Conferences related to Ceramics

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2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)

Science, technology and applications spanning the millimeter-waves, terahertz and infrared spectral regions


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


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Periodicals related to Ceramics

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


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Most published Xplore authors for Ceramics

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Xplore Articles related to Ceramics

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Hydrogen in high-temperature superconducting ceramics

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37370769900', u'full_name': u'I. Dragieva', u'id': 37370769900}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37312465700', u'full_name': u'I. Nedkov', u'id': 37312465700}] 1990 IEEE International Magnetics Conference (INTERMAG), 1990

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A unique hybrid transformerless DC-to-DC converter suitable for biomedical applications

[{u'author_order': 1, u'affiliation': u'Northeastern University, Boston, MA, USA', u'full_name': u'N. Poirier'}, {u'author_order': 2, u'full_name': u'B. Cochrun'}, {u'author_order': 3, u'full_name': u'M. Riccio'}, {u'author_order': 4, u'full_name': u'J. Feldman'}] 1971 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1971

This paper will discuss a miniaturized solid-state transformerless dc-to-dc converter using hybrid techniques that converts a 0.4-V nuclear cell output to 1.35 V, making possible an equivalent mercury cell rated in mA-years rather than mA-hours.


Thermal printer

[{u'author_order': 1, u'affiliation': u'Texas Instruments, Inc., Dallas, TX, USA', u'full_name': u'T. Payne'}, {u'author_order': 2, u'full_name': u'H. Plumlee'}] 1972 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1972

A thermal printer containing a matrix of semiconductor heating elements, each with an integrated control circuit, has been developed for printing calculators, etc. Unique circuit requirements for producing sharp characters and the complete system will be described.


Optimization of a quad-band IFA main antenna to improve the efficiency and isolation with a ceramic GPS antenna in handset antenna designs

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37962384900', u'full_name': u'Zhong Ji', u'id': 37962384900}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37947044600', u'full_name': u'Ted Hebron', u'id': 37947044600}] 2007 IEEE Antennas and Propagation Society International Symposium, 2007

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Filters and Resonators - A Review

[{u'author_order': 1, u'full_name': u'A.R. Braun'}] IEEE Transactions on Sonics and Ultrasonics, 1974

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Educational Resources on Ceramics

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eLearning

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IEEE.tv Videos

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IEEE-USA E-Books

  • 5 Fabulating in Practice

    Critical fabulations are ways of telling stories that open new avenues for design by awakening alternative histories. They solidify in response to the systems of values that might overturn them. They shift according to the aspirations of those who absorb them. They fade with the purpose of connecting legacies of design to the production of knowledge about them. Thrown together among diverse material engagements, critical fabulations help investigators reposition the work ahead.

  • Advanced Antenna Materials

    This chapter contains sections titled:Low‐Temperature Co‐fired CeramicsLiquid Crystal PolymerCMOSMeta MaterialsHigh‐Temperature Superconducting AntennaNano AntennasReferences

  • Passives Technology

    This chapter is about the technologies for the passives, those on‐chip, embedded (EPs), and integrated passive devices (IPDs). It discusses the SMA assembly processes that include the solder masks, underfill, and reflow. The chapter also discusses the fabrication technologies for on‐chip, embedded, and IPDs. The chapter introduces different types of passives: homogeneous on‐chip and heterogeneous off chip. It presents the design considerations specific to passives, including parasitic‐scaling effects, the proximity requirement, and RF isolation techniques. Passives design becomes interesting because of these two opposing design requirements. The chapter also describes the technologies for these passives, including back end of the line (BEOL)/front end of line (FEOL), thick‐film ceramic (TFC), laminate organic (LO), and thin‐film multilayer (TFM). It also describes the multilayer organic (MLO) for, integrated circuit (IC) and passives. Multi‐layer ceramic (MLC), MLO, FEOL, BEOL, and TFM are technology solutions for RF CMOS and RF‐passives systems.



Standards related to Ceramics

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Jobs related to Ceramics

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