTs, other material TFTs such as graphene, carbon nanotubes, and semiconductor nanowires, device modeling, device and circuit simulation, and reliability. Photovoltaics (PV): thin-film solar cells, amorphous/crystalline Si heterojunction, passivation, transparent conductive oxides.

  • 2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

    Conference for researchers and experts, this workshop has been providing good opportunities to exchange scientific and technological knowledge on active-matrix flatpanel displays (AMFPDs), thin-film transistors (TFTs), thin-film materials and devices (TFMD), photovoltaics (PV) technologies, and other related topics. Papers are solicited on, but not limited to, the following topics: Flat Panel Display (FPD): LCDs OLED displays e papers 3 D displays LCDs, displays, epapers, 3-displays, flexible displays, touch screens, driving methods, integrated drivers, and display materials and systems. TFT Technologies (TFT): amorphous, microcrystalline, and polycrystalline Si TFTs, organicTFTs, oxide TFTs, other material TFTs such as graphene, carbon nanotubes, and semiconductor nanowires, device modeling, device and circuit simulation, and reliability. Photovoltaics (PV): thin-film solar cells, amorphous/crystalline Si heterojunction, passivation, transparent conductive oxides.

  • 2015 22nd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

    Conference for researchers and experts, this workshop has been providing good opportunities to exchange scientific and technological knowledge on active-matrix flatpanel displays (AMFPDs), thin-film transistors (TFTs), thin-film materials and devices (TFMD), photovoltaics (PV) technologies, and other related topics. Papers are solicited on, but not limited to, the following topics: Flat Panel Display (FPD): LCDs OLED displays e papers 3 D displays LCDs,displays, epapers, 3-displays, flexible displays, touch screens, driving methods, integrated drivers, and display materials and systems. TFT Technologies (TFT): amorphous, microcrystalline, and polycrystalline Si TFTs,organicTFTs, oxide TFTs, other material TFTs such as graphene, carbon nanotubes, and semiconductor nanowires, device modeling, device and circuit simulation, and reliability. Photovoltaics (PV): thin-film solar cells, amorphous/crystalline Si heterojunction, passivation, transparent conductive oxides.

  • 2014 21st International Workshop on Active-Matrix Flatpanel Displays and Devices(AM-FPD)

    Conference for researchers and experts, this workshop has been providing good opportunities to exchange scientific and technological knowledge on active-matrix flatpanel displays (AMFPDs), thin-film transistors (TFTs), thin-film materials and devices (TFMD), photovoltaics (PV) technologies, and other related topics. Papers are solicited on, but not limited to, the following topics: Flat Panel Display (FPD): LCDs OLED displays e papers 3 D displays LCDs, displays, epapers, 3-displays, flexible displays, touch screens, driving methods, integrated drivers, and display materials and systems.TFT Technologies (TFT): amorphous, microcrystalline, and polycrystalline Si TFTs, organicTFTs, oxide TFTs, other material TFTs such as graphene, carbon nanotubes, and semiconductor nanowires, device modeling, device and circuit simulation, and reliability. Photovoltaics (PV): thin-film solar cells, amorphous/crystalline Si heterojunction, passivation, transparent conductive oxides.

  • 2013 Twentieth International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

    Conference for researchers and experts, this workshop has been providing good opportunities to exchange scientific and technological knowledge on active-matrix flatpanel displays (AM-FPDs), thin-film transistors (TFTs), thin-film materials and devices (TFMD), photovoltaics (PV) technologies, and other related topics. Papers are solicited on, but not limited to, the following topics:

  • 2012 19th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

    Conference for researchers and experts, this workshop has been providing good opportunities to exchange scientific ideas for advanced information on active-matrix flatpanel displays (AM-FPDs) including thin-film transistors (TFTs), and solar cells.


