Corrosion

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Corrosion is the disintegration of an engineered material into its constituent atoms due to chemical reactions with its surroundings. (Wikipedia.org)






Conferences related to Corrosion

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2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

ICMMT2018 is intended to provide a broad international forum and nice opportunity for the scientists and engineers to present their new ideas and exchange information on research.


2017 12th International Forum on Strategic Technology (IFOST)

New materials and nanotechnologies , Information and communication technologies , Information and communication technologies , Power engineering and electric power electronics , etc


2017 13th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD)

International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD) is a premier international forum for scientists and researchers to present the state of the art of data mining and intelligent methods inspired from nature, particularly biological, linguistic, and physical systems, with applications to computers, circuits, systems, control, robotics, communications, and more.

  • 2016 12th International Conference on Natural Computation and 13th Fuzzy Systems and Knowledge Discovery (ICNC-FSKD)

    International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD) is a premier international forum for scientists and researchers to present the state of the art of data mining and intelligent methods inspired from nature, particularly biological, linguistic, and physical systems, with applications to computers, circuits, systems, control, robotics, communications, and more.

  • 2015 12th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy sets, Bioinformatics and Bio-Medical Informatics, Genomics, Proteomics, Big Data, Databases and Applications, Semi-Structured/Unstructured Data Mining, Multimedia Mining, Web and Text Data Mining, Graphic Model Discovery, Data Warehousing and OLAP, Pattern Recognition and Diagnostics, etc..

  • 2014 11th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy sets, rough sets, Statistical methods, Parallel/ Distributed data mining, KDD Process and human interaction, Knowledge management, Knowledge visualization, Reliability and robustness, Knowledge Discovery in Specific Domains, High dimensional data, Temporal data, Data streaming, Scientific databases, Semi-structured/unstructured data, Multimedia, Text, Web and the Internet, Graphic model discovery, Software warehouse and software mining, Data engineering, Communications and networking, Software engineering, Distributed systems and computer hardware

  • 2013 10th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy sets, rough sets, Statistical methods, Parallel/ Distributed data mining, KDD Process and human interaction, Knowledge management, Knowledge visualization, Reliability and robustness, Knowledge Discovery in Specific Domains, High dimensional data, Temporal data, Data streaming, Scientific databases, Semi-structured/unstructured data, Multimedia, Text, Web and the Internet, Graphic model discovery, Software warehouse and software mining, Data engineering, Communications and networking, Software engineering, Distributed systems and computer hardware, etc.

  • 2012 9th International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy theory and foundations; stability of fuzzy systems; fuzzy methods and algorithms; fuzzy image, speech and signal processing; multimedia; fuzzy hardware and architectures; data mining.

  • 2011 Eighth International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy theory and foundations; stability of fuzzy systems; fuzzy methods and algorithms; fuzzy image, speech and signal processing; multimedia; fuzzy hardware and architectures; data mining.

  • 2010 Seventh International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD is an international forum on fuzzy systems and knowledge discovery. Specific topics include fuzzy theory and foundations; stability of fuzzy systems; fuzzy methods and algorithms; fuzzy image, speech and signal processing; multimedia; fuzzy hardware and architectures; data mining.

  • 2007 International Conference on Fuzzy Systems and Knowledge Discovery (FSKD)

    FSKD '07 covers all aspects of fuzzy systems and knowledge discovery, including recent theoretical advances and interesting applications, for example, fuzzy theory and models, mathematical foundation of fuzzy systems, fuzzy image/signal processing, fuzzy control and robotics, fuzzy hardware and architectures, fuzzy systems and the internet, fuzzy optimization and modeling, fuzzy decision and support, classification, clustering, statistical methods, knowledge etc.


