Conferences related to Electrodes

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.


2011 International Workshop on Dielectric Thin Films for Future ULSI Devices: Science and Technology (IWDTF)

The IWDTF2011 will focus on the science and technologies of gate dielectric films for MOS and memory devices, such as ultrathin SiO2, SiON, high-k gate dielectrics, and ferroelectric films. The topics on other technologies involved in the advanced gate stacks, including metal gate electrodes and high-mobility channel materials, will also be discussed.


2010 XIVth International Conference on Electrical Bioimpedance and the 11th Conference on Biomedical Applications of EIT (ICEBI)

Bioimpedance Theory and Modeling Electrical Impedance Tomography Clinical Applications Tissue and Organ Impedance Skin and Epithelial Impedance Electrodes and Instrumentation Body Composition and Tissue Fluid Content Magnetic Induction Tomography Magnetic Resonance Electrical Impedance Tomography Advanced Bioimpedance Technologies Bioimpedance Analysis Cells, Cell Cultures and Suspensions Plant Tissue Impedance


2009 6th International Symposium on Advanced Gate Stack Technology (ISAGST)

This year s Symposium provides a forum for semiconductor industry professionals, researchers, and academia to discuss strategies for implementing high-k and metal gate stack technology into memory (flash, DRAM) and logic (high performance, low standby power) for 22nm node and beyond. Stacks for advanced high-mobility channels will also be discussed including InGaAs, Graphene and Ge. The Symposium will include developments in functional stacks including stacks for mechanical (MEMS)


2007 International Symposium on Advanced Gate Stack Technology (ISAGST) (Formerly IWGST)

This conference will provide a forum for researchers from semiconductor industry and universities to discuss advanced gate stack related topics through invited and contributed presentations. The program will include speakers from all areas of science and technology in advanced gate stack.



Periodicals related to Electrodes

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Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.




Xplore Articles related to Electrodes

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Nano-structured ZnO/ITO based SO<inf>2</inf> detector in room temperature operation

U. B. Memon; A. Ibrahim; S. P. Duttagupta; S. Roy 2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS), 2015

ZnO Nanostructured thin film of thickness 200nm was deposited on quartz by spray pyrolysis technique; further interdigitated ITO electrodes were fabricated by lithography. Compositional, surface morphology and electrical characterization of ZnO nanostructure thin film was done using X-ray photo electron spectroscopy (XPS), Secondary electron microscopy (SEM), and current- voltage (I-V) measurement technique respectively. SO2 sensing was done by using a ...


The cyclotron

W. M. Brobeck Electrical Engineering, 1942

Possible relationships of the cyclotron to future engineering developments are considered in this article, which describes the development of atomic accelerating devices, the operating principle and construction of a typical cyclotron, and the uses to which it is now being put.


Life and capacity improvements in lead acid batteries through metal control additives

T. J. Clough; J. A. Wertz Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Metal impurities can be particularly detrimental in valve regulated lead acid batteries (VRLA) operating on the oxygen recombination principal. A number of metal impurities can exert a deleterious effect on the performance of VRLA batteries by affecting one of more of the performance requirements of the VRLA batteries such as by increasing oxygen evolution at the positive electrode, increasing hydrogen ...


Multi-channel nerve stimulations using intrafascicular electrodes

K. Yoshida; K. Horch [1990] Proceedings of the Twelfth Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1990

First Page of the Article ![](/xploreAssets/images/absImages/00692235.png)


Multi-functional capacitive proximity sensing system for industrial safety applications

Fan Xia; Behraad Bahreyni; Fabio Campi 2016 IEEE SENSORS, 2016

This paper presents a capacitive sensing system, addressing the issue of collision avoidance in partially modelled or unknown robot-assisted industrial environment by means of object distance measurement, motion tracking, and surface profile detection. The sensor consists of a mesh of multiple electrodes, a digital control module, a capacitance to digital converter, and a data processing module. The mesh is composed ...


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Educational Resources on Electrodes

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eLearning

Nano-structured ZnO/ITO based SO<inf>2</inf> detector in room temperature operation

U. B. Memon; A. Ibrahim; S. P. Duttagupta; S. Roy 2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS), 2015

ZnO Nanostructured thin film of thickness 200nm was deposited on quartz by spray pyrolysis technique; further interdigitated ITO electrodes were fabricated by lithography. Compositional, surface morphology and electrical characterization of ZnO nanostructure thin film was done using X-ray photo electron spectroscopy (XPS), Secondary electron microscopy (SEM), and current- voltage (I-V) measurement technique respectively. SO2 sensing was done by using a ...


