Conferences related to Driver circuits

Back to Top

2014 IEEE International Symposium on Circuits and Systems (ISCAS)

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world’s premier networking forum in the highly active fields of theory, design and implementation of circuits and systems.ISCAS 2014 will have a special focus on nano/bio circuits and systems applied to enhancing living and lifestyles, and seeks to address multidisciplinary challenges in healthcare and well-being, the environment and climate change.

  • 2013 IEEE International Symposium on Circuits and Systems (ISCAS)

    The Symposium will focus on circuits and systems employing nanodevices (both extremely scaled CMOS and non-CMOS devices) and circuit fabrics (mixture of standard CMOS and evolving nano-structure elements) and their implementation cost, switching speed, energy efficiency, and reliability. The ISCAS 2010 will include oral and poster sessions; tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to the community that cut across and beyond disciplines traditionally represented at ISCAS.

  • 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012

    2012 International Symposium on Circuits and Systems (ISCAS 2012) aims at providing the world's premier forum of leading researchers in circuits and systems areas from academia and industries, especially focusing on Convergence of BINET (BioInfoNanoEnviro Tech.) which represents IT, NT and ET and leading Human Life Revolutions. Prospective authors are invited to submit papers of their original works emphasizing contributions beyond the present state of the art. We also welcome proposals on special tuto

  • 2011 IEEE International Symposium on Circuits and Systems (ISCAS)

    The IEEE International Symposium on Circuits and Systems (ISCAS) is the world's premier networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems.

  • 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010

    ISCAS is a unique conference dealing with circuits and systems. It's the yearly "rendez-vous" of leading researchers, coming both from academia and industry, in the highly active fields of theory, design and implementation of circuits and systems. The Symposium will focus on circuits and systems for high quality life and consumer technologies, including mobile communications, advanced multimedia systems, sensor networks and Nano-Bio Circuit Fabrics and Systems.

  • 2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009

    Analog Signal Processing, Biomedical Circuits and Systems, Blind Signal Processing, Cellular Neural Networks and Array Computing, Circuits and Systems for Communications, Computer-Aided Network Design, Digital Signal Processing, Life-Science Systems and Applications, Multimedia Systems and Applications, Nanoelectronics and Gigascale Systems, Neural Systems and Applications, Nonlinear Circuits and Applications, Power Systems and Power Electronic Circuits, Sensory Systems, Visual Signal Processing and Communi


2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

It is the premier International Conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, and packages & systems.

  • 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    It is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

  • 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    It is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

  • 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity

  • 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. This meeting is the premier conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity.

  • 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)

    The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity

  • 2007 IEEE 16th Conference on Electrical Performance of Electronic Packaging (EPEP)

  • 2006 IEEE 15th Conference on Electrical Performance of Electronic Packaging (EPEP)

  • 2005 IEEE 14th Conference on Electrical Performance of Electronic Packaging (EPEP)


2013 IEEE Intelligent Vehicles Symposium (IV)

The IEEE Intelligent Vehicles Symposium (IV) is the premier annual forum sponsored by the IEEE Intelligent Transportation Systems Society. Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere. Tutorials will be offered on the first day followed by three days of presentations. An exhibition area will be available for the presentation of products.

  • 2012 IEEE Intelligent Vehicles Symposium (IV)

    The INTELLIGENT VEHICLES SYMPOSIUM (IV 2012) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCIETY (ITSS). Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Vehicle-Infrastructure Cooperation. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere.

  • 2011 IEEE Intelligent Vehicles Symposium (IV)

    THE INTELLIGENT VEHICLES SYMPOSIUM (IV'11) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCIETY (ITSS). Researchers, academicians, practitioners, and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in

  • 2010 IEEE Intelligent Vehicles Symposium (IV)

    THE INTELLIGENT VEHICLES SYMPOSIUM (IV'10) is the premier annual forum sponsored by the IEEE INTELLIGENT TRANSPORTATION SYSTEMS SOCITY (ITSS). Researchers, academicians, practitioners and students from universities, industry, and government agencies are invited to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures.

