Conferences related to Assembly

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2014 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2014)

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  • 2013 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2013)

    Papers are solicited in all related areas in robotics and intelligent systems. Proposals for tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.

  • 2012 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2012)

    The 2012 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2012) will be held in Vilamoura-Algarve, Portugal, during October 7-11, 2012. The theme of the conference will be Robotics for Quality of Life and Sustainable Development. Papers are solicited in all related areas in robotics and intelligent systems. Proposals for tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.

  • 2011 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2011)

    The 2011 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2011) will be held in San Francisco, California, USA, during September 25-30, 2011. The theme of the conference will be Human- Centered Robotics, and its format will feature innovations in the form of interactive multimedia presentations and special-topic symposia celebrating 50 years of robotics.

  • 2010 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2010)

    Papers are solicited in all related areas in robotics and intelligent systems. Proposals and tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.

  • 2009 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2009)

    Papers are solicited in all related areas in robotics and intelligent systems. Proposals for tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.


INTELEC 2014 - 2014 IEEE International Telecommunications Energy Conference

An international conference for users, designers, and manufacturers of communications energy systems for: Wireline and Wireless systems, Data/Internet systems, Video systems, SATCOM, CATV, VOIP, Unified Communications systems, WiFi, Data Centers, Energy Storage, Renewable Energy, and Smart Grid Systems.

  • INTELEC 2013 - 2013 IEEE International Telecommunications Energy Conference

    INTELEC®‚ is an international forum for the exchange of information on energy and power for communication systems including IP and multimedia applications both today and in the future. The conference provides a unique opportunity for designers, manufacturers, distributors of power equipment and network operators to interact directly with researchers and users to discuss a wide variety of topics of power systems, components and energy storage technologies, exchange operational experience and other related energy topics.

  • INTELEC 2012 - 2012 IEEE International Telecommunications Energy Conference

    INTELEC is an international assembly and forum for the exchange of ideas, information and new developments in energy systems for communications. This conference provides a unique opportunity for network operators and developers to interact directly with designers, manufacturers and distributors of communications energy systems, and related components and products.


2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.

  • 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanomaterials; Carbon Nanotube based Devices and Systems; Molecular Sensors, Actuators, and Systems; Nanobiology, Nano-bio-informatics, Nanomedicine; Microfluidics and Nanofluidics;Micro and Nano Heat Transfer.

  • 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanotechnology is an important emerging field. On the other hand, MEMS is indispensable in spanning nano devices into systems. It is evident that MEMS and Nanotechnology will soon merge together and this marriage will significantly impact many industries across the globe. This conference is the annual IEEE Nanotechnology Council meeting to bring together world-leading researchers in several advanced topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary.

  • 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Micro and Nano Fabrication Micro/Nano Sensors and Actuators Nanophotonics Nanomaterials Microfluidics and Nanofluidics Micro and Nano Heat Transfer Nanobiology, Nano-bio-informatics, Nanomedicine Nanoscale Robotics, Assembly, and Automation Carbon Nanotube based Devices and Systems Micro/Nanoelectromechanical Systems (M/NEMS) Molecular Sensors, Actuators, and Systems

  • 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in topics of MEMS and Nanotechnology to disseminate latest research results and allow cross-disciplinary exchange of knowledge to further advance both areas. It is foreseeable that MEMS and Nanotechnology will become highly complimentary technologies and impact the technological globe.


2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.


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Periodicals related to Assembly

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Xplore Articles related to Assembly

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Magnetic performance of the Advanced Light Source EPUS5.0 elliptically polarizing undulator

S. Marks; J. DeVries; E. Hoyer; B. M. Kincaid; D. Plate; P. Pipersky; R. D. Schleuter; A. Young Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366), 1999

An elliptically polarizing undulator (EPU) has been assembled, tested, and installed in the Advanced Light Source (ALS) storage ring. It is a 2 m long pure permanent magnet device with a 5.0 cm period capable of providing polarized radiation of any ellipticity. This paper reports on the program of magnetic measurements and field tuning, and final magnetic and drive system ...


Preliminary Observations on the Response of Accelerator Shielding Blocks to Earthquake Motions

W. G. Godden; W. Peregoy; M. Aslam; D. Theodore Scalise IEEE Transactions on Nuclear Science, 1973

First Page of the Article ![](/xploreAssets/images/absImages/04327150.png)


Performance of five and six block coil geometries in short superconducting dipole models for the LHC

N. Andreev; K. Artoos; L. Bottura; F. Rodriguez-Mateos; S. Russenschuck; N. Sigel; A. Siemko; F. Sonnemann; D. Tommasini; I. Vanenkov Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366), 1999

A series of similar one meter long superconducting dipole models for the LHC is being manufactured and tested since 1995 for exploring design variants and assembly parameters. Until the end of 1997 all magnets of this series were based on a coil geometry subdividing the conductors in five distinctive winding blocks. In order to cope with new requirements of magnetic ...


