Conferences related to Cleaning

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2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 53rd International Universities Power Engineering Conference (UPEC)

UPEC is a long-established international conference which provides a major forum for scientists, young researchers, PhD students and engineers worldwide to present, review and discuss the latest developments in Electrical Power Engineering and relevant technologies including energy storage and renewables

  • 2016 51st International Universities Power Engineering Conference (UPEC)

    UPEC is a long-established conference, which is very popular with young researchers, PhD students and engineers from the electrical power industry. The aim of the conference is to allow participants to exchange experiences and discuss the most up-to-date topics in Power Engineering. The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grid systems in developing countries require significant research input in the area. UPEC is an ideal forum to address some of these issues, and to network and meet with talented engineers and innovators in these areas.

  • 2015 50th International Universities Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2014 49th International Universities Power Engineering Conference (UPEC)

    Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges. It also provides the opportunity to network and to meet the experts in these areas.

  • 2013 48th Universities' Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2012 47th International Universities Power Engineering Conference (UPEC)

    A major international forum for the presentation, discussion and exchange of information concerning new trends in electrical power engineering. To become better informed about the latest developments in the field of power engineering.

  • 2010 45th International Universities Power Engineering Conference (UPEC)

    The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grids in developing countries require significant research effort and the need for talented engineers and innovators is critical to the electrical energy industry. UPEC is an ideal forum to address such issues, and to network and meet experts in these areas

  • 2009 44th International Universities Power Engineering Conference (UPEC)

    UPEC has been long-established as a major annual international forum for the presentation, discussion and exchange of information concerning new trends in all areas of electric power engineering. Contributions from younger engineers and researchers are particularly encouraged at UPEC, where ideas can be aired freely and new relationships developed.

  • 2008 43rd International Universities Power Engineering Conference (UPEC)

    Its aim will be to provide a professional forum for engineers and research scientists from the universities, consultants, and in the manufacturing and supply industries opportunities to present their work and explore potential trends and recent developments, current practices in Power Engineering and related fields.

  • 2007 Universities Power Engineering Conference (UPEC)

  • 2006 International Universities Power Engineering Conference (UPEC)

  • 2004 International Universities Power Engineering Conference (UPEC)


2018 9th International Particle Accelerator Conference (IPAC)

Topics cover a complete survey of the field of charged particle accelerator science and technology and infrastructure.


2018 European Conference on Optical Communication (ECOC)

ECOC is the leading European conference in the field of optical communication, and one of the most prestigious and long-standing events in this field. Here, the latest progress in optical communication technologies will be reported in selected papers, keynotes, presentations and special symposia.Parallel to the scientific conference, the ECOC exhibition covers a wide range of optical communication products and services.Therefore, ECOC is open to a variety of interested participants like researchers and students, product developers, sales managers and telecommunication market developers. Every year this international forum attracts more than 1,000 scientists and researchers from research institutions and companies from across the world.


2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

This is a set of five conferences with a focus on wireless components, applications and systems that affect both now and our future lifestyle. The main niche of these conferences is to bring together technologists, circuit designers, system designers and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems. This is also an area where today's design compromises can trigger tomorrow's advanced technologies, where dreams can become a reality.


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Periodicals related to Cleaning

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems Magazine, IEEE


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Xplore Articles related to Cleaning

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Effect of post CMP in-situ cleaning and its optimization on the defect improvement: CFM: Contamination free manufacturing

[{u'author_order': 1, u'affiliation': u'CMP/Plating, Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Rd (ext), Malta, NY USA 12020', u'full_name': u'Hong Jin Kim'}, {u'author_order': 2, u'affiliation': u'CMP/Plating, Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Rd (ext), Malta, NY USA 12020', u'full_name': u'Tae Hoon Lee'}, {u'author_order': 3, u'affiliation': u'CMP/Plating, Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Rd (ext), Malta, NY USA 12020', u'full_name': u'Venugopal Govindarajulu'}, {u'author_order': 4, u'affiliation': u'CMP/Plating, Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Rd (ext), Malta, NY USA 12020', u'full_name': u'Jason Mazzotti'}] 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2016

Post CMP defect is a critical process parameter to yield enhancement and device reliability in sub-14nm semiconductor manufacturing as "killing" particle size has shrunk according to device shrinkage. In order to improve defect at post CMP step, CMP has an in-situ cleaning module, commonly composed of megasonic cleaning, brush scrubber cleanings, fluid jet cleaning and their combination. Among the module, ...


Angular laser cleaning for the enhancement of cleaning efficiency

[{u'author_order': 1, u'affiliation': u'Dept. of Eng., Liverpool Univ., UK', u'full_name': u'J.M. Lee'}, {u'author_order': 2, u'full_name': u'C. Curran'}, {u'author_order': 3, u'full_name': u'K.G. Watkins'}] Conference Digest. 2000 Conference on Lasers and Electro-Optics Europe (Cat. No.00TH8505), 2000

Summary form only given. Laser cleaning has begun to attract a considerable amount of interest recently as a new cleaning technique among scientists and engineers. Due to its unique characteristics as a selective, precise, controllable and environmentally-friendly process, the laser cleaning technique is finding a wide range of successful applications both in industry and in the world of art conservation. ...


