Conferences related to Driver circuits

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2014 IEEE International Symposium on Circuits and Systems (ISCAS)

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world’s premier networking forum in the highly active fields of theory, design and implementation of circuits and systems.ISCAS 2014 will have a special focus on nano/bio circuits and systems applied to enhancing living and lifestyles, and seeks to address multidisciplinary challenges in healthcare and well-being, the environment and climate change.

  • 2013 IEEE International Symposium on Circuits and Systems (ISCAS)

    The Symposium will focus on circuits and systems employing nanodevices (both extremely scaled CMOS and non-CMOS devices) and circuit fabrics (mixture of standard CMOS and evolving nano-structure elements) and their implementation cost, switching speed, energy efficiency, and reliability. The ISCAS 2010 will include oral and poster sessions; tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to the community that cut across and beyond disciplines traditionally represented at ISCAS.

  • 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012

    2012 International Symposium on Circuits and Systems (ISCAS 2012) aims at providing the world's premier forum of leading researchers in circuits and systems areas from academia and industries, especially focusing on Convergence of BINET (BioInfoNanoEnviro Tech.) which represents IT, NT and ET and leading Human Life Revolutions. Prospective authors are invited to submit papers of their original works emphasizing contributions beyond the present state of the art. We also welcome proposals on special tuto

  • 2011 IEEE International Symposium on Circuits and Systems (ISCAS)

    The IEEE International Symposium on Circuits and Systems (ISCAS) is the world's premier networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems.

  • 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010

    ISCAS is a unique conference dealing with circuits and systems. It's the yearly "rendez-vous" of leading researchers, coming both from academia and industry, in the highly active fields of theory, design and implementation of circuits and systems. The Symposium will focus on circuits and systems for high quality life and consumer technologies, including mobile communications, advanced multimedia systems, sensor networks and Nano-Bio Circuit Fabrics and Systems.

  • 2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009

    Analog Signal Processing, Biomedical Circuits and Systems, Blind Signal Processing, Cellular Neural Networks and Array Computing, Circuits and Systems for Communications, Computer-Aided Network Design, Digital Signal Processing, Life-Science Systems and Applications, Multimedia Systems and Applications, Nanoelectronics and Gigascale Systems, Neural Systems and Applications, Nonlinear Circuits and Applications, Power Systems and Power Electronic Circuits, Sensory Systems, Visual Signal Processing and Communi


2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

It is the premier International Conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, and packages & systems.

  • 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    It is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

  • 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    It is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

  • 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity

  • 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. This meeting is the premier conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity.

  • 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity

  • 2007 IEEE 16th Conference on Electrical Performance of Electronic Packaging (EPEP)

  • 2006 IEEE 15th Conference on Electrical Performance of Electronic Packaging (EPEP)

  • 2005 IEEE 14th Conference on Electrical Performance of Electronic Packaging (EPEP)


2013 IEEE Intelligent Vehicles Symposium (IV)

The IEEE Intelligent Vehicles Symposium (IV) is the premier annual forum sponsored by the IEEE Intelligent Transportation Systems Society. Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere. Tutorials will be offered on the first day followed by three days of presentations. An exhibition area will be available for the presentation of products.

  • 2012 IEEE Intelligent Vehicles Symposium (IV)

    The INTELLIGENT VEHICLES SYMPOSIUM (IV 2012) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCIETY (ITSS). Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere.

  • 2011 IEEE Intelligent Vehicles Symposium (IV)

    THE INTELLIGENT VEHICLES SYMPOSIUM (IV'11) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCIETY (ITSS). Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in

  • 2010 IEEE Intelligent Vehicles Symposium (IV)

    THE INTELLIGENT VEHICLES SYMPOSIUM (IV'10) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCITY (ITSS). Researchers, academicians, practitioners and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures.

  • 2009 IEEE Intelligent Vehicles Symposium (IV)

    It gathers researchers from industry and universities to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere. Most of the papers will be poster presentations. Papers dealing with all aspects of vehicle-related intelligent systems and cooperation between vehicles and infrastructures are solicite


2012 10th IEEE/IAS International Conference on Industry Applications - INDUSCON 2012

The INDUSCON covers the main topic areas of interest of the Brazilian chapter of the IEEE Industry Applications Society, providing a forum for sharing theoretical and practical results related to the applications of Electrical and Electronic Engineering in industry.


APCCAS 2012-2012 IEEE Asia Pacific Conference on Circuits and Systems

2012 APCCAS will be focused on presenting new ideas, novel architectures, cutting-edge circuit techniques and technologies, for heterogeneous integration for circuits and systems.


