Conferences related to Dielectric materials

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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic dielectrics, etc... prebreakdown and breakdown in solids, liquids, gases, and vacuum surface flashover, and treeing.

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2014 IEEE Electrical Insulation Conference (EIC)

The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.

  • 2013 IEEE Electrical Insulation Conference (EIC)

    Held biennially since 1958, the Electrical Insulation Conference is focused on the practical applications of electrical insulating systems and materials (including nanodielectrics), the associated diagnostics, including field use, as applied to all types of electrical and electronic equipment.

  • 2011 Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    The Conference is a venue to discuss the development, application and testing of electrical insulation, usually in high voltage equipment, such as rotating machines, transformers, switchgear, cables, outdoor insulation, live line work, aerospace, and capacitors. Papers are oriented in practical applications, rather than basic research.

  • 2009 IEEE Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    Electrical insulating materrials and systems, their application to all types of electrical and electronic equipment and associated diagnostics.

  • 2007 Electrical Insulation Conference and Electrical Manufacturing Expo (EIC/EME)


2012 4th Electronic System-Integration Technology Conference (ESTC)

The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.


2012 IEEE International Conference on Condition Monitoring and Diagnosis (CMD)

Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.

  • 2008 International Conference on Condition Monitoring and Diagnosis (CMD)

    Condition Monitoring and Diagnosis for Power Plants Condition Monitoring and Diagnosis of HV Power Apparatus and Power System Electrical, Mechanical, Thermal and Chemical Failure Phenomena Dielectric Materials Aging and Failure Mechanism Advanced Sensing Technologies for Condition Monitoring and Diagnosis Application of Artificial Intelligence for Data Mining and Condition Assessment Applications of Information Technology for Asset Management Strategic Planning and Management for Condition Monitoring


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Periodicals related to Dielectric materials

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


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Most published Xplore authors for Dielectric materials

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Xplore Articles related to Dielectric materials

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Ferroelectric ceramics in the Na<sub>0.5</sub>Bi<sub>0.5</sub>TiO <sub>3</sub>-K<sub>0.5</sub>Bi<sub>0.5</sub>TiO<sub>3</sub>, Na<sub>0.5 </sub>Bi<sub>0.5</sub>TiO<sub>3</sub>-PbTiO<sub>3</sub> and K<sub>0.5 </sub>Bi<sub>0.5</sub>TiO<sub>3</sub>-PbTiO<sub>3</sub> systems

O. Elkechai; J. Mercurio Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on, 1994

The study of the Na0.5Bi0.5TiO3-K 0.5Bi0.5TiO3, Na0.5Bi0.5TiO3-PbTiO3 and K 0.5Bi0.5TiO3-PbTiO3 systems was carried our using X-ray diffraction, DSC and dielectric measurements. The limits of the rhombohedral (Na0.5Bi0.5 TiO3-rich side) and orthorhombic (K0.5Bi0.5TiO3, and PbTiO3-rich side) solid solutions were determined, as well as the evolutions of their lattice parameters as a function of composition. Ceramic materials have been prepared by natural ...


Dielectric, Elastic and Piezoelectric Losses in Piezoelectric Materials

G. E. Martin 1974 Ultrasonics Symposium, 1974

First Page of the Article ![](/xploreAssets/images/absImages/01533352.png)


New formulation for evaluating complex permittivity of low-loss materials

A. Muqaibel; A. Safaai-Jazi Antennas and Propagation Society International Symposium, 2003. IEEE, 2003

A widely used method for non-contact electromagnetic characterization of materials is based on the measurement of an 'insertion transfer function'. This function is related to the complex dielectric constant of the material through a transcendental equation which can be solved numerically using a two- dimensional root search technique. Solving this complex equation is often time consuming due to slow convergence ...


3D stackable 32nm High-K/Metal Gate SOI embedded DRAM prototype

John Golz; John Safran; Bishan He; Derek Leu; Ming Yin; Todd Weaver; Adis Vehabovic; Yan Sun; Alberto Cestero; Ben Himmel; Gary Maier; Chandrasekharan Kothandaraman; Daniel Fainstein; John Barth; Norman Robson; Toshiaki Kirihata; Ken Rim; Subramanian Iyer VLSI Circuits (VLSIC), 2011 Symposium on, 2011

For the first time we report a high performance embedded DRAM prototype fabricated in a 3D stackable 32nm High-K/Metal Gate technology with copper through-silicon vias. Post through-via processing functional test demonstrates that <;1.5ns latency and 500 MHz operation are preserved.