The cyclotron

W. M. Brobeck Electrical Engineering, 1942

Possible relationships of the cyclotron to future engineering developments are considered in this article, which describes the development of atomic accelerating devices, the operating principle and construction of a typical cyclotron, and the uses to which it is now being put.


Life and capacity improvements in lead acid batteries through metal control additives

T. J. Clough; J. A. Wertz Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Metal impurities can be particularly detrimental in valve regulated lead acid batteries (VRLA) operating on the oxygen recombination principal. A number of metal impurities can exert a deleterious effect on the performance of VRLA batteries by affecting one of more of the performance requirements of the VRLA batteries such as by increasing oxygen evolution at the positive electrode, increasing hydrogen ...


Multi-channel nerve stimulations using intrafascicular electrodes

K. Yoshida; K. Horch [1990] Proceedings of the Twelfth Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1990

First Page of the Article ![](/xploreAssets/images/absImages/00692235.png)


Multi-functional capacitive proximity sensing system for industrial safety applications

Fan Xia; Behraad Bahreyni; Fabio Campi 2016 IEEE SENSORS, 2016

This paper presents a capacitive sensing system, addressing the issue of collision avoidance in partially modelled or unknown robot-assisted industrial environment by means of object distance measurement, motion tracking, and surface profile detection. The sensor consists of a mesh of multiple electrodes, a digital control module, a capacitance to digital converter, and a data processing module. The mesh is composed ...


More eLearning Resources

IEEE-USA E-Books

  • Contact Makers and Electrodes

    This chapter contains sections titled: Contact Makers and Electrodes Relays and Contactors Circuit Breakers Arc Quenching Tripping Motor Starters Switches Limit Switches Ignition Breakers and Buzzers Connectors Sliding Contacts Contacts and Electrodes Contact Bounce, Wipe, and Geometry Dry Circuits Arcing and Quenching Fuses Life Other Devices

  • Surface EMG Decomposition

    This chapter provides an overview of surface EMG decomposition techniques, along with their basic assumptions, properties, and limitations. Surface electrodes measure the electrical activity of several nearby muscle fibers that are active during a muscle contraction. The electrical activity of each fiber can be described by a single fiber action potential (SFAP) that propagates from the neuromuscular junction towards the tendons. There is large diversity of decomposition techniques that can roughly be categorized either as template matching or latent component analysis (blind source separation) approaches. Decomposition of surface EMG is a powerful tool enabling noninvasive insight not only into muscle control strategies, but also into peripheral muscle properties. It provides unambiguous information on physiological parameters of individual motor units that can easily be interpreted. The identification of motor units (MUs) discharge patterns from surface EMG signals, acquired during dynamic muscle contractions, needs to be addressed.

  • Noninvasive Estimates of Local Field Potentials for Brain-Computer Interfaces

    Recent experiments have shown the possibility of using the brain electrical activity to directly control the movement of robots or prosthetic devices in real time. Such neuroprostheses can be invasive or noninvasive, depending on how the brain signals are recorded. In principle, invasive approaches will provide a more natural and flexible control of neuroprostheses, but their use in humans is debatable given the inherent medical risks. Noninvasive approaches mainly use scalp electroencephalogram (EEG) signals and their main disadvantage is that these signals represent the noisy spatiotemporal overlapping of activity arising from very diverse brain regions, that is, a single scalp electrode picks up and mixes the temporal activity of myriad neurons at very different brain areas. To combine the benefits of both approaches, we propose to rely on the noninvasive estimation of local field potentials (eLFP) in the whole human brain from the scalp-measured EEG data using a recently developed inverse solution (ELECTRA) to the EEG inverse problem. The goal of a linear inverse procedure is to deconvolve or unmix the scalp signals attributing to each brain area its own temporal activity. To illustrate the advantage of this approach, we compare, using identical sets of spectral features, classification of rapid voluntary finger self-tapping with left and right hands based on scalp EEG and eLFP on three subjects using different numbers of electrodes. It is shown that the eLFP-based Gaussian classifier outperforms the EEG-based Gaussian classifier for the three subjects.

