11,115 resources related to Dielectric materials
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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.
Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.
Xiaorong Luo; Jiang, Y.H.; Zhou, K.; Wang, P.; Wang, X.W.; Wang, Q.; Yao, G.L.; Zhang, B.; Li, Z.J. Electron Device Letters, IEEE, 2012
A superjunction (SJ) VDMOS with a high-_k_ (HK) dielectric pillar below the trench gate is proposed and investigated by simulation. The HK dielectric causes a self-adapted assistant depletion of the n pillar. This not only increases the n-pillar doping concentration and thus reduces the specific on- resistance (_R_on, sp) but also alleviates the charge-imbalance issue in SJ devices. The HK ...
Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988
A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...
Tewari, U.S.; Sharma, S.K.; Nalwa, H.S.; Vasudevan, P. Electrical Insulation, IEEE Transactions on, 1985
Polymers normally exhibit low dielectric permittivity, but very high values have also been exhibited under conditions of nomadic and interfacial polarization and by ferroelectric materials. Each of these mechanism require certain physico-chemical structural features in the solids. Interesting dielectric properties displayed by phthalocyanine systems, in particular polymeric copper phthalocyanine, synthesized in our laboratory, are discussed.
Degryse, D.; Vandevelde, B.; Beyne, E. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on, 2005
Wire bonding is a widely used interconnection technique. Traditional processes use Au bond wire and Al metal layers. Nowadays there is a trend to go over to Cu bond wire to benefit from its better electrical performance characteristics. However during the bonding process, high pressure is put on the bond pad structure. These bond pad structures can contain low K ...
Tokumitsu, Y.; Ishizaki, M.; Iwakuni, Mikio; Saito, T. Microwave Theory and Techniques, IEEE Transactions on, 1983
This paper discusses the feasibility of employing alumina substrates instead of fused quartz or sapphire substrates in millimeter-wave integrated circuits (IC's), an attractive prospect since alumina boasts considerable advantages over either of the other materials. Millimeter-wave 50-GHz components were developed on alumina substrates. These included passive components, a mixer, an ASK modulator, and an oscillator. Empirical results for both oscillator ...
Gambino, Jeff Advanced Interconnect Technology for 32 NM and Beyond, 2008
This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"