Conferences related to Cleaning

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2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 53rd International Universities Power Engineering Conference (UPEC)

UPEC is a long-established international conference which provides a major forum for scientists, young researchers, PhD students and engineers worldwide to present, review and discuss the latest developments in Electrical Power Engineering and relevant technologies including energy storage and renewables

  • 2016 51st International Universities Power Engineering Conference (UPEC)

    UPEC is a long-established conference, which is very popular with young researchers, PhD students and engineers from the electrical power industry. The aim of the conference is to allow participants to exchange experiences and discuss the most up-to-date topics in Power Engineering. The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grid systems in developing countries require significant research input in the area. UPEC is an ideal forum to address some of these issues, and to network and meet with talented engineers and innovators in these areas.

  • 2015 50th International Universities Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2014 49th International Universities Power Engineering Conference (UPEC)

    Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges. It also provides the opportunity to network and to meet the experts in these areas.

  • 2013 48th Universities' Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2012 47th International Universities Power Engineering Conference (UPEC)

    A major international forum for the presentation, discussion and exchange of information concerning new trends in electrical power engineering. To become better informed about the latest developments in the field of power engineering.

  • 2010 45th International Universities Power Engineering Conference (UPEC)

    The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grids in developing countries require significant research effort and the need for talented engineers and innovators is critical to the electrical energy industry. UPEC is an ideal forum to address such issues, and to network and meet experts in these areas

  • 2009 44th International Universities Power Engineering Conference (UPEC)

    UPEC has been long-established as a major annual international forum for the presentation, discussion and exchange of information concerning new trends in all areas of electric power engineering. Contributions from younger engineers and researchers are particularly encouraged at UPEC, where ideas can be aired freely and new relationships developed.

  • 2008 43rd International Universities Power Engineering Conference (UPEC)

    Its aim will be to provide a professional forum for engineers and research scientists from the universities, consultants, and in the manufacturing and supply industries opportunities to present their work and explore potential trends and recent developments, current practices in Power Engineering and related fields.

  • 2007 Universities Power Engineering Conference (UPEC)

  • 2006 International Universities Power Engineering Conference (UPEC)

  • 2004 International Universities Power Engineering Conference (UPEC)


2018 9th International Particle Accelerator Conference (IPAC)

Topics cover a complete survey of the field of charged particle accelerator science and technology and infrastructure.


2018 European Conference on Optical Communication (ECOC)

ECOC is the leading European conference in the field of optical communication, and one of the most prestigious and long-standing events in this field. Here, the latest progress in optical communication technologies will be reported in selected papers, keynotes, presentations and special symposia.Parallel to the scientific conference, the ECOC exhibition covers a wide range of optical communication products and services.Therefore, ECOC is open to a variety of interested participants like researchers and students, product developers, sales managers and telecommunication market developers. Every year this international forum attracts more than 1,000 scientists and researchers from research institutions and companies from across the world.


2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

This is a set of five conferences with a focus on wireless components, applications and systems that affect both now and our future lifestyle. The main niche of these conferences is to bring together technologists, circuit designers, system designers and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems. This is also an area where today's design compromises can trigger tomorrow's advanced technologies, where dreams can become a reality.


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Periodicals related to Cleaning

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems Magazine, IEEE


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Most published Xplore authors for Cleaning

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Xplore Articles related to Cleaning

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Damage-free CMP towards 32nm-node porous low-k (k = 1.6)/Cu integration

[{u'author_order': 1, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'S. Kondo'}, {u'author_order': 2, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'B. U. Yoon'}, {u'author_order': 3, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'S. G. Lee'}, {u'author_order': 4, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'S. Tokitoh'}, {u'author_order': 5, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'K. Misawa'}, {u'author_order': 6, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'T. Yoshie'}, {u'author_order': 7, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'N. Ohashi'}, {u'author_order': 8, u'affiliation': u'Semicond. Leading Edge Technol. Inc., Ibaraki, Japan', u'full_name': u'N. Kobayashi'}] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., None

To reduce the effective dielectric constant (keff) to less than 2.6 for the 45-nm node, direct CMP of a high-modulus porous MSQ (p-MSQ) film (k=2.3, E=10GPa) without a protective cap layer has been successfully applied to 300mm-wafer Cu damascene fabrication by using damage-free CMP process. This process can be extended to the 32nm-node ultra low-k (ULK, k=1.6) CMP with a ...


