Conferences related to Dielectric materials

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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic dielectrics, etc... prebreakdown and breakdown in solids, liquids, gases, and vacuum surface flashover, and treeing.

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2014 IEEE Electrical Insulation Conference (EIC)

The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.

  • 2013 IEEE Electrical Insulation Conference (EIC)

    Held biennially since 1958, the Electrical Insulation Conference is focused on the practical applications of electrical insulating systems and materials (including nanodielectrics), the associated diagnostics, including field use, as applied to all types of electrical and electronic equipment.

  • 2011 Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    The Conference is a venue to discuss the development, application and testing of electrical insulation, usually in high voltage equipment, such as rotating machines, transformers, switchgear, cables, outdoor insulation, live line work, aerospace, and capacitors. Papers are oriented in practical applications, rather than basic research.

  • 2009 IEEE Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    Electrical insulating materrials and systems, their application to all types of electrical and electronic equipment and associated diagnostics.

  • 2007 Electrical Insulation Conference and Electrical Manufacturing Expo (EIC/EME)


2012 4th Electronic System-Integration Technology Conference (ESTC)

The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.


2012 IEEE International Conference on Condition Monitoring and Diagnosis (CMD)

Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.

  • 2008 International Conference on Condition Monitoring and Diagnosis (CMD)

    Condition Monitoring and Diagnosis for Power Plants Condition Monitoring and Diagnosis of HV Power Apparatus and Power System Electrical, Mechanical, Thermal and Chemical Failure Phenomena Dielectric Materials Aging and Failure Mechanism Advanced Sensing Technologies for Condition Monitoring and Diagnosis Application of Artificial Intelligence for Data Mining and Condition Assessment Applications of Information Technology for Asset Management Strategic Planning and Management for Condition Monitoring


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Periodicals related to Dielectric materials

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


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Most published Xplore authors for Dielectric materials

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Xplore Articles related to Dielectric materials

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Issues in computer aided engineering for power semiconductor devices and ICs

R. K. Williams Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00991230.png)


Full set of complex material constants for porous piezoelectric ceramics

Andrey Rybianets; Anastasia Rybianets; Andrey Nasedkin 2008 17th IEEE International Symposium on the Applications of Ferroelectrics, 2008

Porous piezoelectric ceramics are important for a variety of applications such as medical ultrasonic devices, non-destructive testing, underwater acoustics etc. In this paper a line of proprietary porous piezoelectric ceramics with 3-0/3-3 connectivity types were systematically studied. Complex sets of elastic, dielectric and piezoelectric coefficients of the porous piezoelectric ceramics were measured by ultrasonic and impedance spectroscopy methods using Piezoelectric ...


Additional approximate formulas and experimental data on micro-coplanar striplines [MMICs]

Y. Qian; E. Yamashita IEEE Transactions on Microwave Theory and Techniques, 1990

Approximate design formulas and experimental data of micro-coplanar striplines for high-packing-density MMICs are given. These formulas are applicable to three types of substrate materials: GaAs, plastics, and alumina with different dielectric constants


Narrow Ka bandpass filters using periodically loaded substrates

W. J. Chappell; Xun Gong; L. P. B. Katehi IEEE MTT-S International Microwave Symposium Digest, 2003, 2003

High-k ceramics (TiO/sub 2/) are periodically embedded into a polymer based host material to create a filter utilizing the two-dimensional stopband of the periodic dielectric materials. The high-k ceramic rods (/spl epsiv//spl sim/90) are periodically spaced in a commercially-available Teflon-based host, to create a material that will inhibit propagation in two-dimensions. The inhibition of energy is used to create a ...


Breakdown voltage enhancement for devices on thin silicon layer/silicon dioxide film

A. Nakagawa; N. Yasuhara; Y. Baba IEEE Transactions on Electron Devices, 1991

Studies of high-voltage lateral device structures on a thin silicon layer over silicon dioxide have been carried out. It was found both theoretically and experimentally that over 600-V devices can be realized using a structure consisting of an n diffusion layer over a 15-μm-thick high-resistivity n- silicon layer over 3-μm silicon dioxide (SOI). A method is presented to enhance breakdown ...