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Periodicals related to Driver circuits

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Solid-State Circuits, IEEE Journal of

The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...




Xplore Articles related to Driver circuits

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CLOUDIO: A Cloud Computing-Oriented Multi-tenant Architecture for Business Information Systems

Enrique Jimé nez Domingo; Javier Torres Nino; Angel Lagares Lemos; Miguel Lagares Lemos; Ricardo Colomo Palacios; Juan Miguel Gó mez Berbí s 2010 IEEE 3rd International Conference on Cloud Computing, 2010

Cloud Computing is evolving from a mere "storage" technology to a new vehicle for Business Information Systems (BIS) to manage, organize and provide added- value strategies to current business models. However, the underlying infrastructure for Software-as-a-Service (SaaS) to become a new platform for trading partners and transactions must rely on intelligent, flexible, context- aware Multi-Tenant Architectures. In this paper, we ...


Efficient congestion control in VANET for safety messaging

Bilal Munir Mughal; Asif Ali Wagan; Halabi Hasbullah 2010 International Symposium on Information Technology, 2010

The prime goal of Vehicular Ad hoc Network (VANET) is to provide life safety on the road. To achieve this, vehicles make use of two types of safety messages i) Periodic safety messages (beacons): to exchange status information e.g. position, speed etc. ii) Event-driven messages: broadcast in case of an emergency situations e.g. accidents, hard-braking etc. As both type of ...


IMPATT-Diode Power Amplifiers for Digital Communication Systems

S. F. Paik; P. J. Tanzi; D. J. Kelley IEEE Transactions on Microwave Theory and Techniques, 1973

lMPATT-diode amplifiers with a power output of 1.0 W have been developed for use in an 11-GHz digital radio. Two types of amplifiers, a multistage reflection amplifier and a hybrid amplifier containing an injection-locked oscillator stage, have been evaluated by measuring the bit error rate degradation due to the amplifier. System test data show that the stable amplifier introduces little ...


P1–9: A driving circuit system with high voltage output for FED

Liu Gao; Shaozhi Deng International Vacuum Nanoelectronics Conference, 2010

A FED driving circuit system with adjustable parameters, resources optimizing, voltage output with 420 V, giving support to 640×3×480 resolution is presented. In the circuit system, the following design methode was introduced: double buffer, internal dual-port distributed RAM, and low-voltage differential signaling (LVDS) interface.


Morphing Smartphones into Automotive Application Platforms

Raja Bose; Jorg Brakensiek; Keun-Young Park; Jonathan Lester Computer, 2011

The Terminal Mode technology integrates smartphones into in-vehicle infotainment systems and transforms them into automotive application platforms on the fly, allowing drivers to safely access and interact with mobile applications.


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Educational Resources on Driver circuits

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eLearning

CLOUDIO: A Cloud Computing-Oriented Multi-tenant Architecture for Business Information Systems

Enrique Jimé nez Domingo; Javier Torres Nino; Angel Lagares Lemos; Miguel Lagares Lemos; Ricardo Colomo Palacios; Juan Miguel Gó mez Berbí s 2010 IEEE 3rd International Conference on Cloud Computing, 2010

Cloud Computing is evolving from a mere "storage" technology to a new vehicle for Business Information Systems (BIS) to manage, organize and provide added- value strategies to current business models. However, the underlying infrastructure for Software-as-a-Service (SaaS) to become a new platform for trading partners and transactions must rely on intelligent, flexible, context- aware Multi-Tenant Architectures. In this paper, we ...


Efficient congestion control in VANET for safety messaging

Bilal Munir Mughal; Asif Ali Wagan; Halabi Hasbullah 2010 International Symposium on Information Technology, 2010

The prime goal of Vehicular Ad hoc Network (VANET) is to provide life safety on the road. To achieve this, vehicles make use of two types of safety messages i) Periodic safety messages (beacons): to exchange status information e.g. position, speed etc. ii) Event-driven messages: broadcast in case of an emergency situations e.g. accidents, hard-braking etc. As both type of ...


IMPATT-Diode Power Amplifiers for Digital Communication Systems

S. F. Paik; P. J. Tanzi; D. J. Kelley IEEE Transactions on Microwave Theory and Techniques, 1973

lMPATT-diode amplifiers with a power output of 1.0 W have been developed for use in an 11-GHz digital radio. Two types of amplifiers, a multistage reflection amplifier and a hybrid amplifier containing an injection-locked oscillator stage, have been evaluated by measuring the bit error rate degradation due to the amplifier. System test data show that the stable amplifier introduces little ...


