Conferences related to Design Of Experiments (DOE)

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2016 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics


2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.


2012 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 2012

This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.


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Periodicals related to Design Of Experiments (DOE)

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Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.



Most published Xplore authors for Design Of Experiments (DOE)

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Xplore Articles related to Design Of Experiments (DOE)

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Design optimization of spoke-type ferrite magnet machines by combined design of experiments and differential evolution algorithms

Peng Zhang; Gennadi Y. Sizov; Dan M. Ionel; Nabeel A. O. Demerdash Electric Machines & Drives Conference (IEMDC), 2013 IEEE International, 2013

In this paper, a combined design optimization method utilizing Design of Experiments (DOE) and Differential Evolution (DE) algorithms was implemented to provide practical insights in the multi-objective design optimization of a 12-slot, 8-pole, spoke-type, ferrite magnet machine, with fractional-slot concentrated windings. A robust parametric model of this type of machine is provided here. In this combined design optimization approach, the ...


Sub 0.1 /spl mu/m nMOSFETs fabricated using experimental design techniques to optimise performance and minimise process sensitivity

S. Kubicek; S. Biesemans; Q. F. Wang; K. Maex; K. De Meyer VLSI Technology, 1995. Digest of Technical Papers. 1995 Symposium on, 1995

Bulk nMOS transistors with nominal poly length of 0.12 /spl mu/m and minimum effective channel length below 0.1 /spl mu/m were fabricated. Arsenic S/D shallow extensions and optimised channel doping by Indium were used to suppress the short channel effect (SCE) as well as the reverse-SCE. E-beam lithography was used for poly level definition and an advanced Co/Ti salicidation scheme ...


Critical parameter selection for thermal cycle of FBGA fatigue life

You-Cheng Luo; Mei-Ling Wu 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012

This paper will focus on the fast assessment methodology of FBGA fatigue life through simulation and physics of failure (PoF) analysis under thermal cycle. The structure of fine pitch ball grid array (FBGA) that has been investigated, and been modeled by ANSYS to compare with experimental data. There are two temperature cycling will be used, one is used to verify ...


The catapult project: an innovative approach for learning statistical design of experiments

Siong Lin Ho; Wan Lyn Nge; Kian Hong Chua Engineering Management Conference, 2004. Proceedings. 2004 IEEE International, 2004

This article illustrates the use of a catapult as an innovative teaching tool for enhancing the understanding of design of experiments (DOE) in a classroom environment. This device can be adopted to simulate the design of a real-life product using the 2K factorial design and 2K factorial design with centre points. It is an effective method to introduce the fundamental ...


Optimal write head design for perpendicular magnetic recording

H. Wang; T. Katayama; K. Chan; Y. Kanai; Z. Yuan; S. Shafidah 2015 IEEE Magnetics Conference (INTERMAG), 2015

Herein, we adopt an approach to search for the optimal solution of the write head design based on the maximization of the signal-to-noise ratio (SNR) and the minimization of the bit error rate (BER) via micromagnetic simulations the grain-flipping probability (GFP) model and channel simulation . We select six variables as the design parameters in the write head. An initial ...


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Educational Resources on Design Of Experiments (DOE)

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eLearning

Design optimization of spoke-type ferrite magnet machines by combined design of experiments and differential evolution algorithms

Peng Zhang; Gennadi Y. Sizov; Dan M. Ionel; Nabeel A. O. Demerdash Electric Machines & Drives Conference (IEMDC), 2013 IEEE International, 2013

In this paper, a combined design optimization method utilizing Design of Experiments (DOE) and Differential Evolution (DE) algorithms was implemented to provide practical insights in the multi-objective design optimization of a 12-slot, 8-pole, spoke-type, ferrite magnet machine, with fractional-slot concentrated windings. A robust parametric model of this type of machine is provided here. In this combined design optimization approach, the ...


Sub 0.1 /spl mu/m nMOSFETs fabricated using experimental design techniques to optimise performance and minimise process sensitivity

S. Kubicek; S. Biesemans; Q. F. Wang; K. Maex; K. De Meyer VLSI Technology, 1995. Digest of Technical Papers. 1995 Symposium on, 1995

Bulk nMOS transistors with nominal poly length of 0.12 /spl mu/m and minimum effective channel length below 0.1 /spl mu/m were fabricated. Arsenic S/D shallow extensions and optimised channel doping by Indium were used to suppress the short channel effect (SCE) as well as the reverse-SCE. E-beam lithography was used for poly level definition and an advanced Co/Ti salicidation scheme ...


Critical parameter selection for thermal cycle of FBGA fatigue life

You-Cheng Luo; Mei-Ling Wu 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012

This paper will focus on the fast assessment methodology of FBGA fatigue life through simulation and physics of failure (PoF) analysis under thermal cycle. The structure of fine pitch ball grid array (FBGA) that has been investigated, and been modeled by ANSYS to compare with experimental data. There are two temperature cycling will be used, one is used to verify ...


The catapult project: an innovative approach for learning statistical design of experiments

Siong Lin Ho; Wan Lyn Nge; Kian Hong Chua Engineering Management Conference, 2004. Proceedings. 2004 IEEE International, 2004

This article illustrates the use of a catapult as an innovative teaching tool for enhancing the understanding of design of experiments (DOE) in a classroom environment. This device can be adopted to simulate the design of a real-life product using the 2K factorial design and 2K factorial design with centre points. It is an effective method to introduce the fundamental ...


Optimal write head design for perpendicular magnetic recording

H. Wang; T. Katayama; K. Chan; Y. Kanai; Z. Yuan; S. Shafidah 2015 IEEE Magnetics Conference (INTERMAG), 2015

Herein, we adopt an approach to search for the optimal solution of the write head design based on the maximization of the signal-to-noise ratio (SNR) and the minimization of the bit error rate (BER) via micromagnetic simulations the grain-flipping probability (GFP) model and channel simulation . We select six variables as the design parameters in the write head. An initial ...


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IEEE-USA E-Books

  • Application of FTA to Real-Life Example

    This chapter provides a case study of Fault Tree Analysis (FTA) for a telecommunications project. We note a variety of factors could cause a system outage - including events outside the system itself, such as environmental or security issues. We examine one important aspect of system failure - call processing failure and identified issues or faults that could result in this failure. A good approach is to initially capture the fault tree in a modeling tool, such as Relex, and then transfer these data and relationships to a spreadsheet for easier manipulation. We identify the high risk nodes and used (Design of Experiments) DOE and Monte Carlo Analysis to determine the impact of these nodes on the system. This simulation results show how likely it is the system would achieve its five 9s availability requirement. The sensitivity analysis showed which failures have the largest impact on the system. Armed with this information, the design team can focus on the components that have the biggest impact on availability. By addressing these items, we greatly improve the probability of meeting our availability requirements.



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