Conferences related to Dies

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2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Advanced Electronics Packaging Technologies.

  • 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2009 11th Electronics Packaging Technology Conference - (EPTC 2009)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2008 10th Electronics Packaging Technology Conference - (EPTC 2008)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.


2013 IEEE International Conference on Mechatronics and Automation (ICMA)

The objective of ICMA 2013 is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of mechatronics, robotics, automation and sensors to disseminate their latest research results and exchange views on the future research directions.


2013 International Conference on Machine Learning and Cybernetics (ICMLC)

Statistical Machine Learning, Intelligent & fuzzy control, Pattern Recognition , Ensemble method, Evolutionary computation, Fuzzy & rough set, Data & web mining , Intelligent Business Computing , Biometrics , Bioinformatics , Information retrieval, Cybersecurity, Web intelligence and technology, Semantics & ontology engineering, Social Networks & Ubiquitous Intelligence, Multicriteria decision making, Soft Computing, Intelligent Systems, Speech, Image & Video Processing, Decision Support System

  • 2012 International Conference on Machine Learning and Cybernetics (ICMLC)

    Adaptive systems, Pattern Recognition, Biometrics, Inductive learning, Evolutionary computation, Bioinformatics, Data mining, Information retrieval, Intelligent agent, Financial engineering, Rough Set, Applications.

  • 2011 International Conference on Machine Learning and Cybernetics (ICMLC)

    Adaptive systems, Neural net and support vector machine, Business intelligence, Hybrid and nonlinear system, Biometrics, Fuzzy set theory, fuzzy control and system, Bioinformatics, Knowledge management, Data and web mining, Information retrieval, Intelligent agent, Intelligent and knowledge based system, Financial engineering, Rough and fuzzy rough set, Inductive learning, Networking and information security, Geoinformatics, Evolutionary computation, Pattern Recognition, Ensemble method, Logistics.

  • 2010 International Conference on Machine Learning and Cybernetics (ICMLC)

    Adaptive systems, Neural net and support vector machine, Business intelligence, Hybrid and nonlinear system, Biometrics, Fuzzy set theory, fuzzy control and system, Bioinformatics, Knowledge management, Data and web mining, Information retrieval, Intelligent agent, Intelligent and knowledge based system, Financial engineering, Rough and fuzzy rough set, Inductive learning, Networking and information security, Geoinformatics, Evolutionary computation, Pattern Recognition, Ensemble method, Logistics, Informat


2012 International Symposium on Information Technology in Medicine and Education (ITME 2012)

ITME 2012 is to further explore the theoretical and practical issues of IT in education and medicine, Internet and computer networks and Multimedia Technology.

  • 2011 International Symposium on Information Technology in Medicine and Education (ITME 2011)

    The scope of the conference includes, but not limited to Architecture of Educational Information Systems, Building and Sharing Digital Education Resources on the Internet, Collaborative Learning/Training, Digital Library, e-Learning Pedagogical Strategies, Web Based Systems for Education, Medical Image Processing & compression, e-Health and e-Hospital, Medical Knowledge Mining, IT and Medical Informatics, Other related theories technologies and applications.

  • 2009 IEEE International Symposium on IT in Medicine & Education (ITME 2009)

    ITME 2009 is to further explore the theoretical and practical issues of IT in education and medicine, including Educational Information Systems, Digital Education Resources, Collaborative Learning/Training ,Computer Aided Teaching, e-Learning, Medical Image Processing & compression, Biomechanics, modeling and computing, Hospital Management Information, Construction of Medical Database and etc..


2010 International Conference on Mechanic Automation and Control Engineering (MACE)

Manufacturing Control and Automation Engineering,CAD/CAM/CIM and Simulation, Materials Processing and Control, Instruments and Vibration Control


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Periodicals related to Dies

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...




Xplore Articles related to Dies

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Identification of wafer defect clusters using a self-organizing multilayer perceptron

Chenn-Jung Huang Neural Information Processing, 2002. ICONIP '02. Proceedings of the 9th International Conference on, 2002

During an electrical testing stage, each die on a wafer must be tested to determine whether it functions as it was originally designed. In the case of a clustered defect on the wafer, such as scratches, stains, or localized failed patterns, the tester may not detect all of the defective dies in the flawed area. To avoid the defective dies ...


Self-organizing modeling in forecasting daily river flows

M. Valenga; T. Ludermir Proceedings 5th Brazilian Symposium on Neural Networks (Cat. No.98EX209), 1998

In a new approach, which corresponds in a better way to the actions of human nervous system, the connections between several neurons are not fixed but change in dependence on the neurons themselves. This article presents a GMDH (group method of data handling) algorithm with active neurons. These neurons are able, during the learning or self-organizing process, to estimate which ...