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Educational Resources on Dielectric materials

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eLearning

Issues in computer aided engineering for power semiconductor devices and ICs

R. K. Williams Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00991230.png)


Full set of complex material constants for porous piezoelectric ceramics

Andrey Rybianets; Anastasia Rybianets; Andrey Nasedkin 2008 17th IEEE International Symposium on the Applications of Ferroelectrics, 2008

Porous piezoelectric ceramics are important for a variety of applications such as medical ultrasonic devices, non-destructive testing, underwater acoustics etc. In this paper a line of proprietary porous piezoelectric ceramics with 3-0/3-3 connectivity types were systematically studied. Complex sets of elastic, dielectric and piezoelectric coefficients of the porous piezoelectric ceramics were measured by ultrasonic and impedance spectroscopy methods using Piezoelectric ...


Additional approximate formulas and experimental data on micro-coplanar striplines [MMICs]

Y. Qian; E. Yamashita IEEE Transactions on Microwave Theory and Techniques, 1990

Approximate design formulas and experimental data of micro-coplanar striplines for high-packing-density MMICs are given. These formulas are applicable to three types of substrate materials: GaAs, plastics, and alumina with different dielectric constants


Narrow Ka bandpass filters using periodically loaded substrates

W. J. Chappell; Xun Gong; L. P. B. Katehi IEEE MTT-S International Microwave Symposium Digest, 2003, 2003

High-k ceramics (TiO/sub 2/) are periodically embedded into a polymer based host material to create a filter utilizing the two-dimensional stopband of the periodic dielectric materials. The high-k ceramic rods (/spl epsiv//spl sim/90) are periodically spaced in a commercially-available Teflon-based host, to create a material that will inhibit propagation in two-dimensions. The inhibition of energy is used to create a ...


Breakdown voltage enhancement for devices on thin silicon layer/silicon dioxide film

A. Nakagawa; N. Yasuhara; Y. Baba IEEE Transactions on Electron Devices, 1991

Studies of high-voltage lateral device structures on a thin silicon layer over silicon dioxide have been carried out. It was found both theoretically and experimentally that over 600-V devices can be realized using a structure consisting of an n diffusion layer over a 15-μm-thick high-resistivity n- silicon layer over 3-μm silicon dioxide (SOI). A method is presented to enhance breakdown ...


More eLearning Resources

IEEE.tv Videos

IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Unconventional Superconductivity: From History to Mystery
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies
Care Innovations: Green Engineering (com legendas em portugues)
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
2013 IEEE Corporate Innovation Award
Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Materials Challenges for Next-Generation, High-Density Magnetic Recording - Kazuhiro Hono: IEEE Magnetics Distinguished Lecture 2016
EMBC 2011-Speaker Highlights-Mary Tolikas, PhD, MBA
35 Years of Magnetic Heterostructures
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
30 Years to High Temperature Superconductivity (HTS): Status and Perspectives
APEC 2011 Exhibitor Overview
Recent Research Activities of Applied Superconductivity in China
2011 IEEE Awards Edison Medal - Isamu Akasaki
Perpendicular magnetic anisotropy: From ultralow power spintronics to cancer therapy

IEEE-USA E-Books

  • Electrical Characterization of Glass, Teflon, and Tantalum Capacitors at High Temperatures

    Dielectric materials and electrical components and devices employed in radiation fields and space environment are often exposed to elevated temperatures among other things. These systems must, therefore, withstand the high temperature exposure while still providing good electrical and other functional properties. In this work, experiments were carried out to evaluate glass, teflon, and tantalum capacitors for potential use in high temperature applications. The capacitors were characterized in terms of their capacitance and dielectric loss as a function of temperature up to 200 °C. At a given temperature, these properties were obtained in a frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed in a temperature range from 20 to 200 °C. The results obtained are discussed and conclusions are made concerning the suitability of the capacitors investigated for high temperature applications.

  • More on One-Dimensional Simulation

    This chapter introduces some advanced concepts of one-dimensional electromagnetic (EM) FDTD simulation. First, it changes the formulation slightly and introduces the use of the flux density into the simulation. One of the most significant developments in the FDTD method is a means to simulate frequency-dependent dielectric materials. Then, the chapter introduces the use of the discrete Fourier transform in FDTD simulation. This is an extremely powerful method to quantify the output of the simulation. The chapter concludes with the simulation of human muscle tissue. Muscle tissue can be adequately simulated over a frequency range of about two decades with the Lorentz formulation.

