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2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
The conference will cover diverse topics ranging from biomedical engineering to healthcare technologies to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions and oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by IEEE Xplore and Medline/PubMed.
Design, operation, analysis, application, and optimization of electric machinery and drive systems and their components. A venue for users, researchers, designers, and manufacturers of electric machines and drives and their related power electronics and controls.
Artificial intelligence; data management; information security; software engineering.
2012 World Automation Congress (WAC)
WAC has its scope on robotics, automation, systems engineering, bio-medical engineering, multi-media, image processing and soft computing all built into a 5-tier symposia.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.
Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control was the number-three journal in acoustics in 2002, according to the annual Journal Citation Report (2002 edition) published by the Institute for Scientific Information. This publication focuses on the theory, design, and application on generation, transmission, and detection of bulk and surface mechanical waves; fundamental studies in physical acoustics; design of sonic ...
Jonsson, H.; Moshfegh, B. Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on, 2000
Tests have been conducted in a wind tunnel with seven types of heat sinks including plate fin, strip fill, and pin fin heat sinks. In the case of strip fin, and pin fin heat sinks, both inline and staggered arrays have been studied. The pin fin heat sinks had circular and square cross-sections. For each type, tests were run with ...
Der Houhanessian, V.; Zaengl, Walter S. Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on, 1997
Results of relaxation current measurements on impregnated pressboard samples and on multi-layer arrangements of pressboards in series with oil ducts are presented. The measurements have been performed dependent on the material properties of oil and pressboard and the volume ratio of these materials. Calculated values of related dielectric quantities such as tanδ versus frequency, based on equivalent circuits obtained from ...
Faghri, M.; Molki, M.; Chrupcala, J.; Asako, Y. Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on, 1994
A numerical study is conducted to investigate the entrance behavior of turbulent flow over arrays of rectangular heated blocks. The problem formulation is three dimensional and the solution domain includes both the developing and fully-developed regions of the array. The blocks are deployed along the lower wall of a parallel-plate duct in an attempt to simulate the cooling passages of ...
Fleming, J.; Narasimhan, S. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, 2012
Switches deployed in data centers often utilize side-to-side airflow cooling. This airflow pattern can cause heated exhaust air to flow to the inlet of adjacent equipment in open rack installations or re-circulate to the switch inlet in cabinet applications. Through the use of CFD and testing, ducting solutions have been developed that improve inlet air conditions for both open rack ...
Rosenberg, L.T. Power Apparatus and Systems, Part III. Transactions of the American Institute of Electrical Engineers, 1957
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