Ultra wideband material characterization for indoor propagation

A. Muqaibel; A. Safaai-Jazi; A. Bayram; S. M. Riad Antennas and Propagation Society International Symposium, 2003. IEEE, 2003

The information on electromagnetic properties of building materials in the ultra wideband (UWB) frequency range provides valuable insights in assessing the capabilities and limitations of UWB technology. This research examines propagation through typical construction materials and their ultra wideband characterization. Ten commonly used construction materials are chosen for this investigation. Results for the insertion loss and the dielectric constant of ...


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Educational Resources on Dielectric materials

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eLearning

Ferroelectric ceramics in the Na<sub>0.5</sub>Bi<sub>0.5</sub>TiO <sub>3</sub>-K<sub>0.5</sub>Bi<sub>0.5</sub>TiO<sub>3</sub>, Na<sub>0.5 </sub>Bi<sub>0.5</sub>TiO<sub>3</sub>-PbTiO<sub>3</sub> and K<sub>0.5 </sub>Bi<sub>0.5</sub>TiO<sub>3</sub>-PbTiO<sub>3</sub> systems

O. Elkechai; J. Mercurio Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on, 1994

The study of the Na0.5Bi0.5TiO3-K 0.5Bi0.5TiO3, Na0.5Bi0.5TiO3-PbTiO3 and K 0.5Bi0.5TiO3-PbTiO3 systems was carried our using X-ray diffraction, DSC and dielectric measurements. The limits of the rhombohedral (Na0.5Bi0.5 TiO3-rich side) and orthorhombic (K0.5Bi0.5TiO3, and PbTiO3-rich side) solid solutions were determined, as well as the evolutions of their lattice parameters as a function of composition. Ceramic materials have been prepared by natural ...


Dielectric, Elastic and Piezoelectric Losses in Piezoelectric Materials

G. E. Martin 1974 Ultrasonics Symposium, 1974

First Page of the Article ![](/xploreAssets/images/absImages/01533352.png)


New formulation for evaluating complex permittivity of low-loss materials

A. Muqaibel; A. Safaai-Jazi Antennas and Propagation Society International Symposium, 2003. IEEE, 2003

A widely used method for non-contact electromagnetic characterization of materials is based on the measurement of an 'insertion transfer function'. This function is related to the complex dielectric constant of the material through a transcendental equation which can be solved numerically using a two- dimensional root search technique. Solving this complex equation is often time consuming due to slow convergence ...


3D stackable 32nm High-K/Metal Gate SOI embedded DRAM prototype

John Golz; John Safran; Bishan He; Derek Leu; Ming Yin; Todd Weaver; Adis Vehabovic; Yan Sun; Alberto Cestero; Ben Himmel; Gary Maier; Chandrasekharan Kothandaraman; Daniel Fainstein; John Barth; Norman Robson; Toshiaki Kirihata; Ken Rim; Subramanian Iyer VLSI Circuits (VLSIC), 2011 Symposium on, 2011

For the first time we report a high performance embedded DRAM prototype fabricated in a 3D stackable 32nm High-K/Metal Gate technology with copper through-silicon vias. Post through-via processing functional test demonstrates that <;1.5ns latency and 500 MHz operation are preserved.


Ultra wideband material characterization for indoor propagation

A. Muqaibel; A. Safaai-Jazi; A. Bayram; S. M. Riad Antennas and Propagation Society International Symposium, 2003. IEEE, 2003

The information on electromagnetic properties of building materials in the ultra wideband (UWB) frequency range provides valuable insights in assessing the capabilities and limitations of UWB technology. This research examines propagation through typical construction materials and their ultra wideband characterization. Ten commonly used construction materials are chosen for this investigation. Results for the insertion loss and the dielectric constant of ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Electrical Characterization of Glass, Teflon, and Tantalum Capacitors at High Temperatures

    Dielectric materials and electrical components and devices employed in radiation fields and space environment are often exposed to elevated temperatures among other things. These systems must, therefore, withstand the high temperature exposure while still providing good electrical and other functional properties. In this work, experiments were carried out to evaluate glass, teflon, and tantalum capacitors for potential use in high temperature applications. The capacitors were characterized in terms of their capacitance and dielectric loss as a function of temperature up to 200 °C. At a given temperature, these properties were obtained in a frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed in a temperature range from 20 to 200 °C. The results obtained are discussed and conclusions are made concerning the suitability of the capacitors investigated for high temperature applications.

