Conferences related to Assembly

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)


2014 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2014)

tbd

  • 2013 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2013)

    Papers are solicited in all related areas in robotics and intelligent systems. Proposals for tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.

  • 2012 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2012)

    The 2012 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2012) will be held in Vilamoura-Algarve, Portugal, during October 7-11, 2012. The theme of the conference will be Robotics for Quality of Life and Sustainable Development. Papers are solicited in all related areas in robotics and intelligent systems. Proposals for tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.

  • 2011 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2011)

    The 2011 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2011) will be held in San Francisco, California, USA, during September 25-30, 2011. The theme of the conference will be Human- Centered Robotics, and its format will feature innovations in the form of interactive multimedia presentations and special-topic symposia celebrating 50 years of robotics.

  • 2010 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2010)

    Papers are solicited in all related areas in robotics and intelligent systems. Proposals and tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.

  • 2009 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2009)

    Papers are solicited in all related areas in robotics and intelligent systems. Proposals for tutorials and workshops, as well as organized/special sessions are also welcome to address the emerging areas and innovative applications of new technologies.


INTELEC 2014 - 2014 IEEE International Telecommunications Energy Conference

An international conference for users, designers, and manufacturers of communications energy systems for: Wireline and Wireless systems, Data/Internet systems, Video systems, SATCOM, CATV, VOIP, Unified Communications systems, WiFi, Data Centers, Energy Storage, Renewable Energy, and Smart Grid Systems.

  • INTELEC 2013 - 2013 IEEE International Telecommunications Energy Conference

    INTELEC®‚ is an international forum for the exchange of information on energy and power for communication systems including IP and multimedia applications both today and in the future. The conference provides a unique opportunity for designers, manufacturers, distributors of power equipment and network operators to interact directly with researchers and users to discuss a wide variety of topics of power systems, components and energy storage technologies, exchange operational experience and other related energy topics.

  • INTELEC 2012 - 2012 IEEE International Telecommunications Energy Conference

    INTELEC is an international assembly and forum for the exchange of ideas, information and new developments in energy systems for communications. This conference provides a unique opportunity for network operators and developers to interact directly with designers, manufacturers and distributors of communications energy systems, and related components and products.


2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.


2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.


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Periodicals related to Assembly

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Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Nanotechnology, IEEE Transactions on

The proposed IEEE Transactions on Nanotechnology will be devoted to the publication of manuscripts of archival value in the general area of nanotechnology, that is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.


Systems, Man and Cybernetics, Part A, IEEE Transactions on

Systems engineering, including efforts that involve issue formnaulations, issue analysis and modeling, and decision making and issue interpretation at any of the life-cycle phases associated with the definition, development, and implementation of large systems. It will also include efforts that relate to systems management, systems engineering processes and a variety of systems engineering methods such as optimization, modeling and simulation. ...




Xplore Articles related to Assembly

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Use DNA origami as a scaffold for self-assembly of optical metamolecules

Yoon Jo Hwang; Shelley F. J. Wickham; Steven D. Perrault; Sanghyun Yoo; Sung Ha Park; William M. Shih; Seungwoo Lee 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

A roadmap for assembling optical metamolecule is not yet clear; to address this challenge, herein, we propose to use DNA origami to achieve custom arrangements of metallic nanoparticles for deterministic assembly of optical metamolecules.


Experimental data for two different alternator configurations in a solar Brayton power system

L. S. Mason; R. K. Shaltens; W. D. Espinosa IECEC-97 Proceedings of the Thirty-Second Intersociety Energy Conversion Engineering Conference (Cat. No.97CH6203), 1997

A solar dynamic (SD) space power system has been under test at the NASA Lewis Research Center since 1994. The SD Ground Test Demonstration (GTD) system includes a solar concentrator, heat receiver with thermal energy storage, Brayton power conversion unit and radiator installed in a thermal-vacuum chamber with a solar simulator. The Brayton unit has been operated with two different ...


Trading agents competing: performance, progress, and market effectiveness

M. P. Wellman; S. -F. Cheng; D. M. Reeves; K. M. Lochner IEEE Intelligent Systems, 2003

The annual trading agent competition offers agent designers a forum for evaluating programmed trading techniques in a challenging market scenario. TAC aims to spur research by enabling researchers to compare techniques on a common problem and build on each other's ideas. A fixed set of assumptions and environment settings facilitates communication of methods and results. As a multiyear event, TAC ...