  • Detection and Conditioning of Surface EMG Signals

    This chapter presents the detection and conditioning of surface electromyographic (EMG) signals. More advanced techniques are now widely used in research laboratories and are being adopted in clinical settings. Such techniques are based on multichannel detection by means of one dimensional (1-D) or two dimensional (2-D) electrode arrays. The chapter describes the electrode-skin interface and the front-end amplifier stage. The impedance between two electrodes is the sum of two electrode-skin impedances plus the interposed tissue impedance. Conventional electrodes, either wet or dry, behave like transducers converting ionic current (in tissue and gel) into flow of electrons in the metal. These electrical sensors require a careful skin preparation to reduce the impedance and noise associated to this interface. The biomedical sector offers small-sized, high-cost application-specific integrated circuits (ASIC) devices for biopotential measurements. Applications are expected to range from physiopathological investigations, to rehabilitation games, biofeedback applications, and sport training.

  • OLED Devices

    While the fundamental device structure of OLEDs is simple in a sense, there are various types of OLED devices, which can be classified into various categories. From the point of view of emitting directions, OLED devices are classified as bottom emission, top emission, and both???side emission (transparent). OLED devices are also classified into normal and inverted structures from the point of view of the stacking order of the electrodes.In addition, this chapter describes some useful technologies for practical OLED displays and lighting: white OLEDs, full???color technologies, micro???cavity structures, multi???photon structures, and encapsulating technologies.

  • Triangles

    MATLAB program mom_tri_1.m is a simple demonstration script for setting up and solving a method of moments (MoM) problem using triangular cells. This program includes two input electrodes, each composed of two triangles. This chapter provides a description of the desired electrode geometry to arrive at a completed calculation of the charge distribution on the electrodes. Manual generation of triangular meshings very quickly becomes an overwhelming task when the electrode geometries and desired resolutions are not trivial. MATLAB has built-in capabilities that perform this task very well. The chapter discusses the issue of finding the voltage and the electric field at arbitrary points in space, before proceeding to discuss some more interesting geometries. When electrodes are rectangular and consists of square cells, it is easy to examine a charge profile.

  • Practical Considerations in Retinal Neuroprosthesis Design

    This chapter contains sections titled: Introduction Electrode Organization and Phosphenized Vision Electrode Quantities and Stimulation Rates Electrode Fabrication Psychophysics of Electrical Stimulation Implantation and Prosthesis Design Implant Electronics Models of Electrodes and Current Injection Conclusion References

  • Grounding Methods for Electric Supply and Communications Facilities

    This chapter contains sections titled: Purpose Scope Point of Connection of Grounding Conductor Grounding Conductor and Means of Connection Grounding Electrodes Method of Connection to Electrode Ground Resistance Requirements Separation of Grounding Conductors Not Used Additional Requirements for Communication Apparatus

  • Fabrication of Passive Components for HighTemperature Instrumentation

    Thin-film resistors and capacitors have been fabricated for use in geothermal well-logging tools. The resistors can operate from 25°C-500°C with a temperature coefficient below 100 ppm/°C; capacitors can operate from 25°C-350°C with a similar temperature coefficient. Chemical vapor deposition (CVD) is used to fabricate both resistors and capacitors. The processing is compatible with most microcircuit processes; and resistors, capacitors, interconnecting metallization, and passivation are all produced by CVD and can be integrated on a single substrate. Resistor material is tungsten-silicon, capacitor electrodes and metallization are tungsten, and dielectric material is silicon nitride. Photolithography is used to delineate component geometry.

  • Performance Comparison of Modern Devices

    This chapter discusses the performance of cross???current tetrode silicon???on???insulator complementary metal oxide semiconductors (XCT???SOI CMOSs) based on the partially depleted silicon???on insulator metal oxide???semiconductor field???effect transistor (SOI MOSFET). In order to understand comprehensively the position of XCT???SOI CMOS, the chapter presents a summary of the expected switching performance of various devices based on the International Technology Roadmap for Semiconductors (ITRS) of 2011. Switching performance estimation assumed that the gate???induced drain leakage (GIDL) current of the SOI CMOS is well suppressed in the ???OFF??? state. Although the tunnel barrier junction (TBJ) MOSFET offers fairly low energy, the switching delay time appears to be sensitive to the material of source and drain electrodes. It is anticipated that the tunneling dielectric thin???film transistor (TDTFT) will also show behavior similar to the TBJ MOSFET. In contrast, the gate???all???around (GAA) wire MOSFET is superior to the others in terms of switching speed, but not in terms of switching energy.



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