Contact resistance

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The term contact resistance refers to the contribution to the total resistance of a material which comes from the electrical leads and connections as opposed to the intrinsic resistance, which is an inherent property, independent of the measurement method. (Wikipedia.org)


Conferences related to Contact resistance

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2013 IEEE 40th International Conference on Plasma Sciences (ICOPS)

    Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.

  • 2008 IEEE 35th International Conference on Plasma Sciences (ICOPS)

    The 35th IEEE International Conference on Plasma Science will feature an exciting technical program with reports from around the globe about new and innovative developments in the field of plasma science and engineering: 1. Basic processes in fully and partially ionized plasmas 2. Microwave generation and plasma interactions 3. Charged particle beams and sources 4. High energy density plasmas applications 5. Industrial, commercial and medical plasma applications 6. Plasma diagnostics 7. Pulsed power


2013 IEEE 59th Holm Conference on Electrical Contacts (Holm 2013)

Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2013 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects

  • 2012 IEEE 58th Holm Conference on Electrical Contacts (Holm 2012)

    Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects

  • 2011 IEEE 57th Holm Conference on Electrical Contacts (Holm 2011)

    Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects

  • 2010 IEEE Holm Conference on Electrical Contacts (Holm 2010)

    Practicing designers, engineers, physicists and research scientists-those new to the field and those experienced. The 2010 Holm Conference will include excellent papers authored by many of the outstanding technical people in field...

  • 2009 IEEE Holm Conference on Electrical Contacts (Holm 2009)

  • 2008 IEEE Holm Conference on Electrical Contacts (Holm 2008)

    Practicing designers, engineers, physicists and research scientists-those new to the field and those experienced. The 2008 Holm Conference will include excellent papers authored by many of the outstanding technical people in this field...


2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)

TRANSDUCERS conference is the largest multidisciplinary conference on Microsensors, Microactuators and Microsystems, with about more than 1000 attendees from university, research institute, government and industry who gather every two years to exchange the latest advances in the field. The coming Transducers'13 conference is the 17th international conference on solid-state sensors, actuators and Microsystems of the TRANSDUCERS conference series started at 1981 in Boston (USA), and it is the first time for t



Xplore Articles related to Contact resistance

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Complementary Dual-Contact Switch Using Soft and Hard Contact Materials for Achieving Low Contact Resistance and High Reliability Simultaneously

Yong-Ha Song; Min-Wu Kim; Jeong Oen Lee; Seung-Deok Ko; Jun-Bo Yoon Microelectromechanical Systems, Journal of , 2013

This paper reports a dual-contact microelectromechanical switch, which consists of two contacts in a single switch: one with a soft contact material and the other with a hard contact material to achieve low contact resistance and high reliability at the same time under hot switching conditions. In a single switching operation, the proposed dual-contact switch makes contact twice in sequence, ...


Theory and experimental measurements of contact resistance

Tang, W.; Gomez, M.R.; Lau, Y.Y.; Gilgenbach, R.M.; Zier, J. Plasma Science - Abstracts, 2009. ICOPS 2009. IEEE International Conference on , 2009

Summary form only given. Electrical contact is an important issue for high power microwave sources, wire-array Z pinches, field emitters, and metal- insulator-vacuum junctions. Because of the surface roughness on a microscopic scale, true contact between two pieces of metal occurs only on the asperities of the two contacting surfaces. Current flows only through these asperities, which occupy a small ...


A New Automated Test Equipment for Measuring Electrical Contact Resistance of Real Size Rivets

Wanbin Ren; Yu Chen; Sheng Cao; Li Cui; Huimin Liang Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th , 2013

It is well known that electrical contact resistance influencing factors include not only the contact material physical characteristics, contact type (sphere-flat, flat-flat), the contact surface status (clean, contaminated), but also contact current and mechanical load during measuring. Electrical contact material industry has considerable trouble with batch consistency check of rivet contacts. An automated test equipment and a test method have ...


Analysis of Contact Resistance Behavior for Electric Contacts with Plating Layer

Sawada, S.; Shimizu, K.; Hattori, Y.; Tamai, T.; Iida, K. Electrical Contacts (HOLM), 2010 Proceedings of the 56th IEEE Holm Conference on , 2010

It is very important to predict the force-contact resistance relation for the virtual connector designing. In this study, the prediction of electrical contact resistance in various cases was examined. The specimens consisted of a copper alloy with tin or silver plating. To predict the contact resistance at each contact force, the relationship between contact resistance and contact force were separated ...


Micro-Contact Performance Characterization of Carbon Nanotube (CNT)-Au Composite Micro-Contacts

Stilson, C.; Toler, B.; Coutu, R. Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th , 2013

This paper presents the micro-contact performance comparison between contact pairs of Au/Au and composite contact pairs Au/Au-CNT. The Au/Au-CNT micro- contact's planar lower contact interface is an Au-CNT composite film with encapsulated CNTs. Micro-contact performance is affected by factors such as applied micro-contact force, temperature, current density, etc. At the micro- contact interface, asperities provide localized points for current flow. ...


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Periodicals related to Contact resistance

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.