Corrosion

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Corrosion is the disintegration of an engineered material into its constituent atoms due to chemical reactions with its surroundings. (Wikipedia.org)






Conferences related to Corrosion

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2017 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE Aerospace Conference

The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors. The annual, weeklong conference, set in a stimulating and thought -provoking environment, is designed for aerospace experts, academics, military personnel, and industry leaders.

  • 2012 IEEE Aerospace Conference

    The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors. The annual, weeklong conference, set in a stimulating and thought-provoking environment, is designed for aerospace experts, academics, military personnel, and industry leaders.

  • 2011 IEEE Aerospace Conference

    The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors.

  • 2010 IEEE Aerospace Conference

    The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors.


2012 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 2012

This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.


2012 IEEE 58th Holm Conference on Electrical Contacts (Holm 2012)

Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the authors field of expertise.


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Periodicals related to Corrosion

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.


Sensors Journal, IEEE

The Field of Interest of the IEEE Sensors Journal is the science and applications of sensing phenomena, including theory, design, and application of devices for sensing and transducing physical, chemical, and biological phenomena. The emphasis is on the electronics, physics, biology, and intelligence aspects of sensors and integrated sensor-actuators. (IEEE Guide for Authors) (The fields of interest of the IEEE ...




Xplore Articles related to Corrosion

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Life and capacity improvements in lead acid batteries through metal control additives

T. J. Clough; J. A. Wertz Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Metal impurities can be particularly detrimental in valve regulated lead acid batteries (VRLA) operating on the oxygen recombination principal. A number of metal impurities can exert a deleterious effect on the performance of VRLA batteries by affecting one of more of the performance requirements of the VRLA batteries such as by increasing oxygen evolution at the positive electrode, increasing hydrogen ...


Transparent microelectrode array in diamond technology

Z. Gao; V. Carabelli; E. Carbone; E. Colombo; M. Dipalo; Ch. Manfredotti; A. Pasquarelli; M. Feneberg; K. Thonke; E. Vittone; E. Kohn 2009 IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering, 2009

We report on the development of a diamond-on-sapphire microelectrode quadrupole array, substituting the commonly used inert metal electrode material by nanocrystalline diamond (NCD). This allows to combine the transparency (desired for fluorescence analysis) with the properties of an inert quasi-metallically doped diamond electrode. The NCD film was nucleated by BEN (Bias Enhanced Nucleation) on double side polished sapphire substrates and ...


Comparison and discussion on potential mitigating measures regarding inductive interference of metallic pipelines

René Braunstein; Ernst Schmautzer; Gerald Propst Graz Electrical Systems for Aircraft, Railway and Ship Propulsion, 2010

This paper describes the actual problem of inductively interfered pipelines due to traction and short circuit currents of electric railways. At first a brief overview about calculation-formulas and standards is given. Furthermore the most important limits for induced pipe potentials regarding short time- (short circuit currents) and long time interference (normal operation traction currents) of the electric railway are mentioned. ...


Assessment of deteriorating reinforced concrete structures using artificial neural networks

N. Yasuda; T. Tsutsumi; T. Kawamura; S. Matsuho; W. Shiraki 1993 (2nd) International Symposium on Uncertainty Modeling and Analysis, 1993

An artificial neural network was used to assess deteriorating reinforced concrete (RC) structures using periodical inspection data for thermal power plants along the coast of Tokyo Bay arranged by the Tokyo Electric Power Company. In the analysis, the focus is on chloride-induced corrosion damage of RC structures. 13 input variables such as crack width, crack direction, number of cracks, etc. ...


Ion transport in encapsulants used in microcircuit packaging

L. Lantz; M. G. Pecht IEEE Transactions on Components and Packaging Technologies, 2003

Most semiconductor devices are encapsulated in epoxy molding compounds. These molding compounds contain ionic contaminants including chloride ions from epichlorohydrin used in the epoxidation of the resin and bromine ions incorporated into the resin as a flame retardant. Chloride ions are known to break down the protective oxide on the surface of aluminum metallization and accelerate corrosion. The encapsulant material ...


