11,118 resources related to Dielectric materials
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2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)
Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics
2014 IEEE Electrical Insulation Conference (EIC)
The Electrical Insulation Conference is focused on the practical applications of electrical insulating sytsems and materials (including nanodielectrics), the associated diagnostics and field use as applied to all types of electrical and electronic equipment.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.
Condition monitoring and diagnosis for power equipments and power systems,power plants, dielectric materials and their aging mechanisms, degradation assessment for power system, application of information and communication technologies for condition monitoring and diagnosis, tropical climate and other related issues including recycling, reuse and mitigation,strategic planning and management for condition monitoring and diagnosis.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.
Measurements and instrumentation utilizing electrical and electronic techniques.
Balestreri, A.; Andreani, L.C. Transparent Optical Networks, 2006 International Conference on, 2006
Summary form only given: If one wants to achieve a full control of light propagation and emission, three-dimensional photonic crystals (3D PhCs) are the most appropriate structures to deal with. Artificial opals are readily available 3D PhC as they can be produced with easy and low cost process, such as natural sedimentation or vertical deposition, and eventually infiltrated with high-index ...
Konishi, Y.; Konno, K.; Awai, I. Broadcasting, IEEE Transactions on, 1988
A variety of resonators and bandpass, notch, lowpass, and highpass filters are described that use dielectric materials of high permittivity and are based on conventional waveguide technology. The devices are reasonably small, of high Q, and low loss tangent (tan δ). The various configurations presented include the use of posts, inductive strips, waveguide resonator-filters, and re- entrant resonators. Also examined ...
Chang, C.T.M. Nuclear Science, IEEE Transactions on, 1973
Circular deflectors lined with boron nitride, beryllia, and alumina are studied for application to ultrahigh-energy beam separators. These deflectors are designed at an aperture of 1 cm2 at 5.6 and 8.5 GHz. The attenuation length, transverse shunt impedance, and group velocity are presented in graphs.
Yoneyama, T. Microwave Conference, 1986. 16th European, 1986
Research activities at Japanese universities are reviewed placing emphasis on transmission lines for integrated circuits, filters and dielectric resonators, couplers and junctions, material constant measurements, and analytical techniques.
Sturdivant, R.; Chung Ly; Benson, J.; Wooldridge, J. Microwave Symposium Digest, 1997., IEEE MTT-S International, 1997
MMIC flip chips offer several benefits over conventional face-up versions. This includes lower cost, ease of interconnection, self alignment to motherboard, and simultaneous attachment and electrical connection. High power MMIC flip chips use bumps on the FET source to provide for an improved thermal path. When connected to a high thermal conductivity mounting substrate such as aluminum nitride, high power ...
Gambino, Jeff Advanced Interconnect Technology for 32 NM and Beyond, 2008
This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
2013 IEEE Corporate Innovation Award
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Care Innovations: Green Engineering (com legendas em portugues)
IEEE Magnetics 2014 Distinguished Lectures - Tim St Pierre
Advances in MgB2 - ASC-2014 Plenary series - 7 of 13 - Wednesday 2014/8/13
High Magnetic Field Science and its Application in the US - ASC-2014 Plenary series - 10 of 13 - Friday 2014/8/15
ASC-2014 SQUIDs 50th Anniversary: 3 of 6 - Bob Fagaly
Transphorm: GaN Champions
Nanotechnology For Electrical Engineers
The Josephson Effect: SQUIDs Then and Now: From SLUGS to Axions
From Maxwell's Equations to Modern Electromagnetics and Antenna Engineering Marvels
EMBC 2011-Speaker Highlights-Mary Tolikas, PhD, MBA
APEC 2011 Exhibitor Overview
Interview with the TX-0 Computer development team
IEEE WIE- TryEngineering Ship the Chip
Change title to a recommended practice, revise table 1, add a table to part IV, coordinate the revisions of IEEE 1, 98, and 99 for consistency, review terms and definitions for harmonization with IEC85 and IEC 505-1, revise Foreward.
Update reference standards, technical review for consistency with IEEE 1 (work in progress), change temperature class" to "temperature index"