Atherosclerosis

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Atherosclerosis (also known as arteriosclerotic vascular disease or ASVD) is a condition in which an artery wall thickens as a result of the accumulation of fatty materials such as cholesterol. (Wikipedia.org)






Conferences related to Atherosclerosis

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2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2012 25th IEEE International Symposium on Computer-Based Medical Systems (CBMS)

The conference will provide an international forum for discussing the latest developments in the field of computational medicine, biomedical informatics and related fields.


2012 IEEE-EMBS International Conference on Biomedical and Health Informatics (BHI)

BHI devotes to an inter-disciplinary research area intersecting engineering, information technology and computer science with biology, medicine and health. The scope includes but not limited to innovative technologies and applications on acquisition, transmission, processing, storage, retrieval (P-STAR) of biomedical and health information, bio-inspired informatics and informatics in biological systems.


2011 International Conference on Remote Sensing, Environment and Transportation Engineering (RSETE)

Remote sensing and application Energy, Environmental, sustainable development Environment Pollution and Protection Transportation Engineering


2010 15th Conference on Microwave Techniques (COMITE 2010)

Microwave techniques, antennas, optoelectronics, computational electromagnetics.



Periodicals related to Atherosclerosis

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Information Technology in Biomedicine, IEEE Transactions on

Telemedicine, teleradiology, telepathology, telemonitoring, telediagnostics, 3D animations in health care, health information networks, clinical information systems, virtual reality applications in medicine, broadband technologies, and global information infrastructure design for health care.


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Most published Xplore authors for Atherosclerosis

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Xplore Articles related to Atherosclerosis

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EM lifetime improvement of Cu damascene interconnects by p-SiC cap layer

[{u'author_order': 1, u'full_name': u'M. Hatano'}, {u'author_order': 2, u'full_name': u'T. Usui'}, {u'author_order': 3, u'full_name': u'Y. Shimooka'}, {u'author_order': 4, u'full_name': u'H. Kaneko'}] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), None

Mean time to failure (MTF) of Cu damascene interconnects with p-SiC cap layer is achieved to be approximately 2 times as long as that with conventional p-SiN cap layer. This improvement can be explained by the difference of adhesion between Cu and the cap layer. It is also found that Cu dominant diffusion path is the interface between Cu and ...


Process integration of CVD Cu seed using ALD Ru glue layer for sub-65nm Cu interconnect

[{u'author_order': 1, u'affiliation': u'Syst. LSI Div., Samsung Electron. Co. Ltd., Youngin, South Korea', u'full_name': u'S. -M. Choi'}, {u'author_order': 2, u'affiliation': u'Syst. LSI Div., Samsung Electron. Co. Ltd., Youngin, South Korea', u'full_name': u'K. -C. Park'}, {u'author_order': 3, u'affiliation': u'Syst. LSI Div., Samsung Electron. Co. Ltd., Youngin, South Korea', u'full_name': u'B. -S. Suh'}, {u'author_order': 4, u'affiliation': u'Syst. LSI Div., Samsung Electron. Co. Ltd., Youngin, South Korea', u'full_name': u'I. -R. Kim'}, {u'author_order': 5, u'affiliation': u'Syst. LSI Div., Samsung Electron. Co. Ltd., Youngin, South Korea', u'full_name': u'H. -K. Kang'}, {u'author_order': 6, u'affiliation': u'Syst. LSI Div., Samsung Electron. Co. Ltd., Youngin, South Korea', u'full_name': u'K. -P. Suh'}, {u'author_order': 7, u'full_name': u'H. -S. Park'}, {u'author_order': 8, u'full_name': u'J. -S. Ha'}, {u'author_order': 9, u'full_name': u'D. -K. Joo'}] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., None

Chemical-vapor-deposited(CVD) Cu film was successfully demonstrated as a seed layer for Cu electroplating, by using atomic-layer-deposited(ALD) Ru as a glue layer on ALD WNC barrier metal. Low via resistance of below 3Ω/via was obtained in 0.13 μm via chains, which was built in SiOC (k=2.9) intermetal dielectric. The adhesion between WNC and CVD Cu. estimated by mELT, was significantly improved ...


Adhesion studies of thin films on ultra low k

[{u'author_order': 1, u'affiliation': u'CEA-DRT-LETI/DTS-CEA/GRE, Grenoble, France', u'full_name': u'S. Maitrejean'}, {u'author_order': 2, u'full_name': u'F. Fusalba'}, {u'author_order': 3, u'full_name': u'M. Patz'}, {u'author_order': 4, u'full_name': u'V. Jousseaume'}, {u'author_order': 5, u'full_name': u'T. Mourier'}] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), None

Adhesion of interfaces related to LKD 5109, a spin-on ultra low k (ULK) material, is quantified using the four-point-bending method. Processing and surface treatment are optimized. Results are compared to CMP process impact. Relatively low adhesion levels are measured for liner/ULK, ULK/cap layer and ULK/cap layer/metal layer interfaces as expected for an ULK material. Nevertheless, CMP can be performed with ...


Design of low-capacitance bond pad for high-frequency I/O applications in CMOS integrated circuits

[{u'author_order': 1, u'affiliation': u'Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan', u'full_name': u'Ming-Dou Ker'}, {u'author_order': 2, u'full_name': u'Hsin-Chin Jiang'}, {u'author_order': 3, u'full_name': u'Chyh-Yih Chang'}] Proceedings of 13th Annual IEEE International ASIC/SOC Conference (Cat. No.00TH8541), None

A new structure of bond pad is proposed to reduce its parasitic capacitance in a baseline CMOS process without any process modification. The proposed bond pad has a capacitance less than 50% of that in the traditional bond pad. In addition, this new bond pad also provides better bonding adhesion of 10% improvement than the traditional one. It is very ...


Parallel-Strip Line Embedded in or Printed on a Dielectric Sheet (Correspondence)

[{u'author_order': 1, u'full_name': u'E. Yamashita'}, {u'author_order': 2, u'full_name': u'S. Yamazaki'}] IEEE Transactions on Microwave Theory and Techniques, 1968

First Page of the Article ![](/xploreAssets/images/absImages/01126843.png)


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