Conferences related to Encapsulation

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2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors.

  • 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)

    Development of micro -electro mechanical systems (MEMS) focusing on design, simulation and analysis tools, fabrication technologies and processes, integration techniques, and assembly and packaging approaches. Application of MEMS in sensors and actuators, microdevices for opto -mechanical systems, fluidic microsystems, biomedical engineering, wireless communication, power supply and energy harvesting and nano - electro -mechanical devices.

  • 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)

    Premier Conference on MEMS reporting the lastest research results on every aspect of microsystems technology.

  • 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS)

    MEMS 2011 will be held in Cancun, Mexico from 23-27 January 2011 at the Hilton. The MEMS Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. In recent years, it has attracted more than 700 participants, 750+ abstract submissions and has presented over 200 select papers in non-overlapping podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees.

  • 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS)

    Development of micro-electro mechanical systems (MEMS) focusing on design, simulation and analysis tools, fabrication technologies and processes, integration techniques, and assembly and packaging approaches. Application of MEMS in sensors and actuators, microdevices for opto-mechanical systems, fluidic microsystems, biomedical engineering, wireless communication, power supply and energy harvesting and nano-electro-mechanical devices.

  • 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS)

    MEMS 2009 will be held in Sorrento, Italy on 26-29 January 2009 at the Hilton Sorrento Palace. the MEMS Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. In recent years, it has attracted more than 700 participants, 750+ abstract submissions and has presented over 200 select papers in non-overlapping podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, present

  • 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems (MEMS)

    The IEEE MEMS 2008 Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. Topics include: Fabrication and Packaging Technologies, Materials and Device Characterization, Biomedical and Chemical Devices/Systems, Mechanical and Physical Sensors & Systems, Design, Stimulation, and Theoretical Concepts with Experimental Verification, Micro-fluidic Components & Systems, Micro-Actuators, Optical and RF MEMS, Energy and Power MEMS and Nano


2014 IEEE 40th Photovoltaic Specialists Conference (PVSC)

The PVSC is a technical conference dedicated to the science and application of photovoltaics for solar electricity generation. Technical Program Areas: 1. Fundamentals and New Concepts for Future Technologies 2. Thin Film Polycrystalline Photovoltaics 3. III-V and Concentrator Technologies 4. Crystalline Silicon Technologies 5. Thin Film Silicon Based PV Technologies 6. Organic Photovoltaics 7. Space Technologies 8. Characterization and Measurement Methods 9. PV Modules and Manufacturing 10. PV Systems and Applications 11. PV Velocity Forum


2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.

  • 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    The theme is IMPACT-Leading Innovation. Advanced Packaging Technologies, Power Module and Green Packaging,3D Integration,LED & Optoelectronics Packaging,Interconnections & nanotechnology,Modeling, Simulation & Design.

  • 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    The theme is IMPACT-Leading Innovation which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage.

  • 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Advanced and Emerging Packaging Technology, Nanotechnology & Interconnection, Thermal Management, Advanced Materials, Process & , Advanced Sensor & Microsystems Technology, Modeling, Testing & Design, Electro Deposition and Electrochemical Processing Technology

  • 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Advanced and Emerging Packaging Technology, Nanotechnology & Interconnection, Thermal Management, Advanced Materials, Process & , Advanced Sensor & Microsystems Technology, Modeling, Testing & Design, Electro Deposition and Electrochemical Processing Technology


2012 4th Electronic System-Integration Technology Conference (ESTC)

The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.


2012 6th Advanced Satellite Multimedia Systems Conference and the 12th Signal Processing for Space Communications Workshop (ASMS/SPSC)

The ASMS/SPSC conference is a biannual event aiming at providing opportunities for industry and research institutions to get the latest updates and to exchange information about recent advances and emerging technologies for mobile, broadband and broadcast satellite communication systems. Tutorials, keynote speeches, panels, and invited technical session complement the technical program in order to provide multiple views on the R&D trends in the SatCom field.


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Periodicals related to Encapsulation

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Computers, IEEE Transactions on

Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...


Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Photonics Technology Letters, IEEE

Rapid publication of original research relevant to photonics technology. This expanding field emphasizes laser and electro-optic technology, laser physics and systems, applications, and photonic/ lightwave components and applications. The journal offers short, archival publication with minimal delay.




