Conferences related to Electrodes

Back to Top

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.


2011 International Workshop on Dielectric Thin Films for Future ULSI Devices: Science and Technology (IWDTF)

The IWDTF2011 will focus on the science and technologies of gate dielectric films for MOS and memory devices, such as ultrathin SiO2, SiON, high-k gate dielectrics, and ferroelectric films. The topics on other technologies involved in the advanced gate stacks, including metal gate electrodes and high-mobility channel materials, will also be discussed.


2010 XIVth International Conference on Electrical Bioimpedance and the 11th Conference on Biomedical Applications of EIT (ICEBI)

Bioimpedance Theory and Modeling Electrical Impedance Tomography Clinical Applications Tissue and Organ Impedance Skin and Epithelial Impedance Electrodes and Instrumentation Body Composition and Tissue Fluid Content Magnetic Induction Tomography Magnetic Resonance Electrical Impedance Tomography Advanced Bioimpedance Technologies Bioimpedance Analysis Cells, Cell Cultures and Suspensions Plant Tissue Impedance


2009 6th International Symposium on Advanced Gate Stack Technology (ISAGST)

This year s Symposium provides a forum for semiconductor industry professionals, researchers, and academia to discuss strategies for implementing high-k and metal gate stack technology into memory (flash, DRAM) and logic (high performance, low standby power) for 22nm node and beyond. Stacks for advanced high-mobility channels will also be discussed including InGaAs, Graphene and Ge. The Symposium will include developments in functional stacks including stacks for mechanical (MEMS)


2007 International Symposium on Advanced Gate Stack Technology (ISAGST) (Formerly IWGST)

This conference will provide a forum for researchers from semiconductor industry and universities to discuss advanced gate stack related topics through invited and contributed presentations. The program will include speakers from all areas of science and technology in advanced gate stack.



Periodicals related to Electrodes

Back to Top

Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.




Xplore Articles related to Electrodes

Back to Top

An investigation of robustness in independent component analysis EMG

Sueaseenak, D.; Chanwimalueang, T.; Sangworasil, M.; Pintavirooj, C. Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, 2009. ECTI-CON 2009. 6th International Conference on, 2009

We developed a multi-channel electromyogram acquisition system using PSOC microcontroller to acquire multi-channel EMG signals. The two channel surface electrodes were used to measure and record EMG signals on forearm muscles. These two channels of EMG signals were performed a blind signal separation by using an independent component analysis (ICA) technique. The well known ICA algorithm called FASTICA is a ...


Hydrodynamics and structure of dusty plasma fluid

Petrov, O.F.; Gavrikov, A.V.; Shakhova, I.A.; Vaulina, O.S.; Levashov, P.R.; Fortov, V.E. Plasma Science, 2004. ICOPS 2004. IEEE Conference Record - Abstracts. The 31st IEEE International Conference on, 2004

Summary form only given. The dusty plasma is a partly ionized gas that, in the majority of cases, contains negatively charged dust particles of micron size. Micron-sized dust particles in the dusty plasma assume a significant negative charge (/spl sim/10/sup 3/-10/sup 5/e) and may form quasi-stationary plasma- dust structures similar to a liquid or a solid. In contrast to real ...


Continuous Monitoring of Blood Glucose Concentration using a Fully Implantable Wireless Biomedical Microsystem

Ahmadi, M.M.; Jullien, G.A.; Peiyu Zhang Life Science Systems and Applications Workshop, 2006. IEEE/NLM, 2006

In this paper, we conceptually describe a new microsystem which we are developing for continuous blood glucose monitoring. The microsystem is intended to be implanted underneath the skin and measure the blood glucose concentration every few minutes. The power to the implant along with data transmission will use a transcutaneous wireless link. The microsystem uses a novel electrochemical glucose sensor ...


1 Tbit/inch2 very high-density recording in polycrystalline PZT/SRO/SiO2/Si thin film

Fujimoto, K.; Kawano, T.; Onoe, A.; Tamura, M.; Umeda, M.; Toda, M. Applications of Ferroelectrics, 2008. ISAF 2008. 17th IEEE International Symposium on the, 2008

We demonstrate very high-density ferroelectric probe storage experiments of 1 Tbit/inch2 in polycrystalline Pb(Zr, Ti)O3 (PZT) thin film for the first time. Very thin polycrystalline PZT film with the thickness of 40 nm was successfully deposited on silicon substrate with SrRuO3 (SRO) electrode using liquid delivery metal-organic chemical vapor deposition (MOCVD) method. The PZT film has very homogeneous grains with ...


Continuum properties from interdigital electrode dielectrometry

Zaretsky, M.C.; Mouayad, L.; Melcher, J.R. Electrical Insulation, IEEE Transactions on, 1988

Using a modal approach, a model is derived that makes the interdigital electrode microdielectrometer developed by S. D. Senturia et al. (J. Adhesion, vol.15, p.69-90, 1982) applicable to measuring continuum parameters in a wide range of heterogeneous media. In this so-called imposed omega -k technique, the medium is excited at the temporal (angular) frequency omega by means of an interdigital ...


More Xplore Articles

Educational Resources on Electrodes

Back to Top

eLearning

Smart Fabrics and Interactive Textile: State of the Art and Future Challenges

Paradiso, Rita Smart Fabrics and Interactive Textile: State of the Art and Future Challenges, 2009

Smart Fabrics and Interactive Textile (SFIT) based systems are conceived as the integration, into textile, of sensors, actuators, computing, and a power source, with the whole being part of an interactive communication network. Such systems could only be envisaged through a combination of advances in fields as fiber and polymer research, advanced material processing, microelectronics, signals processing, nanotechnologies, and telecommunication.Textile ...


Introduction to Grounding

Allen L. Clapp Introduction to Grounding, 2014

This course covers grounding requirements and grounding methods of the National Electrical Safety Code that are to be applied to electric supply and communication utility systems. This course does not cover the theory of grounding. After completing this course, the reader will be able to: 1. Identify electric supply and communication parts required to be grounded. 2. Identify correct methods ...


IEEE-USA E-Books

No IEEE-USA E-Books are currently tagged "Electrodes"



Standards related to Electrodes

Back to Top

No standards are currently tagged "Electrodes"


Jobs related to Electrodes

Back to Top