Copper

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Copper is a chemical element with the symbol Cu and atomic number 29. (Wikipedia.org)






Conferences related to Copper

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2012 IEEE International Interconnect Technology Conference - IITC

The IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology


2011 11th International Conference on Control, Automation and Systems (ICCAS)

Theory and application of instrumentation, control, robotics, automation, and information technology.


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Periodicals related to Copper

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.



Most published Xplore authors for Copper

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Xplore Articles related to Copper

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A new model for the determination of copper losses in transformer windings with arbitrary conductor distribution under high frequency sinusoidal excitation

G. S. Dimitrakakis; E. C. Tatakis; E. J. Rikos 2007 European Conference on Power Electronics and Applications, 2007

Magnetic components (inductors and transformers), when present in power electronics converters, consist undoubtedly, along with the semiconductor switches, the main power loss contribution. This fact emerges the necessity of having some easily applicable tools for their effective resistance accurate calculation. The up to now widely used relative theoretical or empirical formulas have been extracted under assumptions or experimental conditions that ...


Availability modeling of a safe communication system for rolling stock applications

Ada Fort; Francesco Bertocci; Marco Mugnaini; Valerio Vignoli; Vittorio Gaggii; Alessandro Galasso; Moreno Pieralli 2013 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), 2013

The concern related to the design of highly reliable communication structures used in applications where safety plays a crucial role has always been under the attention of researchers due to the complexity and importance of the topic. In this paper the authors study the availability of a communication system topology exploitable in rolling stock applications comparing results for two different ...


Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


Biomimetic sensors for the heavy metal detection

Suseung Lee; Inhee Choi; Surin Hong; Young In Yang; Jeongjin Lee; Hyeon-don Song; Jongheop Yi; Taewook Kanga 2009 IEEE Sensors, 2009

Specific interactions between heavy metal ions and biomaterials have advantages in the sensitive and selective detection of the metal ions. In this study, Cu-demetallated form of Cu/Zn-superoxide dismutase (SOD1) protein was applied as a sensing probe in order to detect Cu(II) ions selectively via surface plasmon resonance (SPR) analysis. Because demetallated metalloproteins have vacant specific metal-binding sites in their own ...


Characterization of grain boundaries in YBa/sub 2/Cu/sub 3/O/sub y/ bicrystal junctions [SQUIDs]

Hsiao-Wen Yu; Ming-Jye Chen; Hong-Chang Yang; S. Y. Yang; H. E. Horng IEEE Transactions on Applied Superconductivity, 1999

I-V, V-/spl Phi/ characteristics and atomic force images of grain boundary Josephson junctions fabricated on SrTiO/sub 3/ bicrystal substrates were investigated. The half integer Shapiro steps and I/sub c/ versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction. The dc SQUID formed on the grain boundary shows the expected V-/spl Phi/ curve. The AFM ...


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Educational Resources on Copper

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eLearning

A new model for the determination of copper losses in transformer windings with arbitrary conductor distribution under high frequency sinusoidal excitation

G. S. Dimitrakakis; E. C. Tatakis; E. J. Rikos 2007 European Conference on Power Electronics and Applications, 2007

Magnetic components (inductors and transformers), when present in power electronics converters, consist undoubtedly, along with the semiconductor switches, the main power loss contribution. This fact emerges the necessity of having some easily applicable tools for their effective resistance accurate calculation. The up to now widely used relative theoretical or empirical formulas have been extracted under assumptions or experimental conditions that ...


Availability modeling of a safe communication system for rolling stock applications

Ada Fort; Francesco Bertocci; Marco Mugnaini; Valerio Vignoli; Vittorio Gaggii; Alessandro Galasso; Moreno Pieralli 2013 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), 2013

The concern related to the design of highly reliable communication structures used in applications where safety plays a crucial role has always been under the attention of researchers due to the complexity and importance of the topic. In this paper the authors study the availability of a communication system topology exploitable in rolling stock applications comparing results for two different ...


Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


Biomimetic sensors for the heavy metal detection

Suseung Lee; Inhee Choi; Surin Hong; Young In Yang; Jeongjin Lee; Hyeon-don Song; Jongheop Yi; Taewook Kanga 2009 IEEE Sensors, 2009

Specific interactions between heavy metal ions and biomaterials have advantages in the sensitive and selective detection of the metal ions. In this study, Cu-demetallated form of Cu/Zn-superoxide dismutase (SOD1) protein was applied as a sensing probe in order to detect Cu(II) ions selectively via surface plasmon resonance (SPR) analysis. Because demetallated metalloproteins have vacant specific metal-binding sites in their own ...


Characterization of grain boundaries in YBa/sub 2/Cu/sub 3/O/sub y/ bicrystal junctions [SQUIDs]

Hsiao-Wen Yu; Ming-Jye Chen; Hong-Chang Yang; S. Y. Yang; H. E. Horng IEEE Transactions on Applied Superconductivity, 1999

I-V, V-/spl Phi/ characteristics and atomic force images of grain boundary Josephson junctions fabricated on SrTiO/sub 3/ bicrystal substrates were investigated. The half integer Shapiro steps and I/sub c/ versus B curves show evidence of the inhomogeneous current distribution along the grain boundary junction. The dc SQUID formed on the grain boundary shows the expected V-/spl Phi/ curve. The AFM ...


