# Copper

View this topic in
Copper is a chemical element with the symbol Cu and atomic number 29. (Wikipedia.org)

### Conferences related to Copper

2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies

2018 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

A: BREAKDOWN AND FLASHOVERA1. Vacuum breakdown and pre-breakdown phenomenaA2. Surface discharges and flashover phenomenaB: VACUUM ARCSB1. Switching in vacuum and related phenomenaB2. Interaction of vacuum arcs with magnetic fieldsB3. Vacuum arc physicsB4. Computer modeling and computer aided designB5. Pulsed power physics and technologyC: APPLICATIONSC1. Vacuum interrupters and their applicationsC2. Surface modification and related technologiesC3. Electron, ion, neutron, X-ray and other beam and light sources

2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.

2018 IEEE 18th International Power Electronics and Motion Control Conference (PEMC)

Promote and co-ordinate the exchange and the publication of technical, scientific and economic information in the field of Power Electronics and Motion Control with special focus on countries less involved in IEEE related activities. The main taget is to create a forum for industrial and academic community.

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation

More Conferences

### Periodicals related to Copper

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.

Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...

More Periodicals

### Xplore Articles related to Copper

Influence of PWM characteristics on the core losses due to harmonic voltages in PWM fed induction motors

[{u'author_order': 1, u'affiliation': u"Dept. of Electr. Eng., King Mongkut's Inst. of Technol., Bangkok, Thailand", u'full_name': u'S. Khomfoi'}, {u'author_order': 2, u'full_name': u'V. Kinnares'}, {u'author_order': 3, u'full_name': u'P. Viriya'}] 2000 IEEE Power Engineering Society Winter Meeting. Conference Proceedings (Cat. No.00CH37077), None

The paper focuses on mechanisms of harmonic core losses due to PWM characteristics. The influence of PWM characteristics such as switching frequency, modulation depth and PWM strategy on core losses has been examined. The investigation into harmonic core losses based on no-load input power measurement with minimized rotor copper loss and rotational loss has been made. The experimental results show ...

A study of main contributors to the Out-Of-Band performance of a generic wire antenna

[{u'author_order': 1, u'affiliation': u'Nanyang Technology University, 50 Nanyang Avenue Singapore 639798', u'full_name': u'V. J. X. Lim'}, {u'author_order': 2, u'affiliation': u'ST Electronics (Info-Comm Systems) Pte Ltd, 100 Jurong East Street 21, ST Electronics, Jurong East Building, Singapore 609602', u'full_name': u'W. L. Ke'}, {u'author_order': 3, u'affiliation': u'Nanyang Technology University, 50 Nanyang Avenue Singapore 639798', u'full_name': u'E. L. Tan'}, {u'author_order': 4, u'affiliation': u'ST Electronics (Info-Comm Systems) Pte Ltd, 100 Jurong East Street 21, ST Electronics, Jurong East Building, Singapore 609602', u'full_name': u'E. Lee'}] 2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), None

The Out-Of-Band (OOB) performance of a generic wire antenna, exemplified by a simple monopole, has been analysed using various antenna models. Our study showed that the low frequency gain roll off is about 55 dB/decade for wire type antenna. Across the rest of the OOB frequency band, the analytical and simulated antenna models have showed good agreement with the measured ...

The Influence of Stress on Aluminum Conductor Life

[{u'author_order': 1, u'affiliation': u'Mostek Corporation, 1215 West Crosby Rd., Carrollton, bx. 75006. (214) 466-6337/466-6442', u'full_name': u'T. Turner'}, {u'author_order': 2, u'affiliation': u'Mostek Corporation, 1215 West Crosby Rd., Carrollton, bx. 75006. (214) 466-6337/466-6442', u'full_name': u'K. Wendel'}] 23rd International Reliability Physics Symposium, None

Stress induced failure of Al-Si metal lines has been observed in long lines less than four microns wide. The failures result from voids or cracks in metal lines and appear very similar to electromigration induced damage. However, these failures can be generated without electrical stress, and are not accelerated by high temperatures. The failures were found to be due to ...

