Conferences related to Degradation

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2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 56th ACM/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM//IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


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Periodicals related to Degradation

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


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Most published Xplore authors for Degradation

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Xplore Articles related to Degradation

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Study on the Growth and Degradation Characteristics of Atrazine Degradation Strain Named J2

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37538263000', u'full_name': u'Zhao Jiang', u'id': 37538263000}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37578290900', u'full_name': u'Jing Li', u'id': 37578290900}, {u'author_order': 3, u'authorUrl': u'https://ieeexplore.ieee.org/author/37578463500', u'full_name': u'Xinran Peng', u'id': 37578463500}, {u'author_order': 4, u'authorUrl': u'https://ieeexplore.ieee.org/author/37533402900', u'full_name': u'Yao Ma', u'id': 37533402900}, {u'author_order': 5, u'authorUrl': u'https://ieeexplore.ieee.org/author/37538663700', u'full_name': u'Rongjuan Wang', u'id': 37538663700}, {u'author_order': 6, u'authorUrl': u'https://ieeexplore.ieee.org/author/37538286700', u'full_name': u'Ying Zhang', u'id': 37538286700}] 2009 International Conference on Environmental Science and Information Application Technology, 2009

This paper mainly studies the growth and degradation characteristics of the atrazine degradation strain J<sub>2</sub> isolated from the soil collected from the cornfield in northern China with a long history of atrazine application. The growth and the degradation characteristics at different pHs, temperatures and in mediums with different salinity are also studied. The results indicate that: when J<sub>2</sub> is inoculated ...


Real-Time Thermoelectrical Model of PV Panels for Degradation Assessment

[{u'author_order': 1, u'affiliation': u'Department of Electrical and Electronics Engineering, Holy Spirit University of Kaslik, Jounieh, Lebanon', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085427858', u'full_name': u'Bechara Fadi Nehme', u'id': 37085427858}, {u'author_order': 2, u'affiliation': u'Department of Electrical and Electronics Engineering, Holy Spirit University of Kaslik, Jounieh, Lebanon', u'authorUrl': u'https://ieeexplore.ieee.org/author/38548771900', u'full_name': u'Tilda Karkour Akiki', u'id': 38548771900}, {u'author_order': 3, u'affiliation': u'LSIS UMR 7296, Aix Marseille Universit\xe9, Marseille, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/37544008600', u'full_name': u'Aziz Naamane', u'id': 37544008600}, {u'author_order': 4, u'affiliation': u'LSIS UMR 7296, Aix Marseille Universit\xe9, Marseille, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/37374120700', u'full_name': u"Nacer K. M'Sirdi", u'id': 37374120700}] IEEE Journal of Photovoltaics, 2017

In this paper, we develop a new real-time thermoelectrical model of a photovoltaic (PV) panel that takes degradations into consideration. The degradation modes under study are the potential-induced degradation, the light-induced degradation, the ultraviolet light degradation, the moisture- induced degradation, and the cell cracks. The effect of each degradation mode on the equivalent circuit of PV cells is described by ...


The growth curve and the best degradation training time of oil degradation bacterium in the soil

[{u'author_order': 1, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37717084800', u'full_name': u'Xu Hou', u'id': 37717084800}, {u'author_order': 2, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37715489100', u'full_name': u'Xiaofan Ma', u'id': 37715489100}, {u'author_order': 3, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37716380800', u'full_name': u'Jiangtao Wang', u'id': 37716380800}, {u'author_order': 4, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37584441900', u'full_name': u'Ping Guo', u'id': 37584441900}, {u'author_order': 5, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37711004100', u'full_name': u'Yuzhen Ma', u'id': 37711004100}, {u'author_order': 6, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37711624500', u'full_name': u'Junjia Cui', u'id': 37711624500}, {u'author_order': 7, u'affiliation': u'College of Environment and Resources, Key Laboratory of Groundwater Resources and Environment of Ministry of Education, Jilin University, Changchun, 130021, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37710991600', u'full_name': u'Chen Zhang', u'id': 37710991600}] 2011 International Conference on Remote Sensing, Environment and Transportation Engineering, 2011

In petroleum and petrochemical industry, spillage and overflow of petroleum products produce crude oil on the ground, which is soil environment problem. Some ingredients in the oil, especially PAHs, can be accumulated in agricultural products to enter the food chain, and, may produce “three cause” effects (teratogenic, cancer, mutation), which is harmful to both human health and ecological environmental security. ...


