Conferences related to Driver circuits

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2014 IEEE International Symposium on Circuits and Systems (ISCAS)

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world's premier networking forum in the highly active fields of theory, design and implementation of circuits and systems.ISCAS 2014 will have a special focus on nano/bio circuits and systems applied to enhancing living and lifestyles, and seeks to address multidisciplinary challenges in healthcare and well-being, the environment and climate change.

  • 2013 IEEE International Symposium on Circuits and Systems (ISCAS)

    The Symposium will focus on circuits and systems employing nanodevices (both extremely scaled CMOS and non-CMOS devices) and circuit fabrics (mixture of standard CMOS and evolving nano-structure elements) and their implementation cost, switching speed, energy efficiency, and reliability. The ISCAS 2010 will include oral and poster sessions; tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to th

  • 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012

    2012 International Symposium on Circuits and Systems (ISCAS 2012) aims at providing the world's premier forum of leading researchers in circuits and systems areas from academia and industries, especially focusing on Convergence of BINET (BioInfoNanoEnviro Tech.) which represents BT, IT, NT and ET and leading Human Life Revolutions. Prospective authors are invited to submit papers of their original works emphasizing contributions beyond the present state of the art. We also welcome proposals on special tuto

  • 2011 IEEE International Symposium on Circuits and Systems - ISCAS 2011

    The IEEE International Symposium on Circuits and Systems (ISCAS) is the world's premier networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems

  • 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010

    ISCAS is a unique conference dealing with circuits and systems. It's the yearly rendez-vous of leading researchers, coming both from academia and industry, in the highly active fields of theory, design and implementation of circuits and systems. The Symposium will focus on circuits and systems for high quality life and consumer technologies, including mobile communications, advanced multimedia systems, sensor networks and Nano-Bio Circuit Fabrics and Systems.

  • 2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009

    Analog Signal Processing, Biomedical Circuits and Systems, Blind Signal Processing, Cellular Neural Networks and Array Computing, Circuits and Systems for Communications, Computer-Aided Network Design, Digital Signal Processing, Life-Science Systems and Applications, Multimedia Systems and Applications, Nanoelectronics and Gigascale Systems, Neural Systems and Applications, Nonlinear Circuits and Applications, Power Systems and Power Electronic Circuits, Sensory Systems, Visual Signal Processing and Communi


2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

It is the premier International Conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, and packages & systems.

  • 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    It is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

  • 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    It is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems

  • 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity

  • 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging (EPEP)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. This meeting is the premier conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity.

  • 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity

  • 2007 IEEE 16th Conference on Electrical Performance of Electronic Packaging (EPEP)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. This meeting is the premier conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity.

  • 2006 IEEE 15th Conference on Electrical Performance of Electronic Packaging (EPEP)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. This meeting is the premier conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity.

  • 2005 IEEE 14th Conference on Electrical Performance of Electronic Packaging (EPEP)


2013 IEEE Intelligent Vehicles Symposium (IV)

The IEEE Intelligent Vehicles Symposium (IV) is the premier annual forum sponsored by the IEEE Intelligent Transportation Systems Society. Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications

  • 2012 IEEE Intelligent Vehicles Symposium (IV)

    The INTELLIGENT VEHICLES SYMPOSIUM (IV 2012) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCIETY (ITSS). Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communic

  • 2011 IEEE Intelligent Vehicles Symposium (IV)

    THE INTELLIGENT VEHICLES SYMPOSIUM (IV'11) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCIETY (ITSS). Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in

  • 2010 IEEE Intelligent Vehicles Symposium (IV)

    THE INTELLIGENT VEHICLES SYMPOSIUM (IV'10) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCITY (ITSS). Researchers, academicians, practitioners and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures.

  • 2009 IEEE Intelligent Vehicles Symposium (IV)

    It gathers researchers from industry and universities to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere. Most of the papers will be poster presentations. Papers dealing with all aspects of vehicle-related intelligent systems and cooperation between vehicles and infrastructures are solicited for IV'09.


2012 10th IEEE/IAS International Conference on Industry Applications - INDUSCON 2012

The INDUSCON covers the main topic areas of interest of the Brazilian chapter of the IEEE Industry Applications Society, providing a forum for sharing theoretical and practical results related to the applications of Electrical and Electronic Engineering in industry.


APCCAS 2012-2012 IEEE Asia Pacific Conference on Circuits and Systems

2012 APCCAS will be focused on presenting new ideas, novel architectures, cutting-edge circuit techniques and technologies, for heterogeneous integration for circuits and systems.