Wide-band semivane and heavily dielectric loaded helix traveling-wave tubes

Sun-Shin Jung; Chan-Wook Baik; Seong-Tae Han; Seok-Gy Jeon; Hyun-Jun Ha; A. V. Soukhov; Baofu Jia; Gun-Sik Park; H. S. Kim; H. S. Uhm; B. N. Basu IEEE Transactions on Plasma Science, 2002

Theoretical simulation of the dispersion and interaction impedance characteristics of a semivane loaded negative dispersion helical slow-wave structure, which is a slight variant of a conventional vane-loaded helix of a wide-band traveling-wave tube (TWT), was validated for the nonresonant perturbation measurement. While the experimental and theoretical results agreed well with respect to interaction impedance for both the semivane structure and ...


Design, simulation, fabrication, and characterization of package level micro shielding for EMI/EMC management in BGA environment

E. Diaz-Alvarez; J. P. Krusius 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

With the introduction of compact mixed signal assemblies and mixed signal integrated circuits, electromagnetic interference (EMI) and electromagnetic compatibility (EMC) problems have started to emerge on the package and chip levels. Mixed signal circuit partitions (digital/analog/RF) have to be implemented such that EMI/EMC effects can be controlled. EMI/EMC management is today primarily performed on the subsystem level. We explore here ...


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Educational Resources on Assembly

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eLearning

Use DNA origami as a scaffold for self-assembly of optical metamolecules

Yoon Jo Hwang; Shelley F. J. Wickham; Steven D. Perrault; Sanghyun Yoo; Sung Ha Park; William M. Shih; Seungwoo Lee 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

A roadmap for assembling optical metamolecule is not yet clear; to address this challenge, herein, we propose to use DNA origami to achieve custom arrangements of metallic nanoparticles for deterministic assembly of optical metamolecules.


Experimental data for two different alternator configurations in a solar Brayton power system

L. S. Mason; R. K. Shaltens; W. D. Espinosa IECEC-97 Proceedings of the Thirty-Second Intersociety Energy Conversion Engineering Conference (Cat. No.97CH6203), 1997

A solar dynamic (SD) space power system has been under test at the NASA Lewis Research Center since 1994. The SD Ground Test Demonstration (GTD) system includes a solar concentrator, heat receiver with thermal energy storage, Brayton power conversion unit and radiator installed in a thermal-vacuum chamber with a solar simulator. The Brayton unit has been operated with two different ...


Trading agents competing: performance, progress, and market effectiveness

M. P. Wellman; S. -F. Cheng; D. M. Reeves; K. M. Lochner IEEE Intelligent Systems, 2003

The annual trading agent competition offers agent designers a forum for evaluating programmed trading techniques in a challenging market scenario. TAC aims to spur research by enabling researchers to compare techniques on a common problem and build on each other's ideas. A fixed set of assumptions and environment settings facilitates communication of methods and results. As a multiyear event, TAC ...


Wide-band semivane and heavily dielectric loaded helix traveling-wave tubes

Sun-Shin Jung; Chan-Wook Baik; Seong-Tae Han; Seok-Gy Jeon; Hyun-Jun Ha; A. V. Soukhov; Baofu Jia; Gun-Sik Park; H. S. Kim; H. S. Uhm; B. N. Basu IEEE Transactions on Plasma Science, 2002

Theoretical simulation of the dispersion and interaction impedance characteristics of a semivane loaded negative dispersion helical slow-wave structure, which is a slight variant of a conventional vane-loaded helix of a wide-band traveling-wave tube (TWT), was validated for the nonresonant perturbation measurement. While the experimental and theoretical results agreed well with respect to interaction impedance for both the semivane structure and ...


Design, simulation, fabrication, and characterization of package level micro shielding for EMI/EMC management in BGA environment

E. Diaz-Alvarez; J. P. Krusius 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

With the introduction of compact mixed signal assemblies and mixed signal integrated circuits, electromagnetic interference (EMI) and electromagnetic compatibility (EMC) problems have started to emerge on the package and chip levels. Mixed signal circuit partitions (digital/analog/RF) have to be implemented such that EMI/EMC effects can be controlled. EMI/EMC management is today primarily performed on the subsystem level. We explore here ...