Data Cleaning: A Practical Perspective

[{u'author_order': 1, u'affiliation': u'Alation Inc.', u'full_name': u'Venkatesh Ganti'}, {u'author_order': 2, u'affiliation': u'Google Inc.', u'full_name': u'Anish Das Sarma'}] Data Cleaning: A Practical Perspective, None

Data warehouses consolidate various activities of a business and often form the backbone for generating reports that support important business decisions. Errors in data tend to creep in for a variety of reasons. Some of these reasons include errors during input data collection and errors while merging data collected independently across different databases. These errors in data warehouses often result ...


Feasibility of Pb Flakes Reduction Post Reflow Cleaning Process

[{u'author_order': 1, u'affiliation': u'IFMY BE Dev SON PT, Infineon Technologies Malaysia, Melaka, Malaysia', u'full_name': u'Pedro Almazan'}, {u'author_order': 2, u'affiliation': u'IFMY BE Dev SON UPD DA, Infineon Technologies Malaysia, Melaka, Malaysia', u'full_name': u'Chellamuthu Naveendran'}, {u'author_order': 3, u'affiliation': u'IFMY QM QS FAPD3Infineon Technologies Malaysia, Melaka, Malaysia', u'full_name': u'Chai Ying Lee'}] 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT), 2018

Formation of Pb (Lead) flakes after die attach reflow process is a common concern when soldering packages with high temperature and soldering material with high in Lead components. Pb flakes are visually manifested on the chip bonding pad after the post Reflow cleaning process, general term as “flux cleaning process”. Small Pb solder spheres can leave behind stains on bonding ...


Horizontal laminar flow cleaning in wet batch cleaning process

[{u'author_order': 1, u'affiliation': u'Packaging Technology Solutions Dept., PERL, Hitachi, Ltd., Yokohama, Japan', u'full_name': u'Katsuhiro Ota'}, {u'author_order': 2, u'affiliation': u'Manufacturing Engineering, Hitachi GST Japan Ltd., Fujisawa, Japan', u'full_name': u'Hirokazu Yamamoto'}, {u'author_order': 3, u'affiliation': u'Japan Materials Labs and Chemical Integration, Hitachi GST Japan Ltd., Fujisawa, Japan', u'full_name': u'Akiko Hashi'}] 2011 IEEE 3rd International Conference on Communication Software and Networks, 2011

A novel horizontal laminar flow (HLF) cleaning is proposed for removing contamination from highly integrated semiconductor devices with high pattern densities. The proposed HLF cleaner contains fluid flow plates that realize horizontal laminar flow in the cleaning bath. This configuration effectively reduces cross contamination. The effects of laminar flow are investigated by fluid visualization. The dependence of the laminar flow ...


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Educational Resources on Cleaning

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eLearning

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IEEE-USA E-Books

  • 2 WHAT ARE DATA, AND WHAT IS A DATA SET?

    As its name suggests, data science is fundamentally dependent on data. In its most basic form, a datum or a piece of information is an abstraction of a real-world entity (person, object, or event). The terms variable, feature, and attribute are often used interchangeably to denote an individual abstraction. Each entity is typically described by a number of attributes. For example, a book might have the following attributes: author, title, topic, genre, publisher, price, date published, word count, number of chapters, number of pages, edition, ISBN, and so on.

  • 9 State, Change, and Equality

    Although we have considered both the “stepped” nature of digital data and the steps taken by an executing process, we haven't yet looked very closely at how those ideas interact. We have already seen that a data item can change its value: the “scratch pad” or “tape” of the Turing machine has cells that can be read or written (chapter 3). As we start to consider multiple processes, it's useful to understand this changeability and its implications more carefully.

  • Advances in Climbing Robots

    This chapter presents a comprehensive survey of the adhesion mechanisms and locomotion techniques used in climbing robots. It highlights some representative climbing robots with most successful implementation of climbing robot technologies. Some innovative ideas and emerging technologies for climbing robots are also introduced. The chapter classifies the adhesion mechanism into six categories and summarizes their advantages and limitations. The future research and development directions of climbing robots will mainly focus on the improvement of adhesion reliability and locomotion maneuverability, and the transformation of these innovative technologies into real-world applications. For any climbing robot to be used as a commercial product, reliability is the most critical and determining factor for commercial success. No matter what adhesion mechanism is used, it must be able to supply the necessary attraction force for the robot to operate on targeted wall surfaces reliably at all times.

  • The Best of the Blog

    This chapter shares some engineering career development articles that have been most helpful to engineers based on their feedback. The author's ultimate career goal is to help engineers and other professionals in unleashing possibilities to create a career that is exciting, enjoyable, successful, and well balanced. The chapter provides Zen monks principles, explaining how it is applied in an engineering career to reduce some day-to-day stresses. It presents ideas on how to implement flexibility into the career. Time- management or work-life balance is actually a challenge that most engineers face on a daily basis. Developing engineering skills as well as nontechnical skills gives a person the tools to truly maintain a stable engineering career. The chapter also provides some things can be done in an engineering career to ensure that it is genuinely stable. It also shares three steps that can help you become a partner in an engineering firm.

  • Ultrahigh Vacuum Technology

    This chapter contains sections titled: * Ultrahigh Vacuum Vessels * Pumps * Specimen Manipulators * Gauges * Deposition Sources * Deposition Monitors * Summary



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