Laser ablation threshold of cultural heritage metals

[{u'author_order': 1, u'affiliation': u'University of Lecce, Department of Physics, Laboratorio di Elettronica Applicata e Strumentazione, LEAS I.N.F.N. sect. of Lecce, SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I.', u'full_name': u'F. Belloni'}, {u'author_order': 2, u'affiliation': u'University of Lecce, Department of Physics, Laboratorio di Elettronica Applicata e Strumentazione, LEAS I.N.F.N. sect. of Lecce, SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I.', u'full_name': u'A. Lorusso'}, {u'author_order': 3, u'affiliation': u'University of Lecce, Department of Physics, Laboratorio di Elettronica Applicata e Strumentazione, LEAS I.N.F.N. sect. of Lecce, SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I. Tel./Fax.: 0039 0832 297482 - e-mail: vincenzo.nassisi@le.infn.it', u'full_name': u'V. Nassisi'}, {u'author_order': 4, u'affiliation': u'Department of Mat. Science, University of Lecce;I.N.F.N. SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I', u'full_name': u'A. Buccolieri'}, {u'author_order': 5, u'affiliation': u'Department of Mat. Science, University of Lecce;I.N.F.N. SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I', u'full_name': u'G. Buccolieri'}, {u'author_order': 6, u'affiliation': u'Department of Mat. Science, University of Lecce;I.N.F.N. SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I', u'full_name': u'A. Castellano'}, {u'author_order': 7, u'affiliation': u'Department of Mat. Science, University of Lecce;I.N.F.N. SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I', u'full_name': u'L. S. Leo'}, {u'author_order': 8, u'affiliation': u'Department of Mat. Science, University of Lecce;I.N.F.N. SS Lecce - Monteroni, C.P. 193, 73100 Lecce-I', u'full_name': u'M. Di Giulio'}, {u'author_order': 9, u'affiliation': u'Department of Physics, University of Messina; I.N.F.N. Ctr Papardo 31, 98166 S. Agata, Messina-I', u'full_name': u'L. Torrisi'}, {u'author_order': 10, u'affiliation': u'Department of Physics, University of Messina; I.N.F.N. Ctr Papardo 31, 98166 S. Agata, Messina-I', u'full_name': u'F. Caridi'}, {u'author_order': 11, u'affiliation': u'Department of Physics, University of Messina; I.N.F.N. Ctr Papardo 31, 98166 S. Agata, Messina-I', u'full_name': u'A. Borrielli'}] 2007 European Conference on Lasers and Electro-Optics and the International Quantum Electronics Conference, None

In this work we determined experimentally the threshold fluence of the most common metals found in cultural heritage, e.g. copper, silver and their alloys. We carried out the ablation process in air at atmospheric pressure with 8 ns pulsed Nd:YAG and 23 ns pulsed KrF lasers, at 532 and 248 nm, respectively. We irradiated every target by a fixed number ...


Learning from time-synchronized power system measurements with rare anomalous event records to detect PMU data manipulation attacks

[{u'author_order': 1, u'affiliation': u'State Key Laboratory of Advanced Electromagnetic Engineering and Technology School of Electric and Electronic Engineer, Huazhong University of Science and Technology Wuhan 430074, China', u'full_name': u'Jingyu Wang'}, {u'author_order': 2, u'affiliation': u'State Key Laboratory of Advanced Electromagnetic Engineering and Technology School of Electric and Electronic Engineer, Huazhong University of Science and Technology Wuhan 430074, China', u'full_name': u'Dongyuan Shi'}] 2017 IEEE Conference on Energy Internet and Energy System Integration (EI2), None

PMU data manipulation attacks (DMA) which maliciously modify the synchrophasor measurements in power systems, is an emerging type of cyber-attack aiming to mislead the control center into taking erroneous control actions. Widespread application of PMU produces a vast amount of time-synchronized historical operating data, making it possible to turn to machine learning approaches to detect the attacks. However, anomalous events ...


