60 resources related to Dielectric materials
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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.
Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.
Obrzut, J.; Kano, K. Instrumentation and Measurement, IEEE Transactions on, 2005
This paper presents the application of a waveform technique that can determine the complex impedance and nonlinear response of dielectric composite films at high ac voltages using a data acquisition (DAQ) card and virtual instrumentation. The voltage waveforms are Fourier transformed from the time domain to the frequency domain to obtain the fundamental and higher order harmonic responses as complex ...
Xin Yang; Meng Song; Kun Nan Cao; Da Da Wang; Bin Wei Applied Superconductivity, IEEE Transactions on, 2014
110 kV cold dielectric high temperature superconducting (HTS) cable has been developing in China. Generally, the lapped dielectric structure is adapted for cable body, so dielectric characteristics of dielectric sheets are very important. Polyimide, Polypropylene laminated paper (PPLP) and polyimide and poly tetra fluoro ethylene (PTFE) are widespread dielectric sheet materials for HTS equipments with lapped structure. In this paper, ...
Vo, H.T.; Shi, F.G. Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on, 2005
High dielectric constant (high-k) materials are needed for embedded passives in advanced packaging applications. This work presents a systematic theoretical investigation of the effective dielectric constant, dielectric loss of dielectric polymers filled with high-k coated conducting particles with the objective to aid the design of polymer/filler composite materials with high dielectric constant and low dielectric loss at high frequencies. Our ...
Todd, Michael G.; Shi, F.G. Components and Packaging Technologies, IEEE Transactions on, 2003
High frequency microelectronic and optoelectronic device packaging requires the use of substrate and encapsulation materials having a low dielectric constant, low dielectric loss and high volume resistivity. Most packaging materials are polymer-ceramic composites. A clear understanding of the broadband dielectric properties of composite materials is thus of great current importance for the effective development of high frequency packaging materials and ...
Bois, K.J.; Handjojo, L.F.; Benally, A.D.; Mubarak, K.; Zoughi, R. Instrumentation and Measurement, IEEE Transactions on, 1999
There are numerous dielectric property characterization techniques available in the microwave regime each with its own uniqueness, advantages and disadvantages. The two-port completely-filled waveguide (transmission line) technique is a robust measurement approach which is well suited for solid dielectric materials. In this case, the dielectric material can be relatively easily machined to fit inside the waveguide and the subsequent measurement ...
Gambino, Jeff Advanced Interconnect Technology for 32 NM and Beyond, 2008
This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
Richter, Curt Molecular Electronics (Part 1), 2007
This course will begin by outlining approaching limits of conventional CMOS technology. New architectural requirements and paradigms for future nanoelectronics will be described. .Top-down. and .bottom-up. manufacturing paradigms, particularly self-assembly of organic monolayers will be discussed. Theoretical and experimental realizations of molecular-scale electronic switches will be described. This course will also show nanoscale memory and logic circuits built with these ...
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"
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