P1–9: A driving circuit system with high voltage output for FED

Liu Gao; Shaozhi Deng International Vacuum Nanoelectronics Conference, 2010

A FED driving circuit system with adjustable parameters, resources optimizing, voltage output with 420 V, giving support to 640×3×480 resolution is presented. In the circuit system, the following design methode was introduced: double buffer, internal dual-port distributed RAM, and low-voltage differential signaling (LVDS) interface.


Morphing Smartphones into Automotive Application Platforms

Raja Bose; Jorg Brakensiek; Keun-Young Park; Jonathan Lester Computer, 2011

The Terminal Mode technology integrates smartphones into in-vehicle infotainment systems and transforms them into automotive application platforms on the fly, allowing drivers to safely access and interact with mobile applications.


More eLearning Resources

IEEE.tv Videos

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IEEE-USA E-Books

  • Extreme Temperature Range Microelectronics

    Down-hole geothermal instrumentation must operate over a large temperature range. The technology and capabilities of room temperature to 300°C hybrid and printed-circuit (PC) board electronics that were developed during the last two years to meet that need are summarized. To ensure rapid widespread commercialization, this technology was developed, insofar as possible, using commerically available components, devices, and materials. Initial extensive high-temperature characterization revealed that selected thickfilm passive components and silicon junction-field-effect transistors had electrical parameters sufficiently insensitive to temperature change and sufficiently constant in time at high temperatures to form the backbone of this circuitry. Attachment techniques needed to be developed, since standard methods failed at high temperatures. Similarly, circuit design innovations were needed because of the restricted list of parts. Voltage regulators, line drivers, voltage comparators, special purpose amplifiers and multiplexers were constructed and operated over the 25-300°C temperature range. Temperature and pressure monitoring instruments using these circuits have been used for downhole measurements in geothermal wells. Methods of fabrication, circuit performance, and the scope of future work are discussed.

  • Mixed Signals, Technology and Techniques

    A practical guide to the successful integration of digital and analog circuits Mixed-signal processing-the integration of digital and analog circuitry within computer systems-enables systems to take signals from the analog world and process them within a digital system. In fact, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that requires the use of analog pre- and post-processing systems such as converters, filters, sensors, drivers, buffers, and actuators. However, the lack of universal CAD tools for the synthesis, simulation, and layout of the analog part of the chip represents a design bottleneck of today's VLSI circuits. Mixed-Signal Systems: A Guide to CMOS Circuit Design presents a comprehensive general overview of the latest CMOS technology and covers the various computer systems that may be used for designing integrated circuits. Taking an original approach to one- and two- dimensional filter design, the author explores the many digital-oriented design systems, or silicon compilers, currently being used, and presents the basic methods, procedures, and tools used by each. In a thorough and systematic manner, the text: * Presents common features of digital-oriented design systems * Describes methods and tools that are not yet being applied in any compiler * Illustrates image processing systems that can be implemented on a single chip * Demonstrates the path from synthesis methods to the actual silicon assembly Essential reading for integrated circuit designers and developers of related computer programs, as well as advanced students of system design, this book represents an invaluable resource for anyone involved in the development of mixed-signal systems.

  • References

    A practical guide to the successful integration of digital and analog circuits Mixed-signal processing-the integration of digital and analog circuitry within computer systems-enables systems to take signals from the analog world and process them within a digital system. In fact, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that requires the use of analog pre- and post-processing systems such as converters, filters, sensors, drivers, buffers, and actuators. However, the lack of universal CAD tools for the synthesis, simulation, and layout of the analog part of the chip represents a design bottleneck of today's VLSI circuits. Mixed-Signal Systems: A Guide to CMOS Circuit Design presents a comprehensive general overview of the latest CMOS technology and covers the various computer systems that may be used for designing integrated circuits. Taking an original approach to one- and two- dimensional filter design, the author explores the many digital-oriented design systems, or silicon compilers, currently being used, and presents the basic methods, procedures, and tools used by each. In a thorough and systematic manner, the text: * Presents common features of digital-oriented design systems * Describes methods and tools that are not yet being applied in any compiler * Illustrates image processing systems that can be implemented on a single chip * Demonstrates the path from synthesis methods to the actual silicon assembly Essential reading for integrated circuit designers and developers of related computer programs, as well as advanced students of system design, this book represents an invaluable resource for anyone involved in the development of mixed-signal systems.