Design of a High- <inline-formula> <tex-math notation="LaTeX">$T_{\text{c}}$</tex-math></inline-formula> Superconductive Maglev Flywheel System at 100-kW Level

[{u'author_order': 1, u'affiliation': u'Coll. of Nucl. Technol. & Autom. Eng., Chengdu Univ. of Technol., Chengdu, China', u'full_name': u'Wei Liu'}, {u'author_order': 2, u'affiliation': u'Coll. of Nucl. Technol. & Autom. Eng., Chengdu Univ. of Technol., Chengdu, China', u'full_name': u'Dong Kang'}, {u'author_order': 3, u'affiliation': u'Beijing Inst. of Technol., Beijing, China', u'full_name': u'Chengning Zhang'}, {u'author_order': 4, u'affiliation': u'Beijing Inst. of Technol., Beijing, China', u'full_name': u'Guohong Peng'}, {u'author_order': 5, u'affiliation': u'Coll. of Nucl. Technol. & Autom. Eng., Chengdu Univ. of Technol., Chengdu, China', u'full_name': u'Xiaofeng Yang'}, {u'author_order': 6, u'affiliation': u'Appl. Supercond. Lab., Southwest Jiaotong Univ., Chengdu, China', u'full_name': u'Suyu Wang'}] IEEE Transactions on Applied Superconductivity, 2016

The flywheel energy storage system (FESS) is an ideal candidate for electrical energy savings in subway systems when combined with regenerative braking technology. Practical application in a subway system requires a FESS with large energy storage capacity (ESC), high power level, short recharge interval times, and high recharge cycles. The high-Tc superconductive (HTS) Maglev bearing can levitate and rotate a ...

Technology/Circuit/System Co-Optimization and Benchmarking for Multilayer Graphene Interconnects at Sub-10-nm Technology Node

[{u'author_order': 1, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA', u'full_name': u'Chenyun Pan'}, {u'author_order': 2, u'affiliation': u'imec, Leuven, Belgium', u'full_name': u'Praveen Raghavan'}, {u'author_order': 3, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA', u'full_name': u'Ahmet Ceyhan'}, {u'author_order': 4, u'affiliation': u'imec, Leuven, Belgium', u'full_name': u'Francky Catthoor'}, {u'author_order': 5, u'affiliation': u'imec, Leuven, Belgium', u'full_name': u'Zsolt Tokei'}, {u'author_order': 6, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA', u'full_name': u'Azad Naeemi'}] IEEE Transactions on Electron Devices, 2015

Based on realistic circuit- and system-level simulations, graphene interconnects are analyzed in terms of multiple material properties, such as the mean free path (MFP), the contact resistance, and the edge roughness. The benchmarking results indicate that the advantage of using graphene interconnects occurs only under certain circumstances. The device-level parameters, including the supply and threshold voltages, and the circuit-level parameters, ...

More Xplore Articles

### Educational Resources on Copper

#### eLearning

No eLearning Articles are currently tagged "Copper"

#### IEEE-USA E-Books

• Coil Design and Temperature Calculations

Magnetic actuators and sensors are often components of large systems, such as automobiles. The actuators and sensors must perform reliably in the system environment and interface properly with the system. To interface properly with system power supplies, the coils of the magnetic components must be properly designed. As part of the coil design, the temperatures developed by the coils and the components must be predicted. This chapter discusses the coil design and temperature calculations for magnetic actuators and sensors. The concepts discussed in the chapter are wire size determination for direct current (DC) currents, coil time constant and impedance, skin effects and proximity effects for alternating current (AC) currents, and finite-element computation of temperatures.

• Wireless Core Network Hardware

The need to reduce end to end delivery cost, microwave link economics, multiplexing gain, point to multipoint, the backhaul mix, The HRAN (higher RAN) and LRAN (lower RAN) backhaul options economic comparisons

• Rotor Inspection

This chapter talks about inspection of the rotor, mostly while removed from the stator. It aims to serve as a guide to learning the specific problems and failure mechanisms, and their identification that will make it possible to correctly assess intrinsic risks for a given design, and to notice explicit signs of deterioration, damage, and/or impending failure. In large machines, balance weights, bolts, nuts, and any other rotor attachments are subjected to intensive centrifugal forces. The chapter provides discussion about the condition of the windings, cleanliness, or the lack of it, that plays in the condition of the rotor. The end rings contain the radial displacement of the copper end windings and the supporting blocks. In two‐or four‐pole machines, one arrangement of the rotor‐mounted fans has the fan blades attached to fan rings or hubs shrunk onto the shaft.

