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Copper is a chemical element with the symbol Cu and atomic number 29. (

Conferences related to Copper

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2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies

2018 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

A: BREAKDOWN AND FLASHOVERA1. Vacuum breakdown and pre-breakdown phenomenaA2. Surface discharges and flashover phenomenaB: VACUUM ARCSB1. Switching in vacuum and related phenomenaB2. Interaction of vacuum arcs with magnetic fieldsB3. Vacuum arc physicsB4. Computer modeling and computer aided designB5. Pulsed power physics and technologyC: APPLICATIONSC1. Vacuum interrupters and their applicationsC2. Surface modification and related technologiesC3. Electron, ion, neutron, X-ray and other beam and light sources

2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.

2018 IEEE 18th International Power Electronics and Motion Control Conference (PEMC)

Promote and co-ordinate the exchange and the publication of technical, scientific and economic information in the field of Power Electronics and Motion Control with special focus on countries less involved in IEEE related activities. The main taget is to create a forum for industrial and academic community.

  • 2016 IEEE International Power Electronics and Motion Control Conference (PEMC)

    The IEEE Power Electronics and Motion Control (IEEE-PEMC) conference continues to be the oldest in Europe and is a direct continuation of the conferences held since 1970. Its main goal is to promote and co-ordinate the exchange and publication of technical, scientific and economic information on Power Electronics and Motion Control. One of its main objectives is the cooperation and integration between the long-time divided Western and Eastern Europe, this goal expressed in the conference logo, as well. The conference attracts now a large number (roughly 500+) of participants from the world. An exhibition is organised in parallel with every PEMC Conference, offering space for the industry to present their latest products for Power Electronics and Motion Control. In addition to the regular oral sessions, key notes, round tables, tutorials, workshops, seminars, exhibitions, the dialogue sessions (enlarged “poster” presentations) present to the speakers a better cooperation opportunity.

  • 2014 16th International Power Electronics and Motion Control Conference (PEMC)

    The purpose of the 16th International Power Electronics and Motion Control Conference and Exposition (PEMC) is to bring together researchers, engineers and practitioners from all over the world, interested in the advances of power systems, power electronics, energy, electrical drives and education. The PEMC seeks to promote and disseminate knowledge of the various topics and technologies of power engineering, energy and electrical drives. The PEMC aims to present the important results to the international community of power engineering, energy, electrical drives fields and education in the form of research, development, applications, design and technology. It is therefore aimed at assisting researchers, scientists, manufacturers, companies, communities, agencies, associations and societies to keep abreast of new developments in their specialist fields and to unite in finding power engineering issues.

  • 2012 EPE-ECCE Europe Congress

    Power Electronics and Motion Control.

  • 2010 14th International Power Electronics and Motion Control Conference (EPE/PEMC 2010)

    Semiconductor Devices and Packaging, Power Converters, Electrical Machines, Actuators, Motion Control, Robotics, Adjustable Speed Drives, Application and Design of Power Electronics circuits, Measurements, Sensors, Observing Techniques, Electromagnetic Compatibility, Power Electronics in Transportation, Mechatronics, Power Electronics in Electrical Energy Generation, Transmission and Distribution, Renewable Energy Sources, Active Filtering, Power Factor Correction

  • 2008 13th International Power Electronics and Motion Control Conference (EPE/PEMC 2008)

  • 2006 12th International Power Electronics and Motion Control Conference (EPE/PEMC 2006)

2018 IEEE 45th Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications

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Periodicals related to Copper

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission

Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.

Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...

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Xplore Articles related to Copper

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Effects of charging algorithm and converter topology on energy efficiency

[{u'author_order': 1, u'affiliation': u'Dept. of Electrical, Electronic and Computer Engineering, University of Pretoria, South Africa', u'full_name': u'MN Gitau'}, {u'author_order': 2, u'affiliation': u'Dept. of Electrical, Electronic and Computer Engineering, University of Pretoria, South Africa', u'full_name': u'G. Ebersohn'}] AFRICON 2009, None

Underground mining activities in South Africa depend on battery fed underground locomotives to haul ore. The batteries are predominantly lead-acid and have to be charged periodically. At the moment, most of the battery chargers in use in South African mines are based on ferroresonant or transductor charger technology. At the same time, the charging algorithms in use are time based ...

