Conferences related to Electrodes

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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 48th European Microwave Conference (EuMC)

The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessionsand workshops are held on the full range of microwave technology from field theory, throughcomponents and subsystems to systems.

  • 2017 47th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2016 46th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology. The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2015 European Microwave Conference (EuMC 2015)

    The 45th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2015, the largest event in Europe dedicated to microwave components, systems and technology. It is the premier event to present the current status and future trends in the field of microwave, millimeter-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.The European Microwave Conference provides many opportunities of networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. In addition to scientific papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defense systems.

  • 2014 44th European Microwave Conference (EuMC)

    EuMC is the premier European conference in the microwave field, which represent the ideal venue for prospective authors to present the status and trends in microwave and millimetre-wave systems and frequency related topics, from materials and technologies to integrated circuits, systems their aspects: theory, simulation, design and measurement including passive components, design of high frequency and high data rate photonics, highly stable and noiseless microwave wave sources, new linearisation techniques and the impact of new packaging technologies.

  • 2013 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre -wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in alltheir aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development

  • 2012 European Microwave Conference (EuMC)

    Microwave and millimeter wave: active/passive devices, antennas, electromagnetics, bio-interaction, circuits, manufacturing and measurement, MEMS, meta-materials, sensor networks, cognitive radio, 4G communications, space technology and applications.

  • 2011 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development app

  • 2010 European Microwave Conference (EuMC)

    The European Microwave Conference is the premier forum for presentation of the present status and future trends in the field of microwave, millimetre- and submillimetre-wave systems and technologies.

  • 2009 European Microwave Conference (EuMC)

    The 39th European Microwave Conference (EuMC), is the core of the European Microwave Week 2009, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2008 European Microwave Conference (EuMC)

    The 38th European Microwave Conference (EuMC) in Amsterdam, The Netherlands, from 27 to 31 October, is the core of the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2007 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging.

  • 2006 European Microwave Conference (EuMC)

  • 2005 European Microwave Conference (EuMC)

  • 2004 European Microwave Conference (EuMC)

  • 2003 European Microwave Conference (EuMC)

  • 1998 28th European Microwave Conference (EuMC)

  • 1997 27th European Microwave Conference (EuMC)


2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

Nanotechnology

  • 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO)

    IEEE Nano is one of the largest nanotechnology conferences in the world, directly sponsored by the IEEE Nanotechnology Council. IEEE NANO 2017 will provide an international forum for inspiration, interactions and exchange of ideas in a wide variety of branches of nanotechnology and nanoscience, through feature tutorials, workshops, and track sessions; plenary and invited talks from the world most renowned scientists and engineers; exhibition of software, hardware, equipment, materials, services and literature. It is a must for students, educators, researchers, scientists and engineers engaged in a wide range of nanotechnology fields and related applications, including electronic materials, photonics, biotechnology, medicine, alternative energy, environment and electronic devices.

  • 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO)

    IEEE-NANO is the flagship IEEE Nanotechnology conference. The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope is to bring together researchers, industry workers, entrepreneurs and funding agency leaders, in the general area of nanotechnology. IEEE NANO 2015 will provide a forum for the exchange of ideas, interaction, networking and collaboration for research and development in nanotechnology with special attention to the latest advances in nanotechnology

  • 2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

    NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2013 IEEE 13th International Conference on Nanotechnology (IEEE-NANO)

    Nanoelectronics, nanomanufacturing, nanomaterials, nanodevice, nanofibration, nanofluidics, nano-bio-medicine, NEMS applications, nanocircuits, nanorobotics, nanomanipulation, nanosensors and actuators, nanophotonics, nanomagnetics, micro-to-nano-scale bridging

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.

  • 2008 8th IEEE Conference on Nanotechnology (IEEE-NANO)

    This conference is the sequel to meetings held in Maui (2001), Washington (2002), San Francisco (2003), Munich (2004), Nagoya (2005), Cinncinati (2006), and Hong Kong (2007). The conference focus will be on engineering and business issues related to nanoelectronics, circuits, architectures, sensor systems, integration, reliability and manufacturing in addition to fundamental issues such as modeling, growth/synthesis, and characterization. The conference will feature plenary, invited, and contributed papers

  • 2007 7th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2006 6th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2005 5th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2004 4th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2003 3rd IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2002 2nd IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2001 1st IEEE Conference on Nanotechnology (IEEE-NANO)


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Periodicals related to Electrodes