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Educational Resources on Corrosion

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eLearning

Life and capacity improvements in lead acid batteries through metal control additives

T. J. Clough; J. A. Wertz Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Metal impurities can be particularly detrimental in valve regulated lead acid batteries (VRLA) operating on the oxygen recombination principal. A number of metal impurities can exert a deleterious effect on the performance of VRLA batteries by affecting one of more of the performance requirements of the VRLA batteries such as by increasing oxygen evolution at the positive electrode, increasing hydrogen ...


Transparent microelectrode array in diamond technology

Z. Gao; V. Carabelli; E. Carbone; E. Colombo; M. Dipalo; Ch. Manfredotti; A. Pasquarelli; M. Feneberg; K. Thonke; E. Vittone; E. Kohn 2009 IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering, 2009

We report on the development of a diamond-on-sapphire microelectrode quadrupole array, substituting the commonly used inert metal electrode material by nanocrystalline diamond (NCD). This allows to combine the transparency (desired for fluorescence analysis) with the properties of an inert quasi-metallically doped diamond electrode. The NCD film was nucleated by BEN (Bias Enhanced Nucleation) on double side polished sapphire substrates and ...


Comparison and discussion on potential mitigating measures regarding inductive interference of metallic pipelines

René Braunstein; Ernst Schmautzer; Gerald Propst Graz Electrical Systems for Aircraft, Railway and Ship Propulsion, 2010

This paper describes the actual problem of inductively interfered pipelines due to traction and short circuit currents of electric railways. At first a brief overview about calculation-formulas and standards is given. Furthermore the most important limits for induced pipe potentials regarding short time- (short circuit currents) and long time interference (normal operation traction currents) of the electric railway are mentioned. ...


Assessment of deteriorating reinforced concrete structures using artificial neural networks

N. Yasuda; T. Tsutsumi; T. Kawamura; S. Matsuho; W. Shiraki 1993 (2nd) International Symposium on Uncertainty Modeling and Analysis, 1993

An artificial neural network was used to assess deteriorating reinforced concrete (RC) structures using periodical inspection data for thermal power plants along the coast of Tokyo Bay arranged by the Tokyo Electric Power Company. In the analysis, the focus is on chloride-induced corrosion damage of RC structures. 13 input variables such as crack width, crack direction, number of cracks, etc. ...


Ion transport in encapsulants used in microcircuit packaging

L. Lantz; M. G. Pecht IEEE Transactions on Components and Packaging Technologies, 2003

Most semiconductor devices are encapsulated in epoxy molding compounds. These molding compounds contain ionic contaminants including chloride ions from epichlorohydrin used in the epoxidation of the resin and bromine ions incorporated into the resin as a flame retardant. Chloride ions are known to break down the protective oxide on the surface of aluminum metallization and accelerate corrosion. The encapsulant material ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Enclosure Design Guidelines

    This chapter contains sections titled: Metal Portions of Enclosures Should Be Connected to Chassis Ground (If this isn't possible, see III) Portions of Enclosures That Are Metal, and Are Not Insulated,and Are Connected to Chassis Ground, Should Be Kept 2.2 mm from Exposed Electronic Components or Lines Metal Portions of Enclosures That Aren't Connected to Chassis Ground and Are Not Insulated Must Be Kept At Least 2 cm Away From Exposed Electronic Components and Lines Avoid Sharp Edges on Metal Components Because They Encourage Secondary Arcs Design System Enclosures So an Operator Cannot Approach Closer Than 2 cm to Exposed Nongrounded Metal, Electronic Components, or Electronic Lines; or So a Chassis Grounded Object Is between the Operator and the Electronics (Ungrounded Screws Are an Especially Troublesome Path for ESD Entry Into a System) The Enclosures Should Not Constrict PWB Designs So Much That It Is Impossible to Include Sufficient Logic Ground Grid or Chassis Grounding Enclosure Designs Should Allow the I/O Devices to Remain Close to the I/O Connector and Each Other Try to Locate the I/O Cable Entry Point in a Central Location on Each Enclosure There Must Be a Provision for a Short, Low Corrosion Connection of Each Cable Shield to the Chassis; This Connection Must Be Within 4 cm of the Cable Entry Point(s) Connectors Must Be Within 4 cm of the Cable Entry and Chassis Connection Point(s), So the Unshielded Portion of the Cable Doesn't Exceed 4 cm If a Cable Has a Ferrite Added, this Ferrite Must Also Be Near the Cable Entry Point No Slot or Hole Should Have a Long Dimension Greater Than 2cm Use Several Small O penings Instead of One Large Opening The Space between Openings Must Equal the Largest Dimension of the Opening Don't Place a Slot Near a Chassis Cable Ground Connection Point, or Near Sensitive Signal Lines or Devices Electrically Fasten the Shielding Seams at Several Points to Reduce the Slot Length That Can Exist (Screws, Clips, etc.) If Necessary, Use Conductive Gaskets to Fill Gaps That Remain in Seams Gaskets and Fasteners Both Should Be Chosen to Keep Corrosion to a Minimum (See the corrosion discussion in Chapter 5) If Foil Tape Is Used, It Must Make Electrical Contact With the Rest of the Shield A Shield Seam Should Be Overlapped, and the Overlap Should Be At Least Five Times the Gap Width, and Equal to the Distance between Contact Points Bonding Straps Used to Connect Various Chassis, or Enclosure Sections, Must Be Kept Short and Kept Away from Sensitive Electronics. Bonding Straps Should Also Be Wide; It Is Recommended That Bonding Straps Be No More Than Five Times Longer Than They Are Wide This chapter contains sections titled: Summary of Enclosure Design Guidelines

