Conferences related to Digital alloys

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2019 IEEE International Symposium on Phased Array System & Technology (PAST)

Phased array systems have made major steps forward with the development of manymajor radar and communications systems. Due to many recent advances, including MMIC,photonics, anddigital beamforming, phased array systems and technology continue to progress rapidly.Current and futuredevelopments of ground -based, sea-based, airborne, and space -based phased array radar,communications,and other electronic systems will be discussed at this international symposium.


2018 11th Global Symposium on Millimeter Waves (GSMM)

The main theme of the GSMM2018 is Millimeter-wave Propagation: Hardware, Measurements and Systems. It covers millimeter-wave and THz devices, circuits, systems, and applications, with a special focus on mmWave propagation. The conference will include keynote talks, technical sessions, panels, and exhibitions on the listed topics.

  • 2017 10th Global Symposium on Millimeter-Waves (GSMM)

    The main theme of the symposium is Millimeter-Wave and Terahertz Sensing and Communications. It covers millimeter- wave and THz antennas, circuits, devices, systems and applications.

  • 2016 Global Symposium on Millimeter Waves (GSMM) & ESA Workshop on Millimetre-Wave Technology and Applications

    The main theme of the conference is millimeter-wave and terahertz sensing and communications and the conference covers different topics related to millimeter-wave and terahertz technologies, such as: antennas and propagation, passive and active devices, radio astronomy, earth observation and remote sensing, communications, wireless power transfer, integration and packaging, photonic systems, and emerging technologies.

  • 2015 Global Symposium On Millimeter Waves (GSMM)

    The main theme of the GSMM 2015 is “Future Millimeter-wave and Terahertz Wireless and Wireline”. It will cover all emerging and future millimeter wave and terahertz software and hardware aspects ranging from communicating devices, circuits, systems and applications to passive and active sensing and imaging technologies and applications. The GSMM 2015 will feature world-class keynote speeches, technical sessions, panel discussions and industrial exhibitions in the following (but not limited to) topics listed below.In addition to the regular program, the GSMM 2015 will organize a unique industrial forum for presenting and discussing future wireless technologies and trends including 5G and Terahertz Wireless Systems.

  • 2012 5th Global Symposium on Millimeter Waves (GSMM 2012)

    The aim of the conferences is to bring together people involved in research and development of millimeter-wave components, equipment and systems, and to explore common areas.

  • 2009 Global Symposium On Millimeter Waves (GSMM 2009)

    The GSMM2009 will be held in Sendai, Japan from April 20 to April 22, 2009. The GSMM2009 is the second international conference in its name after the three conferences of TSMMW, MINT-MIS, and MilliLab Workshop on Millimeter-wave Technology and Applications were integrated into GSMM (Global Symposium on Millimeter Waves) in 2007. The main theme of the GSMM2009 is "Millimeter Wave Communications at Hand" and it will focus on millimeter wave devices and systems to realize Giga-bit wireless applications. The

  • 2008 Global Symposium On Millimeter Waves (GSMM 2008)

    Frequency Management and Utilization, Millimeter-Wave Communication Systems, Devices and Circuit Technologies, Wireless Access Systems, Mobile Access Systems, Satellite Communications, LANs and PANs, Home Link Systems, Photonics, Antennas and Propagation, Phased Array Antennas, Signal Processing, Wearable Devices and Systems, Automotive Radars and Remote Sensing, Supporting and Related Technologies


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 18th International Conference on Mechatronics - Mechatronika (ME)

The 18th International Conference on Mechatronics - Mechatronika 2018 will be held during december 5 - 7 2018, in Brno, Czech Republic. The program will consist of contributed papers,there will be no more than two parallel sessions, depending upon topic grouping. Themes will be drawn from, but not limited to the following: ICT, Power electronics, Sensors, EMC, Actuators, Modeling and Simulation, Robots, Industrial Applications, Military Technologies, Education, Measurement and Diagnostics, Biomechatronics.

  • 2016 17th International Conference on Mechatronics - Mechatronika (ME)

    The 17th International Conference on Mechatronics - Mechatronika 2016 will be held duringdecember 7 - 9 2016, in Prague, Czech Republic. The program will consist of contributed papers,there will be no more than two parallel sessions, depending upon topic grouping. Themes will bedrawn from, but not limited to the following: ICT, Power electronics, Sensors, EMC, Actuators,Modeling and Simulation, Robots, Industrial Applications, Military Technologies, Education,Measurement and Diagnostics, Biomechatronics.