CuNiO/sub x/ Bimetallic Oxides Obtained by Laser Irradiation of Mixed Copper and Nickel Salts

[{u'author_order': 1, u'full_name': u'R. Alexandrescu'}, {u'author_order': 2, u'full_name': u'I. Morjan'}, {u'author_order': 3, u'full_name': u'I. Voicn'}, {u'author_order': 4, u'full_name': u'G. Pugra'}, {u'author_order': 5, u'full_name': u'S. Petcu'}] Proceedings of European Meeting on Lasers and Electro-Optics, None

First Page of the Article ![](/xploreAssets/images/absImages/00562324.png)

Green mould compounds: Impact on second level interconnect reliability

[{u'author_order': 1, u'affiliation': u'imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'full_name': u'B. Vandevelde'}, {u'author_order': 2, u'affiliation': u'imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'full_name': u'M. Lofrano'}, {u'author_order': 3, u'affiliation': u'imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'full_name': u'G. Willems'}] 2011 IEEE 13th Electronics Packaging Technology Conference, None

The change-over from conventional to so-called green moulding compounds has gradually taken place in the last five years. These green mould compound materials have a lower thermal expansion and higher elastic modulus. As a consequence of the modified thermal and mechanical properties, an impact on the thermo-mechanical behaviour of the package-board assembly is expected (so- called Package Board Interaction: PBI). ...

Mossbauer Studies Of Nanocrystalline Fe/sub 83/B/sub 9/Nb/sub 7/Cu/sub1/ Alloy By Flash Annealing

[{u'author_order': 1, u'affiliation': u'Kookmin University', u'full_name': u'Chul Sung Kim'}, {u'author_order': 2, u'full_name': u'Sung Back Kim'}, {u'author_order': 3, u'full_name': u'Hi Min Lee'}, {u'author_order': 4, u'full_name': u'Young Rang Um'}, {u'author_order': 5, u'full_name': u'K. Y. Kim'}, {u'author_order': 6, u'full_name': u'T. H. Noh'}] 1997 IEEE International Magnetics Conference (INTERMAG), None

First Page of the Article ![](/xploreAssets/images/absImages/00597876.png)

Strength of Hycon 3 HP Be-Cu and other copper alloys from 20/spl deg/C to 200/spl deg/C

[{u'author_order': 1, u'affiliation': u'Francis Bitter Nat. Magnet Lab., MIT, Cambridge, MA, USA', u'full_name': u'R. J. Weggel'}, {u'author_order': 2, u'full_name': u'J. O. Ratka'}, {u'author_order': 3, u'full_name': u'W. D. Spiegelberg'}, {u'author_order': 4, u'full_name': u'Y. Sakai'}] IEEE Transactions on Magnetics, 1994

To be suitable for high-performance water-cooled magnets a conductor must have an excellent combination of electrical conductivity and tensile strength at moderately elevated temperatures. We have measured the 0.2% yield and ultimate tensile strengths, elongation and modulus of five copper alloys, in the form of heavily cold-worked strip 0.4 mm to 1.2 mm thick, at temperatures up to 200/spl deg/C. ...

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Educational Resources on Copper

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No eLearning Articles are currently tagged "Copper"


  • Broadband Access

    This chapter contains sections titled: Broadband Services Over Copper The Passive Optical Network Ethernet in the First Mile Service Provisioning Selected Bibliography

  • Disasters and Outages

  • Paving the Road to Gbit/s Broadband Access with Copper


  • Electronic Materials

    This chapter traces the increasing number of materials used in electronic devices over time. The main areas covered are silicon device technology, compound semiconductor device technology, and displays. In each area, the elements of the periodic table which are used in the production of these devices are shown. The main device types in the silicon area includebipolar and metal-oxide-silicon (MOS) silicon transistors for integrated circuits, power devices, and photovoltaic devices. In the compound device area, metal- semiconductor field-effect transistors (MESFETs), high electron mobility transistors (HEMTs), and heterojunction bipolar transistor (HBTs)compound semiconductor are described. Optoelectronic and photovoltaic devices are briefly addressed. In the display area, cathode ray tubes as well as modern flat panel display technology is covered, such as plasma display panels (PDPs), liquid crystal displays (LCDs), electrophoretic displays, and organic light emitting diode displays (OLEDs). Combined, well over 50 elements are used to produce these devices.

