Conferences related to Cleaning

Back to Top

2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


2020 IEEE International Power Modulator and High Voltage Conference (IPMHVC)

This conference provides an exchange of technical topics in the fields of Solid State Modulators and Switches, Breakdown and Insulation, Compact Pulsed Power Systems, High Voltage Design, High Power Microwaves, Biological Applications, Analytical Methods and Modeling, and Accelerators.


2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)

The scope of the 2020 IEEE/ASME AIM includes the following topics: Actuators, Automotive Systems, Bioengineering, Data Storage Systems, Electronic Packaging, Fault Diagnosis, Human-Machine Interfaces, Industry Applications, Information Technology, Intelligent Systems, Machine Vision, Manufacturing, Micro-Electro-Mechanical Systems, Micro/Nano Technology, Modeling and Design, System Identification and Adaptive Control, Motion Control, Vibration and Noise Control, Neural and Fuzzy Control, Opto-Electronic Systems, Optomechatronics, Prototyping, Real-Time and Hardware-in-the-Loop Simulation, Robotics, Sensors, System Integration, Transportation Systems, Smart Materials and Structures, Energy Harvesting and other frontier fields.


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

This is a set of five conferences with a focus on wireless components, applications and systems that affect both now and our future lifestyle. The main niche of these conferences is to bring together technologists, circuit designers, system designers and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems. This is also an area where today's design compromises can trigger tomorrow's advanced technologies, where dreams can become a reality.


More Conferences

Periodicals related to Cleaning

Back to Top

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems Magazine, IEEE


More Periodicals

Most published Xplore authors for Cleaning

Back to Top

Xplore Articles related to Cleaning

Back to Top

Fiber Optic Connectors - Termination and Testing

Fiber Optic Connectors - Termination and Testing, 12/14/2009

In this tutorial we will review the methods used to bond, hold and align optical fibers for factory and field terminations. Scribing tools and techniques will also be covered. Next, proper polishing of the optical endface will be reviewed as well as the importance of cleaning optical surfaces to minimize damage, lower attenuation, and improve reflection values. This is followed ...


Fiber Optic Test Equipment and Testing Fiber Optic Links - Fiber Optic Test Equipment

Fiber Optic Test Equipment and Testing Fiber Optic Links - Fiber Optic Test Equipment, 12/14/2009

In this tutorial we begin with an introduction to fiber testing including an overview of the available equipment. This is followed by a discussion of selecting test equipment and understanding how elements such as instrument resolution, dynamic range, launch conditions and calibration effect the final measurement. Next we examine the need for connector cleanliness which is critical for successful installation, ...


Technology '88: medical electronics

IEEE Spectrum, 1988

Developments during 1987 are reviewed, namely, the use of movies of the beating heart; increased use of ultrasound; automatic insulin delivery; a laser catheter for cleaning leg arteries of plaque; improved pacemakers; and testing of cochlear devices. An expert opinion is provided by George V. Kondraske, associate professor of electrical and biomedical engineering at the University of Texas at Arlington, ...


Surface modification by cathode spots of a vacuum arc

IEEE Transactions on Plasma Science, 2001

Cathode spots of a vacuum arc have the efficient property to remove oxide on the metal surface selectively. Analyses of the surface treated by vacuum arc revealed that various interesting surface modifications occurred during the removal of oxide. We have investigated these effects to open new applications of the vacuum arc. The cathode spots can remove inclusions, which often cause ...


Undersea corrosion protection for aluminum structures

1970 IEEE International Conference on Engineering in the Ocean Environment - Digest of Technical Papers, 1970

This paper discusses a method of protecting aluminum alloy structure and instrument housings against corrosion. The abrasion-resisting qualities of hardcoat anodize are considered and the advantages of sealing the hardcoat with paint are stated. It is concluded that a hardcoat/paint combination offers a good temporary protection.


More Xplore Articles

Educational Resources on Cleaning

Back to Top

IEEE-USA E-Books

  • Fiber Optic Connectors - Termination and Testing

    In this tutorial we will review the methods used to bond, hold and align optical fibers for factory and field terminations. Scribing tools and techniques will also be covered. Next, proper polishing of the optical endface will be reviewed as well as the importance of cleaning optical surfaces to minimize damage, lower attenuation, and improve reflection values. This is followed by an examination of how to test singlemode and multimode cable assemblies for attenuation and reflections in factory and field environments. Finally, the tutorial will summarize the role of those terminating fiber optic devices. Yield is the actual loaded cost of a termination and includes the component cost, consumables, and the associated labor. After completing this tutorial you should have an understanding of: Bonding and scribing; Polishing; Cleaning; Testing patchcords; and Yield.