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Reviews in

The IEEE Reviews in Biomedical Engineering will review the state-of-the-art and trends in the emerging field of biomedical engineering. This includes scholarly works, ranging from historic and modern development in biomedical engineering to the life sciences and medicine enabled by technologies covered by the various IEEE societies.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Electrodes

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Xplore Articles related to Electrodes

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Numerical study of the stator motion in a piezoelectric ultrasonic motor

[{u'author_order': 1, u'affiliation': u'University POLITEHNICA of Bucharest, Bucharest, Romania', u'full_name': u'A. M. Morega'}, {u'author_order': 2, u'affiliation': u'Universidad de Valladolid, Valladolid, Spain', u'full_name': u'G. Robello'}, {u'author_order': 3, u'affiliation': u'University POLITEHNICA of Bucharest, Bucharest, Romania', u'full_name': u'M. Morega'}, {u'author_order': 4, u'affiliation': u'National Institute for Electrical Engineering, ICPE-CA, Bucharest, Romania', u'full_name': u'L. P\xeeslaru-D\u0103nescu'}] 2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), None

This paper presents mathematical modeling and numerical simulation results that are part of a study concerning the dynamics of the stator of piezoelectric (PZ) traveling wave (TW) rotating ultrasonic motor. The stator is a PZ composite ring, and the rotor is a metallic ring. The rotational torque is produced by exciting the stator into a flexural traveling wave, transmitted to ...


Optimizing the Spectral Response from Coplanar-Grid Sensors

[{u'author_order': 1, u'affiliation': u'Instrumentation Division, Brookhaven National Laboratory, Upton, NY 11973.', u'full_name': u'Gianluigi De Geronimo'}, {u'author_order': 2, u'affiliation': u'National Synchrotron Light Source, Brookhaven National Laboratory, Upton, NY 11973, USA.', u'full_name': u'Gabriella Carini'}, {u'author_order': 3, u'affiliation': u'Instrumentation Division, Brookhaven National Laboratory, Upton, NY 11973.', u'full_name': u'Jack Fried'}, {u'author_order': 4, u'affiliation': u'eV PRODUCTS, Division of II-VI Inc., Saxonburg, PA 16056 USA.', u'full_name': u'Stephen A. Soldner'}] 2006 IEEE Nuclear Science Symposium Conference Record, None

The coplanar-grid (CPG) technique applied to CdZnTe (CZT) crystals resulted in efficient and large volume room-temperature gamma-ray detectors. In order to achieve a good spectral response with CPG sensors, some correction of the electron trapping effect must be applied. This is typically done either by reducing the gain of one of the two co-planar grid signals, or by using for ...


Multi channel high aspect ratio glass microelectrode array for neuroprosthetic applications

[{u'author_order': 1, u'affiliation': u'Blackrock Microsystems 391 Chipeta Way, Suite G, Salt Lake City, UT, 84108', u'full_name': u'Sandeep Negi'}, {u'author_order': 2, u'affiliation': u'Blackrock Microsystems 391 Chipeta Way, Suite G, Salt Lake City, UT, 84108', u'full_name': u'Rajmohan Bhandari'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

To map neural signal in the brain 3D electrodes are desired. 3D electrodes are difficult fabricate due to the cumbersome assembly process. In this work, 2D array of glass electrodes were designed and later assembles into 3D by simple assembly process. Glass was used as a dielectric material to provide better electrical isolation capability and better biocompatibility compared to silicon. ...


Thin film Barium-Strontium-Titanate Parallel-Plate varactors integrated on low-resistivity silicon and saphhire substrate

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Comput. Eng., Univ. of Dayton, Dayton, OH, USA', u'full_name': u'HailingYue'}, {u'author_order': 2, u'affiliation': u'Dept. of Electr. & Comput. Eng., Univ. of Dayton, Dayton, OH, USA', u'full_name': u'Dustin Brown'}, {u'author_order': 3, u'affiliation': u'Dept. of Electr. & Comput. Eng., Univ. of Dayton, Dayton, OH, USA', u'full_name': u'Guru Subramanyam'}, {u'author_order': 4, u'affiliation': u'Sensors Directorate, Wright Patterson Air Force Res. Lab., Wright-Patterson AFB, OH, USA', u'full_name': u'Kevin Leedy'}, {u'author_order': 5, u'affiliation': u'Sensors Directorate, Wright Patterson Air Force Res. Lab., Wright-Patterson AFB, OH, USA', u'full_name': u'Charles Cerny'}] 2013 Joint IEEE International Symposium on Applications of Ferroelectric and Workshop on Piezoresponse Force Microscopy (ISAF/PFM), None

Barium-Strontium-Titanate (BST) thin film based ferroelectric varactors are designed at specific capacitances under 0V dc bias on CMOS compatible low- resistivity silicon substrate. The BST varactor device operation is based on the nonlinear dielectric tunability of BST thin film sandwiched between two metal plates in a revised conductor-backed coplanar waveguide (CBCPW) transmission line configuration. The varactor capacitance at 0V dc ...


