Conferences related to Dielectric materials

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2018 9th International Particle Accelerator Conference (IPAC)

Topics cover a complete survey of the field of charged particle accelerator science and technology and infrastructure.


2018 International Conference on Actual Problems of ElectronDevices Engineering (APEDE)

The conference APEDE will provide a forum for scientists and engineers from Russia and different countries.The goal of this Conference is to bring together the researchers from academia and to share ideas,problems and solutions relating to the multifaceted aspects of Electronics and Technology. Topics of Conference- Microwave Electronics;- Vacuum Microelectronics and Nanoelectronics;- Microwave Theory and Techniques;- Technologies;- Power Electronics;- Applications of Electron Devices.

  • 2016 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

    Microwave electronics Vacuum microelectronics and nanoelectronics Microwave theory and techniques Technologies Applications of electron devices

  • 2014 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

    Papers in the following areas are requested:Microwave electronics, Microwave theory and techniques, Measurement in electronics, Power electronics, Technologies Applications of Electron Devices, Vacuum Microelectronics and nanoelectronics.

  • 2012 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

    Microwave electronics Vacuum Microelectronics and nanoelectronics Microwave theory and techniques Technologies Applications of Electron Devices

  • 2010 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

    The purpose of the conference is to provide a forum for extended interaction between scientists, engineers, and students working in the fields of electronics and device technologies. Papers in the following areas are requested: microwave electronics, including nanoelectronics; microwave theory and techniques; electron devices and instruments application and technology, power electronics.

  • 2008 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

    Microwave Electronics, including semiconductor devices, power-amplifier devices, photonics and optoelectronics, nanoelectronics; Microwave Theory and Techniques, including electromagnetic field analysis and guided waves, resonators, filters, antennas, passive microwave components, acoustic wave components; Electron Devices and Instruments Application and Technology, including power electronics, medical application, sensor and sensor systems, process technology.

  • 2006 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

  • 2004 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

  • 2002 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

  • 2000 International Conference on Actual Problems of Electron Devices Engineering (APEDE)

  • 1998 International Conference on Actual Problems of Electron Devices Engineering (APEDE)


2017 11th European Conference on Antennas and Propagation (EUCAP)

The conference addresses all scientific and application topics in the area of electromagnetic antennas and radio propagation whatever the frequency.


2017 12th International Forum on Strategic Technology (IFOST)

New materials and nanotechnologies , Information and communication technologies , Information and communication technologies , Power engineering and electric power electronics , etc


2017 18th International Conference on Electronic Packaging Technology (ICEPT)

The conference will exchange the latest developments in the field of electronic packaging technology through exhibitions, special lectures, special reports, thematic forums, club reports, posters and other forms of experience


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Periodicals related to Dielectric materials

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Dielectric materials

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Xplore Articles related to Dielectric materials

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Characterization of three-dimensional GaAs/Al<sub>x</sub>O<sub>y</sub> near-infrared photonic crystals fabricated by using an autocloning technique

M. -H. Mao; D. -M. Yeh; P. -W. Liu; H. -H. Lin; H. -L. Chen; C. -T. Pan The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003., 2003

A series of three-dimensional photonic crystals are fabricated. The existence of photonic bandgap is demonstrated in the near-infrared wavelength range and bandgap position shows red-shift with increasing feature size of photonic crystals.


A grounded coplanar waveguide technique for microwave measurement of complex permittivity and permeability

Jiqing Hu; A. Sligar; Chih-Hung Chang; Shih-Lien Lu; R. K. Settaluri IEEE Transactions on Magnetics, 2006

We present a method for extracting the complex permittivity and permeability of dielectric/magnetic thin films in a grounded coplanar waveguide configuration. The technique is applicable for extraction of these material parameters for lossy and lossless materials over a broad frequency range with high accuracy. For validation, we extracted complex permittivity and permeability, using the scattering parameters obtained from the full-wave ...


Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

R. C. Dunne; S. K. Sitaraman; S. Luo; C. P. Wong; W. E. Estes; M. Periyasamy; J. Coburn 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, the processing temperatures and the thermomechanical properties of the dielectric and substrate materials. In this work, a prospective epoxy-based dielectric material for such sequentially built up (SBU) high density-interconnect printed wiring ...


Working equations for piezoelectric actuators and sensors

M. S. Weinberg Journal of Microelectromechanical Systems, 1999

A new solution to the force, displacements, and charges developed in piezoelectric beams is derived. Differing from previous solutions, this development determines the neutral axis where the bending strains are zero and results in a closed form solution (without matrix inversion). With the closed form, simplifications become evident which increase understanding and facilitate calculations. These equations are than expanded to ...


Multilayer Analysis of the CdTe Solar Cell Structure by Spectroscopic Ellipsometry

Jie Chen; Jian Li; D. Sainju; K. D. Wells; N. J. Podraza; R. W. Collins 2006 IEEE 4th World Conference on Photovoltaic Energy Conference, 2006

In this study, ex situ spectroscopic ellipsometry was applied to investigate the optical properties and structure of the thin film CdTe solar cell and its component layer materials. Dielectric functions have been obtained by SE for all layers of the cell, leading to a reference library for comprehensive ex situ CdTe solar cell analysis. In addition, with a Br2+methanol layer-by-layer ...


