Copper

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Copper is a chemical element with the symbol Cu and atomic number 29. (Wikipedia.org)






Conferences related to Copper

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2012 IEEE International Interconnect Technology Conference - IITC

The IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology


2009 International Conference on Energy and Environment Technology (ICEET)

The main topics are listed as follows: Energy efficency and management power generation technology power technology and application water,air pollution and protection


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Periodicals related to Copper

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.



Most published Xplore authors for Copper

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Xplore Articles related to Copper

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Study of NiZn ferrite absorption: Effect of relative density and microstructure

Luis Nuno; Antonio Barba; Juan V. Balbastre; Carolina Clausell; Ana Vines 2009 International Symposium on Electromagnetic Compatibility - EMC Europe, 2009

A study to optimize the reflectivity of ferrite absorbers is presented. The study considers the variation of the magnetic loss factor with the evolution of fired relative density and microstructure of ferrites made from a Zn-Ni-Cu ferrite powder, and from mixture of Zn-Ni and a Cu ferrite powder. From the results, an equation which relates the magnetic loss factor to ...


Electric machine design for traction applications considering recycling aspects-review and new solution

Mikael Alatalo; Sonja Tidblad Lundmark; Emma Arfa Grunditz IECON 2011 - 37th Annual Conference of the IEEE Industrial Electronics Society, 2011

With the expansion of the fleet of electric and hybrid electric vehicles worldwide, it is of interest to consider recycling aspects of the parts that are introduced in these new vehicles. This paper focuses on the design of electrical machines considering recycling of its components. The materials to consider are mainly copper, core materials such as lamination steel or iron, ...


Operating parameter based wirebond model for a power module

Lakshmi Gopi Reddy; Leon M. Tolbert; Burak Ozpineci 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, 2014

Lifetime estimation of power semiconductors for various applications has gained technical importance. The main failures in high power semiconductors are caused by thermo-mechanical fatigue, mainly in solder and wirebonds, due to different coefficients of thermal expansions of the various packaging materials. Most of the lifetime models do not take all the operating parameters into account. There is a need to ...


Copper (II) 15-crown-5 coordination compound with 3dz<sup>2</sup>

Li Yong; Guo Jinliang; Song Xinqi Tsinghua Science and Technology, 1997

This paper illustrates the origination, preparation, electron configuration, crystal structure, and properties of copper (II) 15-crown-5 coordination compound with 3dz2 ground state. The characteristics of electron paramagnetic resonance(EPR) spectrum, d-d transition in electron spectrum and differential thermal analysis (DTA) of the compound are shown. The future development in biochemistry and material science is discussed.


Temperature control of waveguide extenders

Johannes Hoffmann; Daniel Stalder; Michael Wollensack; Juerg Ruefenacht; Markus Zeier 2016 Conference on Precision Electromagnetic Measurements (CPEM 2016), 2016

Waveguide extenders are used for reflection and transmission measurements at frequencies higher than 70 GHz. The extenders produce a lot of heat during operation and thus their test-port temperature rises above 23 degrees Celsius. By using an active cooling system with a large thermal mass, excellent stability and test-port temperatures close to 23 degrees Celsius can be achieved.


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Educational Resources on Copper

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eLearning

Study of NiZn ferrite absorption: Effect of relative density and microstructure

Luis Nuno; Antonio Barba; Juan V. Balbastre; Carolina Clausell; Ana Vines 2009 International Symposium on Electromagnetic Compatibility - EMC Europe, 2009

A study to optimize the reflectivity of ferrite absorbers is presented. The study considers the variation of the magnetic loss factor with the evolution of fired relative density and microstructure of ferrites made from a Zn-Ni-Cu ferrite powder, and from mixture of Zn-Ni and a Cu ferrite powder. From the results, an equation which relates the magnetic loss factor to ...


Electric machine design for traction applications considering recycling aspects-review and new solution

Mikael Alatalo; Sonja Tidblad Lundmark; Emma Arfa Grunditz IECON 2011 - 37th Annual Conference of the IEEE Industrial Electronics Society, 2011

With the expansion of the fleet of electric and hybrid electric vehicles worldwide, it is of interest to consider recycling aspects of the parts that are introduced in these new vehicles. This paper focuses on the design of electrical machines considering recycling of its components. The materials to consider are mainly copper, core materials such as lamination steel or iron, ...