More eLearning Resources

IEEE-USA E-Books

  • An Industry Perspective on MCMD

    This chapter contains sections titled: Introduction MCM Definition: Pre-Design Laundry List Design Packaging Substrate Manufacturing Assembly Test Summary This chapter contains sections titled: References

  • Closed Loop Control of a Gravity-assisted Underactuated Snake Robot with Application to Aircraft Wing-Box Assembly

    Stable, nonlinear closed-loop control of a gravityassisted underactuated robot arm with 2nd order non-holonomic constraints is presented in this paper. The joints of the hyper articulated arm have no dedicated actuators, but are activated with gravity. By tilting the base link appropriately, the gravitational torque drives the unactuated links to a desired angular position. With simple locking mechanisms, the hyper articulated arm can change its configuration using only one actuator at the base. This underactuated arm design was motivated by the need for a compact snake-like robot that can go into aircraft wings and perform assembly operations using heavy end-effecters. The dynamics of the unactuated links are essentially 2nd order nonholonomic constraints, for which there are no general methods for designing closed loop control. We propose an algorithm for positioning the links of an n-link robot arm inside an aircraft wing-box. This is accomplished by sequentially applying a closed loop point-to-point control scheme to the unactuated links. We synthesize a Lyapunov function to prove the convergence of this control scheme. The Lyapunov function also provides us with lower bounds on the domain of convergence of the control law. The control algorithm is implemented on a prototype 3-link system. Finally, we provide some experimental results to demonstrate the efficacy of the control scheme.

  • A Hybrid Silicon Carbide Differential Amplifier for 350C Operation

    An operational amplifier has been designed, fabricated, and tested at 350°C using silicon carbide MESFET pairs and thick film hybrid technology. The amplifier was successfully tested over the temperature range of 25-350°C. The gain of the amplifier was greater than 60 dB, the common-mode rejection ratio was greater than 55 dB, and the offset voltage varied from 139 to 159 mV over the entire temperature range. The results demonstrate the feasibility of high temperature circuit design and assembly using silicon carbide MESFET's and thick film hybrid technology.

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Design for Manufacturing

    This chapter contains sections titled: Why Quantity Preferred Processes Materials Process Categories Design for Automation Design for Automatic Assembly Short-Run Manufacturing

  • Frontmatter

    The prelims comprise: Half Title IEEE Press Editorial Board Title Copyright Contents Foreword Preface Contributors

  • Advanced Topics and Future Trends in MCM Technology

    This chapter contains sections titled: Introduction Packaging Perspective Integrated Circuit Technology Integrated Circuit Technology Generations National Technology Roadmap for Semiconductors NTRS Assembly and Packaging Interconnect Technology Issues Emergence of MCM Technology Three-Dimensional (3-D) MCMs System-On-Chip Superconductor Interconnects Optical Interconnects Diamond Substrates Summary This chapter contains sections titled: References

  • Architecture and Instruction Set of the C6x Processor

    This chapter contains sections titled: Introduction TMS320C6x Architecture Functional Units Fetch and Execute Packets Pipelining Registers Linear and Circular Addressing Modes TMS320C6x Instruction Set Assembler Directives Linear Assembly ASM Statement Within C C-Callable Assembly Function Timers Interrupts Multichannel Buffered Serial Ports Direct Memory Access Memory Considerations Fixed- and Floating-Point Format Code Improvement Constraints Programming Examples Using C, Assembly, and Linear Assembly Assignments References

  • No title

    Many electrical and computer engineering projects involve some kind of embedded system in which a microcontroller sits at the center as the primary source of control. The recently-developed Arduino development platform includes an inexpensive hardware development board hosting an eight-bit ATMEL ATmega-family processor and a Java-based software-development environment. These features allow an embedded systems beginner the ability to focus their attention on learning how to write embedded software instead of wasting time overcoming the engineering CAD tools learning curve. The goal of this text is to introduce fundamental methods for creating embedded software in general, with a focus on ANSI C. The Arduino development platform provides a great means for accomplishing this task. As such, this work presents embedded software development using 100% ANSI C for the Arduino's ATmega328P processor. We deviate from using the Arduino-specific Wiring libraries in an attempt to provide the most general embedded methods. In this way, the reader will acquire essential knowledge necessary for work on future projects involving other processors. Particular attention is paid to the notorious issue of using C pointers in order to gain direct access to microprocessor registers, which ultimately allow control over all peripheral interfacing. Table of Contents: Introduction / ANSI C / Introduction to Arduino / Embedded Debugging / ATmega328P Architecture / General-Purpose Input/Output / Timer Ports / Analog Input Ports / Interrupt Processing / Serial Communications / Assembly Language / Non-volatile Memory

  • Code Optimization and Power Management

    This chapter contains sections titled: Code Optimization C Optimization Techniques Using Assembly Code for Efficient Programming Power Consumption and Management in the Blackfin Processor Sample Rate Conversion with Blackfin Simulator Sample Rate Conversion with BF533/BF537 EZ-KIT Sample Rate Conversion with LabVIEW Embedded Module for Blackfin Processors More Exercise Problems



Standards related to Assembly

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No standards are currently tagged "Assembly"