Conferences related to Dies

Back to Top

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE Milan PowerTech

PowerTech is the IEEE PES anchor conference in Europe and has been attended by hundreds of delegates from around the world. It will be an international forum with programme for individuals working in industry and academia, to network, exchange ideas, and discuss the results of their research and development work.

  • 2017 IEEE Manchester PowerTech

    this is IEEE PES anchor conference in Europe covering all areas of electrical power engineering

  • 2015 IEEE Eindhoven PowerTech

    This conference will continue the tradition of the PowerTech conferences held in odd years in Athens, Stockholm, Budapest, Porto, Bologna, St. Petersburg, Lausanne, Bucharest, Trondheim and Grenoble.PowerTech is the anchor conference of the IEEE Power Engineering Society in Europe. It is intended to provide a forum, in the European geographical area, for scientists and engineers interested in electric power engineering to exchange ideas, results of their scientific work, to learn from each other as well as to establish new friendships and rekindle existing ones. Student participation in Power Tech provides an important ingredient toward the event’s success: a special award, the Basil Papadias Award, is presented to the author of the best student paper at each edition. The Power Engineering Society of IEEE organized similar conferences in other parts of the world, such as PowerCon, in the Asia-Pacific region.

  • 2013 IEEE Grenoble PowerTech

    PowerTech is the anchor conference of the IEEE Power & Energy Society in Europe. It is intended to provide a forum for electric power engineering scientists and engineers to share ideas, results of their scientific work, to learn from each other as well as to establish new friendships and maintain existing ones.

  • 2011 IEEE Trondheim PowerTech

    PowerTech is the anchor conference of the IEEE Power & Energy Society in Europe. It is intended to provide a forum for electric power engineering scientists and engineers to share ideas, results of their scientific work and to learn from each other.

  • 2009 IEEE Bucharest Power Tech

    PowerTech is the anchor conference of the IEEE-PES in Europe. It is intended to provide a forum for scientists and engineers interested in electric power engineering to share ideas, results of their scientific work, to learn from each other as well as to establish new friendships and rekindle existing ones.

  • 2007 IEEE Power Tech

  • 2005 IEEE Russia Power Tech

  • 2003 Bologna Power Tech


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 19th International Symposium on Quality Electronic Design (ISQED)

19th International Symposium on Quality Electronic Design (ISQED 2018) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integratedcircuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality.


More Conferences

Periodicals related to Dies

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


More Periodicals

Most published Xplore authors for Dies

Back to Top

Xplore Articles related to Dies

Back to Top

On an analysis approach for an improved linear overlay control

[{u'author_order': 1, u'affiliation': u'itemic AG, Dresden, Germany', u'full_name': u'T. Mueller'}] 2004 43rd IEEE Conference on Decision and Control (CDC) (IEEE Cat. No.04CH37601), None

Overlay control is performed using linear static models of the exposure tool with the controlled variables being the parameters of the linear exposure tool model. The CIM interface of the exposure tool also typically only offers the parameters of those linear models as the manipulated input variables. Nevertheless, the real distribution of the overlay error over the wafer surface can ...


The effect of instruction fetch bandwidth on value prediction

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel', u'full_name': u'F. Gabbay'}, {u'author_order': 2, u'full_name': u'A. Mendelson'}] Proceedings. 25th Annual International Symposium on Computer Architecture (Cat. No.98CB36235), None

Value prediction attempts to eliminate true-data dependencies by dynamically predicting the outcome values of instructions and executing true-data dependent instructions based on that prediction. In this paper we attempt to understand the limitations of using this paradigm in realistic machines. We show that the instruction-fetch bandwidth and the issue rate have a very significant impact on the efficiency of value ...


