Conferences related to Dielectric materials

Back to Top

2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic dielectrics, etc... prebreakdown and breakdown in solids, liquids, gases, and vacuum surface flashover, and treeing.

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2014 IEEE Electrical Insulation Conference (EIC)

The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.

  • 2013 IEEE Electrical Insulation Conference (EIC)

    Held biennially since 1958, the Electrical Insulation Conference is focused on the practical applications of electrical insulating systems and materials (including nanodielectrics), the associated diagnostics, including field use, as applied to all types of electrical and electronic equipment.

  • 2011 Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    The Conference is a venue to discuss the development, application and testing of electrical insulation, usually in high voltage equipment, such as rotating machines, transformers, switchgear, cables, outdoor insulation, live line work, aerospace, and capacitors. Papers are oriented in practical applications, rather than basic research.

  • 2009 IEEE Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    Electrical insulating materrials and systems, their application to all types of electrical and electronic equipment and associated diagnostics.

  • 2007 Electrical Insulation Conference and Electrical Manufacturing Expo (EIC/EME)


2012 4th Electronic System-Integration Technology Conference (ESTC)

The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.


2012 IEEE International Conference on Condition Monitoring and Diagnosis (CMD)

Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.

  • 2008 International Conference on Condition Monitoring and Diagnosis (CMD)

    Condition Monitoring and Diagnosis for Power Plants Condition Monitoring and Diagnosis of HV Power Apparatus and Power System Electrical, Mechanical, Thermal and Chemical Failure Phenomena Dielectric Materials Aging and Failure Mechanism Advanced Sensing Technologies for Condition Monitoring and Diagnosis Application of Artificial Intelligence for Data Mining and Condition Assessment Applications of Information Technology for Asset Management Strategic Planning and Management for Condition Monitoring


More Conferences

Periodicals related to Dielectric materials

Back to Top

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


More Periodicals


Xplore Articles related to Dielectric materials

Back to Top

Ultralow Specific On-Resistance Superjunction Vertical DMOS With High-<formula formulatype="inline"> K </formula> Dielectric Pillar

Xiaorong Luo; Jiang, Y.H.; Zhou, K.; Wang, P.; Wang, X.W.; Wang, Q.; Yao, G.L.; Zhang, B.; Li, Z.J. Electron Device Letters, IEEE, 2012

A superjunction (SJ) VDMOS with a high-_k_ (HK) dielectric pillar below the trench gate is proposed and investigated by simulation. The HK dielectric causes a self-adapted assistant depletion of the n pillar. This not only increases the n-pillar doping concentration and thus reduces the specific on- resistance (_R_on, sp) but also alleviates the charge-imbalance issue in SJ devices. The HK ...


Novel dielectric-waveguide components

Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988

A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...


High Permittivity in Polymers: Structure and Property Correlation

Tewari, U.S.; Sharma, S.K.; Nalwa, H.S.; Vasudevan, P. Electrical Insulation, IEEE Transactions on, 1985

Polymers normally exhibit low dielectric permittivity, but very high values have also been exhibited under conditions of nomadic and interfacial polarization and by ferroelectric materials. Each of these mechanism require certain physico-chemical structural features in the solids. Interesting dielectric properties displayed by phthalocyanine systems, in particular polymeric copper phthalocyanine, synthesized in our laboratory, are discussed.


Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process

Degryse, D.; Vandevelde, B.; Beyne, E. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on, 2005

Wire bonding is a widely used interconnection technique. Traditional processes use Au bond wire and Al metal layers. Nowadays there is a trend to go over to Cu bond wire to benefit from its better electrical performance characteristics. However during the bonding process, high pressure is put on the bond pad structure. These bond pad structures can contain low K ...


50-GHz IC Components Using Alumina Substrates

Tokumitsu, Y.; Ishizaki, M.; Iwakuni, Mikio; Saito, T. Microwave Theory and Techniques, IEEE Transactions on, 1983

This paper discusses the feasibility of employing alumina substrates instead of fused quartz or sapphire substrates in millimeter-wave integrated circuits (IC's), an attractive prospect since alumina boasts considerable advantages over either of the other materials. Millimeter-wave 50-GHz components were developed on alumina substrates. These included passive components, a mixer, an ASK modulator, and an oscillator. Empirical results for both oscillator ...


More Xplore Articles

Educational Resources on Dielectric materials

Back to Top

eLearning

Advanced Interconnect Technology for 32 NM and Beyond

Gambino, Jeff Advanced Interconnect Technology for 32 NM and Beyond, 2008

This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.


IEEE-USA E-Books

No IEEE-USA E-Books are currently tagged "Dielectric materials"



Standards related to Dielectric materials

Back to Top

IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and for the Evaluation of Electrical Insulation

Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.


IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials

Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"



Jobs related to Dielectric materials

Back to Top