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2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
It is the premier International Conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, and packages & systems.
2013 IEEE Intelligent Vehicles Symposium (IV)
The IEEE Intelligent Vehicles Symposium (IV) is the premier annual forum sponsored by the IEEE Intelligent Transportation Systems Society. Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications
2013 IEEE International Symposium on Circuits and Systems (ISCAS)
The Symposium will focus on circuits and systems employing nanodevices (both extremely scaled CMOS and non-CMOS devices) and circuit fabrics (mixture of standard CMOS and evolving nano-structure elements) and their implementation cost, switching speed, energy efficiency, and reliability. The ISCAS 2010 will include oral and poster sessions; tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to th
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)
TRANSDUCERS conference is the largest multidisciplinary conference on Microsensors, Microactuators and Microsystems, with about more than 1000 attendees from university, research institute, government and industry who gather every two years to exchange the latest advances in the field. The coming Transducers'13 conference is the 17th international conference on solid-state sensors, actuators and Microsystems of the TRANSDUCERS conference series started at 1981 in Boston (USA), and it is the first time for t
2012 10th IEEE/IAS International Conference on Industry Applications - INDUSCON 2012
The INDUSCON covers the main topic areas of interest of the Brazilian chapter of the IEEE Industry Applications Society, providing a forum for sharing theoretical and practical results related to the applications of Electrical and Electronic Engineering in industry.
Byong-Deok Choi; Heuisung Jang; Oh-Kyong Kwon; Hong-Gyu Kim; Myung-Jin Soh Consumer Electronics, IEEE Transactions on, 2000
Design techniques of 2.25-in. diagonal poly-Si TFT-LCD panel for an HDTV/XGA projection system are described, especially focusing on the driver circuits. The area-efficiency of the driver circuits is a very important design issue, because the integrated poly-Si driver circuits takes a very large area due to inferior device characteristics of single crystal-Si transistors. For area- efficiency, the pixel with a ...
Mutnury, B.; Swaminathan, M.; Cases, M.; Nam Pham; De Araujo, D.N.; Matoglu, E. Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on, 2005
In this paper, scalable driver I/O macromodels have been proposed for efficient signal integrity and timing analysis of today's high-speed systems. Variations in semiconductor process, temperature, and power supply voltage affect the output voltage and current in driver circuits. The effect of these variations on driver and receiver circuits has been captured using Lagrange's interpolation technique. In this paper, scalable ...
Garcia, J.C.; Montiel-Nelson, J.A.; Nooshabadi, S. Circuits and Systems, 2006. APCCAS 2006. IEEE Asia Pacific Conference on, 2006
This paper reports a high speed and low power consumption differential cross coupled bootstrapped CMOS driver circuit (db-driver). It is 34% faster and provides 8% less core area as compared to a counterpart circuit (Tseng and Wu, 1998) (yc-driver) using indirect bootstrap technique. In addition, db-driver reduces the power consumption by 35% db-driver is implemented on 0.13mum CMOS technology with ...
Younis, S.G.; Knight, T.F., Jr. Advanced Research in VLSI, 1995. Proceedings., Sixteenth Conference on, 1995
Energy dissipation of CMOS circuits is becoming a major concern in the design of digital systems. Earlier, we presented a new form of CMOS charge recovery logic (SCRL), with an energy dissipation per operation that falls linearly with operating frequency, as opposed to the constant energy required for conventional CMOS circuits. These SCRL circuits, along with most adiabatic circuit techniques ...
Takahashi, K.; Kwon, H.N.; Mita, M.; Fujita, H.; Toshiyoshi, H.; Suzuki, K.; Funaki, H. Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on, 2005
In this paper, we report monolithic integration of MEMS (micro electro mechanical systems) actuators and high-voltage driver circuits into a silicon chip. Driver circuits of up to 40 V were prepared on an 8-μm-thick SOI (silicon-on-insulator) wafer by the DMOS (double-diffused metal oxide semiconductor) processes, after which MEMS electrostatic actuators were integrated into an identical SOI layer by post-processing using ...
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Sheppard, Douglas Dual Port Sram - Write Path, 2011
The circuits in the write path from the bit cell through the write drivers and down to the write select circuitry are discussed. Specific analysis is done with one port writing while the other port is reading from the same row. The decoding approach for determining which bit line is driven low for a write is compared to the decoding ...
Deutsch, Alina Understanding On-Chip Transmission Lines - Part 2, 2006
This course delves further into the present-day on-chip wiring design practices and the special characteristics of on-chip lossy transmission lines. A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with frequency-dependent properties and the interaction between delta-I noise, common-mode ...
Sheppard, Douglas SRAM Design: ROW Decoder, 2009
The access of a memory cell starts when the Word Line is asserted which is controlled by the Word Line Driver and the Row Decoder. This tutorial will focus on the design of the Row Decoder starting with an overview of a basic decoder, and then will describe a greatly improved version that is faster and presents a smaller load ...
Sheppard, Douglas SRAM Design - MUX Factor and Data Buffer, 2009
This tutorial continues the design of the read path from the output of the sense amp through the Data Out Buffer into the data out driver and eventually to the pad that the customer connects to. The dual use of the sense amp clock signal is discussed whereby it creates an additional 1 of 2 decode that results in a ...
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Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes
Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...