  • 2009 IEEE Intelligent Vehicles Symposium (IV)

    It gathers researchers from industry and universities to discuss research and applications for Intelligent Vehicles and Intelligent Infrastructures. The technical presentations are characterized by a single session format so that all attendees remain in a single room for multilateral communications in an informal atmosphere. Most of the papers will be poster presentations. Papers dealing with all aspects of vehicle-related intelligent systems and cooperation between vehicles and infrastructures are solicite


2012 10th IEEE/IAS International Conference on Industry Applications - INDUSCON 2012

The INDUSCON covers the main topic areas of interest of the Brazilian chapter of the IEEE Industry Applications Society, providing a forum for sharing theoretical and practical results related to the applications of Electrical and Electronic Engineering in industry.


APCCAS 2012-2012 IEEE Asia Pacific Conference on Circuits and Systems

2012 APCCAS will be focused on presenting new ideas, novel architectures, cutting-edge circuit techniques and technologies, for heterogeneous integration for circuits and systems.


More Conferences

Periodicals related to Driver circuits

Back to Top

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Solid-State Circuits, IEEE Journal of

The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...



Most published Xplore authors for Driver circuits

Back to Top

Xplore Articles related to Driver circuits

Back to Top

A new compact high dI/dt gate drive unit for 6-inch GCTs [gate commutated turn-off thyristor]

Gruening; Koyanagi 2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs, 2004

A gate driver applying a ring of ceramic chip capacitors and MOSFETs around a GCT is presented, achieving unprecedented circular homogeneity of gate turn- off current and gate dI/dt-capability (>35kA//spl mu/s). A fast charger is added to reset the capacitor's voltage within less than 150 /spl mu/s after every GCT turn-off process. The turn-off current capability of 6 kV 6-inch ...


Study on cornering stability control based on pneumatic trail estimation by using dual pitman arm type steer-by-wire on electric vehicle

Ryo Minaki; Yoichi Hori 2010 IEEE Vehicle Power and Propulsion Conference, 2010

This paper proposes novel high accuracy road condition estimation called Tire Grip Margin (TGM), and TGM is estimated by using dual pitman arm type steer- by-wire and lateral force sensor and estimator. In addition, we propose cornering stability control technique based on the TGM. It can help driver and vehicle before unstable state. We verify our proposed system achieves robust ...


The implementation of the intelligent transport system for the real-time roadside environment information transfer

GilYong Lee; HyunMoon Park; HoGil Cho; SungHoon Choi; SooHyun Park 13th International Conference on Advanced Communication Technology (ICACT2011), 2011

The paper proposed a novel system "RTCS (Real-Time Control System for road environment)" to prevent accidents of drivers. This paper deployed sensors on roads and used these sensors to collect information to coordinators. How to use sensors to prevent accidents in vehicular environment is an interesting issue. Vehicles are equipped with OBU (On-Board Unit) and use the OBU to query ...


Automated Design and Insertion of Optimal One-Hot Bus Encoders

Peter Wohl; A. Waicukauski; Sanjay Patel 25th IEEE VLSI Test Symposium (VTS'07), 2007

Tristate buses, commonly used in high-performance designs, raise testability problems because one-hot conditions, required for functional operation, may not be maintained during scan testing. We present a novel method to automatically generate and insert a bus encoder that ensures one-hot bus operation. Each bus is analyzed individually; a customized encoder is then generated and optimized for best testability and minimal ...


Architectural and Functional Modelling of an Automotive Driver Information System Using SysML

Yue Guo; Arun Chakrapani Rao; R. Peter Jones 2008 IEEE/ASME International Conference on Mechtronic and Embedded Systems and Applications, 2008

With a near exponential growth of in-car, embedded electronic systems, the automotive industry is facing extreme challenges in the flawless delivery of such systems within ever decreasing delivery time scales. Model based design is one potential methodology to meet these challenges. This paper describes research into model based design of a particular automotive electronic system, using the SysML modelling language. ...


More Xplore Articles

Educational Resources on Driver circuits

Back to Top

eLearning

Optimal lumbar support prediction using intereface pressure

Electric Information and Control Engineering (ICEICE), 2011 International Conference on, 2011

A commercially available seat equipped height and prominence adjustment function was designed and used in the current study. 11 participants completed the experiments. Participants were asked to sit in a set of designed positions or randomly adjusted positions, the positions, and the interface pressures and subjective ratings of these positions were recorded. Four pressure variables were defined and its relationship ...