Xplore Articles related to Encapsulation

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A Weight-Based Symptom Correlation Approach to SQL Injection Attacks

Massimo Ficco; Luigi Coppolino; Luigi Romano 2009 Fourth Latin-American Symposium on Dependable Computing, 2009

Web applications are vulnerable to a variety of new security threats. SQL injection attacks (SQLIAs) are one of the most significant of such threats. Researchers have proposed a wide variety of anomaly detection techniques to address SQLIAs, but all existing solutions have limitations in terms of effectiveness and practicality. %In particular, We claim that the main cause of such limitations ...


Microfabrication and Self-Assembly of 3D Microboxes for Biomedical Applications

T. Leong; Hongke Ye; E. Call; B. Gimi; Z. Bhujwalla; D. H. Gracias 19th IEEE International Conference on Micro Electro Mechanical Systems, 2006

This paper reports a novel method for fabricating three dimensional (3D) metallic micropatterned boxes by self-assembly of two dimensional (2D) precursors. A 3D micropatterned device has several advantages over its two dimensional (2D) counterpart--a larger surface area to volume ratio, thereby maximizing interactions with the surrounding medium and providing space to mount different electromechanical modules, and a finite volume allowing ...


Determining Achievable Rates for Secure, Zero Divergence, Steganography

K. Sullivan; K. Solanki; B. S. Manjunath; U. Madhow; S. Chandrasekaran 2006 International Conference on Image Processing, 2006

In steganography (the hiding of data into innocuous covers for secret communication) it is difficult to estimate how much data can be hidden while still remaining undetectable. To measure the inherent detectability of steganography, Cachin suggested the ϵ-secure measure, where ϵ is the Kullback Leibler (K-L) divergence between the cover distribution and the distribution after hiding. At zero divergence, an ...


Encapsulation of the anticancer drug cisplatin into nanotubes

Tamsyn A. Hilder; James M. Hill 2008 International Conference on Nanoscience and Nanotechnology, 2008

One important application of nanotechnology is that of drug delivery, and in particular the targeted delivery of drugs using nanotubes. A proper understanding of the encapsulation behavior of drug molecules into nanotubes is vital for the development of nanoscale drug delivery vehicles. Furthermore, there are many other materials which may form single-walled nanotubes, such as carbon, boron carbide, boron nitride ...


High capacity audio data hiding for noisy channels

J. Chou; K. Ramchandran; A. Ortega Proceedings International Conference on Information Technology: Coding and Computing, 2001

We combine theoretical and algorithmic advances in the area of information- hiding with the current mature knowledge-base in the human audio perception system to propose a novel audio data hiding technique that significantly pushes the state-of-the-art in the field. Our work is based on a combination of advances in two disjoint fields: information hiding and human auditory masking. The field ...


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Educational Resources on Encapsulation

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eLearning

A Weight-Based Symptom Correlation Approach to SQL Injection Attacks

Massimo Ficco; Luigi Coppolino; Luigi Romano 2009 Fourth Latin-American Symposium on Dependable Computing, 2009

Web applications are vulnerable to a variety of new security threats. SQL injection attacks (SQLIAs) are one of the most significant of such threats. Researchers have proposed a wide variety of anomaly detection techniques to address SQLIAs, but all existing solutions have limitations in terms of effectiveness and practicality. %In particular, We claim that the main cause of such limitations ...


Microfabrication and Self-Assembly of 3D Microboxes for Biomedical Applications

T. Leong; Hongke Ye; E. Call; B. Gimi; Z. Bhujwalla; D. H. Gracias 19th IEEE International Conference on Micro Electro Mechanical Systems, 2006

This paper reports a novel method for fabricating three dimensional (3D) metallic micropatterned boxes by self-assembly of two dimensional (2D) precursors. A 3D micropatterned device has several advantages over its two dimensional (2D) counterpart--a larger surface area to volume ratio, thereby maximizing interactions with the surrounding medium and providing space to mount different electromechanical modules, and a finite volume allowing ...


Determining Achievable Rates for Secure, Zero Divergence, Steganography

K. Sullivan; K. Solanki; B. S. Manjunath; U. Madhow; S. Chandrasekaran 2006 International Conference on Image Processing, 2006

In steganography (the hiding of data into innocuous covers for secret communication) it is difficult to estimate how much data can be hidden while still remaining undetectable. To measure the inherent detectability of steganography, Cachin suggested the ϵ-secure measure, where ϵ is the Kullback Leibler (K-L) divergence between the cover distribution and the distribution after hiding. At zero divergence, an ...


Encapsulation of the anticancer drug cisplatin into nanotubes

Tamsyn A. Hilder; James M. Hill 2008 International Conference on Nanoscience and Nanotechnology, 2008

One important application of nanotechnology is that of drug delivery, and in particular the targeted delivery of drugs using nanotubes. A proper understanding of the encapsulation behavior of drug molecules into nanotubes is vital for the development of nanoscale drug delivery vehicles. Furthermore, there are many other materials which may form single-walled nanotubes, such as carbon, boron carbide, boron nitride ...