  • Clock Distribution

    This chapter contains sections titled: Introduction Objectives Implementation Clock Driver Layout Variation Conclusion This chapter contains sections titled: References

  • An 8Bit 2ns Monolithic DAC

    An 8-bit resolution ultra-high-speed monolithic digital-to-analog converter (DAC) is fabricated using super self-aligned process technology (SST). In order to improvedynamic8CCUIK)', wbidI is determined by settling speed, clock feed through noise, and glitch,a number of new circuit technologies Ire developed including a rise - and fall-time control switch driver. a low- noise flip-flop, and a differential buffer configuration. In addition, a new clip assembly technology is developed employing a multilayer ceramic substrate. Performance measurements show a settling time to 8-bit accuracy of about 2 ns, a maximum conversion rate of 1 GHz, a glitch energy of 2 ps.V, and a 10-bit linearity error accuracy without trimming.

  • Index

    A practical guide to the successful integration of digital and analog circuits Mixed-signal processing-the integration of digital and analog circuitry within computer systems-enables systems to take signals from the analog world and process them within a digital system. In fact, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that requires the use of analog pre- and post-processing systems such as converters, filters, sensors, drivers, buffers, and actuators. However, the lack of universal CAD tools for the synthesis, simulation, and layout of the analog part of the chip represents a design bottleneck of today's VLSI circuits. Mixed-Signal Systems: A Guide to CMOS Circuit Design presents a comprehensive general overview of the latest CMOS technology and covers the various computer systems that may be used for designing integrated circuits. Taking an original approach to one- and two- dimensional filter design, the author explores the many digital-oriented design systems, or silicon compilers, currently being used, and presents the basic methods, procedures, and tools used by each. In a thorough and systematic manner, the text: * Presents common features of digital-oriented design systems * Describes methods and tools that are not yet being applied in any compiler * Illustrates image processing systems that can be implemented on a single chip * Demonstrates the path from synthesis methods to the actual silicon assembly Essential reading for integrated circuit designers and developers of related computer programs, as well as advanced students of system design, this book represents an invaluable resource for anyone involved in the development of mixed-signal systems.

  • Figures of Merit to Characterize the Importance of OnChip Inductance

    A closed form solution for the output signal of a CMOS inverter driving an _RLC_ transmission line is presented. This solution is based on the alpha power law for deep submicrometer technologies. Two figures of merit are presented that are useful for determining if a section of interconnect should be modeled as either an _RLC_ or an _RC_ impedance. The damping factor of a lumped _RLC_ circuit is shown to be a useful figure of merit. The second useful figure of merit considered in this paper is the ratio of the rise time of the input signal at the driver of an interconnect line to the time of flight of the signals across the line. AS/X circuit simulations of an _RLC_ transmission line and a five section _RC_ II circuit based on a 0.25 µm IBM CMOS technology are used to quantify and determine the relative accuracy of an _RC_ model. One primary result of this study is evidence demonstrating that a range for the length of the interconnect exists for which inductance effects are prominent. Furthermore, it is shown that under certain conditions, inductance effects are negligible despite the length of the section of interconnect.

  • Analyzing OnChip Interconnect Effects

    This chapter contains sections titled: Introduction Simplified Interconnect Analysis Model Order Reduction Driver Models Conclusion This chapter contains sections titled: References

  • VHDL Design with Basic Displays

    This chapter contains sections titled: Introduction, Basic LED/SSD/LCD Driver, Playing with a Seven-Segment Display, Frequency Meter (with LCD), Digital Clock (with SSDs), Quick-Finger Game (with LEDs and SSDs)Other Designs with Basic Displays, Exercises

  • Advances in BiCMOS and Bipolar Circuits

    This chapter contains sections titled: An Overview of BiCMOS State-of-the-Art Digital Circuits Performance Comparison of Driver Configurations and Full-Swing Techniques for BiCMOS Logic Circuits A Feedback-Type BiCMOS logic Gate A High Performance BiCMOS 32-bit Microprocessor O.5-?>m- 2M-Transistor BiPNMOS Channelless Gate Array A 1.5-V Full-Swing BiCMOS Logic Circuit 3.3-V BiCMOS Circuit Techniques for 250-MHz RISC Arithmetic Modules Advanced Bipolar Circuits High-Performance Standard Cell Library and Modeling Technique for Differential Advanced Bipolar Current Tree Logic High-Speed Low-Power ECL Circuit with AC-Coupled Self-Biased Dynamic Current Source and Active-Pull-Down Emitter-Follower Stage Self-Biased Feedback-Controlled Pull-Down Emitter Follower for High-Speed Low- Power Bipolar Logic Circuits An ECL Gate with Improved Speed and Low Power in a BiCMOS Process Merged CMOS/Bipolar Current Switch Logic (MCSL)



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