Conferences related to Annealing

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2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM


2018 24th International Conference on Pattern Recognition (ICPR)

ICPR will be an international forum for discussions on recent advances in the fields of Pattern Recognition, Machine Learning and Computer Vision, and on applications of these technologies in various fields

  • 2016 23rd International Conference on Pattern Recognition (ICPR)

    ICPR'2016 will be an international forum for discussions on recent advances in the fields of Pattern Recognition, Machine Learning and Computer Vision, and on applications of these technologies in various fields.

  • 2014 22nd International Conference on Pattern Recognition (ICPR)

    ICPR 2014 will be an international forum for discussions on recent advances in the fields of Pattern Recognition; Machine Learning and Computer Vision; and on applications of these technologies in various fields.

  • 2012 21st International Conference on Pattern Recognition (ICPR)

    ICPR is the largest international conference which covers pattern recognition, computer vision, signal processing, and machine learning and their applications. This has been organized every two years by main sponsorship of IAPR, and has recently been with the technical sponsorship of IEEE-CS. The related research fields are also covered by many societies of IEEE including IEEE-CS, therefore the technical sponsorship of IEEE-CS will provide huge benefit to a lot of members of IEEE. Archiving into IEEE Xplore will also provide significant benefit to the all members of IEEE.

  • 2010 20th International Conference on Pattern Recognition (ICPR)

    ICPR 2010 will be an international forum for discussions on recent advances in the fields of Computer Vision; Pattern Recognition and Machine Learning; Signal, Speech, Image and Video Processing; Biometrics and Human Computer Interaction; Multimedia and Document Analysis, Processing and Retrieval; Medical Imaging and Visualization.

  • 2008 19th International Conferences on Pattern Recognition (ICPR)

    The ICPR 2008 will be an international forum for discussions on recent advances in the fields of Computer vision, Pattern recognition (theory, methods and algorithms), Image, speech and signal analysis, Multimedia and video analysis, Biometrics, Document analysis, and Bioinformatics and biomedical applications.

  • 2002 16th International Conference on Pattern Recognition


2018 IEEE PES Transmission & Distribution Conference and Exhibition - Latin America (T&D-LA)

The conference will focus on the current state of the art and lessons learned from techniques and practices developed by leading international companies and utilities.


2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

The Internet of Things, including wearable devices and smart home products, will again be a big theme. To cater for the technology trends, the theme of IMPACT-IAAC 2016 highlights "IMPACT on the Next Big Things" and will arrange panel sessions, invited talks, industrial sessions and outstanding paper presentations.


2017 13th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD)

International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD) is a premier international forum for scientists and researchers to present the state of the art of data mining and intelligent methods inspired from nature, particularly biological, linguistic, and physical systems, with applications to computers, circuits, systems, control, robotics, communications, and more.

  • 2016 12th International Conference on Natural Computation and 13th Fuzzy Systems and Knowledge Discovery (ICNC-FSKD)

    International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD) is a premier international forum for scientists and researchers to present the state of the art of data mining and intelligent methods inspired from nature, particularly biological, linguistic, and physical systems, with applications to computers, circuits, systems, control, robotics, communications, and more.

  • 2015 12th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy sets, Bioinformatics and Bio-Medical Informatics, Genomics, Proteomics, Big Data, Databases and Applications, Semi-Structured/Unstructured Data Mining, Multimedia Mining, Web and Text Data Mining, Graphic Model Discovery, Data Warehousing and OLAP, Pattern Recognition and Diagnostics, etc..

  • 2014 11th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy sets, rough sets, Statistical methods, Parallel/ Distributed data mining, KDD Process and human interaction, Knowledge management, Knowledge visualization, Reliability and robustness, Knowledge Discovery in Specific Domains, High dimensional data, Temporal data, Data streaming, Scientific databases, Semi-structured/unstructured data, Multimedia, Text, Web and the Internet, Graphic model discovery, Software warehouse and software mining, Data engineering, Communications and networking, Software engineering, Distributed systems and computer hardware

  • 2013 10th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy sets, rough sets, Statistical methods, Parallel/ Distributed data mining, KDD Process and human interaction, Knowledge management, Knowledge visualization, Reliability and robustness, Knowledge Discovery in Specific Domains, High dimensional data, Temporal data, Data streaming, Scientific databases, Semi-structured/unstructured data, Multimedia, Text, Web and the Internet, Graphic model discovery, Software warehouse and software mining, Data engineering, Communications and networking, Software engineering, Distributed systems and computer hardware, etc.

  • 2012 9th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy theory and foundations; stability of fuzzy systems; fuzzy methods and algorithms; fuzzy image, speech and signal processing; multimedia; fuzzy hardware and architectures; data mining.