Microprocessor-based insulin delivery device with amperometric glucose sensing

[{u'author_order': 1, u'affiliation': u'University of Western Australia, School of Electrical, Electronic and Computer Engineering, 35 Stirling Highway, Crawley 6009, Australia', u'full_name': u'Fred Chee'}, {u'author_order': 2, u'affiliation': u'University of Western Australia, School of Electrical, Electronic and Computer Engineering, 35 Stirling Highway, Crawley 6009, Australia. tyrone@ee.uwa.edu.au', u'full_name': u'Tyrone L. Fernando'}, {u'author_order': 3, u'affiliation': u'Deakin University, School of Engineering Technology, Geelong, Australia. hmt@deakin.edu.au', u'full_name': u'Hieu M. Trinh'}] First International Conference on Industrial and Information Systems, None

This paper details the design of a closed-loop insulin delivery device, consisting of a glucose sensing circuit, and a basic microprocessor-based syringe pump. The glucose sensing circuit contains the required components to interface with CGMS's glucose sensor assembly, while the syringe pump design uses microprocessor to allow flexible control over the pump driver. Instrumentation developed in this paper provides a ...


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Educational Resources on Electrodes

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IEEE-USA E-Books

  • Introduction

    The development of Doppler radar for remote sensing of vital signs, with proof of concept demonstrated for various applications, could offer a platform for unobtrusive, noncontact, yet continuous physiological monitoring systems. Early identification of patient deterioration is important, as it can prevent subsequent cardiopulmonary arrest and reduce mortality. Assessment of cardiopulmonary functions is most often performed with contact sensors when direct access to the subject is available. Monitoring the cardiac state of burn victims can be challenging because it is sometimes difficult to find enough skin on which to apply an electrocardiogram (ECG) electrode. Cardiopulmonary activity is the main parameter used in the study of sleep disorders. Widespread use of microwave technology and digital processors in common household communications devices has driven down costs, making it possible to develop practical radar monitors that cost significantly less than conventional cardiopulmonary assessment instruments.

  • Recording Materials for Holography

    This chapter discusses various recording materials for holography, including silver halide materials, photopolymer, photoresist, and dichromated gelatin (DCG). The silver halide materials chosen for holography are essentially gelatin‐based suspensions which are traditionally known as "emulsions", although technically defying the definition of "emulsion". These are, in the case of holographic recording materials, definitively based upon silver bromide, although silver chloride is also well known as a really useful photosensitive material, which is used extensively in the emulsions used for photographic papers. DCG has played a rather glorious role in holography in the past. As gelatin is such a remarkably inexpensive material, this method, which is capable of very high index modulation and diffraction efficiency over both narrow and wide spectral bandwidths, appeared to have a promising future until the advent of the photopolymer recording materials for holography.

  • Practical Source/Drain Diffusion and Body Doping Layouts for High¿¿¿Performance and Low¿¿¿Energy Triple¿¿¿Gate SOI MOSFETs

    This chapter describes the impact of taking a holistic approach to designing the source and drain (S/D) structures of triple¿¿¿gate silicon¿¿¿on¿¿¿insulator metal oxide semiconductor field¿¿¿effect transistors (TG SOI MOSFETs) on their resulting performance; here the FinFET structure is considered to be realistic. The fundamental tradeoff between drive current (_ION _) and short¿¿¿channel effects, which should result in a negative impact on device performance, is demonstrated for devices with various S/D structures. Practical design guidelines are proposed to raise drivability and suppress the degradation in subthreshold swing in future nano¿¿¿scale TG SOI MOSFETs. It is shown that a low¿¿¿doping p¿¿¿region for nMOS device (or n¿¿¿region for pMOS device) should be put beneath the n+¿¿¿S/D for nMOS device (p+¿¿¿S/D for pMOS device) diffusion layer in order to ensure drivability while suppressing the buried¿¿¿insulator¿¿¿induced barrier¿¿¿lowering (BIIBL) effect. It is also shown that a low¿¿¿fin device with a shallow junction should be used in order to ensure drivability per unit channel width, and that a high¿¿¿fin device with a shallow junction should be used in order to achieve low standby power consumption.

