Conferences related to Design Of Experiments (DOE)

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2016 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics


2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.


2012 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 2012

This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.


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Periodicals related to Design Of Experiments (DOE)

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Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.



Most published Xplore authors for Design Of Experiments (DOE)

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Xplore Articles related to Design Of Experiments (DOE)

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High-level optimization for low power consumption on microprocessor-based systems

David A. Ortiz; Nayda G. Santiago 2007 50th Midwest Symposium on Circuits and Systems, 2007

Power consumption is an important constraint in the design of battery-operated embedded systems. The problem of minimizing power dissipation may be handled in terms of hardware or software optimizations. High-level language optimization techniques appear as an alternative to achieve low power consumption when programming embedded systems. In this work, software optimization techniques were applied to a set of code segments ...


The Virtual CVD Learning Platform

Milo D. Koretsky; Danielle Amatore; Connelly Barnes; Sho Kimura Proceedings. Frontiers in Education. 36th Annual Conference, 2006

The virtual CVD learning platform provides a capstone experience in which students synthesize engineering science and statistics principles. They apply design of experiments (DOE) in the context similar to that of industry with a wider design space than is typically seen in the undergraduate lab. The virtual CVD learning platform contains a numerical simulation of a chemical- vapor deposition (CVD) ...


Design of experiments using a physical model

John S Atherton; Christopher M Snowden; Roger D Pollard Microwave Conference, 1995. 25th European, 1995

This paper describes the use of the Design of Experiments (DOE) technique with an accurate and efficient physical model. This approach allows for the systematic study of the effects of device geometry and process variations on electrical performance and demonstrates efficiently which parameters have the largest effect on device performane as well as showing any significant interaction between the effects. ...


Shortest Travel Distance For Full Reads On Least RFID Friendly Carton Stacking Configuration Using Advance DOE Techniques and Gage Reproducibility and Repeatability

Edmund Chan Ming Hoong 2008 IEEE International Conference on RFID, 2008

Radio frequency identification (RFID) tags are placed on one face of a carton. When cartons are unloaded from shipping containers, they are segregated into product type and re-stacked on pallets. It takes considerable effort for warehouse staff to re-stack cartons such that the tags are orientated for optimal readability by RFID gantry. To minimize the re-stacking effort, the least radio ...


Robust Design and Performance Verification of an In-Plane XYθ Micropositioning Stage

Donghyun Hwang; Jungwoong Byun; Jaehwa Jeong; Moon G. Lee IEEE Transactions on Nanotechnology, 2011

This paper describes the robust design, fabrication, and performances verification of a novel ultraprecision XYθ micropositioning stage with piezoelectric actuator and flexure mechanism. The main goal of the proposed novel design is to combine a translational motion part and rotational motion part as a decoupled serial kinematics on a same plane. Proposed compound cymbal mechanisms of the translational motion part ...


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Educational Resources on Design Of Experiments (DOE)

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eLearning

High-level optimization for low power consumption on microprocessor-based systems

David A. Ortiz; Nayda G. Santiago 2007 50th Midwest Symposium on Circuits and Systems, 2007

Power consumption is an important constraint in the design of battery-operated embedded systems. The problem of minimizing power dissipation may be handled in terms of hardware or software optimizations. High-level language optimization techniques appear as an alternative to achieve low power consumption when programming embedded systems. In this work, software optimization techniques were applied to a set of code segments ...


The Virtual CVD Learning Platform

Milo D. Koretsky; Danielle Amatore; Connelly Barnes; Sho Kimura Proceedings. Frontiers in Education. 36th Annual Conference, 2006

The virtual CVD learning platform provides a capstone experience in which students synthesize engineering science and statistics principles. They apply design of experiments (DOE) in the context similar to that of industry with a wider design space than is typically seen in the undergraduate lab. The virtual CVD learning platform contains a numerical simulation of a chemical- vapor deposition (CVD) ...


Design of experiments using a physical model

John S Atherton; Christopher M Snowden; Roger D Pollard Microwave Conference, 1995. 25th European, 1995

This paper describes the use of the Design of Experiments (DOE) technique with an accurate and efficient physical model. This approach allows for the systematic study of the effects of device geometry and process variations on electrical performance and demonstrates efficiently which parameters have the largest effect on device performane as well as showing any significant interaction between the effects. ...


Shortest Travel Distance For Full Reads On Least RFID Friendly Carton Stacking Configuration Using Advance DOE Techniques and Gage Reproducibility and Repeatability

Edmund Chan Ming Hoong 2008 IEEE International Conference on RFID, 2008

Radio frequency identification (RFID) tags are placed on one face of a carton. When cartons are unloaded from shipping containers, they are segregated into product type and re-stacked on pallets. It takes considerable effort for warehouse staff to re-stack cartons such that the tags are orientated for optimal readability by RFID gantry. To minimize the re-stacking effort, the least radio ...


Robust Design and Performance Verification of an In-Plane XYθ Micropositioning Stage

Donghyun Hwang; Jungwoong Byun; Jaehwa Jeong; Moon G. Lee IEEE Transactions on Nanotechnology, 2011

This paper describes the robust design, fabrication, and performances verification of a novel ultraprecision XYθ micropositioning stage with piezoelectric actuator and flexure mechanism. The main goal of the proposed novel design is to combine a translational motion part and rotational motion part as a decoupled serial kinematics on a same plane. Proposed compound cymbal mechanisms of the translational motion part ...


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IEEE-USA E-Books

  • Application of FTA to Real-Life Example

    This chapter provides a case study of Fault Tree Analysis (FTA) for a telecommunications project. We note a variety of factors could cause a system outage - including events outside the system itself, such as environmental or security issues. We examine one important aspect of system failure - call processing failure and identified issues or faults that could result in this failure. A good approach is to initially capture the fault tree in a modeling tool, such as Relex, and then transfer these data and relationships to a spreadsheet for easier manipulation. We identify the high risk nodes and used (Design of Experiments) DOE and Monte Carlo Analysis to determine the impact of these nodes on the system. This simulation results show how likely it is the system would achieve its five 9s availability requirement. The sensitivity analysis showed which failures have the largest impact on the system. Armed with this information, the design team can focus on the components that have the biggest impact on availability. By addressing these items, we greatly improve the probability of meeting our availability requirements.



Standards related to Design Of Experiments (DOE)

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Jobs related to Design Of Experiments (DOE)

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