60 resources related to Dielectric materials
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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2014 IEEE International Power Modulator and High Voltage Conference (IPMHVC)
Power Modulators and High Voltage in Research, Industry, and Government.
2013 9th IEEE International Symposium on Diagnostics for Electric Machines, Power Electronics and Drives - (SDEMPED 2013)
1.ELECTRICAL MACHINES: Failure detection and location in electrical machines using vibration, audible noise, electrical or mechanical variables, sensors, insulation failures, electrical, mechanical and thermal models 2.POWER ELECTRONICS: Diagnostics in power converters using input-output monitoring, thermal and/or electrical measurements on power semiconductors, control supervision, signal processing 3.ADJUSTABLE SPEED DRIVES: Monitoring and diagnostics for ASDs using electrical machines, power converters a
2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM)
Materials and processes for packaging the whole range of electronic and optoelectronic products.
Obrzut, J.; Kano, K. Instrumentation and Measurement, IEEE Transactions on , 2005
This paper presents the application of a waveform technique that can determine the complex impedance and nonlinear response of dielectric composite films at high ac voltages using a data acquisition (DAQ) card and virtual instrumentation. The voltage waveforms are Fourier transformed from the time domain to the frequency domain to obtain the fundamental and higher order harmonic responses as complex ...
Vo, H.T.; Shi, F.G. Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on , 2005
High dielectric constant (high-k) materials are needed for embedded passives in advanced packaging applications. This work presents a systematic theoretical investigation of the effective dielectric constant, dielectric loss of dielectric polymers filled with high-k coated conducting particles with the objective to aid the design of polymer/filler composite materials with high dielectric constant and low dielectric loss at high frequencies. Our ...
Todd, Michael G.; Shi, F.G. Components and Packaging Technologies, IEEE Transactions on , 2003
High frequency microelectronic and optoelectronic device packaging requires the use of substrate and encapsulation materials having a low dielectric constant, low dielectric loss and high volume resistivity. Most packaging materials are polymer-ceramic composites. A clear understanding of the broadband dielectric properties of composite materials is thus of great current importance for the effective development of high frequency packaging materials and ...
Bois, K.J.; Handjojo, L.F.; Benally, A.D.; Mubarak, K.; Zoughi, R. Instrumentation and Measurement, IEEE Transactions on , 1999
There are numerous dielectric property characterization techniques available in the microwave regime each with its own uniqueness, advantages and disadvantages. The two-port completely-filled waveguide (transmission line) technique is a robust measurement approach which is well suited for solid dielectric materials. In this case, the dielectric material can be relatively easily machined to fit inside the waveguide and the subsequent measurement ...
Fiedziuszko, S.J.; Hunter, I.C.; Itoh, T.; Kobayashi, Y.; Nishikawa, T.; Stitzer, S.N.; Wakino, K. Microwave Theory and Techniques, IEEE Transactions on , 2002
Dielectric materials are continuing to play a very important role in the microwave communication systems. These materials are key in realization of low-loss temperature-stable resonators and filters for satellite and broadcasting equipment, and in many other microwave devices. High dielectric- constant materials are critical to the miniaturization of wireless systems, both for the terminals and base-stations, as well as for ...
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Gambino, Jeff Advanced Interconnect Technology for 32 NM and Beyond , 2008
This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
Richter, Curt Molecular Electronics (Part 1) , 2007
This course will begin by outlining approaching limits of conventional CMOS technology. New architectural requirements and paradigms for future nanoelectronics will be described. .Top-down. and .bottom-up. manufacturing paradigms, particularly self-assembly of organic monolayers will be discussed. Theoretical and experimental realizations of molecular-scale electronic switches will be described. This course will also show nanoscale memory and logic circuits built with these ...
IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
IMS 2014: LNA Modules for the WR4 (170-260 GHz) Frequency Range
Larson Collection interview with John V. Atanasoff
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.