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Periodicals related to Driver circuits

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Solid-State Circuits, IEEE Journal of

The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...




Xplore Articles related to Driver circuits

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Design of poly-Si TFT-LCD panel with integrated driver circuits for an HDTV/XGA projection system

Byong-Deok Choi; Heuisung Jang; Oh-Kyong Kwon; Hong-Gyu Kim; Myung-Jin Soh Consumer Electronics, IEEE Transactions on, 2000

Design techniques of 2.25-in. diagonal poly-Si TFT-LCD panel for an HDTV/XGA projection system are described, especially focusing on the driver circuits. The area-efficiency of the driver circuits is a very important design issue, because the integrated poly-Si driver circuits takes a very large area due to inferior device characteristics of single crystal-Si transistors. For area- efficiency, the pixel with a ...


Scalable driver I/O macromodels for statistical analysis

Mutnury, B.; Swaminathan, M.; Cases, M.; Nam Pham; De Araujo, D.N.; Matoglu, E. Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on, 2005

In this paper, scalable driver I/O macromodels have been proposed for efficient signal integrity and timing analysis of today's high-speed systems. Variations in semiconductor process, temperature, and power supply voltage affect the output voltage and current in driver circuits. The effect of these variations on driver and receiver circuits has been captured using Lagrange's interpolation technique. In this paper, scalable ...


Non-dissipative rail drivers for adiabatic circuits

Younis, S.G.; Knight, T.F., Jr. Advanced Research in VLSI, 1995. Proceedings., Sixteenth Conference on, 1995

Energy dissipation of CMOS circuits is becoming a major concern in the design of digital systems. Earlier, we presented a new form of CMOS charge recovery logic (SCRL), with an energy dissipation per operation that falls linearly with operating frequency, as opposed to the constant energy required for conventional CMOS circuits. These SCRL circuits, along with most adiabatic circuit techniques ...


Low Power Bootstrapped CMOS Differential Cross Coupled Driver

Garcia, J.C.; Montiel-Nelson, J.A.; Nooshabadi, S. Circuits and Systems, 2006. APCCAS 2006. IEEE Asia Pacific Conference on, 2006

This paper reports a high speed and low power consumption differential cross coupled bootstrapped CMOS driver circuit (db-driver). It is 34% faster and provides 8% less core area as compared to a counterpart circuit (Tseng and Wu, 1998) (yc-driver) using indirect bootstrap technique. In addition, db-driver reduces the power consumption by 35% db-driver is implemented on 0.13mum CMOS technology with ...


Modeling the Driver Load in the Presence of Process Variations

Wang, J.M.; Jun Li; Yanamanamanda, S.; Vakati, L.K.; Muchherla, K.K. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, 2006

Feature sizes of less than 90 nm and clock frequencies higher than 3 GHz calls for fundamental changes in driver-load models. New driver-load models must consider the process variation impact of the manufacturing procedure, the nonlinear behavior of the drivers, the inductance effects of the loads, and the slew rates of the output waveforms. The present deterministic driver-load models use ...


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Educational Resources on Driver circuits

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eLearning

Dual Port Sram - Write Path

Sheppard, Douglas Dual Port Sram - Write Path, 2011

The circuits in the write path from the bit cell through the write drivers and down to the write select circuitry are discussed. Specific analysis is done with one port writing while the other port is reading from the same row. The decoding approach for determining which bit line is driven low for a write is compared to the decoding ...


Understanding On-Chip Transmission Lines - Part 2

Deutsch, Alina Understanding On-Chip Transmission Lines - Part 2, 2006

This course delves further into the present-day on-chip wiring design practices and the special characteristics of on-chip lossy transmission lines. A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with frequency-dependent properties and the interaction between delta-I noise, common-mode ...


SRAM Design: ROW Decoder

Sheppard, Douglas SRAM Design: ROW Decoder, 2009

The access of a memory cell starts when the Word Line is asserted which is controlled by the Word Line Driver and the Row Decoder. This tutorial will focus on the design of the Row Decoder starting with an overview of a basic decoder, and then will describe a greatly improved version that is faster and presents a smaller load ...


SRAM Design - MUX Factor and Data Buffer

Sheppard, Douglas SRAM Design - MUX Factor and Data Buffer, 2009

This tutorial continues the design of the read path from the output of the sense amp through the Data Out Buffer into the data out driver and eventually to the pad that the customer connects to. The dual use of the sense amp clock signal is discussed whereby it creates an additional 1 of 2 decode that results in a ...


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Standards related to Driver circuits

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