  • Textile Antennas for Body Area Networks: Design Strategies and Evaluation Methods

    This chapter presents the design, development, and evaluation procedures for textile antennas. It overviews the types of textiles (conductive and non- conductive) and explains the characterization procedure using a commercial setup prior to the proposal of a systematic antenna fabrication procedure. In experiments, measurement of the reflection coefficient is performed using a vector network analyzer (VNA), whereas radiation characteristics, that is, patterns, gain, and efficiency are evaluated in an anechoic chamber. Antenna performance is assessed in the proximity of either a human user or a phantom and must lead to sufficient design information to guarantee this performance in the simulation-based design process, where the proximity of the human body also has to be taken into account. Finally, the chapter also describes the evaluation methods used for the fabricated antenna prototypes, that is, in terms of reflection coefficient, radiation characteristics, efficiency, and specific absorption rates (SAR).

  • DC Machines and Drives

    This chapter discusses the well‐established theory of direct‐current (dc) machines, and illustrates the dynamic characteristics of the shunt and permanent‐magnet machines. The time‐domain block diagrams and state equations are developed for these two types of machines. The field and armature windings may be excited from separate sources or from the same source with the windings connected differently to form the basic types of dc machines, such as the shunt‐connected, the series‐connected, and the compound‐connected dc machines. The chapter provides the equivalent circuits for each of these machines along with an analysis and discussion of their steady‐state operating characteristics. It presents the widely used converters, and the analysis and performance of several common dc drive systems. The chapter analyzes the operation and establishes the average‐value model for one, two and four quadrant chopper drive systems. It concludes with a discussion on typical control systems, and the control design using the models.

  • Physical Layer Connectivity

    Differentiating guided and unguided media, the transfer of bandwidth from broadcasting to mobile broadband, the cost of propagation loss - impact of OFDM, The Smith Chart as descriptor of technology economics, vector analysis and Moore's law Innovation domains, enabling technologies and their impact on the cost of delivery, graphene as a new enabler, the evolution of photonics and free space optics, Infra Red Optical systems, cable and Hybrid Fibre Coaxial Systems, DVB‐S and terrestrial TV, Copper access - ADSL and VDSL evolution, OFDM in wireless, characteristics of the Fourier Transform, the impact of transforms on DSP and Microcontroller architectures ‐

  • DC Machines

  • Beyond 3G Network Architectures

    This chapter contains sections titled: Overview UMTS, HSPA, and HSPA+ LTE 802.11 Wi‐Fi

  • Arc Flash Hazard Analysis

    The procedures and policies set forth in ANSI/AIHA Z10-2012 Occupational Health and Safety Management Systems can be used as part of an electrical safety program to mitigate the hazards of arc flash and electrical shock. This chapter describes approaches that are not always effective for arc flashes caused by electric arcs which produce an incident energy that exceeds 40 cal/cm2. Some design techniques which reduce the possibility of such high levels of incident energy are discussed here. Design for safety is critical because engineering methods that reduce the amount of energy associated with the electric arc and the duration of the arc may not be available for use with levels greater than 40 cal/cm2. Flash hazard analysis has developed as a field within electrical engineering. There are three major aspects to this: safety by prevention, operational safety and safety by protection.

Standards related to Copper

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IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)

Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).

IEEE Standard Method for Measuring the Effectiveness of Electromagnetic Shielding Enclosures

This standard provides uniform measurement procedures for determining the effectiveness of electromagnetic (EM) shielding enclosures at frequencies from 9 kHz to 18 GHz (extendable down to 50 Hz and up to 100 GHz). The owner of the shielding enclosure shall provide the frequencies at which the shield will be tested, and the shielding effectiveness (SE) limits for pass/fail. This standard ...

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