2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)

The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic andembedded system engineering. It covers the design process, test, and automation tools forelectronics ranging from integrated circuits to distributed embedded systems. This includes bothhardware and embedded software design issues. The conference scope also includes theelaboration of design requirements and new architectures for challenging application fields suchas telecoms, wireless communications, multimedia, healthcare, smart energy and automotivesystems. Companies also present innovative industrial designs to foster the feedback from realworlddesign to research. DATE also hosts a number of special sessions, events within the maintechnical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops

  • 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback from realworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback from real-world design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops

  • 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE 2013)

    DATE is the complete event for the European electronic and test community. A leading world conference and exhibition, DATE unites 2,000 professionals with approximately 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.

  • 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE 2012)

    DATE is the complete event for the European electronic system and test community. A leading world conference and exhibition, DATE unites 2,000 professionals with some 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.

  • 2011 Design, Automation & Test in Europe Conference & Exhibition (DATE 2011)

    DATE is the complete event for the European electronic system and test community. A world leading conference and exhibition, DATE unites 2,000 professionals with some 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.

  • 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)

    All aspects of research into technologies for electronic and (embedded) systems engineering. It covers the design process, test, and tools for design automation of electronic products ranging from integrated circuits to distributed large-scale systems.

  • 2009 Design, Automation & Test in Europe Conference & Exhibition (DATE 2009)

    The Design, Automation, and Test in Europe (DATE) conference is the world's premier conference dedicated to electronics system design & test. The technical programme features: Four distinctive and integrated themes, covering all aspects of systems design and engineering. Two special days are focusing on SoC Development Strategies and Multicore Applications.

  • 2008 Design, Automation & Test in Europe Conference & Exhibition (DATE 2008)

    The 11th DATE conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software. The five-day event consists of a conference with plenary invited papers, regular papers, panels, hot-topic sessions, tutorials.

  • 2007 Design, Automation & Test in Europe Conference & Exhibition (DATE 2007)

    DATE is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on both ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software.

  • 2006 Design, Automation & Test in Europe Conference & Exhibition (DATE 2006)

  • 2005 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2004 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2003 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2002 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2001 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2000 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 1999 Design, Automation & Test in Europe Conference & Exhibition (DATE)


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Periodicals related to Films

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Films

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Xplore Articles related to Films

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50Ω-terminated 900MHz monolithic lateral-extensional piezoelectric filters on ultrananocryslalline diamond

[{u'author_order': 1, u'affiliation': u'Oklahoma State University, Tulsa, USA', u'full_name': u'H. Fatemi'}, {u'author_order': 2, u'affiliation': u'Oklahoma State University, Tulsa, USA', u'full_name': u'B. P. Harrington'}, {u'author_order': 3, u'affiliation': u'Advanced Diamond Technologies, Inc., Romeoville, IL, USA', u'full_name': u'H. Zeng'}, {u'author_order': 4, u'affiliation': u'Advanced Diamond Technologies, Inc., Romeoville, IL, USA', u'full_name': u'J. Carlisle'}, {u'author_order': 5, u'affiliation': u'Oklahoma State University, Tulsa, USA', u'full_name': u'R. Abdolvand'}] 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, None

For the first time, very low insertion loss (3.7 dB) 900 MHz micromachined bulk-lateral mode filters are reported with 50 Ω termination impedance. Two lateral-extensional modes of a single resonant structure are coupled together to enable low insertion loss (IL) while maintaining a very small footprint (~ 2666 μm × 2666 μm). These narrow-band filters are fabricated on a thin-film ...


Improved bulk-heterojunction polymer solar cells with paraphenylenevinylene and fullerene

[{u'author_order': 1, u'affiliation': u"Department of Physics and Physical Oceanography, Memorial University of Newfoundland, St. John's, NL A1B 3X7, Canada", u'full_name': u'Yanfei Ding'}, {u'author_order': 2, u'affiliation': u"Department of Physics and Physical Oceanography, Memorial University of Newfoundland, St. John's, NL A1B 3X7, Canada", u'full_name': u'Qiying Chen'}] 2009 Conference on Lasers and Electro-Optics and 2009 Conference on Quantum electronics and Laser Science Conference, None

We report bulk-heterojunction solar cells consisting of poly [2-methoxy, 5 ethyl (2' hexyloxy) paraphenylenevinylene] (MEH-PPV) as a donor and [6,6]-phenyl-C61-butyric acid methyl ester (PCBM) as an acceptor with improved performance after optimization of device parameters.


