107 resources related to Digital alloys
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Phased array systems have made major steps forward with the development of manymajor radar and communications systems. Due to many recent advances, including MMIC,photonics, anddigital beamforming, phased array systems and technology continue to progress rapidly.Current and futuredevelopments of ground -based, sea-based, airborne, and space -based phased array radar,communications,and other electronic systems will be discussed at this international symposium.
The main theme of the GSMM2018 is Millimeter-wave Propagation: Hardware, Measurements and Systems. It covers millimeter-wave and THz devices, circuits, systems, and applications, with a special focus on mmWave propagation. The conference will include keynote talks, technical sessions, panels, and exhibitions on the listed topics.
Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM
The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
The 18th International Conference on Mechatronics - Mechatronika 2018 will be held during december 5 - 7 2018, in Brno, Czech Republic. The program will consist of contributed papers,there will be no more than two parallel sessions, depending upon topic grouping. Themes will be drawn from, but not limited to the following: ICT, Power electronics, Sensors, EMC, Actuators, Modeling and Simulation, Robots, Industrial Applications, Military Technologies, Education, Measurement and Diagnostics, Biomechatronics.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...
No Xplore Articles are currently tagged "Digital alloys"
IMS 2011 Microapps - Digital Radio Testing Using an RF Channel Replicator
MicroApps: How Digital Markets are Driving Microwave Technology (Agilent Technologies)
Analog to Digital Types
IMS 2012 Microapps - Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
APEC Speaker Highlights: Robert White, Chief Engineer, Embedded Power
Materials Challenges for Next-Generation, High-Density Magnetic Recording - Kazuhiro Hono: IEEE Magnetics Distinguished Lecture 2016
The Josephson Effect: Josephson Digital Electronics in the Soviet Union
IEEE Top Trends for 2012 at CES: Metadata Automatically Organizes Digital Content
Analog to Digital Traits
IEEE Internet Inclusion: Advancing Solutions for Digital Inclusion Roundtable
Your Digital Clone for Games, Videos, and More
Niobium Manufacturing for Superconductivity - ASC-2014 Plenary series - 5 of 13 - Tuesday 2014/8/12
Maker Faire 2008: Spectrum's Digital Clock Contest Winner
Yamaha's Avant Grand Digital Piano Mimics Acoustic
IEEE Member Digital Library
Panel Moderator: Prasanto Kumar Roy - ETAP Delhi 2016
IEEE Xplore Digital Library - Prakash Bellur - Ignite: Sections Congress 2017
Big Data Panelist - Joe Weinman: 2016 Technology Time Machine
ComSoc Digital Library
No standards are currently tagged "Digital alloys"