More eLearning Resources

IEEE-USA E-Books

  • Preindustrial Societies

    This chapter contains sections titled: Hunters and Gatherers, Shifting Cultivation, Traditional Agricultures, Cattle, Horses, Wood, Charcoal, and Straw, Waterwheels, Windmills, Copper, Iron, and Steel, Gunpowder, Sailships

  • Level III HV Protection Equipment, Installation, and Testing

    This chapter contains sections titled: General Level III Copper HVI Components Copper HVI System Design Copper HVI Installation Examples Copper HVI System Initial Testing Copper HVI Maintenance and Inspection Fiber HVI Systems Installation Fiber HVI Installation Examples Wireless Sites on Electrical Power Towers Protection at Non-Power Company Locations

  • Generator Design and Construction

    This chapter contains sections titled: Stator Core Stator Frame Flux and Armature Reaction Electromagnetics End-Region Effects and Flux Shielding Stator Core and Frame Forces Stator Windings Stator Winding Wedges End-Winding Support Systems Stator Winding Configurations Stator Terminal Connections Rotor Forging Rotor Winding Rotor Winding Slot Wedges Amortisseur Winding Retaining Rings Bore Copper and Terminal Connectors Slip-Collector Rings and Brush Gear Rotor Shrink Coupling Rotor Turning Gear Bearings Air and Hydrogen Cooling Rotor Fans Hydrogen Containment Hydrogen Coolers References

  • Variable Frequency Drive Systems

    This chapter discusses the basic design and construction of variable frequency drives (VFD). VFD and variable speed drives (VSD) are used to control the speed and/or torque of induction and synchronous motors at the power generation facility when speed control or torque control is required for the application. The types of VFD technologies available are varied and each has its own unique advantages and disadvantages. While details of construction vary from manufacturer to manufacturer, the three main types of VFD are the voltage source inverter (VSI), the current source inverter (CSI) and the pulse width modulated inverter (PWM). Harmonic currents can have several adverse effects on the electrical distribution system feeding the drive. Some of the effects are the possible overheating of distribution equipment due to nonlinear current waveforms and increased copper and iron losses in motors and transformers.

  • Causes of Breaks in Squirrel Cage Windings During Direct???On???Line Starts and Steady???State Operation

    Squirrel cage rotor windings are designed to cope with mechanical and electromagnetic forces and thermal stresses during direct???on???line (DOL) starting. The cage rotor should be a reliable part of a Squirrel Cage Induction Motor (SCIM) in any abnormal steady???state operating conditions which the motor may experience. This chapter begins with a general review of the failure mechanisms, which lead to actual breaks in the cage winding, such as broken rotor bars or end rings. The mechanical stresses in a squirrel cage winding result from centrifugal forces during motor operation and are highest at the largest radius of rotation in a rotor. The speed and load fluctuations imposed on the rotors are most significant in reciprocating compressors and they cause fluctuating motor line currents and varying rotor speed and hence slip. Copper or copper alloy cage windings cope better with these problems since they have a much higher thermal capacity than aluminum types.

  • Parasitic Resistances, Capacitances, and Inductances

    This chapter contains sections titled: Parasitic Resistances: General Considerations Parasitic Capacitances: General Considerations Parasitic Inductances: General Considerations Approximate Formulas for Capacitances Green's Function Method: Using Method of Images Green's Function Method: Fourier Integral Approach Network Analog Method Simplified Formulas for Interconnection Capacitances and Inductances on Silicon and GaAs Substrates Inductance Extraction Using FastHenry Copper Interconnections: Resistance Modeling Electrode Capacitances in GaAs MESFET: Application of Program IPCSGV Exercises References

  • Copper Physical Layers

    This chapter contains sections titled: Introduction Overview of the chapter Who will benefit from reading this chapter The premise of Ethernet over telephone wire Relationship to ATIS, ETSI, and ITU-T The need for two modulation techniques Layering and sublayer interfaces Physical coding sublayer (PCS) functions Transmission convergence (TC) sublayer functions Management Summary of the concepts presented in this chapter For further reference

  • Appendix C: Diameter and Resistance of Annealed Copper Wire by Gauge Size

    No abstract.

  • Generator Design and Construction

    This chapter contains sections titled: Stator Core Stator Frame Flux and Armature Reaction Electromagnetics End-Region Effects and Flux Shielding Stator Core and Frame Forces Stator Windings Stator Winding Wedges End-Winding Support Systems Stator Winding Configurations Stator Terminal Connections Rotor Forging Rotor Winding Rotor Winding Slot Wedges Amortisseur Winding Retaining-Rings Bore Copper and Terminal Connectors Slip-Collector Rings and Brush-Gear Rotor Shrink Coupling Rotor Turning Gear Bearings Air and Hydrogen Cooling Rotor Fans Hydrogen Containment Hydrogen Coolers References

  • Unclad and Clad Structures

    This chapter contains sections titled: Unclad Structures Introduction Reinforcements Resins Development Programs Market Trends Principal Unclad Structures for Electrical/Electronic Uses Clad Structures Introduction Suppliers Technology Substrates for Printed Circuits Semiconductor Silicon Copper Foils Adhesives Covercoats Multilayer Circuits Flexible Circuits Federal Specifications for Printed Circuits IPC Specifications for Printed Circuits ASTM Standards for Copper-Clad Thermoset Laminates Ul Standard for Printed Wiring Boards Development Programs Market Trends



Standards related to Copper

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No standards are currently tagged "Copper"