CIGS absorber layer by single-step non-vacuum intense pulsed light treatment of inkjet-printed film

[{u'author_order': 1, u'affiliation': u'International Advanced Research Center for Powder Metallurgy and New Materials (ARCI), PO Balapur, Hyderabad 500 005, India', u'full_name': u'Sanjay R. Dhage'}, {u'author_order': 2, u'affiliation': u'International Advanced Research Center for Powder Metallurgy and New Materials (ARCI), PO Balapur, Hyderabad 500 005, India', u'full_name': u'P. S. Chandrasekhar'}, {u'author_order': 3, u'affiliation': u'International Advanced Research Center for Powder Metallurgy and New Materials (ARCI), PO Balapur, Hyderabad 500 005, India', u'full_name': u'S. B. Chandrasekhar'}, {u'author_order': 4, u'affiliation': u'International Advanced Research Center for Powder Metallurgy and New Materials (ARCI), PO Balapur, Hyderabad 500 005, India', u'full_name': u'Shrikant V. Joshi'}] 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC), None

Non-vacuum processes are of great interest for development of low-cost chalcopyrite-based photovoltaic technologies. Apart from the expensive vacuum- based routes that are widely adopted, another negative feature of the popularly employed methods is the need for selenization treatment, which significantly impacts the microstructure of the absorber layer and, in turn, also determines the performance of the device. A novel process ...


Deposition of amorphous Co-Ta and Co-Zr thin films by means of double ion beam sputtering

[{u'author_order': 1, u'affiliation': u'Tokyo Institute of Technology, Meguro-Ku, Tokyo, Japan', u'full_name': u'M. Naoe'}, {u'author_order': 2, u'full_name': u'N. Terada'}, {u'author_order': 3, u'full_name': u'Y. Hoshi'}, {u'author_order': 4, u'full_name': u'S. Yamanaka'}] IEEE Transactions on Magnetics, 1984

Co-Zr and Co-Ta amorphous films with soft magnetic properties have been deposited by double ion beam sputtering. And the dependence of their crystal structure and magnetic properties on preparation conditions, especially on the ion bombardment during deposition, has been investigated. The composition range of Co content where the amorphous films are obtained becomes wider as the energy of bombarding ions ...


Fabrication of high quality Nb/AlO/sub x/-Al/Nb Josephson junctions. I. Sputtered Nb films for junction electrodes

[{u'author_order': 1, u'affiliation': u'Fujitsu Lab. Ltd., Atsugi, Japan', u'full_name': u'T. Imamura'}, {u'author_order': 2, u'affiliation': u'Fujitsu Lab. Ltd., Atsugi, Japan', u'full_name': u'T. Shiota'}, {u'author_order': 3, u'affiliation': u'Fujitsu Lab. Ltd., Atsugi, Japan', u'full_name': u'S. Hasuo'}] IEEE Transactions on Applied Superconductivity, 1992

The stress, surface morphology, superconducting characteristics, and crystal structure of sputtered Nb films were evaluated to judge their applicability to Josephson-junction electrodes. The film qualities were compared between Nb films deposited by DC and RF magnetron sputtering. The authors concluded that DC-sputtered Nb films are more suitable for junction electrodes and studied the relationship between their film quality and sputtering ...


