Contact resistance

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The term contact resistance refers to the contribution to the total resistance of a material which comes from the electrical leads and connections as opposed to the intrinsic resistance, which is an inherent property, independent of the measurement method. (Wikipedia.org)






Conferences related to Contact resistance

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.

  • 2008 IEEE 35th International Conference on Plasma Sciences (ICOPS)

    The 35th IEEE International Conference on Plasma Science will feature an exciting technical program with reports from around the globe about new and innovative developments in the field of plasma science and engineering: 1. Basic processes in fully and partially ionized plasmas 2. Microwave generation and plasma interactions 3. Charged particle beams and sources 4. High energy density plasmas applications 5. Industrial, commercial and medical plasma applications 6. Plasma diagnostics 7. Pulsed power


2012 IEEE 58th Holm Conference on Electrical Contacts (Holm 2012)

Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the authors field of expertise.


TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

Latest progress in physical, chemical and biological microsensors; Latest development in optical, RF, fluidic, biomedical and power MEMS; Most advanced technologies in micro/nano fabrication, packaging and design.



Periodicals related to Contact resistance

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.




Xplore Articles related to Contact resistance

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Long-term high resolution wear studies of high current density electrical brushes

Jensen, M.V.R.S. Electrical Contacts, 2005. Proceedings of the Fifty-First IEEE Holm Conference on, 2005

With renewed interest in sliding electrical contacts for application in doubly-fed asynchronous induction wind turbine generators, focus on optimizing the wear life of high current density electrical brushes has re-emerged. This is due to the service and maintenance costs associated with some wind turbine sites, especially offshore. An automated test apparatus has been built and tests conducted to study the ...


Effects of nanofiber materials of nanofiber anisotropic conductive adhesives (nanofiber ACAs) for ultra-fine pitch electronic assemblies

Kyoung-Lim Suk; Kyung-Wook Paik Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 2013

We investigate the effects of material properties of nanofiber on fine pitch ACA interconnection stability in terms of thermal and mechanical properties. Three kinds of nanofiber materials, polyvinylidene fluoride (PVDF), ethylene vinyl alcohol (EVOH), and Nylon 6, which have different tensile properties and melting temperatures, are coupled with conductive particles to form PVDF-CPIN, EVOH-CPIN, and Nylon 6-CPIN, respectively, and the ...


Degradation process of a sliding system with Au-plated slip-ring and AgPd brush for power supply

Sawa, K.; Kakino, S.; Shigemori, T.; Kawakami, Y.; Endo, K.; Gun Ou; Hagino, H. Electrical Contacts, 2005. Proceedings of the Fifty-First IEEE Holm Conference on, 2005

Sliding contact is still an important mechanism to transmit current or electric power from a stationary equipment to a moving device. A power supply slip-ring used in a chip mounter is presently 20 millions rotations in life, but expected to have longer life time. In this paper a slip-ring with Au plated on Ni base-plated layer is investigated in reliability ...


A low gate bias model extraction technique for AlGaN/GaN HEMTs

Chen, Guang; Kumar, V.; Schwindt, R.S.; Adesida, Ilesanmi Microwave Theory and Techniques, IEEE Transactions on, 2006

The small-signal equivalent circuit of AlGaN/GaN high electron-mobility transistors is discussed. A new modeling procedure is introduced in this paper that does not bias the device at a untenable high gate voltage in order to extract the parasitic inductance and resistance. Simulated results show good agreement with measurements up to 40 GHz.


Investigation of contact materials in 42 VDC automotive relay

Takahashi, K.; Sakaguchi, O.; Yamamoto, T.; Inaoka, H. Electrical Contacts, 2004. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, 2004

Automobile makers have revealed plans to increase the voltage of car batteries from 12 V to 42 V in order to use high-power electrical components and improve fuel consumption. It is said that the total power supply to various electrical components of a car can reach to 7-8 kW around 2010. Since, the total power conventional DC 14 V battery ...


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