  • 2014 16th International Conference on Mechatronics - Mechatronika (ME)

    The 16th International Conference on Mechatronics

  • 2012 15th International Conference MECHATRONIKA

    The scope is based on contributed papers presented in no more than two parallel sessions, depending upon topic grouping. Themes will be drawn from, but not limited to the following: ICT, Power electronics, Sensors, EMC, Actuators, Modeling and Simulation, Robots, Industrial Applications, Military Technologies, Education, Measurement and Diagnostics, Biomechatronics.

  • 2011 14th International Conference MECHATRONIKA

    The program will consist of contributed papers (official language of the conference is English), there will be no more then two parallel sessions, depending upon topic grouping. Themes will be drawn from, but not limited to the following: * Signal processing * Power electronics * Sensors * EMC, microwave techniques * Actuators and electrical machinery * Modeling and Simulation * Robots and Industrial Applications * Military Technologies * Education * Measurement and Diagnostics * Biomechatronics

  • 2010 13th International Symposium MECHATRONIKA

    The program will consist of contributed papers (official language of the conference is English), there will be no more then two parallel sessions, depending upon topic grouping. Themes will be drawn from, but not limited to the following: * Signal processing * Power electronics * Sensors * EMC, microwave techniques * Actuators and electrical machinery * Modeling and Simulation * Robots and Industrial Applications * Military Technologies * Education * Measurement and Diagnostics * Biomechatronics


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Periodicals related to Digital alloys

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


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Most published Xplore authors for Digital alloys

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Xplore Articles related to Digital alloys

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Damage Mechanics and Experiments of Lead-free Solder Alloy

[{u'author_order': 1, u'affiliation': u"The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Zhejiang Province, People's Republic of China, 310014, Email: zhouaanod@163.com Telephone: +86 0571-88320244, Fax: +86 0571-88320244", u'full_name': u'Jun Zhou'}, {u'author_order': 2, u'affiliation': u"The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Zhejiang Province, People's Republic of China, 310014", u'full_name': u'WeiNa Hao'}, {u'author_order': 3, u'affiliation': u"The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Zhejiang Province, People's Republic of China, 310014", u'full_name': u'GuoZhong Chai'}] 2006 Conference on Optoelectronic and Microelectronic Materials and Devices, None

Based on DSCM (digital speckle correlation method), a novel video control experimental technique was developed for assessing mechanical behavior of SnAgCu solder alloy. A series of experimental tests in tension on a SnAgCu solder alloy have been conducted under various constant strain rates ranging from 10E-5/s to 10E-3/s and at 298K to 423K. The experimental results have revealed the presence ...


What limits the maximum output power of long-wavelength AlGaInAs/InP laser diodes?

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA', u'full_name': u'J. Piprek'}, {u'author_order': 2, u'full_name': u'J. K. White'}, {u'author_order': 3, u'full_name': u'A. J. SpringThorpe'}] IEEE Journal of Quantum Electronics, 2002

We analyze the high-temperature continuous-wave performance of 1.3-μm AlGaInAs/InP laser diodes grown by digital alloy molecular-beam epitaxy. Commercial laser software is utilized that self-consistently combines quantum- well bandstructure and gain calculations with two-dimensional simulations of carrier transport, wave guiding, and heat flow. Excellent agreement between simulation and measurements is obtained by careful adjustment of material parameters in the model. Joule ...


Low-resistance Ohmic contacts to digital alloys of n-AlGaN/AlN

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'J. Yun'}, {u'author_order': 2, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'K. Choi'}, {u'author_order': 3, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'K. Mathur'}, {u'author_order': 4, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'V. Kuryatkov'}, {u'author_order': 5, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'B. Borisov'}, {u'author_order': 6, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'G. Kipshidze'}, {u'author_order': 7, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'S. Nikishin'}, {u'author_order': 8, u'affiliation': u'Dept. of Electr. Eng., Texas Tech Univ., Lubbock, TX, USA', u'full_name': u'H. Temkin'}] IEEE Electron Device Letters, 2006

Low contact resistance to digital alloys of n-type AlGaN/AlN with high average Al concentration is described. Low-energy electron diffraction was used to evaluate surface precleaning with HCl and buffered HF. The contact metallization consisting of a stack of Ti/Al/Ti/Au, 20/100/45/60 nm in thickness, was e-beam deposited and etch-patterned. The lowest specific contact resistance of 5.6×10-5 Ω*cm2 was obtained after annealing ...