Cu Single Damascene Integration of an Organic Nonporous Ultralow- <formula formulatype="inline"><tex Notation="TeX">$k$</tex></formula> Fluorocarbon Dielectric Deposited by Microwave-Excited Plasma-Enhanced CVD

[{u'author_order': 1, u'affiliation': u'Graduate School of Engineering, Tohoku University, Sendai, Japan', u'full_name': u'Xun Gu'}, {u'author_order': 2, u'affiliation': u'Tokyo Electron Limited Development Institute Inc., Sendai, Japan', u'full_name': u'Takenao Nemoto'}, {u'author_order': 3, u'affiliation': u'New Industry Creation Hatchery Center, Tohoku University, Sendai, Japan', u'full_name': u'Yugo Tomita'}, {u'author_order': 4, u'affiliation': u'New Industry Creation Hatchery Center, Tohoku University, Sendai, Japan', u'full_name': u'Akinobu Teramoto'}, {u'author_order': 5, u'affiliation': u'Graduate School of Engineering, Tohoku University, Sendai, Japan', u'full_name': u'Rihito Kuroda'}, {u'author_order': 6, u'affiliation': u'Graduate School of Engineering, Tohoku University, Sendai, Japan', u'full_name': u'Shin-Ichiro Kuroki'}, {u'author_order': 7, u'affiliation': u'Advanced Technology R&D Center, Mitsubishi Electric Corporation, Amagasaki, Japan', u'full_name': u'Kazumasa Kawase'}, {u'author_order': 8, u'affiliation': u'Graduate School of Engineering, Tohoku University, Sendai, Japan', u'full_name': u'Shigetoshi Sugawa'}, {u'author_order': 9, u'affiliation': u'New Industry Creation Hatchery Center, Tohoku University, Sendai, Japan', u'full_name': u'Tadahiro Ohmi'}] IEEE Transactions on Electron Devices, 2012

An integration of an organic nonporous ultralow-_k_ dielectric fluorocarbon (_k_ = 2.2) deposited by microwave-excited plasma-enhanced CVD into Cu single damascene interconnects is developed in this paper. The changing of the chemical structure of the fluorocarbon was found after dry etching, which resulted in the degradation of electrical properties during the postetching cleaning process. A nitrogen plasma treatment was applied ...


The effect of water droplets on hydrophobic contaminated surface under AC field voltage application

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Tsinghua Univ., Beijing, China', u'full_name': u'Haifeng Gao'}, {u'author_order': 2, u'full_name': u'Zhidong Jia'}, {u'author_order': 3, u'full_name': u'Zhicheng Guan'}, {u'author_order': 4, u'full_name': u'Jie Yang'}] CEIDP '05. 2005 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 2005., None

According to the study on hydrophobicity migration of the SIR, it is found that the SIR can transfer its hydrophobicity to various contaminations deposited on its surface, but the hydrophobic states of different contamination layer is different evaluated by contact angle of the water droplet. Water droplets existing on the surface of silicone rubber (SIR) materials may change the electric ...


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  • Advances in Climbing Robots

    This chapter presents a comprehensive survey of the adhesion mechanisms and locomotion techniques used in climbing robots. It highlights some representative climbing robots with most successful implementation of climbing robot technologies. Some innovative ideas and emerging technologies for climbing robots are also introduced. The chapter classifies the adhesion mechanism into six categories and summarizes their advantages and limitations. The future research and development directions of climbing robots will mainly focus on the improvement of adhesion reliability and locomotion maneuverability, and the transformation of these innovative technologies into real-world applications. For any climbing robot to be used as a commercial product, reliability is the most critical and determining factor for commercial success. No matter what adhesion mechanism is used, it must be able to supply the necessary attraction force for the robot to operate on targeted wall surfaces reliably at all times.

  • The Best of the Blog

    This chapter shares some engineering career development articles that have been most helpful to engineers based on their feedback. The author's ultimate career goal is to help engineers and other professionals in unleashing possibilities to create a career that is exciting, enjoyable, successful, and well balanced. The chapter provides Zen monks principles, explaining how it is applied in an engineering career to reduce some day-to-day stresses. It presents ideas on how to implement flexibility into the career. Time- management or work-life balance is actually a challenge that most engineers face on a daily basis. Developing engineering skills as well as nontechnical skills gives a person the tools to truly maintain a stable engineering career. The chapter also provides some things can be done in an engineering career to ensure that it is genuinely stable. It also shares three steps that can help you become a partner in an engineering firm.

  • Ultrahigh Vacuum Technology

    This chapter contains sections titled: * Ultrahigh Vacuum Vessels * Pumps * Specimen Manipulators * Gauges * Deposition Sources * Deposition Monitors * Summary



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