• A C&#x2010;RAN Approach for 5G Applications

5G networks are anticipated to obtain Shannon‐level and beyond throughput, and almost zero latency in future cellular networks. However, there are several challenges to solve if 5G is to outperform legacy mobile platforms; one of these is the design of the communication 'haul.' Traditionally, the backhaul segment connects the radio access network (RAN) to the rest of the network where the baseband processing takes place at the cell site. However, in this chapter, we will use the concept of 'fronthaul access,' which is recently gaining significant interest since it has the potential to support remote baseband processing based on adopting a cloud radio access network (C‐RAN) architecture that aims to mitigate (or coordinate) interference in operator‐deployed infrastructures; this eases significantly the requirements in interference‐aware transceivers. To do this, we provide a reference architecture which includes a network and protocol architecture incorporating a so‐called 'cloud resource optimizer.' The emergence of wireless fronthaul solutions widens the appeal of fronthaul for small‐cell deployments, because a fibre‐only solution - the technology typically used for fronthaul - is too expensive or just not available at many small‐cell sites. Moreover, we will also present the idea of virtual mobile small cells; these small cells are created on demand according to traffic demand.

Three fixed‐line media are of main interest to broadband telecommunications: twisted pair copper wires traditionally used for the telephony system; coaxial copper cables used for inter‐exchange links and cable TV broadcasting; and optical fibre systems used for international and long‐distance telephony and telecommunications backhaul. This chapter presents a chronological account of major milestones in fixed‐line data and digital voice systems. The performance of twisted pair copper wire systems is affected by interference from other telephone connections. This interference is generally known as crosstalk, and exists in two main types: near end crosstalk (NEXT) far end crosstalk (FEXT). While much of additive noise is random and therefore difficult to remove, the crosstalk interference signals are deterministic and therefore it is possible to calculate and remove them from the received signal. Asymmetric digital subscriber line (ADSL)/very‐high‐bit‐rate DSL (VDSL) standards have evolved to deliver higher transmission rates in both upstream and downstream.

• DC Machines and Drives

This chapter discusses the well&hyphen;established theory of direct&hyphen;current (dc) machines, and illustrates the dynamic characteristics of the shunt and permanent&hyphen;magnet machines. The time&hyphen;domain block diagrams and state equations are developed for these two types of machines. The field and armature windings may be excited from separate sources or from the same source with the windings connected differently to form the basic types of dc machines, such as the shunt&hyphen;connected, the series&hyphen;connected, and the compound&hyphen;connected dc machines. The chapter provides the equivalent circuits for each of these machines along with an analysis and discussion of their steady&hyphen;state operating characteristics. It presents the widely used converters, and the analysis and performance of several common dc drive systems. The chapter analyzes the operation and establishes the average&hyphen;value model for one, two and four quadrant chopper drive systems. It concludes with a discussion on typical control systems, and the control design using the models.

• Physical Layer Connectivity

Differentiating guided and unguided media, the transfer of bandwidth from broadcasting to mobile broadband, the cost of propagation loss - impact of OFDM, The Smith Chart as descriptor of technology economics, vector analysis and Moore's law Innovation domains, enabling technologies and their impact on the cost of delivery, graphene as a new enabler, the evolution of photonics and free space optics, Infra Red Optical systems, cable and Hybrid Fibre Coaxial Systems, DVB‐S and terrestrial TV, Copper access - ADSL and VDSL evolution, OFDM in wireless, characteristics of the Fourier Transform, the impact of transforms on DSP and Microcontroller architectures ‐

• Antenna Manufacturing and Measurements

This chapter contains sections titled: Antenna Manufacturing Antenna Measurement Basics Impedance, S11, VSWR and Return Loss Measurement Radiation Pattern Measurements Gain Measurements Miscellaneous Topics Summary References Problems

• Evaluating Insulation Materials and Systems

This chapter describes the practical aspects and limitations of accelerated aging tests used to determine the capability of winding insulation systems. There are many different stresses that can affect the rate of insulation deterioration in stator and rotor windings. The chapter describes thermal, electrical, ambient, and mechanical stresses, the so-called TEAM stresses. Each insulating material has its characteristic breakdown strength. Elaborate methods have been developed for measuring the short-term (voltage is applied for less than a few minutes) breakdown strength of insulation. The notion that some failure processes in rotor and stator windings do not occur as a result of a single stress or factor but, in fact, depend on two or more stresses/factors. Thus, to reasonably duplicate some failure processes in an accelerated aging test, more than one stress needs to be applied at the same time.

• Terrestrial Backhaul and the Aeronautical Telecommunications Network

This chapter contains sections titled: Summary Introduction Types of Point‐to‐point Bearers

### Standards related to Copper

IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)

Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).

IEEE Standard Method for Measuring the Effectiveness of Electromagnetic Shielding Enclosures

This standard provides uniform measurement procedures for determining the effectiveness of electromagnetic (EM) shielding enclosures at frequencies from 9 kHz to 18 GHz (extendable down to 50 Hz and up to 100 GHz). The owner of the shielding enclosure shall provide the frequencies at which the shield will be tested, and the shielding effectiveness (SE) limits for pass/fail. This standard ...