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2015 IEEE International Conference on Plasma Sciences (ICOPS)
Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.
Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects
Latest progress in physical, chemical and biological microsensors; Latest development in optical, RF, fluidic, biomedical and power MEMS; Most advanced technologies in micro/nano fabrication, packaging and design
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...
Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
Yong-Ha Song; Min-Wu Kim; Jeong Oen Lee; Seung-Deok Ko; Jun-Bo Yoon Microelectromechanical Systems, Journal of, 2013
This paper reports a dual-contact microelectromechanical switch, which consists of two contacts in a single switch: one with a soft contact material and the other with a hard contact material to achieve low contact resistance and high reliability at the same time under hot switching conditions. In a single switching operation, the proposed dual-contact switch makes contact twice in sequence, ...
Tang, W.; Gomez, M.R.; Lau, Y.Y.; Gilgenbach, R.M.; Zier, J. Plasma Science - Abstracts, 2009. ICOPS 2009. IEEE International Conference on, 2009
Summary form only given. Electrical contact is an important issue for high power microwave sources, wire-array Z pinches, field emitters, and metal- insulator-vacuum junctions. Because of the surface roughness on a microscopic scale, true contact between two pieces of metal occurs only on the asperities of the two contacting surfaces. Current flows only through these asperities, which occupy a small ...
Wanbin Ren; Yu Chen; Sheng Cao; Li Cui; Huimin Liang Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th, 2013
It is well known that electrical contact resistance influencing factors include not only the contact material physical characteristics, contact type (sphere-flat, flat-flat), the contact surface status (clean, contaminated), but also contact current and mechanical load during measuring. Electrical contact material industry has considerable trouble with batch consistency check of rivet contacts. An automated test equipment and a test method have ...
Sawada, S.; Shimizu, K.; Hattori, Y.; Tamai, T.; Iida, K. Electrical Contacts (HOLM), 2010 Proceedings of the 56th IEEE Holm Conference on, 2010
It is very important to predict the force-contact resistance relation for the virtual connector designing. In this study, the prediction of electrical contact resistance in various cases was examined. The specimens consisted of a copper alloy with tin or silver plating. To predict the contact resistance at each contact force, the relationship between contact resistance and contact force were separated ...
Stilson, C.; Toler, B.; Coutu, R. Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th, 2013
This paper presents the micro-contact performance comparison between contact pairs of Au/Au and composite contact pairs Au/Au-CNT. The Au/Au-CNT micro- contact's planar lower contact interface is an Au-CNT composite film with encapsulated CNTs. Micro-contact performance is affected by factors such as applied micro-contact force, temperature, current density, etc. At the micro- contact interface, asperities provide localized points for current flow. ...
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