Conferences related to Dielectric materials

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2020 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

Ferroelectric materials and applications


2018 48th European Microwave Conference (EuMC)

The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessionsand workshops are held on the full range of microwave technology from field theory, throughcomponents and subsystems to systems.

  • 2017 47th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2016 46th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology. The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2015 European Microwave Conference (EuMC 2015)

    The 45th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2015, the largest event in Europe dedicated to microwave components, systems and technology. It is the premier event to present the current status and future trends in the field of microwave, millimeter-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.The European Microwave Conference provides many opportunities of networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. In addition to scientific papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defense systems.

  • 2014 44th European Microwave Conference (EuMC)

    EuMC is the premier European conference in the microwave field, which represent the ideal venue for prospective authors to present the status and trends in microwave and millimetre-wave systems and frequency related topics, from materials and technologies to integrated circuits, systems their aspects: theory, simulation, design and measurement including passive components, design of high frequency and high data rate photonics, highly stable and noiseless microwave wave sources, new linearisation techniques and the impact of new packaging technologies.

  • 2013 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre -wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in alltheir aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development

  • 2012 European Microwave Conference (EuMC)

    Microwave and millimeter wave: active/passive devices, antennas, electromagnetics, bio-interaction, circuits, manufacturing and measurement, MEMS, meta-materials, sensor networks, cognitive radio, 4G communications, space technology and applications.

  • 2011 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development app

  • 2010 European Microwave Conference (EuMC)

    The European Microwave Conference is the premier forum for presentation of the present status and future trends in the field of microwave, millimetre- and submillimetre-wave systems and technologies.

  • 2009 European Microwave Conference (EuMC)

    The 39th European Microwave Conference (EuMC), is the core of the European Microwave Week 2009, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2008 European Microwave Conference (EuMC)

    The 38th European Microwave Conference (EuMC) in Amsterdam, The Netherlands, from 27 to 31 October, is the core of the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2007 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging.

  • 2006 European Microwave Conference (EuMC)

  • 2005 European Microwave Conference (EuMC)

  • 2004 European Microwave Conference (EuMC)

  • 2003 European Microwave Conference (EuMC)

  • 1998 28th European Microwave Conference (EuMC)

  • 1997 27th European Microwave Conference (EuMC)


2018 9th International Particle Accelerator Conference (IPAC)

Topics cover a complete survey of the field of charged particle accelerator science and technology and infrastructure.


2018 Asia-Pacific Microwave Conference (APMC)

The conference topics include microwave theory and techniques, and their related technologies and applications. They also include active devices and circuits, passive components, wireless systems, EMC and EMI, wireless power transfer and energy harvesting, antennas and propagation, and others.


2018 European Conference on Antennas and Propagation (EuCAP)

Antennas & related topics e.g. theoretical methods, systems, wideband, multiband, UWBPropagation & related topics e.g. modelling/simulation, HF, body-area, urbanAntenna & RCS measurement techniques


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Periodicals related to Dielectric materials

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Dielectric materials

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Xplore Articles related to Dielectric materials

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Retrieval of above-ground biomass and detection of forest disturbance using SIR-C/X-SAR

[{u'author_order': 1, u'affiliation': u'Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA', u'full_name': u'M. C. Dobson'}, {u'author_order': 2, u'affiliation': u'Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA', u'full_name': u'L. E. Pierce'}, {u'author_order': 3, u'affiliation': u'Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA', u'full_name': u'K. Bergen'}, {u'author_order': 4, u'affiliation': u'Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA', u'full_name': u'J. Kellndorfer'}, {u'author_order': 5, u'affiliation': u'Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA', u'full_name': u'F. T. Ulaby'}] Geoscience and Remote Sensing Symposium, 1995. IGARSS '95. 'Quantitative Remote Sensing for Science and Applications', International, None

A three-step process is presented for estimation of forest biophysical properties from orbital polarimetric SAR data. Simple direct retrieval of total above ground biomass is shown to be ill-posed unless the effects of forest structure are explicitly taken into account. The process involves classification by using SAR data to classify terrain on the basis of structural categories. Next, polarimetric SAR ...


Multi channel high aspect ratio glass microelectrode array for neuroprosthetic applications

[{u'author_order': 1, u'affiliation': u'Blackrock Microsystems 391 Chipeta Way, Suite G, Salt Lake City, UT, 84108', u'full_name': u'Sandeep Negi'}, {u'author_order': 2, u'affiliation': u'Blackrock Microsystems 391 Chipeta Way, Suite G, Salt Lake City, UT, 84108', u'full_name': u'Rajmohan Bhandari'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

To map neural signal in the brain 3D electrodes are desired. 3D electrodes are difficult fabricate due to the cumbersome assembly process. In this work, 2D array of glass electrodes were designed and later assembles into 3D by simple assembly process. Glass was used as a dielectric material to provide better electrical isolation capability and better biocompatibility compared to silicon. ...


A model for electrical tree growth in solid insulating materials using cellular automata

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Comput. Eng., Democritus Univ. of Thrace, Xanthi, Greece', u'full_name': u'M. G. Danikas'}, {u'author_order': 2, u'full_name': u'I. Karafyllidis'}, {u'author_order': 3, u'full_name': u'A. Thanailakis'}, {u'author_order': 4, u'full_name': u'A. M. Bruning'}] Conference Record of the 1996 IEEE International Symposium on Electrical Insulation, None

Models proposed to explain the breakdown mechanisms of the solid insulating materials are based, among others, on electromagnetic theory, avalanche theory and fractals. In this paper the breakdown of insulating materials is simulated using von Neumann's Cellular Automata (CAs). An algorithm for solid dielectric breakdown simulation based on CAs is presented with a point/plane electrode arrangement. The algorithm is also ...