High capacity audio data hiding for noisy channels

J. Chou; K. Ramchandran; A. Ortega Proceedings International Conference on Information Technology: Coding and Computing, 2001

We combine theoretical and algorithmic advances in the area of information- hiding with the current mature knowledge-base in the human audio perception system to propose a novel audio data hiding technique that significantly pushes the state-of-the-art in the field. Our work is based on a combination of advances in two disjoint fields: information hiding and human auditory masking. The field ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • IPTV Applications

    This chapter contains sections titled: Overview and Motivation Basic Architecture Appendix 11.A: Serial Digital Interface Basics Appendix 11.B: MPEG Basics Appendix 11.C: Encapsulation for Transmission of IP Datagrams over MPEG‐2/DVB Networks References

  • HighTemperature Electronics Packaging

    Using standard high-reliability hermetic packaging technology, microelectronics can be packaged to operate at 300°C for hundreds of hours. A number of straightforward variations on this standard technology should increase lifetimes by a factor of 10. Industrial trends decreasing the back- end processing temperatures of semiconductor devices, increasing operational junction temperatures in high-power devices, and widespread use of organic package encapsulation are increasing the difficulty of using off-the-shelf devices in systems intended for high temperature. However, the interest in adapting plastic parts for long-service military systems could make short-term operation of plasticpackaged devices at high temperature more dependable. In addition, the push to high-density multichip modules will force device and circuit designs toward more high-temperature capability.

  • WinRFID: A Middleware for the Enablement of Radiofrequency Identification (RFID)Based Applications

    Radio Frequency Identification (RFID) middleware is a new class of software which facilitates data and information communication between automatic identification physical layer and enterprise applications. It provides a distributed environment to process the data from tags read by the readers, translates the data where necessary, and routes it to a variety of backend applications using suitable technologies such as Web, Remote and Windows Services. This paper reports different challenges and the corresponding research approach in developing a RFID middleware to provide a seamless environment from the edge of the enterprise network; moving data from the point of transaction to the enterprise systems. Key features of the RFID middleware architecture are encapsulation of communication details, large- scale network management, intelligent data processing and routing, hardware and software interoperability, system integration and system extendibility. To deal with high volume data, WinRFID middleware is supported by novel algorithms and data representation schemes capable of processing large amounts of data, rectifying errors in real-time, identifying patterns, correlating events, reorganizing and scrubbing data and recovering from faults and exceptions. Interoperability involves simultaneous distributed working of receivers/readers and transponders/tags at different frequencies using different protocols, with read/write capabilities, different read rates, and other characteristics as a layer transparent to the applications. Network management involves deployment, initialization and control of receivers and transponders, which can be organized into a hierarchical structure with operational syntax and semantics attached to each or a group of receivers, transponders and concentrators or even the edge computers.

  • Evaluation of A1xGa1xAs for HighTemperature Electronic Junction Device Applications

    Mes-isolated, p+nn+, GaAs/AlxGa1-xAs/GaAs (0.10<x<0.5), double-heterojunction diodes are examined over the full temperature range from 50 to 400°C. AlxGa1-xAs is selectively used to suppress reverse junction leakage. GaAs is used for heterojunction contacts and as an encapsulant for the chemically reactive AlxGa1-xAs. An AlAs concentration of approximately 30% was found to provide significant improvements in the high-temperature reverse junction leakage (compared to GaAs homojunctions) without the necessity of going to higher values of x, Extending the diode work to three-terminal devices, a heterojunction- collector bipolar junction transistor was fabricated. These results demonstrate that AlxGa1-xAs coupled with GaAs for contacting and encapsulation is a good materials system for high-temperature junction device applications.