  • Characteristics of Cable Materials

    This chapter contains sections titled: Introduction Metallic Conductors Conductor and Insulation Semiconducting Shields Insulation Materials for Protective Coverings Armoring Materials Coverings for Corrosion Protection Conclusion Glossary of Cable Materials Technology This chapter contains sections titled: References

  • No title

    Decreasing the magnetic field signature of a naval vessel will reduce its susceptibility to detonating naval influence mines and the probability of a submarine being detected by underwater barriers and maritime patrol aircraft. Both passive and active techniques for reducing the magnetic signatures produced by a vessel's ferromagnetism, roll-induced eddy currents, corrosion- related sources, and stray fields are presented. Mathematical models of simple hull shapes are used to predict the levels of signature reduction that might be achieved through the use of alternate construction materials. Also, the process of demagnetizing a steel-hulled ship is presented, along with the operation of shaft-grounding systems, paints, and alternate configurations for power distribution cables. In addition, active signature reduction technologies are described, such as degaussing and deamping, which attempt to cancel the fields surrounding a surface ship or submarine rather than eliminate its source. able of Contents: Introduction / Passive Magnetic Silencing Techniques / Active Signature Compensation / Summary

  • Corrosion of Refractories by Liquid Slags and Glasses

    This chapter contains sections titled: Introduction, Basic for Experimental Evaluation, Experimental Arrangements, Model Systems, Conclusions, References, Acknowledgement

  • Mechanical Performance and Reliability

    This chapter contains sections titled: Introduction, Component Reliability, Component Failure Rates, System Reliability, Comparison of System Reliabilities, System Maintenance, Control Systems, Corrosion and Scaling, Conclusions, References

  • Bonding Principles

    This chapter contains sections titled: Objectives of Bonding Bond Impedance Requirements Types of Bonds Surface Treatment Dissimilar Metals Consideration: Corrosion Control Bibliography

  • Amorphous Metallizations for HighTemperature Semiconductor Device Applications

    In this paper we present the initial results of work on a new class of semiconductor metallizations which appear to hold great promise as primary metallizations and diffusion barriers for high-temperature device applications. These metallizations consist of sputter-deposited films of high- Tg amorphous-metal alloys which (primarily because of the absence of grain boundaries) exhibit exceptionally good corrosion resistance and low diffusion coefficients. Amorphous films of the alloys Ni-Nb, Ni-Mo, W-Si, and Mo-Si have been deposited on Si, GaAs, GaP, and various insulating substrated, The films adhere extremely well to the substrates and remain amorphous during thermal cycling to at least 500°C. Rutherford Backscattering (RBS) and Auger Electron Spectroscopy (AES) measurements indicate atomic diffusivities in the 10- 19 cm 2/S range at 450°C.



Standards related to Corrosion

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IEEE Guide for Detection, Mitigation, and Control of Concentric Neutral Corrosion in Medium-Voltage Underground Cables

The primary focus of this guide is unjacketed, underground distribution cable installed direct buried or in conduit. The causes of corrosion in cable concentric neutral wires and straps and the methods available to detect this corrosion are described. The purpose of the concentric neutral and consequences of significant loss of the concentric neutral are discussed. Recommendations are made for the ...