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2015 IEEE International Conference on Plasma Sciences (ICOPS)
Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.
Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the authors field of expertise.
Latest progress in physical, chemical and biological microsensors; Latest development in optical, RF, fluidic, biomedical and power MEMS; Most advanced technologies in micro/nano fabrication, packaging and design.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...
Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
Granados, X.; Puig, T.; Teva, J.; Mendoza, E.; Obradors, X. Applied Superconductivity, IEEE Transactions on, 2001
In the hybrid HTS current limiter, current limitation is due to the transition to the normal resistive state of YBCO bars, which are shorting the secondary of a transformer. The HTS bars act as current driven switches allowing two states, a low impedance state in which the bar is in its superconducting state and a higher impedance state arisen after ...
Zagozdzon-Wosik, W.; Ranjit, M.; Ravindranath, D.B.; Z.Zhang; Charlson, J.; Rusakova, I.; van der Heide, P.; Larson, L.; Bennett, J.; Tichy, R.; Beebe, M. Advanced Thermal Processing of Semiconductors, 2002. RTP 2002. 10th IEEE International Conference of, 2002
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Carron, V.; Nemouchi, F.; Morand, Y.; Poiroux, T.; Vinet, M.; Bernasconi, S.; Louveau, O.; Lafond, D.; Delaye, V.; Allain, F.; Minoret, S.; Vandroux, L.; Billon, T. SOI Conference, 2009 IEEE International, 2009
We report on the development of a metallic source and drain module for FDSOI pMOSFETs including lateral PtSi formation, Ti/TiN barrier, optimized doping conditions, controlled PtSi penetration below spacers and suitable cleaning of the PtSi surface prior to barrier deposition. Mean specific contact resistivity values lower than 2 Omega mum2 have been achieved, which leads to highly performant pMOSFET devices ...
Jian Li; Mingzhe Rong; Yi Wu; Zhiqiang Sun Applied Superconductivity, IEEE Transactions on, 2007
In this paper, an axial symmetric model is constructed to investigate the electrical contact characteristics of YBCO bulk with silver deposited on the contact surface. In order to calculate the thermal-electromagnetic coupling characteristics near the contact spot, a series expression is derived to describe the quenching behavior of YBCO bulk based on the power law and Kim model and a ...
Vahrmann, Reinhold; Barke, E. Solid State Device Research Conference, 1989. ESSDERC '89. 19th European, 1989
To model NPN-transistor behaviour at high currents or high frequencies, an exact description of base resistance is needed. In this paper a new method for base resistance calculation is presented, that takes into account three- dimensional physical effects at high currents. A distributed equivalent circuit is generated for each NPN-transistor layout using the finite element method. Calculating the power dissipation ...
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