Operating parameter based wirebond model for a power module

Lakshmi Gopi Reddy; Leon M. Tolbert; Burak Ozpineci 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, 2014

Lifetime estimation of power semiconductors for various applications has gained technical importance. The main failures in high power semiconductors are caused by thermo-mechanical fatigue, mainly in solder and wirebonds, due to different coefficients of thermal expansions of the various packaging materials. Most of the lifetime models do not take all the operating parameters into account. There is a need to ...


Copper (II) 15-crown-5 coordination compound with 3dz<sup>2</sup>

Li Yong; Guo Jinliang; Song Xinqi Tsinghua Science and Technology, 1997

This paper illustrates the origination, preparation, electron configuration, crystal structure, and properties of copper (II) 15-crown-5 coordination compound with 3dz2 ground state. The characteristics of electron paramagnetic resonance(EPR) spectrum, d-d transition in electron spectrum and differential thermal analysis (DTA) of the compound are shown. The future development in biochemistry and material science is discussed.


Temperature control of waveguide extenders

Johannes Hoffmann; Daniel Stalder; Michael Wollensack; Juerg Ruefenacht; Markus Zeier 2016 Conference on Precision Electromagnetic Measurements (CPEM 2016), 2016

Waveguide extenders are used for reflection and transmission measurements at frequencies higher than 70 GHz. The extenders produce a lot of heat during operation and thus their test-port temperature rises above 23 degrees Celsius. By using an active cooling system with a large thermal mass, excellent stability and test-port temperatures close to 23 degrees Celsius can be achieved.


More eLearning Resources

IEEE-USA E-Books

  • Salient Pole Rotor Winding Failure Mechanisms and Repair

    Modern salient pole winding designs use aramid paper ground and turn insulation in strip-on-edge windings, resin-bonded glass laminate pole washers DacronTM and glass-covered high-temperature enamel turn insulation in wire wound poles, and thermosetting bonding resins. Insulation aging from thermal cycling occurs mainly in synchronous motors and generators that are started and stopped frequently. Salient pole rotor windings, especially strip-on-edge types, are generally susceptible to failure from contamination by conducting materials because they rely on adequate creepage distances between bare copper conductors to prevent shorts. Abrasive dust from the surrounding atmosphere carried into the interior of a motor or generator by cooling air will abrade the rotor winding insulation surfaces. Among the most common causes of failure in salient pole rotor windings are the continuous centrifugal forces imposed on them by rotation and the cyclic centrifugal forces induced by starting and stopping.

  • Power Rail Segmentation and Deployment

    Power supply rails, often simply referred as power rails, for road???powered electric vehicles (RPEVs) are often segmented like the conventional iron rails. We do not want to turn on the power rail with no running EVs on it and we want to turn on the power rail only for providing wireless power to EVs. There are a few power rail segmentation methods, mainly developed by Chun T. Rim, which will be introduced in this chapter.New cross???segmented power supply rails for RPEVs are explained in this chapter for reducing the construction cost and EMF. The proposed rail consists of two pairs of power cables, core, bidirectional power switches, a transformer, capacitors, and harness. Each rail is connected through a switch box, which can change the current direction of a pair of power cables. Hence, adding the current of the two pairs of power cables results in the activation mode while nullifying the current performs the silence mode. A coupling transformer with two capacitors is introduced to compensate for the variable line inductance of the rail due to the change of current direction. Therefore, multiple rails can be concurrently activated by selective turning the power switches on and off using an inverter. In addition, the EMF for the silence mode is drastically reduced if a twisted pair of power cables and copper nets are used, so that the ICNIRP Guideline 6.25 ??T at 20 kHz operating frequency can be met. The proposed cross???segmented power supply rail was implemented for experiments and verified for practical applications.This chapter is based on the paper by S. Choi, J. Huh, S. Lee, and C.T. Rim, ???New cross???segmented power supply rails for road powered electric vehicles,??? IEEE Trans. on Power Electronics, vol. 28, no. 12, pp. 5832???5841, December 2013.