Bayesian Degradation Analysis With Inverse Gaussian Process Models Under Time-Varying Degradation Rates

[{u'author_order': 1, u'affiliation': u'Center for System Reliability and Safety, University of Electronic Science and Technology of China, Chengdu, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37956029600', u'full_name': u'Weiwen Peng', u'id': 37956029600}, {u'author_order': 2, u'affiliation': u'Center for System Reliability and Safety, University of Electronic Science and Technology of China, Chengdu, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37964147400', u'full_name': u'Yan-Feng Li', u'id': 37964147400}, {u'author_order': 3, u'affiliation': u'Center for System Reliability and Safety, University of Electronic Science and Technology of China, Chengdu, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/38466501100', u'full_name': u'Yuan-Jian Yang', u'id': 38466501100}, {u'author_order': 4, u'affiliation': u'Center for System Reliability and Safety, University of Electronic Science and Technology of China, Chengdu, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37955676700', u'full_name': u'Jinhua Mi', u'id': 37955676700}, {u'author_order': 5, u'affiliation': u'Center for System Reliability and Safety, University of Electronic Science and Technology of China, Chengdu, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085772957', u'full_name': u'Hong-Zhong Huang', u'id': 37085772957}] IEEE Transactions on Reliability, 2017

Degradation observations of modern engineering systems, such as manufacturing systems, turbine engines, and high-speed trains, often demonstrate various patterns of time-varying degradation rates. General degradation process models are mainly introduced for constant degradation rates, which cannot be used for time-varying situations. Moreover, the issue of sparse degradation observations and the problem of evolving degradation observations both are practical challenges for ...


Degradation of PCB52 in Aqueous Solution by ultrasound/Fenton process

[{u'author_order': 1, u'affiliation': u'Department of Environment Science and Engineering, Beijing University of Chemical Technology, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37961414800', u'full_name': u'Huan wen Xu', u'id': 37961414800}, {u'author_order': 2, u'affiliation': u'Department of Environment Science and Engineering, Beijing University of Chemical Technology, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37961126900', u'full_name': u'Liu Feng', u'id': 37961126900}] 2011 Second International Conference on Mechanic Automation and Control Engineering, 2011

The degradation of PCB52 in aqueous solution by ultrasound/Fenton process was investigated. And the effects of ultrasonic power, ultrasonic frequency, initial pH values of the solution and dosage of hydrogen peroxide and ferrous ions on the degradation efficiency were studied. The results indicated that the degradation efficiency increased with the decrease of pH value, and the ultrasonic frequency, ultrasonic power, ...


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Educational Resources on Degradation

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eLearning

No eLearning Articles are currently tagged "Degradation"

IEEE-USA E-Books

  • Thermal Degradation and Termination Behavior of Thick Film Resistors

    Thermal stability was measured for Du Pont 1420 (102ohims/square), Du Pont 1440 (104ohms/square), Cermalloy 540 (104ohms/square), and Cermalloy 550 (105ohms/square) thick film resistor materials. Samples were aged at 200, 300 and 400°c. In addition, effects of resistor-conductor termination area, laser trimming, and applied bias voltage on thermal stability were evaluated. For 200 and 300°C exposure, the sheet resistivity increased for all materials. Maximum increase after 5000 hours exposure as +8%. For 400°C exposure, sheet resistivity decreased for all materials. Maximum decrease was -20% for 5000 hours exposure. The termination region had no significant effect on either asfired resistance or thermal degradation behavior. Laser trimming tended to stabilize resistors slightly and applied bias voltage had no significant effect.

  • DATA‐DRIVEN PROGNOSTICS FOR BATTERIES SUBJECT TO HARD FAILURE

    This chapter considers data‐driven remaining useful life (RUL) of a battery prediction, which is typically made on the basis of projecting the trajectory of the system's health indicator, often called the degradation signal. Two most commonly used health indicators of batteries are capacity and internal resistance, while other health‐dependent variables such as battery self‐discharge rate may also be considered. By analyzing the evolution paths of the health indicating variables/degradation signals, it is possible to infer not only the current but also the future health status of the unit being studied. The chapter introduces a method specifically developed for battery RUL prediction under hard failure. In this method, a joint modeling scheme is used to take into consideration both the degradation data and the time‐to‐failure data. To better assess the performance of the prognostic algorithm, alternative interval prediction, the maximum power interval (MPI), is introduced as opposed to confidence intervals and mean/median‐based intervals.

  • Numerical Correlation Between Meteorological Parameters and Aerodynamic Performance Degradation of Iced Airfoils (2013-01-2137)

    A numerical analysis is conducted to investigate the performance degradation of iced airfoils in terms of meteorological parameters. Reference ice accretion shapes are taken from NASA's icing wind tunnel test results. Ice accretion shape and aerodynamic performance of the airfoil are numerically calculated under the same conditions as those used in the tests, and response surface equations are generated based on the results. The response surface models are applied to the conditions specified in Federal Aviation Regulations, appendix C of part 25, and the changes in aerodynamic coefficients are investigated. The areas of most significant lift and drag performance degradation overlap. The lift coefficient plunges more than 50% under temperatures greater than −10°C and LWC greater than 2g/m3. Under the same conditions, the drag performance greatly decreases as well. On the other hand, the moment coefficient greatly decreases under temperatures of less than −40°C and greater MVD. Changes in free stream speed yield little effect on moment performance compared to lift and drag. Within the bounds specified in the present study, the effects of exposure time are insignificant.