Effects of elastic behaviours of dies and servo press machine on deep drawing process

[{u'author_order': 1, u'affiliation': u'Graduate School of Gunma University, Dpt. of Production Science and Technology, Gunma, Japan', u'full_name': u'A. Watanabe'}, {u'author_order': 2, u'affiliation': u'Gunma Industrial Technology Center, Japan', u'full_name': u'Y. Kotani'}, {u'author_order': 3, u'affiliation': u'Graduate School of Gunma University, Dpt. of Production Science and Technology, Gunma, Japan', u'full_name': u'K. Nishimura'}, {u'author_order': 4, u'affiliation': u'Graduate School of Gunma University, Dpt. of Production Science and Technology, Gunma, Japan', u'full_name': u'H. Watari'}, {u'author_order': 5, u'affiliation': u'Department of Mechanical Engineering, Oyama National College of Technology, Tochigi, Japan', u'full_name': u'T. Yamazaki'}] 2009 ICCAS-SICE, None

Various characteristic features of elastic deformation of dies and presses during deep drawing were presented. It was very important to examine the effects of elastic deformation of these units on product accuracy. Strains were measured on the press system including dies, a slide and a bolster of a servo press. A strain magnitude of 63 times 10-6 was obtained when ...


Control of the flexible automation of metal forming

[{u'author_order': 1, u'affiliation': u'Minnesota Univ., Minneapolis, MN, USA', u'full_name': u'K. A. Stelson'}] Proceedings. 5th IEEE International Symposium on Intelligent Control 1990, None

Pressbrake bending and multibending are two metal-forming processes that can produce a wide variety of parts with fixed tooling. An overview of the technology for producing such parts emphasizing the control issues is presented. Closed-loop control of these processes is essential to maintaining accuracy and to minimizing the setup time for a new part. Moreover, the control algorithms used must ...


Die storage improvement with k-means clustering algorithm: A case of paper packaging business

[{u'author_order': 1, u'affiliation': u'Department of Industrial Engineering, Chiang Mai University, Chiang Mai, Thailand', u'full_name': u'Wimalin Laosiritaworn'}, {u'author_order': 2, u'affiliation': u'Department of Industrial Engineering, Chiang Mai University, Chiang Mai, Thailand', u'full_name': u'Pornpailin Kitjongtawornkul'}, {u'author_order': 3, u'affiliation': u'Department of Industrial Engineering, Chiang Mai University, Chiang Mai, Thailand', u'full_name': u'Melin Pasui'}, {u'author_order': 4, u'affiliation': u'Department of Industrial Engineering, Chiang Mai University, Chiang Mai, Thailand', u'full_name': u'Warocha Wansom'}] 2016 4th International Symposium on Computational and Business Intelligence (ISCBI), None

This paper presents die storage improvement for a case study company, who is a manufacturer of made-to-order paper packaging product. One of the critical equipment used to produce paper packaging is the dies used in die cutting machine. These dies are stored in the separate storage room and they are placed on any available shelf slot. Due to the wide ...


More Xplore Articles

Educational Resources on Dies

Back to Top

eLearning

No eLearning Articles are currently tagged "Dies"

IEEE-USA E-Books

  • Rotor and Stator Laminated Cores

    This chapter discusses rotor and stator cores and, in particular, steel lamination and insulation on these laminations, as well as how the laminations are fabricated into cores. It restricts the materials, processes, and insulation of laminated stator and rotor cores, that is, electromagnet application. Magnetic fields are characterized by the magnetic flux, the magnetic flux density or B, and the magnetic field intensity or H. The latter is called the magnetomotive force or mmf when the field is generated by an electromagnet. Laser cutting is also used for limited new production and prototypes, for modifications of laminations from existing dies or punched stock, and to replace damaged laminations during core repairs. The annealing is carried out in an inert atmosphere to prevent oxidation of the metal surface. Burr removal is often done by a grinding or sanding operation that also leaves some bare metal where the burrwas removed.

  • The Basics of the CMOS Process and Devices

    This chapter contains sections titled: * What are the major process steps in building MOSFET transistors? * What are the two types of MOSFET transistors? * What are base layers and metal layers? * What are wafers and dies? * What is semiconductor lithography? * What is a package?



Standards related to Dies

Back to Top

No standards are currently tagged "Dies"


Jobs related to Dies

Back to Top