  • 2011 Eighth International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy theory and foundations; stability of fuzzy systems; fuzzy methods and algorithms; fuzzy image, speech and signal processing; multimedia; fuzzy hardware and architectures; data mining.

  • 2010 Seventh International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy theory and foundations; stability of fuzzy systems; fuzzy methods and algorithms; fuzzy image, speech and signal processing; multimedia; fuzzy hardware and architectures; data mining.

  • 2007 International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD '07 covers all aspects of fuzzy systems and knowledge discovery, including recent theoretical advances and interesting applications, for example, fuzzy theory and models, mathematical foundation of fuzzy systems, fuzzy image/signal processing, fuzzy control and robotics, fuzzy hardware and architectures, fuzzy systems and the internet, fuzzy optimization and modeling, fuzzy decision and support, classification, clustering, statistical methods, knowledge etc.


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Periodicals related to Annealing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Xplore Articles related to Annealing

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Investigation of silicon stress around through silicon vias by high efficiency micro-Raman microscopy

Jing Xiangmeng; Yu Daquan; He Hongwen; Dai Fengwei; Su Meiying 2013 14th International Conference on Electronic Packaging Technology, 2013

Through silicon vias (TSVs) attract considerable amount of attention and activity in recent years as a main means to achieve three-dimensional (3D) integrated circuit (IC) functionality. However, the new technology poses new integration challenges as well as new reliability challenges. This paper presents the latest progress in TSV non-destructive stress testing by means of micro-Raman microscopy, a technique which is ...


Microstructure and magnetic properties of Ti/CoCrPt/Ti pseudo-sandwich nanogranular films

H. Y. Sun; J. Hu; Z. F. Su; J. L. Xu; S. Z. Feng IEEE Transactions on Magnetics, 2006

We prepared Ti/CoCrPt/Ti pseudo-sandwich granular films by radio-frequency and dc magnetron sputtering onto glass substrates and subsequent in situ annealing. We investigated the microstructure and magnetic properties of the films as a function of Ti overlayer thickness (x). X-ray diffraction profiles show that the CoCrPt magnetic layers are formed as the hexagonal close-packed (HCP) structure. Vibrating sample magnetometer measurements indicate ...


Study on the nano-crystalline Si embedded ZnO thin films for solar cell application

Kuang-Yang Kuo; Shu-Wei Hsu; Wen-Ling Chuang; Po-Tsung Lee 2011 37th IEEE Photovoltaic Specialists Conference, 2011

The characteristics of nano-crystalline silicon (nc-Si) embedded in Si-based dielectric matrix have been investigated extensively. However, these Si-based dielectric materials have the highly-resistive nature and difficulty in building up the built-in electric field, which limit the performances of nc-Si thin films for solar cell (SC) application. In this study, we propose to use ZnO as a new matrix material for ...


N-type doping of silicon by proton implantation

Jan N. Klug; Josef Lutz; Jan B. Meijer Proceedings of the 2011 14th European Conference on Power Electronics and Applications, 2011

Ion implantation is one of the most common processes in semiconductor manufacturing. Unfortunately the implantation depth and is limited due to the mass of phosphorous or arsenic. Proton irradiation can go beyond this limit and be utilized to adjust the doping of silicon power devices even in a high depth. The creation of donors is studied for high energy, high ...


Effects of the interlayer on the magnetic properties of Fe-Hf-C/ceramics multilayered films

J. O. Choi; J. J. Lee; S. H. Han; H. J. Kim; I. K. Kang IEEE Transactions on Magnetics, 1994

The magnetic properties of nanocrystalline FeHfC single layered and FeHfC/ceramics (AlN, Al2O3, Si3N 4, SiO2) multilayered films were investigated. The soft magnetic properties of the multilayered films laminated by the Al-based ceramics were better, but those of films laminated by the Si- based ceramics were worse than the magnetic properties of single layered films. An analysis of multilayered structure revealed ...


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Educational Resources on Annealing

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eLearning

Investigation of silicon stress around through silicon vias by high efficiency micro-Raman microscopy

Jing Xiangmeng; Yu Daquan; He Hongwen; Dai Fengwei; Su Meiying 2013 14th International Conference on Electronic Packaging Technology, 2013

Through silicon vias (TSVs) attract considerable amount of attention and activity in recent years as a main means to achieve three-dimensional (3D) integrated circuit (IC) functionality. However, the new technology poses new integration challenges as well as new reliability challenges. This paper presents the latest progress in TSV non-destructive stress testing by means of micro-Raman microscopy, a technique which is ...


