Design Of Experiments (DOE)
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Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics
reliability, physics, irps
2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and Approaches Novel Device Reliability and Failure Mechanisms Novel Gate Stack/Dielectrics and FEOL Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanisms
2013 IEEE International Integrated Reliability Workshop (IIRW)
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliab
This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.
Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.
Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
No Xplore Articles are currently tagged "Design Of Experiments (DOE)"
IMS 2011 Microapps - Online Design
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Co-design of Power Amplifier and Dynamic Power Supplies for Radar and Communications Transmitters
ICASSP 2011 Trends in Design and Implementation of Signal Processing Systems
IMS 2011 Microapps - Power Amplifier Design Utilizing the NVNA and X-Parameters
Modeling of Lithium ION Batteries
IMS MicroApps: Online Design Centers
Renco Electronics: Renco Everywhere
IMS 2012 Microapps - The Next Generation of Communications Design, Validate, and Test Dr. Mark Pierpoint
A Principled Way to Use Frameworks in Architecture Design
RF Power Amplifier Design for Pseudo Envelope Tracking
Heuristics for Design for Reliability in Electrical and Electronic Products
MicroApps: First-Pass Design Methodology for RF Modules (Agilent Technologies)
IMS 2012 Microapps - Optimizing the Design and Verification of 4G RF Power Amplifiers
IMS 2012 Microapps - RF System Design: Moving Beyond a Linear Datasheet
IEEE WEBINAR SERIES-April 2, 2014 - Understanding Mosfet Parameters: We Do Need Even More Footnotes in Mosfet Datasheets
IMS 2011 Microapps - The Design and Test of Broadband Launches Up to 50GHz on Thin and Thick Substrates
Design Considerations for Wideband Envelope Tracking Power Amplifiers
No standards are currently tagged "Design Of Experiments (DOE)"