Mathematical model of the forced fluctuations of the prefabricated cutting tool elements in milling the spatial complex surfaces on the machines with numerical program control

D. A. Malyshkin; A. M. Markov; E. Yu. Tatarkin Proceedings of the 8th International Scientific and Practical Conference of Students, Post-graduates and Young Scientists Modern Technique and Technologies, 2002. MTT 2002., 2002

Developed mathematical model allows one at the stage of milling operations designing to calculate the values of vibration displacement forming the processed surface asperity and to use it in CAP.


Sharpened of saw blades by electrical discharge machining

J. Doval-Gandoy; R. Pasandin; B. Fernandez 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005., 2005

Electrical discharge machines have undergone rapid improvements in capability, economical operation, speed and flexibility. In fact, electrical discharge machining (EDM) is now the fourth most popular machining process, selling more than all other processes except milling, turning and grinding. Ninety percent of EDM applications in the world are used to produce molds, stamping dies, extrusion dies, forging dies, tool fixtures ...


Producing High Qualityn Dies Usingf CO/sub 2/-Lasers and a New Designed Engraving Machine

A. Penz; S. Fazeny; D. Schuocker CLEO/Europe Conference on Lasers and Electro-Optics, 1998

First Page of the Article ![](/xploreAssets/images/absImages/00718872.png)


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Educational Resources on Dies

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eLearning

Identification of wafer defect clusters using a self-organizing multilayer perceptron

Chenn-Jung Huang Neural Information Processing, 2002. ICONIP '02. Proceedings of the 9th International Conference on, 2002

During an electrical testing stage, each die on a wafer must be tested to determine whether it functions as it was originally designed. In the case of a clustered defect on the wafer, such as scratches, stains, or localized failed patterns, the tester may not detect all of the defective dies in the flawed area. To avoid the defective dies ...


Self-organizing modeling in forecasting daily river flows

M. Valenga; T. Ludermir Proceedings 5th Brazilian Symposium on Neural Networks (Cat. No.98EX209), 1998

In a new approach, which corresponds in a better way to the actions of human nervous system, the connections between several neurons are not fixed but change in dependence on the neurons themselves. This article presents a GMDH (group method of data handling) algorithm with active neurons. These neurons are able, during the learning or self-organizing process, to estimate which ...


Mathematical model of the forced fluctuations of the prefabricated cutting tool elements in milling the spatial complex surfaces on the machines with numerical program control

D. A. Malyshkin; A. M. Markov; E. Yu. Tatarkin Proceedings of the 8th International Scientific and Practical Conference of Students, Post-graduates and Young Scientists Modern Technique and Technologies, 2002. MTT 2002., 2002

Developed mathematical model allows one at the stage of milling operations designing to calculate the values of vibration displacement forming the processed surface asperity and to use it in CAP.


Sharpened of saw blades by electrical discharge machining

J. Doval-Gandoy; R. Pasandin; B. Fernandez 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005., 2005

Electrical discharge machines have undergone rapid improvements in capability, economical operation, speed and flexibility. In fact, electrical discharge machining (EDM) is now the fourth most popular machining process, selling more than all other processes except milling, turning and grinding. Ninety percent of EDM applications in the world are used to produce molds, stamping dies, extrusion dies, forging dies, tool fixtures ...


Producing High Qualityn Dies Usingf CO/sub 2/-Lasers and a New Designed Engraving Machine

A. Penz; S. Fazeny; D. Schuocker CLEO/Europe Conference on Lasers and Electro-Optics, 1998

First Page of the Article ![](/xploreAssets/images/absImages/00718872.png)


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IEEE-USA E-Books

  • The Basics of the CMOS Process and Devices

    This chapter contains sections titled: What are the major process steps in building MOSFET transistors? What are the two types of MOSFET transistors? What are base layers and metal layers? What are wafers and dies? What is semiconductor lithography? What is a package?

  • Rotor and Stator Laminated Cores

    This chapter discusses rotor and stator cores and, in particular, steel lamination and insulation on these laminations, as well as how the laminations are fabricated into cores. It restricts the materials, processes, and insulation of laminated stator and rotor cores, that is, electromagnet application. Magnetic fields are characterized by the magnetic flux, the magnetic flux density or B, and the magnetic field intensity or H. The latter is called the magnetomotive force or mmf when the field is generated by an electromagnet. Laser cutting is also used for limited new production and prototypes, for modifications of laminations from existing dies or punched stock, and to replace damaged laminations during core repairs. The annealing is carried out in an inert atmosphere to prevent oxidation of the metal surface. Burr removal is often done by a grinding or sanding operation that also leaves some bare metal where the burrwas removed.



Standards related to Dies

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No standards are currently tagged "Dies"