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Educational Resources on Dielectric materials

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eLearning

Characterization of three-dimensional GaAs/Al<sub>x</sub>O<sub>y</sub> near-infrared photonic crystals fabricated by using an autocloning technique

M. -H. Mao; D. -M. Yeh; P. -W. Liu; H. -H. Lin; H. -L. Chen; C. -T. Pan The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003., 2003

A series of three-dimensional photonic crystals are fabricated. The existence of photonic bandgap is demonstrated in the near-infrared wavelength range and bandgap position shows red-shift with increasing feature size of photonic crystals.


A grounded coplanar waveguide technique for microwave measurement of complex permittivity and permeability

Jiqing Hu; A. Sligar; Chih-Hung Chang; Shih-Lien Lu; R. K. Settaluri IEEE Transactions on Magnetics, 2006

We present a method for extracting the complex permittivity and permeability of dielectric/magnetic thin films in a grounded coplanar waveguide configuration. The technique is applicable for extraction of these material parameters for lossy and lossless materials over a broad frequency range with high accuracy. For validation, we extracted complex permittivity and permeability, using the scattering parameters obtained from the full-wave ...


Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

R. C. Dunne; S. K. Sitaraman; S. Luo; C. P. Wong; W. E. Estes; M. Periyasamy; J. Coburn 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, the processing temperatures and the thermomechanical properties of the dielectric and substrate materials. In this work, a prospective epoxy-based dielectric material for such sequentially built up (SBU) high density-interconnect printed wiring ...


Working equations for piezoelectric actuators and sensors

M. S. Weinberg Journal of Microelectromechanical Systems, 1999

A new solution to the force, displacements, and charges developed in piezoelectric beams is derived. Differing from previous solutions, this development determines the neutral axis where the bending strains are zero and results in a closed form solution (without matrix inversion). With the closed form, simplifications become evident which increase understanding and facilitate calculations. These equations are than expanded to ...


Multilayer Analysis of the CdTe Solar Cell Structure by Spectroscopic Ellipsometry

Jie Chen; Jian Li; D. Sainju; K. D. Wells; N. J. Podraza; R. W. Collins 2006 IEEE 4th World Conference on Photovoltaic Energy Conference, 2006

In this study, ex situ spectroscopic ellipsometry was applied to investigate the optical properties and structure of the thin film CdTe solar cell and its component layer materials. Dielectric functions have been obtained by SE for all layers of the cell, leading to a reference library for comprehensive ex situ CdTe solar cell analysis. In addition, with a Br2+methanol layer-by-layer ...


More eLearning Resources

IEEE.tv Videos

IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
Unconventional Superconductivity: From History to Mystery
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies
Care Innovations: Green Engineering (com legendas em portugues)
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
2013 IEEE Corporate Innovation Award
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Materials Challenges for Next-Generation, High-Density Magnetic Recording - Kazuhiro Hono: IEEE Magnetics Distinguished Lecture 2016
35 Years of Magnetic Heterostructures
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
EMBC 2011-Speaker Highlights-Mary Tolikas, PhD, MBA
30 Years to High Temperature Superconductivity (HTS): Status and Perspectives
APEC 2011 Exhibitor Overview
Recent Research Activities of Applied Superconductivity in China
2011 IEEE Awards Edison Medal - Isamu Akasaki

IEEE-USA E-Books

  • Dispersion and Anisotropic Media

    There are four major mechanisms of producing the dipole moment in a material. The electronic polarization ae, expressed by the polarizability, is caused by a slight displacement of electrons surrounding positively charged atomic nuclei under the influence of the field E, forming a dipole. The atomic polarization aa is caused by displacement of differently charged atoms with respect to each other. The dipole polarization ad, also called the orientation polarization, is caused by the change of orientation of equivalent dipoles in a medium. Polarizations ae, aa, and ad are due to the locally bound charges in the atoms or molecules. The fourth polarization, as, is called the space charge or interfacial polarization. This chapter discusses the dispersion properties of these polarizations, and the Clausius‐Mossotti formula, relating the dielectric constant to the polarizability. It considers the characteristics of a plane wave propagating in an anisotropic medium.

  • PEEC Models for Dielectrics

    This chapter concentrates on inclusion of several different dielectric circuit¿¿¿oriented models in partial element equivalent circuit (PEEC) to cover a wide range of applications. The interesting aspect is that once either the real or imaginary part of the dielectric model is known for the entire frequency range 0 ¿¿¿ f ¿¿¿ ¿¿¿, then the other part is uniquely determined by the so¿¿¿called Hilbert transform. The chapter describes three different issues. First, the chapter treats the electrical description of dielectric materials in the time and frequency domains. Second, the chapter considers different approaches for the description of the properties of dielectrics such that they can be included in the PEEC solution. Third, it presents approaches for the inclusion of dielectrics in a PEEC model. The chapter further presents equivalent circuits for the multi¿¿¿pole Debye model, the Lorentz model, and other general combined models.



Standards related to Dielectric materials

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IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and for the Evaluation of Electrical Insulation

Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.


IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials

Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"



Jobs related to Dielectric materials

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