CARIOCA-0.25 μm CMOS fast binary front-end for sensor interface using a novel current-mode feedback technique

Circuits and Systems, 2001. ISCAS 2001. The 2001 IEEE International Symposium on, 2001

We report on a very fast and low noise front-end, implemented in 0.25 μm CMOS technology. The CARIOCA amplifier discriminator chip has input impedance of 10 Ω, in order to be compatible with sensors of large capacitance, and a peaking time of 14 ns. The conversion gain of 8 mV/fC remains almost unchanged up to a detector capacitance of 120 ...


A new approach for combined freeway Variable Speed Limits and Coordinated Ramp Metering

Intelligent Transportation Systems (ITSC), 2010 13th International IEEE Conference on, 2010

Freeway corridor traffic flow is limited by bottleneck flow. A possible approach for maximizing recurrent bottleneck flow is to create a discharge section immediately upstream of the bottleneck. This paper proposes a control strategy for combining Variable Speed Limits (VSL) and Coordinated Ramp Metering (CRM) design to achieve this objective when the bottleneck can be modeled as a lane drop ...


Micro-DC/DC converter that integrates planar inductor on power IC

Magnetics, IEEE Transactions on, 2000

A 1 W class step-down micro-DC/DC converter that integrates a (4 mm×4 mm) planar inductor on a (4 mm×5 mm) power IC has been fabricated. The converter operation was stable at 3 MHz switching, achieving a power density of 5.6 W/cm3 and a converter efficiency of approximately 80%


The analysis of competitive factors of integrated circuit industry in Taiwan-a case study of DRAM (dynamic random access memory)

System Sciences, 1997, Proceedings of the Thirtieth Hawaii International Conference on, 1997

The semiconductor industry has been honored as "the resource of industry", which is also one of the great achievements of the Industry Technology Upgrading Policy which has been implemented in Taiwan. Moreover, the DRAM (dynamic random access memory) has also been designated as "the driver of semiconductor technology". Currently, more than half of the new booming 8-inch wafer fabs in ...


More eLearning Resources

IEEE-USA E-Books

  • An 8Bit 2ns Monolithic DAC

    An 8-bit resolution ultra-high-speed monolithic digital-to-analog converter (DAC) is fabricated using super self-aligned process technology (SST). In order to improvedynamic8CCUIK)', wbidI is determined by settling speed, clock feed through noise, and glitch,a number of new circuit technologies Ire developed including a rise - and fall-time control switch driver. a low- noise flip-flop, and a differential buffer configuration. In addition, a new clip assembly technology is developed employing a multilayer ceramic substrate. Performance measurements show a settling time to 8-bit accuracy of about 2 ns, a maximum conversion rate of 1 GHz, a glitch energy of 2 ps.V, and a 10-bit linearity error accuracy without trimming.

  • Advances in BiCMOS and Bipolar Circuits

    This chapter contains sections titled: An Overview of BiCMOS State-of-the-Art Digital Circuits Performance Comparison of Driver Configurations and Full-Swing Techniques for BiCMOS Logic Circuits A Feedback-Type BiCMOS logic Gate A High Performance BiCMOS 32-bit Microprocessor O.5-?>m- 2M-Transistor BiPNMOS Channelless Gate Array A 1.5-V Full-Swing BiCMOS Logic Circuit 3.3-V BiCMOS Circuit Techniques for 250-MHz RISC Arithmetic Modules Advanced Bipolar Circuits High-Performance Standard Cell Library and Modeling Technique for Differential Advanced Bipolar Current Tree Logic High-Speed Low-Power ECL Circuit with AC-Coupled Self-Biased Dynamic Current Source and Active-Pull-Down Emitter-Follower Stage Self-Biased Feedback-Controlled Pull-Down Emitter Follower for High-Speed Low- Power Bipolar Logic Circuits An ECL Gate with Improved Speed and Low Power in a BiCMOS Process Merged CMOS/Bipolar Current Switch Logic (MCSL)

