Contact resistance

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The term contact resistance refers to the contribution to the total resistance of a material which comes from the electrical leads and connections as opposed to the intrinsic resistance, which is an inherent property, independent of the measurement method. (Wikipedia.org)






Conferences related to Contact resistance

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.

  • 2008 IEEE 35th International Conference on Plasma Sciences (ICOPS)

    The 35th IEEE International Conference on Plasma Science will feature an exciting technical program with reports from around the globe about new and innovative developments in the field of plasma science and engineering: 1. Basic processes in fully and partially ionized plasmas 2. Microwave generation and plasma interactions 3. Charged particle beams and sources 4. High energy density plasmas applications 5. Industrial, commercial and medical plasma applications 6. Plasma diagnostics 7. Pulsed power


2012 IEEE 58th Holm Conference on Electrical Contacts (Holm 2012)

Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the authors field of expertise.


TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

Latest progress in physical, chemical and biological microsensors; Latest development in optical, RF, fluidic, biomedical and power MEMS; Most advanced technologies in micro/nano fabrication, packaging and design.



Periodicals related to Contact resistance

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.




Xplore Articles related to Contact resistance

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An Experimental Study of Arc Duration and Transition from Metallic to Gaseous Phase in Ag Alloy Break Arc

Yoshida, K.; Tanimoto, S. Electrical contacts - 2007, the 53rd ieee holm conference on, 2007

We have studied maintaining mechanism of the contacts arc discharge. In our experiment, the arc duration ta, metallic phase arc duration tm, and transition ratio from metallic to gaseous phase arc G were experimentally studied in Ag, AgCu and AgSnO2 breaking contacts. Experiments were carried out under the variation of source voltage E (12, 24, 36, 48 V), closed contact ...


Super coupling currents in Rutherford type of cables due to longitudinal nonhomogeneities of dB/dt

Verweij, A.P.; ten Kate, H.H.J. Applied Superconductivity, IEEE Transactions on, 1995

In this paper it is shown that nonhomogeneities in the field sweep rate dB/dt along the length of a Rutherford cable provoke a nonhomogeneous current distribution during a field sweep. This process can be described by means of super coupling currents (SCCs) flowing through the strands over lengths far larger than the cable pitch. These SCCs can be characterised by ...


Stretchable liquid tactile sensor for robot-joints

Noda, K.; Iwase, E.; Matsumoto, K.; Shimoyama, I. Robotics and Automation (ICRA), 2010 IEEE International Conference on, 2010

In this paper, we propose a stretchable tactile sensor composed of a pair of silicone rubber channels filled with electro conductive liquid. When a force was applied to this channel, its length and cross-sectional area deforms. By measuring the resistance change of the electro conductive liquid in the channel, its deformation can be measured. The proposed tactile sensor is composed ...


Beyond van der Pauw: Sheet resistance determination from arbitrarily shaped planar four-terminal devices with extended contacts

Cornils, M.; Paul, O. Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on, 2008

An extension of van der Pauw's method to determine the sheet resistance Rsq from arbitrarily shaped devices with four peripheral contacts of any size is presented. Extracting Rsq requires the measurement of six electrical resistances on these devices and the simultaneous solution of a system of six algebraic equations. The results are obtained using the method of conformal mapping in ...


A novel MEMS silicon probe card

Bong-Hwan Kim; Sangjun Park; Byeungleul Lee; Jong-Ho Lee; Bong-Gi Min; Soon-Don Choi; Dong-il Cho; Kukjin Chun Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on, 2002

We have developed a novel cantilever-type probe which is capable of less than 70 of pitch and 12g of force. This probe is suitable for wafer-level burn-in testing, function testing and circuit-board O/S testing including memory and RF devices. The probe was fabricated with epitaxial polysilicon on silicon substrate. The through via hole interconnection was formed in silicon wafer by ...


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Educational Resources on Contact resistance

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An Experimental Study of Arc Duration and Transition from Metallic to Gaseous Phase in Ag Alloy Break Arc

Yoshida, K.; Tanimoto, S. Electrical contacts - 2007, the 53rd ieee holm conference on, 2007

We have studied maintaining mechanism of the contacts arc discharge. In our experiment, the arc duration ta, metallic phase arc duration tm, and transition ratio from metallic to gaseous phase arc G were experimentally studied in Ag, AgCu and AgSnO2 breaking contacts. Experiments were carried out under the variation of source voltage E (12, 24, 36, 48 V), closed contact ...


Super coupling currents in Rutherford type of cables due to longitudinal nonhomogeneities of dB/dt

Verweij, A.P.; ten Kate, H.H.J. Applied Superconductivity, IEEE Transactions on, 1995

In this paper it is shown that nonhomogeneities in the field sweep rate dB/dt along the length of a Rutherford cable provoke a nonhomogeneous current distribution during a field sweep. This process can be described by means of super coupling currents (SCCs) flowing through the strands over lengths far larger than the cable pitch. These SCCs can be characterised by ...


Stretchable liquid tactile sensor for robot-joints

Noda, K.; Iwase, E.; Matsumoto, K.; Shimoyama, I. Robotics and Automation (ICRA), 2010 IEEE International Conference on, 2010

In this paper, we propose a stretchable tactile sensor composed of a pair of silicone rubber channels filled with electro conductive liquid. When a force was applied to this channel, its length and cross-sectional area deforms. By measuring the resistance change of the electro conductive liquid in the channel, its deformation can be measured. The proposed tactile sensor is composed ...


Beyond van der Pauw: Sheet resistance determination from arbitrarily shaped planar four-terminal devices with extended contacts

Cornils, M.; Paul, O. Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on, 2008

An extension of van der Pauw's method to determine the sheet resistance Rsq from arbitrarily shaped devices with four peripheral contacts of any size is presented. Extracting Rsq requires the measurement of six electrical resistances on these devices and the simultaneous solution of a system of six algebraic equations. The results are obtained using the method of conformal mapping in ...


A novel MEMS silicon probe card

Bong-Hwan Kim; Sangjun Park; Byeungleul Lee; Jong-Ho Lee; Bong-Gi Min; Soon-Don Choi; Dong-il Cho; Kukjin Chun Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on, 2002

We have developed a novel cantilever-type probe which is capable of less than 70 of pitch and 12g of force. This probe is suitable for wafer-level burn-in testing, function testing and circuit-board O/S testing including memory and RF devices. The probe was fabricated with epitaxial polysilicon on silicon substrate. The through via hole interconnection was formed in silicon wafer by ...


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