Conferences related to Dielectric materials

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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic dielectrics, etc... prebreakdown and breakdown in solids, liquids, gases, and vacuum surface flashover, and treeing.

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2014 IEEE Electrical Insulation Conference (EIC)

The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.

  • 2013 IEEE Electrical Insulation Conference (EIC)

    Held biennially since 1958, the Electrical Insulation Conference is focused on the practical applications of electrical insulating systems and materials (including nanodielectrics), the associated diagnostics, including field use, as applied to all types of electrical and electronic equipment.

  • 2011 Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    The Conference is a venue to discuss the development, application and testing of electrical insulation, usually in high voltage equipment, such as rotating machines, transformers, switchgear, cables, outdoor insulation, live line work, aerospace, and capacitors. Papers are oriented in practical applications, rather than basic research.

  • 2009 IEEE Electrical Insulation Conference (EIC) (Formerly EIC/EME)

    Electrical insulating materrials and systems, their application to all types of electrical and electronic equipment and associated diagnostics.

  • 2007 Electrical Insulation Conference and Electrical Manufacturing Expo (EIC/EME)


2012 4th Electronic System-Integration Technology Conference (ESTC)

The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.


2012 IEEE International Conference on Condition Monitoring and Diagnosis (CMD)

Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.

  • 2008 International Conference on Condition Monitoring and Diagnosis (CMD)

    Condition Monitoring and Diagnosis for Power Plants Condition Monitoring and Diagnosis of HV Power Apparatus and Power System Electrical, Mechanical, Thermal and Chemical Failure Phenomena Dielectric Materials Aging and Failure Mechanism Advanced Sensing Technologies for Condition Monitoring and Diagnosis Application of Artificial Intelligence for Data Mining and Condition Assessment Applications of Information Technology for Asset Management Strategic Planning and Management for Condition Monitoring


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Periodicals related to Dielectric materials

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


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Xplore Articles related to Dielectric materials

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Novel dielectric-waveguide components

Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988

A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...


W band silicon dielectric resonator for semiconductor substrate characterization

Blondy, P.; Cros, D.; Guillon, P.; Balleras, F.; Massit, C. Microwave Symposium Digest, 1998 IEEE MTT-S International, 1998

This paper is about the use of planar millimeter wave whispering gallery dielectric resonator modes for material characterization. Experimental results and theoretical ones obtained with finite element method permit to determine electromagnetic characteristics of a material like silicon. The results on loss factor are compared to basic electromagnetic theory. It is shown that high resistivity silicon dielectric resonators could be ...


Effect of Underfill Mechanical Property on Cu/Low-K Delamination for Lead-Free Flip Chip Packaging

Tsung-shu Lin; Chen, K.M. Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International, 2008

The low dielectric constant (low-K) material and copper (Cu) interconnection in chip enhance the electrical speed for microelectronic devices. The low-K materials generally show low mechanical strength, high coefficient of thermal expansion (CTE) and poor adhesion. Cu/low-K delamination becomes a failure cause during reliability test. Many papers have studied this failure and demonstrated the underfill selection method for preventing the ...


Losses caused by roughness of metallization in printed-circuit boards

Deutsch, A.; Surovic, C.; Krabbenhoft, R.; Kopcsay, G.V.; Chamberlin, B. Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on, 2005

In this paper the effect of metal roughness on the total loss, the extracted tan δ, and signal integrity of typical interconnections found in printed- circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.


Compact modeling of the effects of parasitic internal fringe capacitance on the threshold voltage of high-k gate-dielectric nanoscale SOI MOSFETs

Kumar, M.J.; Gupta, S.K.; Venkataraman, V. Electron Devices, IEEE Transactions on, 2006

A compact model for the effect of the parasitic internal fringe capacitance on the threshold voltage of high-k gate-dielectric silicon-on-insulator MOSFETs is developed. The authors' model includes the effects of the gate-dielectric permittivity, spacer oxide permittivity, spacer width, gate length, and the width of an MOS structure. A simple expression for the parasitic internal fringe capacitance from the bottom edge ...


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Educational Resources on Dielectric materials

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eLearning

Novel dielectric-waveguide components

Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988

A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...


W band silicon dielectric resonator for semiconductor substrate characterization

Blondy, P.; Cros, D.; Guillon, P.; Balleras, F.; Massit, C. Microwave Symposium Digest, 1998 IEEE MTT-S International, 1998

This paper is about the use of planar millimeter wave whispering gallery dielectric resonator modes for material characterization. Experimental results and theoretical ones obtained with finite element method permit to determine electromagnetic characteristics of a material like silicon. The results on loss factor are compared to basic electromagnetic theory. It is shown that high resistivity silicon dielectric resonators could be ...


Effect of Underfill Mechanical Property on Cu/Low-K Delamination for Lead-Free Flip Chip Packaging

Tsung-shu Lin; Chen, K.M. Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International, 2008

The low dielectric constant (low-K) material and copper (Cu) interconnection in chip enhance the electrical speed for microelectronic devices. The low-K materials generally show low mechanical strength, high coefficient of thermal expansion (CTE) and poor adhesion. Cu/low-K delamination becomes a failure cause during reliability test. Many papers have studied this failure and demonstrated the underfill selection method for preventing the ...


Losses caused by roughness of metallization in printed-circuit boards

Deutsch, A.; Surovic, C.; Krabbenhoft, R.; Kopcsay, G.V.; Chamberlin, B. Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on, 2005

In this paper the effect of metal roughness on the total loss, the extracted tan δ, and signal integrity of typical interconnections found in printed- circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.


Compact modeling of the effects of parasitic internal fringe capacitance on the threshold voltage of high-k gate-dielectric nanoscale SOI MOSFETs

Kumar, M.J.; Gupta, S.K.; Venkataraman, V. Electron Devices, IEEE Transactions on, 2006

A compact model for the effect of the parasitic internal fringe capacitance on the threshold voltage of high-k gate-dielectric silicon-on-insulator MOSFETs is developed. The authors' model includes the effects of the gate-dielectric permittivity, spacer oxide permittivity, spacer width, gate length, and the width of an MOS structure. A simple expression for the parasitic internal fringe capacitance from the bottom edge ...


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Standards related to Dielectric materials

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IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and for the Evaluation of Electrical Insulation

Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.


IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials

Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"



Jobs related to Dielectric materials

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