11,155 resources related to Dielectric materials
- Topics related to Dielectric materials
- IEEE Organizations related to Dielectric materials
- Conferences related to Dielectric materials
- Periodicals related to Dielectric materials
- Most published Xplore authors for Dielectric materials
2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.
Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.
Shen Cherng; Yen-Ting Yang; Hsien-Chiao Teng Antenna Technology: Small Antennas and Novel Metamaterials, 2008. iWAT 2008. International Workshop on, 2008
This report presents the power pattern calculated by HFSS for the RF-microwave transmitted from a low profile inexpensive small patch antenna and scattered by a spherical object embedded within the confines of cuboid dissipative medium. The localization of the object causes the alteration of the radiation power pattern as well as the efficiency of the antenna. The calculation results indicate ...
Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988
A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...
Ma, T.P. Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on, 2004
Some important issues related to the electrical characterization of high-k dielectrics will be reviewed and discussed. The problems with the conventional mobility extraction methodology for high-k gated MOSFETs will be pointed out, and an improved methodology will be demonstrated. Trapping in high-k gate dielectrics not only significantly affect electrical measurements, but also presents a serious reliability problem. Our experimental results ...
Hata, R.; Yoshino, Y.; Shimizu, T. Power Engineering Society Winter Meeting, 2000. IEEE, 2000
In 1999, the bulk transmission lines from Tuas power station to Ayer Rajah and Labrador substations were commissioned in Singapore. Polypropylene laminated paper (PPLP), a new insulating material with high dielectric strength and low loss was employed to this important outgoing lines from the newly-installed most modern power station. PPLP has been developed since 1970 by Sumitomo Electric and applied ...
Sturdivant, R.; Chung Ly; Benson, J.; Wooldridge, J. Microwave Symposium Digest, 1997., IEEE MTT-S International, 1997
MMIC flip chips offer several benefits over conventional face-up versions. This includes lower cost, ease of interconnection, self alignment to motherboard, and simultaneous attachment and electrical connection. High power MMIC flip chips use bumps on the FET source to provide for an improved thermal path. When connected to a high thermal conductivity mounting substrate such as aluminum nitride, high power ...
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"