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2013 IEEE 17th International Symposium on Power Line Communications and its Applications (ISPLC)
The symposium focuses on research, application and commercialization aspects of the power line communications technology, in both broadband and narrowband fields.
The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.
2012 IEEE 11th International Conference on Actual Problems of Electronics Instrument Engineering (APEIE)
This conference in international multi-profile conference addressed to persons whose activity is connected with micro- and nanoelectronics, microwaves, antennas, power transformation, medical applications of electronics, lasers, photonics and automation.
2012 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
ICMMT2012 will be held in Shenzhen, China on May 5-8, 2012. Technical papers describing original work in research, development, and application of all area in microwave and millimeter wave are solicited, including antennas, EM theory and numerical methods, RFIC, EMC, measurement, wireless and optic communications. ICMMT2012 is organized, sponsored by Microwave Society of Chinese Institute of Electronics, co-sponsored by Harbin Institute of Technology Shenzhen Graduate School, South China University of Te
This is a conference with the theme of Technology Convergence: Microwave for Life, reflects microwave technology usages in our ways of life through consumer products and advanced communications. The objective of the APMC 2007 is to continue and accelerate the momentum of researching in microwave areas and bring together researchers to discuss and exchange experiences. We are pleased to invite all researchers to submit papers related to microwave fields to the conference.
Secareanu, R.M.; Warner, S.; Seabridge, S.; Burke, C.; Becerra, J.; Watrobski, T.E.; Morton, C.; Staub, W.; Tellier, T.; Kourtev, I.S.; Friedman, E.G. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 2004
This paper describes theoretical and experimental data characterizing the sensitivity of nMOS and CMOS digital circuits to substrate coupling in mixed- signal, smart-power systems. The work presented here focuses on the noise effects created by high-power analog circuits and affecting sensitive digital circuits on the same integrated circuit. The sources and mechanism of the noise behavior of such digital circuits ...
Aingaran, K.; Klass, F.; Chin-Man Kim; Amir, C.; Mitral, J.; You, E.; Mohd, J.; Sai-Keung Dong Quality Electronic Design, 2000. ISQED 2000. Proceedings. IEEE 2000 First International Symposium on, 2000
Although digital circuits are inherently immune to most sources of noise, the scaling of supply voltages and MOSFET threshold voltages has resulted in lowered noise margins. Most CMOS circuits continue to have considerable immunity to power supply and substrate noise even with the aggressive scaling used today. However, the effect of capacitive coupling noise has become a major concern for ...
Dimov, B.; Khabipov, M.; Balashov, D.; Brandt, C.M.; Buchholz, F.-Im.; Niemeyer, J.; Ortlepp, T.; Uhlmann, F.H. Applied Superconductivity, IEEE Transactions on, 2005
The Rapid Single Flux Quantum (RSFQ) technique is regarded as one of the most promising electronics due to its extremely high operating speed and low power consumption. Middle-scale RSFQ applications operating at multigigahertz frequency have recently been reported on. At such high operating frequencies, the on-chip interconnects start to play a limiting role for the performance of the densely packaged ...
Sathe, A.D.; Bushnell, M.L.; Agrawal, V.D. Test Conference, 2002. Proceedings. International, 2002
Proposes a new analog coupling delay fault model and analog macromodeling technique to generate tests for these faults. To our knowledge, this is the first time that analog macromodeling, along with multiple-delay sequential digital fault simulation, using differing rise and fall times for digital logic gates, effectively detected coupling timing faults. We propose a new crosstalk candidate reduction (CCR) algorithm, ...
Chirala, M.K.; Cam Nguyen Microwave Theory and Techniques, IEEE Transactions on, 2006
Multilayer design techniques are investigated for reducing the size and enhancing the performance of microwave and millimeter-wave distributed circuits in CMOS. Various distributed passive circuits are implemented in a standard 0.25-mum RF/mixed-signal process, including a novel broadside-coupled Lange coupler, a microstrip ring hybrid, and a hairpin resonator incorporating a complementary slow-wave structure. The broadside-coupled Lange coupler exhibits -3.3 to -3.35 ...
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Burghartz, Joachim N. RF Passives on Silicon--The Intended and the Unintended, 2008
In typical radio-frequency (RF) front-end circuits, the passive components outnumber the active devices. They occupy a major fraction of the total circuit area, and their low quality factor (Q) limits the circuit performance. Furthermore, these (intended) passive components can easily be perturbed by the interconnects feeding into them and coupled together by the (unintended) magnetic fields around those interconnects, or ...
Sheppard, Douglas Dual Port SRAM: Memory Cell Layout and Array Coupling, 2011
Analyzing the types of conditions that can cause capacitive coupling between bit lines in a memory array is very critical in assuring that the data from the memory cell will be properly read. The state and location of one memory cell relative to others can influence the voltage level that is being sensed. This is made even more complex in ...
Sheppard, Douglas Dual Port SRAM Bit Line Coupling Between Ports, 2012
The influence that one port can have on the other port bit line can be a subtle, yet costly problem if not fully evaluated, and can in fact result in the design not working. Capacitive coupling between neighboring bit lines must be properly modeled and evaluated to determine their impact based on the different conditions that can occur in a ...
Fowler, Kim Introduction to Developing Embedded Systems, 2005
This tutorial would introduce important issues in preparing, designing, and developing a product including: Systems Engineering ? Process, design, and development; Architecture ? Hardware, Software, Tradeoffs; Interface choices; Reliability versus fault tolerance; Review and Testing - Debugging, inspections, integration, validation, verification; Documentation; The Human Interface - User-centered design, elements of successful interfaces; Packaging - Its influence, environmental issues, wiring and ...
Deutsch, Alina Understanding On-Chip Transmission Lines - Part 2, 2006
This course delves further into the present-day on-chip wiring design practices and the special characteristics of on-chip lossy transmission lines. A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with frequency-dependent properties and the interaction between delta-I noise, common-mode ...
No standards are currently tagged "Coupling circuits"
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.