  • MetalGaAs Interaction and Contact Degradation in Microwave MESFETs

    This work reports and critically reviews failure mechanisms induced by metal- GaAs interaction and contact degradation in low and medium power GaAs MESFETs in the framework of a comprehensive reliability evaluation test plan, performed mainly on commercially purchased devices manufactured by different technologies. The results show that, at least as regards contact degradation phenomena, these technologies have reached sufficient maturity, and significant reliability levels have been achieved even for the most severe applications and environments. Devices coming from some suppliers still suffer from reliability problems, such as?>sinking?> of Au-based gate metallization into the active channel, Al electromigration, Al/GaAs interdiffusion enhanced by high contact current density, source and drain ohmic contact resistance increase, ohmic contacts electromigration, surface metal migration and short circuiting of closely spaced electrodes on GaAs with a non-suitable surface preparation and/or passivation. All these failure mechanisms have been identified by means of suitable microanalytical techniques, correlated with device electrical degradation and thoroughly discussed in this paper by comparison with results previously reported in the technical literature.

  • Chapter 4—Controlling Lubricant Degradation through Performance Specification

    None

  • LITHIUM‐ION BATTERY REMAINING USEFUL LIFE ESTIMATION BASED ON ENSEMBLE LEARNING WITH LS‐SVM ALGORITHM

    This chapter proposes the integrated use of parameter‐selection‐based ensemble learning (PSBEL) and least square support vector machine (LS‐SVM) algorithm for lithium‐ion battery remaining useful life (RUL) estimation. Technically, given a set of monitoring parameters, some groups of parameters are randomly selected to construct LS‐SVM submodels. On the basis of these submodels, ensemble learning is utilized to achieve a final result, which overcomes the difficulty of accurately determining the model parameters and significantly improves the precision and stability of RUL estimation. The proposed approach provides practitioners with confidence intervals and probability distributions of RUL estimates for uncertainty management. The validity and applicability of the PSBEL with LS‐SVM for RUL estimation are demonstrated using capacity‐changing data of lithium‐ion batteries during discharging cycles. To analyze the impact of different submodels on the precision of final RUL prediction and to improve the uncertainty representation, more advanced ensemble learning techniques should be considered.

  • PROGNOSTIC CLASSIFICATION PROBLEM IN BATTERY HEALTH MANAGEMENT

    Batteries are crucial power sources for many engineering systems. Once the power source fails, the whole system completely stops performing its intended function. To avoid such catastrophic consequences, effective data‐driven prognostic tools that can accurately predict the failure in advance are highly desired. Effective failure prognosis plays an important role in maintenance decision‐making. Traditionally, most existing prognostic methods focus on the remaining useful life (RUL) prediction. Recently proposed prognostic methods have capability of real‐time online model updating. This chapter compares the logistic regression method and joint prognostic model (JPM), which is one of the most advanced data‐driven prognostic methods. It discusses a potential issue of having imbalanced data to provide important insights into the practitioners. The first category of methods typically models the time‐to‐failure data using parametric distributions such as Weibull distribution. The performance evaluation criteria used in the chapter are AUC, accuracy, and sensitivity.

  • Charge Pumping Technique

    This chapter demonstrates that the charge pumping (CP) technique can be used to characterize two interfaces of the SOI layer when the SOI MOSFET has a body contact. Since the body contact and the source and drain junctions form pn junctions with the MOS gate, the charge pumping technique for the SOI MOSFET is related to SOI Lubistor operation. It is easily anticipated that the impact of Lubistor operation on the charge pumping phenomenon is most critical when the SOI layer thickness is less than 10 nm because the energy levels of the SOI layer are definitely quantized. This is one of the challenging research issues with the charge pumping technique. In the following, we examine how to apply the charge pumping technique to the characterization of the two interfaces of an SOI MOSFET with a thick SOI layer.

  • Self‐Healing

    This chapter contains sections titled:IntroductionCell Degradation DetectionCell Degradation Diagnosis and PredictionCell Outage CompensationReferences

  • OLED Fabrication Process

    This chapter describes the fabrication processes of OLED devices. In general, OLEDs are fabricated by either a dry process or a wet process. The commonly used dry process is vacuum evaporation. Three types of vacuum evaporation techniques are reviewed. In wet processes, there are processes for coating without fine patterning and processes for making fine patterns.In addition to deposition techniques of each organic layer, RGB patterning technologies are important. These RGB patterning technologies are vacuum deposition using fine metal masks, wet processes such as ink‐jet, nozzle printing, relief printing, etc., and laser patterning process.



Standards related to Degradation

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IEEE Guide for Assessing, Monitoring, and Mitigating Aging Effects on Class 1E Equipment Used in Nuclear Power Generating Stations

This document provides the guidelines for assessing, monitoring, and mitigating aging degradation effects on class 1E equipment used in nuclear power generating stations.



Jobs related to Degradation

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