Industry's Move To Electricity

Robert Mauro IEEE Power Engineering Review, 1983

First Page of the Article ![](/xploreAssets/images/absImages/05519204.png)


Production of a High Energy, High Power Polarized Photon Beam at SLAC

R. L. Eisele; D. J. Sherden; R. H. Siemann; C. K. Sinclair; D. J. Quinn; J. P. Rutherfoord; M. A. Shupe IEEE Transactions on Nuclear Science, 1973

Attenuation by coherent pair production in highly oriented compression annealed pyrolytic graphite has been used to polarize a 16 GeV bremsstrahlung beam. Graphite pieces of total volume 0.95 × 0.95 × 5.1 cm3 were assembled in water-cooled precision holders. Eighteen of these units were mounted in two independent coaxial assemblies. Each assembly provided precision angular orientation with respect to the ...


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Educational Resources on Assembly

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eLearning

Magnetic performance of the Advanced Light Source EPUS5.0 elliptically polarizing undulator

S. Marks; J. DeVries; E. Hoyer; B. M. Kincaid; D. Plate; P. Pipersky; R. D. Schleuter; A. Young Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366), 1999

An elliptically polarizing undulator (EPU) has been assembled, tested, and installed in the Advanced Light Source (ALS) storage ring. It is a 2 m long pure permanent magnet device with a 5.0 cm period capable of providing polarized radiation of any ellipticity. This paper reports on the program of magnetic measurements and field tuning, and final magnetic and drive system ...


Preliminary Observations on the Response of Accelerator Shielding Blocks to Earthquake Motions

W. G. Godden; W. Peregoy; M. Aslam; D. Theodore Scalise IEEE Transactions on Nuclear Science, 1973

First Page of the Article ![](/xploreAssets/images/absImages/04327150.png)


Performance of five and six block coil geometries in short superconducting dipole models for the LHC

N. Andreev; K. Artoos; L. Bottura; F. Rodriguez-Mateos; S. Russenschuck; N. Sigel; A. Siemko; F. Sonnemann; D. Tommasini; I. Vanenkov Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366), 1999

A series of similar one meter long superconducting dipole models for the LHC is being manufactured and tested since 1995 for exploring design variants and assembly parameters. Until the end of 1997 all magnets of this series were based on a coil geometry subdividing the conductors in five distinctive winding blocks. In order to cope with new requirements of magnetic ...


Industry's Move To Electricity

Robert Mauro IEEE Power Engineering Review, 1983

First Page of the Article ![](/xploreAssets/images/absImages/05519204.png)


Production of a High Energy, High Power Polarized Photon Beam at SLAC

R. L. Eisele; D. J. Sherden; R. H. Siemann; C. K. Sinclair; D. J. Quinn; J. P. Rutherfoord; M. A. Shupe IEEE Transactions on Nuclear Science, 1973

Attenuation by coherent pair production in highly oriented compression annealed pyrolytic graphite has been used to polarize a 16 GeV bremsstrahlung beam. Graphite pieces of total volume 0.95 × 0.95 × 5.1 cm3 were assembled in water-cooled precision holders. Eighteen of these units were mounted in two independent coaxial assemblies. Each assembly provided precision angular orientation with respect to the ...


More eLearning Resources

IEEE-USA E-Books

  • Overview of Whisker???Mitigation Strategies for High???Reliability Electronic Systems

    In practice, management of the risks associated with tin whiskering is not fundamentally different from managing risks associated with other failure modes that bedevil electronic systems. However, the underlying uncertainties and associated lack of predictability of the tin whiskering phenomenon create a challenging environment for risk management. In order to reduce failure risk presented by tin whiskers, electronic equipment manufacturers need to understand various mitigation strategies and their effectiveness at preventing whisker???related failures. Equipment manufacture mitigation strategies may include setting spacing limits, hot solder dipping, solder assembly and inspection, encapsulation, or application of an insulation coating layer. Appropriate supply chain management will vary depending upon the willingness of the supplier to implement special tin controls and level of complexity of the purchased item, that is, components, simple assemblies, major subassemblies, etc. Effective and efficient tin whisker risk mitigation requires each tier of the supply chain to play its proper role.