Experimental and Mathematical Determination of Mechanical Strains within Plastic IC Packages and Their Effect on Devices During Environmental Tests

[{u'author_order': 1, u'affiliation': u'Burroughs Corporation, Micro Components Organization, 16701 West Bernardo Drive, San Diego, CA 92127', u'full_name': u'R. J. Usell'}, {u'author_order': 2, u'affiliation': u'Burroughs Corporation, Micro Components Organization, 16701 West Bernardo Drive, San Diego, CA 92127', u'full_name': u'S. A. Smiley'}] 19th International Reliability Physics Symposium, None

Methods to quantify mechanical strains in plastic encapsulated devices (PEDs) are described. Calculations of strain-producing tendencies of encapsulants from material properties and processes are given. Measurements of die strain as a function of encapsulant, processing, and environmental exposure are presented. Possible mechanisms for gap formation between chip and encapsulant during autoclave tests are described.


High Gain EBG Resonator Antenna

[{u'author_order': 1, u'affiliation': u'University of Limoges, IRCOM Laboratory; 123 Avenue Albert Thomas 87000 Limoges, Email: bjecko@unilim.fr', u'full_name': u'B. Jecko'}, {u'author_order': 2, u'full_name': u'T. Monediere'}, {u'author_order': 3, u'full_name': u'L. Leger'}] 2005 18th International Conference on Applied Electromagnetics and Communications, None

This paper describes how it is possible to increase the radiation bandwidth and the gain of a classical planar EBG antenna. Those two parameters are relative to the EBG material but also to the excitation, this second characteristic is studied here. The principle is to excite the EBG structure with several sources (instead of a single one classically). The performances ...


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Educational Resources on Dielectric materials

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eLearning

No eLearning Articles are currently tagged "Dielectric materials"

IEEE.tv Videos

IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Spatial-Spectral Materials for High Performance Optical Processing - IEEE Rebooting Computing 2017
Unconventional Superconductivity: From History to Mystery
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies
Care Innovations: Green Engineering (com legendas em portugues)
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
2013 IEEE Corporate Innovation Award
Materials Challenges for Next-Generation, High-Density Magnetic Recording - Kazuhiro Hono: IEEE Magnetics Distinguished Lecture 2016
IMS 2014: LNA Modules for the WR4 (170-260 GHz) Frequency Range
35 Years of Magnetic Heterostructures
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
EMBC 2011-Speaker Highlights-Mary Tolikas, PhD, MBA
Recent Research Activities of Applied Superconductivity in China
2011 IEEE Awards Edison Medal - Isamu Akasaki

IEEE-USA E-Books

  • PEEC Models for Dielectrics

    This chapter concentrates on inclusion of several different dielectric circuit¿¿¿oriented models in partial element equivalent circuit (PEEC) to cover a wide range of applications. The interesting aspect is that once either the real or imaginary part of the dielectric model is known for the entire frequency range 0 ¿¿¿ f ¿¿¿ ¿¿¿, then the other part is uniquely determined by the so¿¿¿called Hilbert transform. The chapter describes three different issues. First, the chapter treats the electrical description of dielectric materials in the time and frequency domains. Second, the chapter considers different approaches for the description of the properties of dielectrics such that they can be included in the PEEC solution. Third, it presents approaches for the inclusion of dielectrics in a PEEC model. The chapter further presents equivalent circuits for the multi¿¿¿pole Debye model, the Lorentz model, and other general combined models.

  • Dispersion and Anisotropic Media

    There are four major mechanisms of producing the dipole moment in a material. The electronic polarization ae, expressed by the polarizability, is caused by a slight displacement of electrons surrounding positively charged atomic nuclei under the influence of the field E, forming a dipole. The atomic polarization aa is caused by displacement of differently charged atoms with respect to each other. The dipole polarization ad, also called the orientation polarization, is caused by the change of orientation of equivalent dipoles in a medium. Polarizations ae, aa, and ad are due to the locally bound charges in the atoms or molecules. The fourth polarization, as, is called the space charge or interfacial polarization. This chapter discusses the dispersion properties of these polarizations, and the Clausius‐Mossotti formula, relating the dielectric constant to the polarizability. It considers the characteristics of a plane wave propagating in an anisotropic medium.



Standards related to Dielectric materials

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IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and for the Evaluation of Electrical Insulation

Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.


IEEE Recommended Practice for Determining the Peak Spatial-Average Specific Absorption Rate (SAR) in the Human Head from Wireless Communications Devices: Measurement Techniques

To specify protocols for the measurement of the peak spatial-average specific absorption rate (SAR) in a simplified model of the head of users of hand-held radio transceivers used for personal wireless communications services and intended to be operated while held next to the ear. It applies to contemporary and future devices with the same or similar operational characteristics as contemporary ...


IEEE Standard for Low-Voltage DC Power Circuit Breakers Used in Enclosures

Revision to incorporate both 1000V and 1200V maximum design voltage ratings. Review and revise as necessary the requirements for peak current design testing. Revise for metrification requirement.


IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials

Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"



Jobs related to Dielectric materials

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