  • No title

    This book provides a thorough introduction to the Texas Instruments MPS432™ microcontroller. The MPS432 is a 32-bit processor with the ARM Cortex M4F architecture and a built-in floating point unit. At the core, the MSP432 features a 32-bit ARM Cortex-M4F CPU, a RISC-architecture processing unit that includes a built-in DSP engine and a floating point unit. As an extension of the ultra-low-power MSP microcontroller family, the MSP432 features ultra-low power consumption and integrated digital and analog hardware peripherals. The MSP432 is a new member to the MSP family. It provides for a seamless transition to applications requiring 32-bit processing at an operating frequency of up to 48 MHz. The processor may be programmed at a variety of levels with different programming languages including the user-friendly Energia rapid prototyping platform, in assembly language, and in C. A number of C programming options are also available to developers, starting with register-level acce s code where developers can directly configure the device's registers, to Driver Library, which provides a standardized set of application program interfaces (APIs) that enable software developers to quickly manipulate various peripherals available on the device. Even higher abstraction layers are also available, such as the extremely user-friendly Energia platform, that enables even beginners to quickly prototype an application on MSP432. The MSP432 LaunchPad is supported by a host of technical data, application notes, training modules, and software examples. All are encapsulated inside one handy package called MSPWare, available as both a stand-alone download package as well as on the TI Cloud development site: dev.ti.com The features of the MSP432 may be extended with a full line of BoosterPack plug-in modules. The MSP432 is also supported by a variety of third party modular sensors and software compiler companies. In the back, a thorough introduction to the MPS432 line of microco trollers, programming techniques, and interface concepts are provided along with considerable tutorial information with many illustrated examples. Each chapter provides laboratory exercises to apply what has been presented in the chapter. The book is intended for an upper level undergraduate course in microcontrollers or mechatronics but may also be used as a reference for capstone design projects. Practicing engineers already familiar with another microcontroller, who require a quick tutorial on the microcontroller, will also find this book very useful. Finally, middle school and high school students will find the MSP432 highly approachable via the Energia rapid prototyping system.

  • References

    A practical guide to the successful integration of digital and analog circuits Mixed-signal processing-the integration of digital and analog circuitry within computer systems-enables systems to take signals from the analog world and process them within a digital system. In fact, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that requires the use of analog pre- and post-processing systems such as converters, filters, sensors, drivers, buffers, and actuators. However, the lack of universal CAD tools for the synthesis, simulation, and layout of the analog part of the chip represents a design bottleneck of today's VLSI circuits. Mixed-Signal Systems: A Guide to CMOS Circuit Design presents a comprehensive general overview of the latest CMOS technology and covers the various computer systems that may be used for designing integrated circuits. Taking an original approach to one- and two- dimensional filter design, the author explores the many digital-oriented design systems, or silicon compilers, currently being used, and presents the basic methods, procedures, and tools used by each. In a thorough and systematic manner, the text: * Presents common features of digital-oriented design systems * Describes methods and tools that are not yet being applied in any compiler * Illustrates image processing systems that can be implemented on a single chip * Demonstrates the path from synthesis methods to the actual silicon assembly Essential reading for integrated circuit designers and developers of related computer programs, as well as advanced students of system design, this book represents an invaluable resource for anyone involved in the development of mixed-signal systems.

  • Voltage Source Inverter Fed Drives

    This chapter presents a number of practical medium voltage (MV) drive configurations using multilevel voltage source inverters, which include two???level voltage source inverter (VSI), three???level neutral point clamped (NPC) inverter, multilevel cascaded H???bridge (CHB) inverter, NPC/H???bridge inverter, active neutral???point clamped (ANPC) inverter, and modular multilevel inverter (MMC) topology. The MV drives using multilevel voltage source inverters have found wide application in industry. The chapter presents the multilevel VSI fed MV drives marketed by the world leading drive manufacturers. The gate driver receives a gate signal from the digital controller of the drive and generates conditioned gating pulses for the insulated gate bipolar transistors (IGBTs). It also detects the operating status of the IGBT and sends it back to the controller for fault diagnosis. However, the use of the load commutated (LC) filter causes some practical consequences, including an increase in manufacturing cost, fundamental voltage drops, and circulating current between the filter and DC circuit.

