Conferences related to Electrodes

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2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.


2011 International Workshop on Dielectric Thin Films for Future ULSI Devices: Science and Technology (IWDTF)

The IWDTF2011 will focus on the science and technologies of gate dielectric films for MOS and memory devices, such as ultrathin SiO2, SiON, high-k gate dielectrics, and ferroelectric films. The topics on other technologies involved in the advanced gate stacks, including metal gate electrodes and high-mobility channel materials, will also be discussed.


2010 XIVth International Conference on Electrical Bioimpedance and the 11th Conference on Biomedical Applications of EIT (ICEBI)

Bioimpedance Theory and Modeling Electrical Impedance Tomography Clinical Applications Tissue and Organ Impedance Skin and Epithelial Impedance Electrodes and Instrumentation Body Composition and Tissue Fluid Content Magnetic Induction Tomography Magnetic Resonance Electrical Impedance Tomography Advanced Bioimpedance Technologies Bioimpedance Analysis Cells, Cell Cultures and Suspensions Plant Tissue Impedance


2009 6th International Symposium on Advanced Gate Stack Technology (ISAGST)

This year s Symposium provides a forum for semiconductor industry professionals, researchers, and academia to discuss strategies for implementing high-k and metal gate stack technology into memory (flash, DRAM) and logic (high performance, low standby power) for 22nm node and beyond. Stacks for advanced high-mobility channels will also be discussed including InGaAs, Graphene and Ge. The Symposium will include developments in functional stacks including stacks for mechanical (MEMS)


2007 International Symposium on Advanced Gate Stack Technology (ISAGST) (Formerly IWGST)

This conference will provide a forum for researchers from semiconductor industry and universities to discuss advanced gate stack related topics through invited and contributed presentations. The program will include speakers from all areas of science and technology in advanced gate stack.



Periodicals related to Electrodes

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Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.




Xplore Articles related to Electrodes

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A neural network scheme for Earthquake prediction based on the seismic electric signals

Lakkos, S.; Hadjiprocopis, A.; Comley, R.; Smith, P. Neural Networks for Signal Processing [1994] IV. Proceedings of the 1994 IEEE Workshop, 1994

Earthquake prediction based on the seismic electric signals usually employs statistical linear models. In this paper, an alternative scheme for earthquake prediction and modelling of the geophysical characteristics based on artificial neural networks, is presented. Several network configurations are investigated and the results are discussed and interpreted in various ways


Electric-circuit burning-clear and damage phenomena on aircraft structures

Electrical Engineering, 1944

W. M. Davidson (Westinghouse Electric and Manufacturing Company, East Pittsburgh, Pa.): In testing aircraft cables to determine their ability to burn clear when subjected to faults there are many variables. The problem in aircraft circuits is even more complex than in industrial distribution systems because of the scarcity of data on the nature of faults. In the laboratory logical assumptions ...


Time-frequency spectral estimation of multichannel EEG using the Auto-SLEX method

Cranstoun, S.D.; Ombao, H.C.; von Sachs, R.; Wensheng Guo; Litt, B. Biomedical Engineering, IEEE Transactions on, 2002

In this paper, we apply a new time-frequency spectral estimation method for multichannel data to epileptiform electroencephalography (EEG). The method is based on the smooth localized complex exponentials (SLEX) functions which are time-frequency localized versions of the Fourier functions and, hence, are ideal for analyzing nonstationary signals whose spectral properties evolve over time. The SLEX functions are simultaneously orthogonal and ...


A new VLSI memory cell using capacitance coupling (CC cell)

Terada, K.; Ishijima, T.; Kurosawa, S.; Suzuki, S. Electron Devices, IEEE Transactions on, 1984

A new VLSI memory cell is proposed, which offers a small cell area, about 6F2(F is the feature size), readout signal gain, and high alpha-particle immunity. Since it employs capacitance coupling in a write operation, it requires only one bit line and is called a capacitance coupling (CC) cell. A CC cell consists of three transistors and a capacitor, which ...


Continuum properties from interdigital electrode dielectrometry

Zaretsky, M.C.; Mouayad, L.; Melcher, J.R. Electrical Insulation, IEEE Transactions on, 1988

Using a modal approach, a model is derived that makes the interdigital electrode microdielectrometer developed by S. D. Senturia et al. (J. Adhesion, vol.15, p.69-90, 1982) applicable to measuring continuum parameters in a wide range of heterogeneous media. In this so-called imposed omega -k technique, the medium is excited at the temporal (angular) frequency omega by means of an interdigital ...


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