  • Materials and Processing Considerations

    This chapter contains sections titled: Introduction Substrate Materials Dielectric Materials Metallization Planarization Chip Bonding Technologies Die Attach Summary This chapter contains sections titled: Exercises References

  • Electrostatic Fields in the Presence of Dielectrics

    This chapter contains sections titled: Volume Charges in Vacuum Green's Function for Infinite Space Multipole Expansion Potential Generated by a Single Layer of Charge Potential Generated by a Double Layer of Charge Potential Generated by a Linear Charge Spherical Harmonics Dielectric Materials Cavity Fields Dielectric Sphere in an External Field Dielectric Spheroid in an Incident Field Numerical Methods

  • Manufacturing, Shipping,and Installation Guidelines

    This chapter contains sections titled: Keep Dielectric Materials to a Minimum When Dielectric Materials are Required, Keep Contact Between Them to a Minimum Conductive Materials Must Be Connected to Ground, If At All Possible (Remember, the human body is conductive) If It Is Not Possible, or Cost Effective, to Prevent Charge Buildup Completely, then Use Ionizers, or Other Devices, to Discharge Components Prior to Assembly Minimize Handling of Components or Assemblies; Especially Handling Resulting in Conductive Contact Shield Especially Sensitive Electronic Components and Assemblies The Ground Path for Conductive Items Must Have a Resistance of at Least 1 M?>, but No More Than 100 M?> Static Prevention Must Take Place at _All_ Points in the Manufacturing, Shipping, and Installation Process Make Regular Checks to Ensure the ESD Protection System is Working Properly This chapter contains sections titled: Summary of Manufacturing, Shipping, and Installation Guidelines

  • Fundamentals

    This chapter contains sections titled: Introduction U.S. and International Standards Insulation Systems and Service Life UL Standards for Insulation Systems Material Aging and Breakdown Partial Discharge (Corona) Space Charges Radiation Dipole Moment and Polarization Material Selection Steps Temperature Index of Dielectric Materials Standard Tests for Dielectric Materials SI System for Metric Practice (ASTM E 380)

  • Organic Printed Circuit Board Materials and Processes

    This chapter contains sections titled: Introduction Common Issues for All PCB Layer Constructions PCB Process Flow Dielectric Materials Surface Finishes Advanced PCB Structures Specifications and Standards Key Terms This chapter contains sections titled: References Exercises

  • Dielectric Materials

    This chapter contains sections titled: Historical Survey The Electric Moment of a Neutral System of Charges The Static Macroscopic Electric Field Due to a Volume of Polarized Dielectric Material A Generalization of D0 The Local Field Electronic Polarization Ionic Polarization Orientational Polarization Dielectric Susceptibility, Permittivity, and Relative Dielectric Constant The Static Dielectric Constant of Gases The Static Dielectric Constant of Solids and Liquids The Clausius-Mossotti Equation Primary Static Charges in an Infinite, Homogeneous, Isotropic Medium Ferroelectric Crystals Piezoelectrics Time-Harmonic Fields and Complex Permittivity Time-Harmonic Electronic Polarizability Complex Ionic Polarizability Time-Harmonic Permittivity of Non-Polar Materials Dipolar Relaxation Dielectric Losses Maxwell's Equations for Dielectric Materials This chapter contains sections titled: References Problems

  • Capacitance Phenomena

    The phenomenon of building up a static charge when walking on a carpet illustrates the charge-storing abilities of human body capacitance. Many electronic devices, such as touch-screen displays, touch-sensitive switches, and computer touch pads make use of this property. Capacitors used in electric power applications are typified by the rectangular cans with one or two bushings. When the dielectric materials contain polarized molecules (dipoles), the polarization may be caused by field cancellation from the capacitor plates. In a simple DC circuit, capacitors can be charged through a resistor at an exponential rate. Power capacitors are used in electric power applications mainly for power factor correction and harmonic filters. Filter capacitors cause several electrical hazards, including the risk of electrical shock from a capacitor charged to a high voltage with a high stored energy. The capacitance of a cable is a distributed quantity-the longer the cable, the larger the capacitance.

  • Dielectric Materials for Integrated Capacitors

    This chapter contains sections titled: Polarizability and Capacitance Capacitance Density Temperature Effects Frequency and Voltage Effects Aging Effects Composition and Morphology Effects Leakage and Breakdown Dissipation Factor Comparison to EIA Dielectric Classifications Matching Dielectric Materials to Applications References



Standards related to Dielectric materials

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IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and for the Evaluation of Electrical Insulation

Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.


IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials

Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"



Jobs related to Dielectric materials

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