  • Thermionic Integrated Micromodules: TIMMS

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

  • Metallizations for Semiconductor Devices

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

  • Coplanar Waveguide Suspended Inside a Conducting Enclosure

    The characteristics of a coplanar waveguide (CPW) suspended inside a conducting metal enclosure are presented. By taking the enclosure into consideration, the inevitable package that is present in practice and its influence are studied and modeled. Quasi-static TEM iterative techniques to analyze suspended CPW are discussed. Computed as well as experimental results on effective dielectric constant eff and characteristic impedance Z0 are presented and compared to characteristics obtained by full-wave analysis. Also considered in this chapter is a CPW suspended inside a nonsymmetrical split block type of housing. This type of construction has the advantage of simplifying assembly by soldering or epoxying the circuit to one-half of the housing.

  • Manufacturing, Shipping,and Installation Guidelines

    This chapter contains sections titled: Keep Dielectric Materials to a Minimum When Dielectric Materials are Required, Keep Contact Between Them to a Minimum Conductive Materials Must Be Connected to Ground, If At All Possible (Remember, the human body is conductive) If It Is Not Possible, or Cost Effective, to Prevent Charge Buildup Completely, then Use Ionizers, or Other Devices, to Discharge Components Prior to Assembly Minimize Handling of Components or Assemblies; Especially Handling Resulting in Conductive Contact Shield Especially Sensitive Electronic Components and Assemblies The Ground Path for Conductive Items Must Have a Resistance of at Least 1 M?>, but No More Than 100 M?> Static Prevention Must Take Place at _All_ Points in the Manufacturing, Shipping, and Installation Process Make Regular Checks to Ensure the ESD Protection System is Working Properly This chapter contains sections titled: Summary of Manufacturing, Shipping, and Installation Guidelines

  • Passive Components

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

  • TwoDimensional Applications

    This chapter contains sections titled: Introduction Two-Dimensional Wave Equations Discretization of the Two-Dimensional Wave Equation Two-Dimensional Scattering Edge Elements This chapter contains sections titled: Appendix 1: Element Matrix for Node- Based Bilinear Rectangles Appendix 2: Sample MATLAB Code for Implementing the Matrix Assembly References

  • Microworld Modeling: Impact of Liquid and Roughness

    This chapter contains sections titled: Introduction Liquid Environments Microscopic Analysis Surface Roughness References

  • Parallel Programming

    Beowulf clusters, which exploit mass-market PC hardware and software in conjunction with cost-effective commercial network technology, are becoming the platform for many scientific, engineering, and commercial applications. With growing popularity has come growing complexity. Addressing that complexity, Beowulf Cluster Computing with Linux and Beowulf Cluster Computing with Windows provide system users and administrators with the tools they need to run the most advanced Beowulf clusters. The book is appearing in both Linux and Windows versions in order to reach the entire PC cluster community, which is divided into two distinct camps according to the node operating system. Each book consists of three stand-alone parts. The first provides an introduction to the underlying hardware technology, assembly, and configuration. The second part offers a detailed presentation of the major parallel programming librairies. The third, and largest, part describes software infrastructures and tools for managing cluster resources. This includes some of the most popular of the software packages available for distributed task scheduling, as well as tools for monitoring and administering system resources and user accounts. Approximately 75% of the material in the two books is shared, with the other 25% pertaining to the specific operating system. Most of the chapters include text specific to the operating system. The Linux volume includes a discussion of parallel file systems.

  • INTRODUCTION

    This is the introductory chapter of Verification of Communication Protocols in Web Services: Model???Checking Service Compositions. Service???oriented architecture (SOA)???based applications are built as an assembly of existing web services wherein the component services can span across several organizations and have any underlying implementations. The chapter summarizes earlier solutions of technical challenges of web services and points out their main limitations, such as memory???efficient state???space analysis in software model checking, time???efficient state???space analysis in software model checking, reducing the size of a formal model and verification of a business process execution language (BPEL) specification. It highlights the new techniques, models, and algorithms presented in this book, such as memory???efficient state???space analysis technique, time???efficient state???space analysis technique, technique for reducing the size of a model exponentially, and technique for modeling, simulating, and verifying a BPEL specification. Finally the chapter provides an overview of the other chapters in this book.



Standards related to Assembly

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Guide to Specifications for Gas-Insulated, Electric Power Substation Equipment

This guide covers the technical requirements for the design, fabrication, testing, installation, and in-service performance of gas-insulated substations(GIS). In line with the user functional one-line diagram, the supplier should furnish all components of the GIS such as circuit breakers(CB), disconnect switches(DS), maintenance ground switches (MGS), fast-acting ground switches(FGS), voltage transformers(VT), current transformers(CT), SF6-to-air bushings, SF6-to-cable terminations, surge arresters, all the ...