11,098 resources related to Dielectric materials
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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.
Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.
Jiongxin Lu; Wong, C.P. Dielectrics and Electrical Insulation, IEEE Transactions on, 2008
In this paper, a wide variety of high dielectric constant (k) composite materials which have been developed and evaluated for embedded capacitor application are reviewed. Current research efforts toward achieving high dielectric performance including high-k and low dielectric loss for polymer composites are presented. New insights into the effect of unique properties of the nanoparticle filler, filler modification and the ...
Spectrum, IEEE, 1965
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Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988
A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...
Majeed, B.; Pham, N.P.; Tezcan, D.S.; Beyne, E. Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 2008
This paper reports on the feasibility of parylene N as a dielectric material for through silicon vias (TSV). TSV are the key enabling technology for 3D wafer laver packaging. Parylene is used as an insulating material in one of the approaches adopted for realizing 3D wafer level packaging at IMEC. This paper discusses main issues regarding the processing of parylene ...
Ajour, M.N.; Dissado, L.A.; Fothergill, J.C.; Norman, P.N. Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on, 2002
Glass fibre reinforced epoxy (GFRE) material is used in pressboard transformers for optical telecommunication systems, typically at voltages between 1 to 2 kV. A programme has been set up to follow the electrical ageing of the GFRE through dielectric and space charge (PEA) measurements. Here we report on the characterisation of the GFRE prior to ageing made by means of ...
Gambino, Jeff Advanced Interconnect Technology for 32 NM and Beyond, 2008
This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"