11,135 resources related to Dielectric materials
- Topics related to Dielectric materials
- IEEE Organizations related to Dielectric materials
- Conferences related to Dielectric materials
- Periodicals related to Dielectric materials
- Most published Xplore authors for Dielectric materials
2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.
Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.
Afsar, M.N.; Button, Kenneth J. Proceedings of the IEEE, 1985
It is no longer necessary to use extrapolated microwave dielectric values when designing millimeter-wave components and systems. Very recently, highly accurate millimeter-wave (5- to 1/2-mm) data on complex dielectric permittivity and loss tangent have become available to engineers for a variety of materials such as common ceramics, semiconductors, crystalline, and glass materials. One quasi-optical measurement method has proved to be ...
Hacib, T.; Acikgoz, H.; Le Bihan, Y.; Meyer, O.; Pichon, L. Electromagnetic Field Computation (CEFC), 2010 14th Biennial IEEE Conference on, 2010
Motivated by the slow learning properties of multilayer perceptrons which utilize computationally intensive training algorithms and can get trapped in local minima, this work deals with ridge polynomial neural networks (RPNN) and least-square support vector machines (LSSVM) technique. RPNN and LSSVM are combined with the finite element method (FEM), to evaluate the dielectric materials properties. RPNN maintain fast learning properties ...
Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988
A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...
Jacob, Mohan V. Microwaves, Radar & Wireless Communications, 2006. MIKON 2006. International Conference on, 2006
Typically dielectric materials are used as a substrate for the fabrication of thin films. Some of the commonly used substrates are Quartz, Sapphire, MgO, LAO. Even though they are expensive the loss associated with these materials at high frequencies is low. In this paper the influence of RF heating on the high frequency loss of a commonly available OHP transparency ...
Weber, O.; Casse, M.; Thevenod, L.; Ducroquet, F.; Ernst, T.; Guillaumot, B.; Deleonibus, S. Solid-State Device Research Conference, 2005. ESSDERC 2005. Proceedings of 35th European, 2005
We report an experimental study of the mobility in TiN/HfO2 gate stacks focused on the accurate determination of the HfO2 remote soft phonon scattering mechanism. The high-K intrinsic mechanism is clearly dissociated from Coulomb scattering which generally dominates the mobility degradation in high-K/metal gate stacks. The temperature dependence of this additional phonon scattering mechanism is nearly linear. This scattering mechanism ...
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"