Microstructure and magnetic properties of Ti/CoCrPt/Ti pseudo-sandwich nanogranular films

H. Y. Sun; J. Hu; Z. F. Su; J. L. Xu; S. Z. Feng IEEE Transactions on Magnetics, 2006

We prepared Ti/CoCrPt/Ti pseudo-sandwich granular films by radio-frequency and dc magnetron sputtering onto glass substrates and subsequent in situ annealing. We investigated the microstructure and magnetic properties of the films as a function of Ti overlayer thickness (x). X-ray diffraction profiles show that the CoCrPt magnetic layers are formed as the hexagonal close-packed (HCP) structure. Vibrating sample magnetometer measurements indicate ...


Study on the nano-crystalline Si embedded ZnO thin films for solar cell application

Kuang-Yang Kuo; Shu-Wei Hsu; Wen-Ling Chuang; Po-Tsung Lee 2011 37th IEEE Photovoltaic Specialists Conference, 2011

The characteristics of nano-crystalline silicon (nc-Si) embedded in Si-based dielectric matrix have been investigated extensively. However, these Si-based dielectric materials have the highly-resistive nature and difficulty in building up the built-in electric field, which limit the performances of nc-Si thin films for solar cell (SC) application. In this study, we propose to use ZnO as a new matrix material for ...


N-type doping of silicon by proton implantation

Jan N. Klug; Josef Lutz; Jan B. Meijer Proceedings of the 2011 14th European Conference on Power Electronics and Applications, 2011

Ion implantation is one of the most common processes in semiconductor manufacturing. Unfortunately the implantation depth and is limited due to the mass of phosphorous or arsenic. Proton irradiation can go beyond this limit and be utilized to adjust the doping of silicon power devices even in a high depth. The creation of donors is studied for high energy, high ...


Effects of the interlayer on the magnetic properties of Fe-Hf-C/ceramics multilayered films

J. O. Choi; J. J. Lee; S. H. Han; H. J. Kim; I. K. Kang IEEE Transactions on Magnetics, 1994

The magnetic properties of nanocrystalline FeHfC single layered and FeHfC/ceramics (AlN, Al2O3, Si3N 4, SiO2) multilayered films were investigated. The soft magnetic properties of the multilayered films laminated by the Al-based ceramics were better, but those of films laminated by the Si- based ceramics were worse than the magnetic properties of single layered films. An analysis of multilayered structure revealed ...


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IEEE-USA E-Books

  • Microchip Post-Processing: There is Plenty of Room at the Top

    This chapter contains sections titled: * Introduction * Adding Functionality to CMOS * Emerging Microsystems * Conclusions

  • Algorithmic Frameworks for Protein Disulfide Connectivity Determination

    This chapter presents a comprehensive introduction to the different algorithmic frameworks available at the state of the art for the determination of disulfide bonds by utilizing data from either protein sequences or tandem mass spectrometry (MS). For the former class of techniques, the authors identify the different problem formulations, features, and solution frameworks. They also review a number of techniques in the area and show how the aforementioned issues are addressed in them. For MS-based methods, our narrative focuses primarily on two methods that the authors developed to provide insight into the key challenges and the anatomy of possible solutions and the underlying algorithmic frameworks. In the chapter, the authors present results from the two methods MS2DB and MS2DB+. The underlying MS/MS data were obtained using a capillary liquid chromatography system coupled with a Thermo- Fisher LCQ ion trap mass spectrometer LC/ESI-MS/MS system.

  • Charge Pumping Technique

    This chapter demonstrates that the charge pumping (CP) technique can be used to characterize two interfaces of the SOI layer when the SOI MOSFET has a body contact. Since the body contact and the source and drain junctions form pn junctions with the MOS gate, the charge pumping technique for the SOI MOSFET is related to SOI Lubistor operation. It is easily anticipated that the impact of Lubistor operation on the charge pumping phenomenon is most critical when the SOI layer thickness is less than 10 nm because the energy levels of the SOI layer are definitely quantized. This is one of the challenging research issues with the charge pumping technique. In the following, we examine how to apply the charge pumping technique to the characterization of the two interfaces of an SOI MOSFET with a thick SOI layer.

  • Device Processing of Silicon Carbide

    Many processing steps are required to fabricate complex electronic devices, including doping by ion implantation, patterning, etching, oxidation, passivation, and metallization. The process flow in SiC device fabrication is similar to that in silicon technology but several unique processes, with particular requirements, are also needed because of the unique physical and chemical properties of SiC. This chapter introduces the fundamental aspects and technological development of ion implantation, etching, oxidation, interface passivation, and Schottky and ohmic contacts in SiC.



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