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2015 IEEE International Conference on Plasma Sciences (ICOPS)
Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.
Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the authors field of expertise.
Latest progress in physical, chemical and biological microsensors; Latest development in optical, RF, fluidic, biomedical and power MEMS; Most advanced technologies in micro/nano fabrication, packaging and design.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...
Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
Ikeda, Hiroaki; Ishida, Kimitaka; Shirako, Kiyoshi Instrumentation and Measurement, IEEE Transactions on, 1987
The very low contact resistance of a mechanical switch is measured under a very low current level. The results are used to reveal the current dependency of the metal-to-metal contacts. The variation of the resistance indicates the characteristics of mechanical switches used especially in circuits having very low level signals. An automated measurement system is designed and used for testing ...
Koike, H.; Unno, Y.; Ishimaru, K.; Matsuoka, F.; Kakumu, M. Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International, 1994
An enlarged grain dual polycide gate and a dual buried contact technology using regrown amorphous-Si have been developed for high density full-CMOS SRAM cell. Lateral dopant diffusion has been suppressed to be less than 0.2 /spl mu/m, as a result, 0.4 /spl mu/m nMOS/pMOS spacing was realized using an 850/spl deg/C process. This technology can also achieve dual buried contact ...
Aziz, A.A.; Missous, M. High Performance Electron Devices for Microwave and Optoelectronic Applications Workshop, 1996. EDMO, 1996
We report in here about the first pseudomorphic InGaP/InGaAs/GaAs HEMT demonstrator using an all solid source MBE technique. The quality of thick InGaP is found comparable to state of the art InGaP material grown by other methods. When inserted as part of a pHEMT structure, we found a very large etch selectivity of GaAs over InGaP using H3 PO4:H2O2:H2O solution. ...
John, J.E.A.; Hilliard, J.J. Space Electronics and Telemetry, IEEE Transactions on, 1963
An investigation was made of the cooling of power transistors in a space environment, where the only available mode of heat transfer is that of conduction to a heat sink and radiation from the heat sink to space. An attempt was made to minimize the thermal resistance between transistor case and heat sink, allowing the transistor to dissipate as much ...
Duraj, A.; Mach, P. Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on, 2008
Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. Quality of these interconnections is usually evaluated with measurement of electrical resistance. This paper describes few simple models for prediction of electrical contact resistance in ACAs interconnects. Nevertheless in these models is usually ...
IEEE Sections Congress 2014: Luc Van den Hove, Wearable Medical Technology
Mapping Human to Robot Motion with Functional Anthropomorphism for Teleoperation and Telemanipulation with Robot Arm Hand Systems
Virtual Reality Support for Teleoperation Using Online Grasp Planning
The Josephson Effect: The Original SQUIDs
APEC 2011- Methode Electronics at APEC 2011
ICRA Plenary: Raffaello D'Andrea
Care Innovations: WEEE and RoHs(e-waste recycling and disposal)
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