  • Group IV Alloys for Advanced Nano??? and Optoelectronic Applications

    Mainstream semiconductor technology builds on elements of group IV within the periodic table. Crystalline silicon remains the principal base material, whereas germanium and carbon have entered the mainstream in the embedded source/drain technology, as well as in heterojunction bipolar transistors (HBTs) used in BiCMOS technology. Recently, it has been shown that alloying Ge with Sn enables the fabrication of fundamental direct bandgap group IV semiconductors, as well as optically pumped GeSn lasers grown on Si. This achievement pave the route toward efficient and monolithically integrated group IV light emitters, that is, lasers, for electronic???photonic integrated circuits (EPICs) that could solve the emerging power consumption crisis in complementary metal???oxide semiconductor (CMOS) technology by enabling optical on???chip and chip???to???chip data transfer. The large parasitic capacitances introduced by various layers of copper (Cu) interconnects demand high transistor ION currents, which could be reduced if some of the Cu lines are replaced by optical interconnects.

  • Additional Design Techniques

    This chapter contains sections titled: Localized Planes 20-H Rule Trace Routing for Corners Selecting Ferrite Components Grounded Heatsinks Lithium Battery Circuits BNC Connectors Creepage and Clearance Distances Current-Carrying Capacity of Copper Traces Film This chapter contains sections titled: References

  • Architectural Shielding

    This chapter contains sections titled: Introduction Critical Considerations in Architectural Shielding Aluminum Foil Shielding Copper Foil Shielded Enclosures Copper Alloy Shielded Enclosures The Sandwich Seam Shielding System Other Shielding Systems Other Shielding Materials Structural Considerations of Architectural Shielding References

  • High Frequency Simulation and Characterization of Advanced Copper Interconnects

    In this paper we evaluate impact of Copper on high frequency (HF) behavior for deep submicron interconnects. Especially we compare Aluminum vs. Copper structures and study association of Copper with low-k dielectrics. Firstly we proceed electromagnetic (EM) and electrical simulations to determine the necessary level of modeling. In a second step we make time domain characterization on dedicated devices. In this study we measure the effective benefit of Copper and low-k on crosstalk.

  • Generator Design and Construction

    This chapter contains sections titled: Stator Core Stator Frame Flux and Armature Reaction Electromagnetics End-Region Effects and Flux Shielding Stator Core and Frame Forces Stator Windings Stator Winding Wedges End-Winding Support Systems Stator Winding Configurations Stator Terminal Connections Rotor Forging Rotor Winding Rotor Winding Slot Wedges Amortisseur Winding Retaining Rings Bore Copper and Terminal Connectors Slip-Collector Rings and Brush Gear Rotor Shrink Coupling Rotor Turning Gear Bearings Air and Hydrogen Cooling Rotor Fans Hydrogen Containment Hydrogen Coolers References

  • IronNickel Alloys

    This chapter contains sections titled: Binary Iron-Nickel Alloys Commercial Binary Alloys Iron-Nickel-Molybdenum Alloys Iron-Nickel-Chromium Alloys Iron-Nickel-Copper Alloys Iron-Cobalt-Nickel Alloys Other Iron-Nickel Alloys

  • Rotor Inspection

    This chapter contains sections titled: Rotor Cleanliness Retaining-Rings Fretting/Movement at Interference-Fit Surfaces of Wedges and Rings Centering (Balance) Rings Fan-Rings or Hubs Fan Blades Bearings and Journals Balance Weights and Bolts End Wedges and Damper Windings Other Wedges End-Windings and Main Leads Collector Rings Collector Ring Insulation Bore Copper and Radial (Vertical) Terminal Stud Connectors Brush-Spring Pressure and General Condition Brush-Rigging Shaft Voltage Discharge (Grounding) Brushes Rotor Winding Main Lead Hydrogen Sealing - Inner and Outer Circumferential Pole Slots (Body Flex Slots) Blocked Rotor Radial Vent Holes - Shifting of Winding and/or Insulation Couplings and Coupling Bolts Bearing Insulation Hydrogen Seals Rotor Body Zone Rings References

  • Copper Physical Layers

    This chapter contains sections titled: Introduction Overview of the chapter Who will benefit from reading this chapter The premise of Ethernet over telephone wire Relationship to ATIS, ETSI, and ITU-T The need for two modulation techniques Layering and sublayer interfaces Physical coding sublayer (PCS) functions Transmission convergence (TC) sublayer functions Management Summary of the concepts presented in this chapter For further reference



Standards related to Copper

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No standards are currently tagged "Copper"


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