  • Intelligent Control: An Overview of Techniques

    In many established fields, the label ?>intelligent?> heralds new developments that take issue with some traditional assumptions in research. In the case of intelligent control, an explicit attempt is made to draw inspiration from nature, biology, and artificial intelligence, and a methodology is promoted that is more accepting of heuristics and approximationsï¿¿-ï¿¿and is less insistent on theoretical rigor and completenessï¿¿-ï¿¿than is the case with most research in control science. Beyond such general and abstract features, succinct characterizations of intelligent control are difficult. Extensional treatments are an easier matter. Fuzzy logic, neural networks, genetic algorithms, and expert systems constitute the main areas of the field, with applications to nonlinear identification, nonlinear control design, controller tuning, system optimization, and encapsulation of human operator expertise. Intelligent control is thus no narrow specialization; it furnishes a diverse body of techniques that potentially addresses most of the technical challenges in control systems. It is also important to emphasize that intelligent control is by no means methodologically opposed to theory and analysis. Chapter 6 of this book, for example, discusses some theoretical results for neural networks and fuzzy models as nonlinear approximators Introductory tutorials to the key topics in intelligent control are provided in this chapter. No prior background in these topics is assumed. Examples from ship maneuvering, robotics, and automotive diagnostics help motivate the discussion. (Other chapters in this volume, notably Chapter 16, also outline applications of intelligent control.) General observations on autonomy and adaptationï¿ ¿-ï¿¿two characteristics that are often considered essential to any definition of intelligenceï¿¿-ï¿¿are also included.

  • Nanofiber Technology for Controlling Stem Cell Functions and Tissue Engineering

    Nanotechnology is an upcoming yet promising technology with respect to the development of well-established products. Nanofibers are potentially recent additions to materials in relation to tissue engineering (TE). Nanofiber-based scaffolds are being explored as scaffolds for TE applications. Electrospinning has developed into a versatile technique to fabricate polymeric nanofiber matrices, and the ability to incorporate bioactive therapeutic molecules without adversely affecting their structural integrity and biological activity using the mild electrospinning process has generated significant interest in polymeric nanofiber-based drug release patterns by changing the mode of encapsulation as well as by varying the matrix polymer. Scaffold composition and fabrication can be controlled to confirm desired properties and biofunctionalities. Interaction between the stem cells and nanofibers are crucial in a cell-scaffold matrix while using them for different TE applications. This chapter finally talks about the stem cell-nanofiber interactions in regenerative medicine and TE.

  • Overview of Whisker???Mitigation Strategies for High???Reliability Electronic Systems

    In practice, management of the risks associated with tin whiskering is not fundamentally different from managing risks associated with other failure modes that bedevil electronic systems. However, the underlying uncertainties and associated lack of predictability of the tin whiskering phenomenon create a challenging environment for risk management. In order to reduce failure risk presented by tin whiskers, electronic equipment manufacturers need to understand various mitigation strategies and their effectiveness at preventing whisker???related failures. Equipment manufacture mitigation strategies may include setting spacing limits, hot solder dipping, solder assembly and inspection, encapsulation, or application of an insulation coating layer. Appropriate supply chain management will vary depending upon the willingness of the supplier to implement special tin controls and level of complexity of the purchased item, that is, components, simple assemblies, major subassemblies, etc. Effective and efficient tin whisker risk mitigation requires each tier of the supply chain to play its proper role.

  • The Acceptability Semantics for Logic Programs

    We present a simple yet powerful semantics for Negation as Failure (NAF) in logic programming, called the acceptability semantics. This is based on the idea that NAF literals represent possible extensions of a given logic program, provided that these satisfy an appropriate criterion, namely the acceptability criterion. The importance of this semantics and the way it is formulated lies in the fact that it allows us to abstract away NAF from the object-level syntax of our representation language. This has two significant consequences. First, it introduces a new more general, yet simpler, style of logic programming which is closer to the logical specification of non-monotonic problems, with the same basic computational paradigm of logic programming. Additionally, the understanding of the NAF principle through acceptability provides us with a general encapsulation of this non-monotonic reasoning principle that can be applied to other, richer in language, representation frameworks.

  • Software Lemmings

    According to the author, software developers, in their search for the Holy Grail, are convinced that they are doing something meaningful. Like lemmings, they tend to follow the leader, without ever asking ourselves if they want to go where the leader is taking them. This chapter presents the lemming paths explored by the author and provides an idea of their popularity, goals, risks and payoffs. It explores the terms structured programming, structured analysis and structured design. Object-oriented programming is based on very sound principles of quality programming discovered 20 to 30 years ago: data abstraction, information hiding, encapsulation, inheritance, and so on. The process-maturity path is only the first leg of a very long journey on the path to quality software. The chapter also talks about the C language, software prototyping, CASE tools, and COTS software.

  • IP and ATM Internetworking

    Introduction IP Internetworking Overview Overview of LAN Protocol Architectures Internetworking Protocol (IP) Layer Functions IP Packet Structure and Functions Transmission Control Protocol (TCP) Structure and Functions Encapsulation of IP over ATM The "Classical" IP over ATM Network Architecture Model Quality of Service in IP Networks Integrated Services Architecture (IntServ) and RSVP The Differentiated Services (DiffServ) Model



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