  • Fiber Optic Test Equipment and Testing Fiber Optic Links - Fiber Optic Test Equipment

    In this tutorial we begin with an introduction to fiber testing including an overview of the available equipment. This is followed by a discussion of selecting test equipment and understanding how elements such as instrument resolution, dynamic range, launch conditions and calibration effect the final measurement. Next we examine the need for connector cleanliness which is critical for successful installation, followed by a review of fiber identifiers, visual tracers and visual inspection. Finally, fiber optic talk sets will be reviewed along with the applications and features that should be addressed when communication is required. After completing this tutorial you should have an understanding of: Introduction to Fiber Testing; Selecting Test Equipment; Cleaning Fiber Identifiers; Visual Tracers; Visual Inspection; and Fiber Optic Talk Sets.

  • Technology '88: medical electronics

    Developments during 1987 are reviewed, namely, the use of movies of the beating heart; increased use of ultrasound; automatic insulin delivery; a laser catheter for cleaning leg arteries of plaque; improved pacemakers; and testing of cochlear devices. An expert opinion is provided by George V. Kondraske, associate professor of electrical and biomedical engineering at the University of Texas at Arlington, who discusses the growing interest in rehabilitation.<<ETX>>

  • Surface modification by cathode spots of a vacuum arc

    Cathode spots of a vacuum arc have the efficient property to remove oxide on the metal surface selectively. Analyses of the surface treated by vacuum arc revealed that various interesting surface modifications occurred during the removal of oxide. We have investigated these effects to open new applications of the vacuum arc. The cathode spots can remove inclusions, which often cause surface defects. They attack not only oxide but also carbide inclusions and eliminate them from the surface by evaporation. Removal of organic compounds is also possible. Degreasing (removal of grease) proceeds in parallel to the removal of oxide. The vacuum arc treatment results in the remarkable increase of hardness in the surface layer due to the rapid heating and quenching.

  • Undersea corrosion protection for aluminum structures

    This paper discusses a method of protecting aluminum alloy structure and instrument housings against corrosion. The abrasion-resisting qualities of hardcoat anodize are considered and the advantages of sealing the hardcoat with paint are stated. It is concluded that a hardcoat/paint combination offers a good temporary protection.

  • A Visual Dirt Detection System for Mobile Service Robots

    Basic service robot technologies become more and more mature so that applications far beyond fetch and carry tasks will be possible in near future. Using a multifunctional service robot as a cleaning assistant is one interesting and challenging application. To be of any use, cleaning robots have to be able to verify the results of their work or have to find dirt in the beginning for point-wise cleaning. This paper presents an approach towards the detection of various dirt on textured surfaces using a low-cost RGB-D sensor. The algorithm aims at removing the regular part of the image with spectral residual filtering leaving only the dirt and some noise. With further post-processing it is possible to localize many kinds of dirt in the image. The proposed method is fast, reliable, quite robust to illumination changes and does not require any prior training of the surfaces to inspect.

  • UV Enhanced low temperature wafer direct bonding and interface quality test

    Ultraviolet (UV) exposure process, as an additional process following traditional wet chemical activation processes, was applied to low temperature hydrophilic silicon wafer direct bonding. The UV source emitted mixed spectrum of light with 254 nm and 185 nm wavelength. The comparative trial was performed to investigate the effects of additional UV exposure and to optimize the exposure time. Infrared inspection, tensile strength test and FSEM scan were performed to verify the qualification with detailed results and discussion. It is found that bond rate of wafers treated with 5 minutes UV exposure increased after annealing at 350degC while several voids would appear for exposure time of 10 minutes. Besides, the relationship of annealing temperature and bond rate was also studied. It is found that as annealing temperature raised, the formed gases would be easy to accumulate in the existing cavities or form new voids in the interface to decrease the bond rate. The relatively higher tensile strength up to 15.1 MPa was obtained when exposure to UV for 5 minutes. Finally, FSEM images were given with explanation of different thicknesses of interface layers due to UV exposure. It is concluded that as an additional cleaning and modification treatment, appropriate UV exposure is demonstrated as an effective technique to enhanced bond quality. High bond rate, tensile strength as well as thinner interface layer can be achieved by exposure for 5 minutes. Prolonging the exposure time may decrease the bond-ability as well as the bond quality.

  • Multilayer Vertical Stacked Capacitors (mvstc) for 64mbit and 256mbit Drams

    None

  • Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology

    A “hybrid” post Cu CMP cleaning process that combines acidic and basic clean in sequence is developed and implemented. The new process demonstrates the strengths of both acidic and basic cleans and achieves a more than 60% reduction in CMP defects, such as polish residues, foreign materials, slurry abrasives, scratches, and hollow metal, relative to an all-basic clean process. It also eliminates the circular ring defects that occur intermittently during roller brush cleans. TXRF scans confirm the reduction of AlOx defects when using the hybrid clean process. XPS spectra show similar Cu surface oxidation states between the basic and hybrid clean processes. As revealed by XRD analysis, surface Cu oxide is dissolved into aqueous solution by the acidic clean chemical. The formation mechanism of circular ring defects and the key to their elimination is discussed.

  • Discussion on “gas engines in city railway and lighting service”, Charlotte, N. C., March 30, 1910. (see proceedings for April, 1910)

    None



Standards related to Cleaning

Back to Top

No standards are currently tagged "Cleaning"