  • Electrical Properties of Dielectrics

    This chapter contains sections titled: Polarization of Dielectrics Classification of Dielectric Materials Frequency-Dependent Dielectric Behavior Properties of a Physical Dielectric Model Fiber-Weave Effect Environmental Variation in Dielectric Behavior Transmission-Line Parameters for Lossy Dielectrics and Realistic Conductors References Problems

  • Organic Printed Circuit Board Materials and Processes

    This chapter contains sections titled: Introduction Common Issues for All PCB Layer Constructions PCB Process Flow Dielectric Materials Surface Finishes Advanced PCB Structures Specifications and Standards Key Terms This chapter contains sections titled: References Exercises

  • Dielectric Materials for Integrated Capacitors

    This chapter contains sections titled: Polarizability and Capacitance Capacitance Density Temperature Effects Frequency and Voltage Effects Aging Effects Composition and Morphology Effects Leakage and Breakdown Dissipation Factor Comparison to EIA Dielectric Classifications Matching Dielectric Materials to Applications References

  • Stimulator Paradigm: Artificial Retina

    Implanted telemetry devices used for medical implants are affected by their surrounding environment since tissues are frequency-dependent lossy dielectric materials. This chapter focuses on the considerations and methodologies for the design of high-performance and small-size antennas appropriate for intraocular implants. The multicoil approach for inductive coupled telemetry offers high power transfer efficiency for biomedical telemetry. Having multiple control parameters to tune efficiency, voltage gain, and bandwidth, multicoil telemetry systems are in general more flexible than dual-coil systems. The artificial retina is undergoing clinical medical trials in several countries, and it can be available to patients worldwide. The implementation of flexible small antennas using liquid metals holds the promise of better fitting implantable conformal devices, which is important in the proximity of delicate biological structures such as the eye's retina and smaller incisions for implant surgery.

  • Manufacturing, Shipping,and Installation Guidelines

    This chapter contains sections titled: Keep Dielectric Materials to a Minimum When Dielectric Materials are Required, Keep Contact Between Them to a Minimum Conductive Materials Must Be Connected to Ground, If At All Possible (Remember, the human body is conductive) If It Is Not Possible, or Cost Effective, to Prevent Charge Buildup Completely, then Use Ionizers, or Other Devices, to Discharge Components Prior to Assembly Minimize Handling of Components or Assemblies; Especially Handling Resulting in Conductive Contact Shield Especially Sensitive Electronic Components and Assemblies The Ground Path for Conductive Items Must Have a Resistance of at Least 1 M?>, but No More Than 100 M?> Static Prevention Must Take Place at _All_ Points in the Manufacturing, Shipping, and Installation Process Make Regular Checks to Ensure the ESD Protection System is Working Properly This chapter contains sections titled: Summary of Manufacturing, Shipping, and Installation Guidelines

  • Electrostatic Fields in the Presence of Dielectrics

    This chapter contains sections titled: Volume Charges in Vacuum Green's Function for Infinite Space Multipole Expansion Potential Generated by a Single Layer of Charge Potential Generated by a Double Layer of Charge Potential Generated by a Linear Charge Spherical Harmonics Dielectric Materials Cavity Fields Dielectric Sphere in an External Field Dielectric Spheroid in an Incident Field Numerical Methods

  • More on One-Dimensional Simulation

    This chapter introduces some advanced concepts of one-dimensional electromagnetic (EM) FDTD simulation. First, it changes the formulation slightly and introduces the use of the flux density into the simulation. One of the most significant developments in the FDTD method is a means to simulate frequency-dependent dielectric materials. Then, the chapter introduces the use of the discrete Fourier transform in FDTD simulation. This is an extremely powerful method to quantify the output of the simulation. The chapter concludes with the simulation of human muscle tissue. Muscle tissue can be adequately simulated over a frequency range of about two decades with the Lorentz formulation.

  • Dielectric Materials

    This chapter contains sections titled: Historical Survey The Electric Moment of a Neutral System of Charges The Static Macroscopic Electric Field Due to a Volume of Polarized Dielectric Material A Generalization of D0 The Local Field Electronic Polarization Ionic Polarization Orientational Polarization Dielectric Susceptibility, Permittivity, and Relative Dielectric Constant The Static Dielectric Constant of Gases The Static Dielectric Constant of Solids and Liquids The Clausius-Mossotti Equation Primary Static Charges in an Infinite, Homogeneous, Isotropic Medium Ferroelectric Crystals Piezoelectrics Time-Harmonic Fields and Complex Permittivity Time-Harmonic Electronic Polarizability Complex Ionic Polarizability Time-Harmonic Permittivity of Non-Polar Materials Dipolar Relaxation Dielectric Losses Maxwell's Equations for Dielectric Materials This chapter contains sections titled: References Problems

  • Materials and Processing Considerations

    This chapter contains sections titled: Introduction Substrate Materials Dielectric Materials Metallization Planarization Chip Bonding Technologies Die Attach Summary This chapter contains sections titled: Exercises References



Standards related to Dielectric materials

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IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and for the Evaluation of Electrical Insulation

Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.


IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials

Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"



Jobs related to Dielectric materials

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