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2015 IEEE MTT-S International Microwave Symposium (IMS2015)
The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh
ISPLC 2012 will bring together academia and industry professionals as well as students and researchers to present and discuss ongoing work on existing and future power line communication (PLC) systems, PLC applications, PLC standardization activities. The contributions presented at ISPLC will span all aspects of communications over power lines, including access, home networking, in-vehicle applications, utility applications, smart grids, and more.
2012 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
ICMMT2012 will be held in Shenzhen, China on May 5-8, 2012. Technical papers describing original work in research, development, and application of all area in microwave and millimeter wave are solicited, including antennas, EM theory and numerical methods, RFIC, EMC, measurement, wireless and optic communications. ICMMT2012 is organized, sponsored by Microwave Society of Chinese Institute of Electronics, co-sponsored by Harbin Institute of Technology Shenzhen Graduate School, South China University of Technology, and KingRadio Technology, and technically co-sponsored by IEEE Beijing Section, IEEE Nanjing Section, IEEE Shanghai Section, IEEE Harbin Section, etc. ICMMT is intended to provide a broad international forum and nice opportunity for the scientists and engineers to present their new ideas and exchange information on research. We welcome you to join us and share your contributions in the conference.
The conference have interdisciplinary character and is directed to improving the scientific cooperation between world scientific research centers working in the field of electrical engineering, electronics, physics, computer sciences, power generation, medical application of electronics, control systems, vacuum devices, nanotechnologies, etc.
This is a conference with the theme of Technology Convergence: Microwave for Life, reflects microwave technology usages in our ways of life through consumer products and advanced communications. The objective of the APMC 2007 is to continue and accelerate the momentum of researching in microwave areas and bring together researchers to discuss and exchange experiences. We are pleased to invite all researchers to submit papers related to microwave fields to the conference.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
Jinjin Shen; Pearson, L.W. Antennas and Wireless Propagation Letters, IEEE, 2003
A two-dimensional coupled oscillator beam-steering array without phase- shifters is presented for several design considerations. The 20 GHz 4/spl times/4 array has a triple-layer tile architecture. Mutually coupled oscillators on the bottom layer generate steered phase by edge-element tuning, which drives a 4/spl times/4 microstrip patch antenna array located on the top layer. The circuit measures 1.2 inch long and ...
Hashemi, M.R.; Itoh, T. Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International, 2010
In this paper a novel four port symmetric coupled composite right/left-handed leaky-wave (LW) transmission-line is introduced. Unlike the other coupled CRLH-TLs, this structure has the ability to support both right-handed as well as left-handed guided and leaky-wave propagations under both common-mode and differential-mode excitations. These unique properties are achievable through providing physical short circuit by means of ground vias at ...
Jiun-Sheng Huang; Shang-Wei Tu; Jing-Yang Jou VLSI Design, Automation and Test, 2005. (VLSI-TSA-DAT). 2005 IEEE VLSI-TSA International Symposium on, 2005
With the continuous shrinkage of device sizes, the global interconnect delay becomes a dominant factor of chip performance in deep-submicron technology. Furthermore, as the working frequency of integrated circuits increasing above GHz, the inductive crosstalk will also have very significant influence on the global interconnect delay. However, most existing works consider only RC effects (the worst-case switching pattern resulting from ...
Chaudhary, K.; Onozawa, A.; Kuh, E.S. Computer-Aided Design, 1993. ICCAD-93. Digest of Technical Papers., 1993 IEEE/ACM International Conference on, 1993
With the shrinking of feature size on silicon, the coupled capacitance between adjacent wires is contributing a significant factor to the interconnect delay, which already dominates the circuit performance. In the near future coupled capacitance could contribute as much as 50-75% to the interconnect delay which has been largely ignored by performance-oriented layout tools. Given a routed design, this work ...
Ting Qian; Lehman, B. Power Electronics Specialists Conference, 2007. PESC 2007. IEEE, 2007
This paper proposes an integrated magnetic DC-DC converter suitable for high input voltage application. The converter is based on a coupled input-series and output-parallel dual interleaved Flyback converter concept. All the center and outer legs are gapped, and the transformers are integrated into one magnetic core with not so tight coupling. The gap is beneficial for suppressing current spike caused ...
Burghartz, Joachim N. RF Passives on Silicon--The Intended and the Unintended, 2008
In typical radio-frequency (RF) front-end circuits, the passive components outnumber the active devices. They occupy a major fraction of the total circuit area, and their low quality factor (Q) limits the circuit performance. Furthermore, these (intended) passive components can easily be perturbed by the interconnects feeding into them and coupled together by the (unintended) magnetic fields around those interconnects, or ...
Sheppard, Douglas Dual Port SRAM: Memory Cell Layout and Array Coupling, 2011
Analyzing the types of conditions that can cause capacitive coupling between bit lines in a memory array is very critical in assuring that the data from the memory cell will be properly read. The state and location of one memory cell relative to others can influence the voltage level that is being sensed. This is made even more complex in ...
Sheppard, Douglas Dual Port SRAM Bit Line Coupling Between Ports, 2012
The influence that one port can have on the other port bit line can be a subtle, yet costly problem if not fully evaluated, and can in fact result in the design not working. Capacitive coupling between neighboring bit lines must be properly modeled and evaluated to determine their impact based on the different conditions that can occur in a ...
Fowler, Kim Introduction to Developing Embedded Systems, 2005
This tutorial would introduce important issues in preparing, designing, and developing a product including: Systems Engineering ? Process, design, and development; Architecture ? Hardware, Software, Tradeoffs; Interface choices; Reliability versus fault tolerance; Review and Testing - Debugging, inspections, integration, validation, verification; Documentation; The Human Interface - User-centered design, elements of successful interfaces; Packaging - Its influence, environmental issues, wiring and ...
Deutsch, Alina Understanding On-Chip Transmission Lines - Part 2, 2006
This course delves further into the present-day on-chip wiring design practices and the special characteristics of on-chip lossy transmission lines. A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with frequency-dependent properties and the interaction between delta-I noise, common-mode ...
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