  • New Technologies

    New technologies generate industrial innovations. This chapter describes several new technologies: non¿¿¿ITO transparent electrode, organic TFT, wet¿¿¿processed TFT, wet¿¿¿processed OLED, roll¿¿¿to¿¿¿roll equipment, and quantum dot. Most of these are compatible with wet processes and are flexible. This means that wet processes and flexible are strongly required and related to the generation change of organic electronics technologies because wet processes and flexible give new value to products and low cost.

  • Properties and Whisker Formation Behavior of Tin¿¿¿Based Alloy Finishes

    This chapter reviews the basic properties of tin¿¿¿based alloy finishes and the effect of various alloying elements on whisker formation. The focus is on whisker test data and potential mechanisms for whisker suppression or enhancement for each element. A close look based on experimental data at the mechanisms of spontaneous whisker formation or suppression in matte Sn¿¿¿Cu alloy finishes reveals how adding minor elements to the copper base material (lead frame) can significantly change the whisker formation propensity of the alloy finish. Significantly different tendencies of whisker formation from the same matte Sn¿¿¿Cu coating electrodeposited on two different copper lead frames, namely, copper¿¿¿iron and copper¿¿¿chromium, were found. The results of these examinations clarified the mechanisms of formation and suppression of whiskers grown from the Sn¿¿¿Cu coating, and they established a countermeasure against the spontaneous whisker formation through the selection of the copper lead¿¿¿frame material.

  • Performance Prediction of SOI Tunneling¿¿¿Barrier¿¿¿Junction MOSFET

    In this chapter, we describe the operation characteristics of a silicon¿¿¿on¿¿¿insulator (SOI) tunneling¿¿¿barrier¿¿¿junction (TBJ) MOSFET and simulation methods with the aid of the commercial 2¿¿¿D device simulator. No scattering (ballistic transport) is assumed in the electron conduction. It is shown that the device exhibits current¿¿¿voltage characteristics similar to those of the conventional MOSFET. The subthreshold swing and off¿¿¿leakage current of the device are much smaller than those of modern MOSFETs; short¿¿¿channel effects are sufficiently suppressed. However, generally speaking, the drive current of TBJ MOSFET is smaller than that of the conventional MOSFET. In order to increase the drive current, the optimization method for the device structure of TBJ MOSFET is discussed in detail.

  • Closing Switches

    Closing switches are required to withstand high voltages and then rapidly enter a conducting state that will pass high currents with minimal losses. This chapter describes spark gap closing switches in considerable detail because of their ubiquitous use in pulsed power technology. It then describes other closing switches, including thyratrons, ignitrons, and pseudospark switches, as well as commercially available solid¿¿¿state switches. A spark gap is comprised of two conducting electrodes separated by an insulating medium, usually a gas, but liquids or vacuum are also used. The pseudospark switch exhibits remarkable switching properties, combining the advantages of thyratrons and spark gaps, specifically high _dI/dt_, reverse current, and charge transfer capabilities, along with long lifetime and low jitter. A solid dielectric switch consists of two main insulation sheets, a trigger insulation foil, and two metallic foils sandwiched between the main electrodes E1 and E2 by an external clamping force.

  • CSC¿¿¿HVDC Transmission

    A Current¿¿¿Sourced Converter (CSC) ¿¿¿ High Voltage Direct Current Transmission (HVDC) link can be either long distance or back¿¿¿to¿¿¿back (BTB). In a long¿¿¿distance HVDC system, the rectifier and inverter stations are connected via an overhead line or cable or a combination of both. In a BTB system, there is no HVDC line or cable. The power flow is from a rectifier to the inverter. There is no reactive power exchange between the two stations. The main configurations of HVDC transmission systems are bipolar lines, monopolar lines, and BTB links. The DC side controls of the general arrangement of control for a bipole HVDC link, in terms of the time constants are hierarchized into three levels, the master control, the pole control and the valve electronics control. The overall control of an HVDC link requires adequate communication with the AC system national/regional control center. Adequate communication is also required in case of transient or fault conditions.

  • Intelligent Cap Interface for Wheelchair Control

    This chapter contains sections titled: Introduction Electromyography and Electrooculography Approach Interface Experimental Study Conclusion



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