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Educational Resources on Films

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eLearning

No eLearning Articles are currently tagged "Films"

IEEE-USA E-Books

  • Flexible OLEDs

    One of the significant advantages of OLEDs is that they can be fabricated on flexible substrates. The use of flexible substrates instead of conventional glass substrates can significantly reduce the thickness and weight of displays and lighting. In addition, flexible OLEDs bring about additional attractive features from the product design point of view, because flexible OLEDs can provide such unique designs as curved, bent, folded, rolled, and ultimately flexible. Moreover, use of flexible substrates has great potential of production innovation such as utilization of roll¿¿¿to¿¿¿roll (R2R) process with low mass¿¿¿production cost. As the candidates for flexible substrates, ultra¿¿¿thin glasses, stainless steel foils and plastic films are well known. This chapter describes current status and future potential of three types of flexible substrates and their applications to flexible OLED displays and lightings.

  • The 5202 Machine

    No Abstract.

  • Major Driving Forces and Growth Mechanisms for Tin Whiskers

    This chapter focuses on describing the primary driving forces and mechanisms causing the growth of whiskers and hillocks. It devotes to describing how the growth of intermetallic phase (IMC) leads to stress in the Sn layer. It also discusses the impact of Sn whiskers on reliability and the importance of suppressing their formation. The chapter discusses results from simultaneously measuring the growth of the IMC between the Cu and Sn whiskers, the stress in the Sn layer, and the whisker density to understand how these different processes interact. It describes experimental studies that are designed to identify the other processes that play a role in whiskers forming, for example, plasticity, diffusion¿¿¿mediated creep, and prevention of surface diffusion by the Sn oxide. The chapter also describes results from real¿¿¿time studies of whisker growth in the scanning electron microscope/focused ion beam milling (SEM/FIB) that show how whiskers and hillocks evolve in time.

  • Immersion in Digital Games: Review of Gaming Experience Research

    This chapter focuses on the idea of immersion in games as it has consistently proved itself to be an important component of the experience players seek from games. It reviews the work on gaming experience with the aim of dissociating spatial presence from immersion to show how the two may vary independently of each other. Immersion can be characterized as the degree of involvement that players have with different aspects of the game leading to a move of the attention, awareness, and thoughts of the player from the real world around them to the events happening within the game. The chapter groups the descriptions of gaming experience into three sections: generic positive experiences that are not particular to the experience of playing digital games, broader descriptions of gaming experiences, and gaming experiences specifically related to immersion, engagement, and involvement.

  • Tunneling Dielectric Thin¿¿¿Film Transistor

    A decrease in the gate¿¿¿off current of the thin¿¿¿film transistors (TFTs) is one of the key issues when realizing high speed, high brightness, and low power consumption for liquid crystal or organic LED displays. To solve this problem, a new transistor called a tunneling dielectric thin¿¿¿film transistor (TDTFT) has been proposed and designed. In this chapter, a bottom¿¿¿gate TDTFT, fabricated using a silicon¿¿¿on¿¿¿insulator (SOI) substrate, and its electrical characteristics, are introduced, where a 1.7 nm thick SiNx film for the tunneling dielectric film was deposited at 750¿¿¿¿¿C by LPCVD. The conduction mechanism of electrons flowing in the channel of the TDTFT was examined at high temperatures from 293 to 623¿¿¿K and low temperatures from 20 to 150¿¿¿K. It was found that direct tunneling via the SiNx film dominates the channel conduction of the TDTFT not only at the low temperatures but also at high temperatures up to 353¿¿¿K. It was also clarified that the TDTFT improved the hump phenomenon and the short¿¿¿channel effect.

  • Animation Research: A Brief Introduction

  • Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects

    This chapter focuses on development and validation of a surface¿¿¿defect counting procedure, which can be applied in research on the specific mechanisms responsible for stress relaxation and tin whisker formation in tin films. It describes how to quantify the stress relaxation that can be attributed to the separate types of defects, each with a lower reliability risk than tin whiskers, and how the data can be combined to quantify overall stress relaxation in a given film under a given set of conditions. The chapter explains what comparisons of such data from the same films under different conditions, or different films under the same stressing conditions. It reveals about the relationship between film microstructure, stressing conditions, and stress relaxation. The defect assessment methodology documented evolution of film microstructure and defect formation among the 18 different sample types, providing a method to quantify the complexity of stress relaxation in tin surface finishes.



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