  • Analyzing OnChip Interconnect Effects

    This chapter contains sections titled: Introduction Simplified Interconnect Analysis Model Order Reduction Driver Models Conclusion This chapter contains sections titled: References

  • Index

    A practical guide to the successful integration of digital and analog circuits Mixed-signal processing-the integration of digital and analog circuitry within computer systems-enables systems to take signals from the analog world and process them within a digital system. In fact, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that requires the use of analog pre- and post-processing systems such as converters, filters, sensors, drivers, buffers, and actuators. However, the lack of universal CAD tools for the synthesis, simulation, and layout of the analog part of the chip represents a design bottleneck of today's VLSI circuits. Mixed-Signal Systems: A Guide to CMOS Circuit Design presents a comprehensive general overview of the latest CMOS technology and covers the various computer systems that may be used for designing integrated circuits. Taking an original approach to one- and two- dimensional filter design, the author explores the many digital-oriented design systems, or silicon compilers, currently being used, and presents the basic methods, procedures, and tools used by each. In a thorough and systematic manner, the text: * Presents common features of digital-oriented design systems * Describes methods and tools that are not yet being applied in any compiler * Illustrates image processing systems that can be implemented on a single chip * Demonstrates the path from synthesis methods to the actual silicon assembly Essential reading for integrated circuit designers and developers of related computer programs, as well as advanced students of system design, this book represents an invaluable resource for anyone involved in the development of mixed-signal systems.

  • Forming Damped LRC Parasitic Circuits in Simultaneously Switched CMOS Output Buffers

    Several techniques to reduce the ground bounce effect in CMOS chips are described. The effective width of the predrive and final driver of a CMOS output buffer is automatically adjusted to compensate for process, voltage, and temperature (PVT) variations. The slew rate of the predrive nodes is controlled by introducing a digitally weighted capacitance. Finally, a compensated active resistance is inserted into both the power and ground leads to further dampen the oscillations. These techniques allow the buffer to behave uniformly over the entire PVT range. Measurements of a O.5-µm CMOS test chip have demonstrated that these new buffers generate 2.5x less ground bounce when compared to conventional buffers. An external resistance is required to set a reference current.

  • Methods and Tools for Mixed Signal Circuit Design

    A practical guide to the successful integration of digital and analog circuits Mixed-signal processing-the integration of digital and analog circuitry within computer systems-enables systems to take signals from the analog world and process them within a digital system. In fact, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that requires the use of analog pre- and post-processing systems such as converters, filters, sensors, drivers, buffers, and actuators. However, the lack of universal CAD tools for the synthesis, simulation, and layout of the analog part of the chip represents a design bottleneck of today's VLSI circuits. Mixed-Signal Systems: A Guide to CMOS Circuit Design presents a comprehensive general overview of the latest CMOS technology and covers the various computer systems that may be used for designing integrated circuits. Taking an original approach to one- and two- dimensional filter design, the author explores the many digital-oriented design systems, or silicon compilers, currently being used, and presents the basic methods, procedures, and tools used by each. In a thorough and systematic manner, the text: * Presents common features of digital-oriented design systems * Describes methods and tools that are not yet being applied in any compiler * Illustrates image processing systems that can be implemented on a single chip * Demonstrates the path from synthesis methods to the actual silicon assembly Essential reading for integrated circuit designers and developers of related computer programs, as well as advanced students of system design, this book represents an invaluable resource for anyone involved in the development of mixed-signal systems.

  • No title

    High-Speed Digital System Design bridges the gap from theory to implementation in the real world. Systems with clock speeds in low megahertz range qualify for high-speed. Proper design results in quality digital transmissions and lowers the chance for errors. This book is for computer and electrical engineers who may or may not have learned electromagnetic theory. The presentation style allows readers to quickly begin designing their own high- speed systems and diagnosing existing designs for errors. After studying this book, readers will be able to: Design the power distribution system for a printed circuit board to minimize noise Plan the layers of a PCB for signals, power, and ground to maximize signal quality and minimize noise Include test structures in the printed circuit board to easily diagnose manufacturing mistakes Choose the best PCB design parameters such a trace width, height,and routed path to ensure the most stable characteristic impedance Determine the correct terminati n to minimize reflections Predict the delay caused by a given PCB trace Minimize driver power consumption using AC terminations Compensate for discontinuities along a PCB trace Use pre-emphasis and equalization techniques to counteract lossy transmission lines Determine the amount of crosstalk between two traces Diagnose existing PCBs to determine the sources of errors



Standards related to Driver circuits

Back to Top

No standards are currently tagged "Driver circuits"


Jobs related to Driver circuits

Back to Top