Microlens fabrication by selective oxidation of composition-graded digital alloy AlGaAs

[{u'author_order': 1, u'affiliation': u'Dept. of Inf. & Commun., Gwangju Inst. of Sci. & Technol., South Korea', u'full_name': u'Ki Soo Chang'}, {u'author_order': 2, u'affiliation': u'Dept. of Inf. & Commun., Gwangju Inst. of Sci. & Technol., South Korea', u'full_name': u'Young Min Song'}, {u'author_order': 3, u'affiliation': u'Dept. of Inf. & Commun., Gwangju Inst. of Sci. & Technol., South Korea', u'full_name': u'Yong Tak Lee'}] IEEE Photonics Technology Letters, 2006

We have fabricated refractive microlenses using selective oxidation of composition-graded digital alloy AlGaAs. The chirped short period superlattice of GaAs-AlAs was used to grade the composition of AlGaAs along the growth direction for a reproducible and controllable composition and oxidation profile. The oxidized profile of linearly composition-graded digital alloy AlGaAs shows a circular convex lens shape. The focused spot pattern ...


Characteristics of laminated alloy films heads for high frequency recording

[{u'author_order': 1, u'affiliation': u'Nippon Min. Co. Ltd., Saitama', u'full_name': u'K. Saito'}] IEEE Transactions on Magnetics, 1990

Excellent performance of laminated Fe-Si-Al alloy film heads is demonstrated in applications to high-definition VCR and to digital recording. It is emphasized that these results are derived not only from the ring-shaped core geometry but also from the isotropic behavior in the magnetic properties of the sputtered Fe-Si-Al alloy films. The experimental results on the isotropic magnetic behavior are summarized. ...


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Educational Resources on Digital alloys

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IEEE-USA E-Books

  • Index

    "As digital data storage technology undergoes enormous change, electrical engineers, physicists, and materials scientists need to keep pace with the materials requirements for recording media. Expert contributors -- together with world-class authorities Richard J. Gambino and Takao Suzuki -- bring you a practical, comprehensive guide to materials design and selection for magneto-optical storage media. This authoritative book explores multilayered thin films, exchanged coupled layers, materials used in current products, and materials of potential interest not yet available in practical applications. A detailed analysis concerning the physics of magneto-optical recording will help you make informed decisions about materials properties. You will also find an extensive discussion of systems and engineering design features for magneto-optical storage devices. This discussion will help you to understand how materials properties impact system performance. You will gain addi ional insight into this fast-developing field through in- depth coverage of these featured topics: * Rare earth-transition metal amorphous alloys, multilayers, garnets, intermetallic compounds, and ferrites * Basic principles of domain dynamics and recording physics * Latest developments in exchange coupled layers, direct overwrite, and magnetic superresolution * Minidisc, future high-density systems, and DVD format. MAGNETO-OPTICAL RECORDING MATERIALS is essential reading for anyone who needs to keep up-to-date with the latest advances in digital data storage technology."

  • About the Editors

    "As digital data storage technology undergoes enormous change, electrical engineers, physicists, and materials scientists need to keep pace with the materials requirements for recording media. Expert contributors -- together with world-class authorities Richard J. Gambino and Takao Suzuki -- bring you a practical, comprehensive guide to materials design and selection for magneto-optical storage media. This authoritative book explores multilayered thin films, exchanged coupled layers, materials used in current products, and materials of potential interest not yet available in practical applications. A detailed analysis concerning the physics of magneto-optical recording will help you make informed decisions about materials properties. You will also find an extensive discussion of systems and engineering design features for magneto-optical storage devices. This discussion will help you to understand how materials properties impact system performance. You will gain addi ional insight into this fast-developing field through in- depth coverage of these featured topics: * Rare earth-transition metal amorphous alloys, multilayers, garnets, intermetallic compounds, and ferrites * Basic principles of domain dynamics and recording physics * Latest developments in exchange coupled layers, direct overwrite, and magnetic superresolution * Minidisc, future high-density systems, and DVD format. MAGNETO-OPTICAL RECORDING MATERIALS is essential reading for anyone who needs to keep up-to-date with the latest advances in digital data storage technology."



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