Design Of Experiments (DOE)
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This conf covers all facets of the assurance sciences.
2015 IEEE International Reliability Physics Symposium (IRPS)
Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components
2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms
2013 IEEE International Integrated Reliability Workshop (IIRW)
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.
This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.
Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.
Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
Tandon, N.; Baweja, G. Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop, 2002
The complex semiconductor fabrication process needs to be optimized quickly to increase process yield and efficiency in fab operations. The Design of Experiments (DOE) technique is frequently applied in semiconductor domain by separating a wafer lot into wafer splits, and studying the effects of varying process parameters in relation to a baseline split across diffusion, photo, etch and other fabrication ...
Lahoud, N.; Manh Quan Nguyen; Maussion, P.; Malec, D.; Mary, D. Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on, 2010
The electrical ageing of the low voltage rotating machine insulation involves complex phenomena since a large amount of parameters related to both operating conditions and material design are acting together. Accelerated ageing tests are usually undertaken in order to develop a theory to describe the electrical ageing process and to determine the lifetime of these materials. To the best of ...
Lahoud, N.; Manh Quan Nguyen; Maussion, P.; Malec, D.; Mary, D. Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on, 2010
A large amount of parameters related to both operating conditions and material design affects the electrical ageing of the low voltage rotating machine insulation. Accelerated ageing tests are usually undertaken in order to develop a theory to describe the electrical ageing process and to determine a lifetime model of these materials. However, to the best of our knowledge, there is ...
Bushyager, N.; Staiculescu, D.; Obatoyinbo, A.; Martin, L.; Tentzeris, M.M. Microwave Symposium Digest, 2004 IEEE MTT-S International, 2004
The successful use of the design of experiments (DOE) approach in an optimization feasibility study for two microwave balanced to unbalanced transformers (baluns) is presented. The medium of interest is the multi-layer low temperature cofired ceramic (LTCC) and two different topologies, one microstrip and one stripline, are investigated. The design goals are perfectly balanced outputs from 2-3 GHz and a ...
Maurin, David; Ke Wu Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific, 1997
A Design of Experiments (DOE) analysis of a feed-forward amplifier system is presented. The frequency behavior of feed-forward components is for the first time considered in the analysis. It is shown that, for the simulation and specification of a feed-forward system, it is possible to include the amplitude and frequency dispersion of the components in the tolerance specification of the ...
Tracked Vehicle with Circular Cross-Section to Realize Sideways Motion
The Josephson Effect: The Original SQUIDs
The Josephson Effect: SQUIDs Then and Now: From SLUGS to Axions
APEC 2015: KeyTalks - US DOE perspective on Microgrids
Finger Mechanism Equipped with Omnidirectional Driving Roller (Omni-Finger)
Flight Stability in Aerial Redundant Manipulators
A Principled Way to Use Frameworks in Architecture Design
MicroApps: First-Pass Design Methodology for RF Modules (Agilent Technologies)
IEEE WEBINAR SERIES-April 2, 2014 - Understanding Mosfet Parameters: We Do Need Even More Footnotes in Mosfet Datasheets
Design Considerations for Wideband Envelope Tracking Power Amplifiers
RF Power Amplifier Design for Pseudo Envelope Tracking
Co-design of Power Amplifier and Dynamic Power Supplies for Radar and Communications Transmitters
Micro-Apps 2013: Design Methodology for GaAs MMIC PA
Micro-Apps 2013: Class F Power Amplifier Design, Including System-to-Circuit-to-EM Simulation
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Quadrotor Trajectory Tracking with L1 Optimal control
Heuristics for Design for Reliability in Electrical and Electronic Products
IMS 2012 Microapps - The Next Generation of Communications Design, Validate, and Test Dr. Mark Pierpoint
IMS 2012 Microapps - Optimizing the Design and Verification of 4G RF Power Amplifiers
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