2017 18th International Conference on Electronic Packaging Technology (ICEPT)

The conference will exchange the latest developments in the field of electronic packaging technology through exhibitions, special lectures, special reports, thematic forums, club reports, posters and other forms of experience


2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology. The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems, Fabrication and Packaging, Mechanical and Physical Sensors, Materials and Characterization, Design, Simulation and Theory, Actuators, Optical MEMS, RF MEMS, Nanotechnology, Energy and Power


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Periodicals related to Corrosion

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


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Xplore Articles related to Corrosion

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Timewise increases in contact resistance due to surface roughness and corrosion

M. D. Bryant; M. Jin Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

To understand failure and estimate connector reliability a connector model was made in which two mated rough copper surfaces were subjected to ingression and corrosive attack by atmospheric oxygen. The rough surface segments the connector contact area into many small discrete areas (a-spots) through which currents flow. The initial a-spot contact radii ae (formed as metal-to-metal bridges by mating surface ...


Multispot model of contacts based on surface features

R. D. Malucci Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

A model to account for long-term degradation of stationary contacts is proposed. The model is based on introducing a third level of multispot constrictions on the surface of each asperity. The results of simulating fretting corrosion provided good agreement with existing test data. In the latter case it was found that variation of the basic parameter which represents film breakdown ...


Evaluation of different contact-aid compounds for aluminum-to-copper connections

M. Braunovic Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

Whether the contact-aid compounds commonly used for aluminum-to-aluminum connections can also be used for aluminum-to-copper joints is investigated. The evaluation is based on the contact-resistance-force relationship, spreading tendency, protection ability against fretting, and performance of lubricated bolted joints under current-cycling conditions. In addition, the effectiveness of bimetallic aluminum-copper transition contact plates, commonly used in Europe for jointing aluminum to copper, ...


Improved humidity resistance of leaded packages through solder dip process

Yeoh Lai Seng; Law Che Seong; Ng Eng Keat; Gooi Boon Hooi; Francis Classe; Susan Li 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011

Humid atmospheres may pose a critical reliability hazard in microelectronic packages, as they are comprised of metals prone to moisture-induced galvanic corrosion. Galvanic corrosion is a global issue that is affecting variety of devices in semiconductor industry. In this paper, we simulated galvanic corrosion via unbiased HAST on flash memory encapsulated in plastic lead frame packages with tin-plated copper leads. ...


Testing of power connectors-influence of testing parameters

A. Oberg; K. -E. Olsson; A. Bohlin Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

The basic principles of accelerated life testing of electrical contacts are discussed, with special emphasis on aging mechanisms and testing parameters. The testing parameters are described, and their influence on the aging behavior for a given connector type is evaluated. The influence on the aging characteristics of bolted Al/Cu high-current connectors by different testing parameters is studied. The parameters studied ...


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Educational Resources on Corrosion

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eLearning

Timewise increases in contact resistance due to surface roughness and corrosion

M. D. Bryant; M. Jin Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

To understand failure and estimate connector reliability a connector model was made in which two mated rough copper surfaces were subjected to ingression and corrosive attack by atmospheric oxygen. The rough surface segments the connector contact area into many small discrete areas (a-spots) through which currents flow. The initial a-spot contact radii ae (formed as metal-to-metal bridges by mating surface ...


Multispot model of contacts based on surface features

R. D. Malucci Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

A model to account for long-term degradation of stationary contacts is proposed. The model is based on introducing a third level of multispot constrictions on the surface of each asperity. The results of simulating fretting corrosion provided good agreement with existing test data. In the latter case it was found that variation of the basic parameter which represents film breakdown ...


Evaluation of different contact-aid compounds for aluminum-to-copper connections

M. Braunovic Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

Whether the contact-aid compounds commonly used for aluminum-to-aluminum connections can also be used for aluminum-to-copper joints is investigated. The evaluation is based on the contact-resistance-force relationship, spreading tendency, protection ability against fretting, and performance of lubricated bolted joints under current-cycling conditions. In addition, the effectiveness of bimetallic aluminum-copper transition contact plates, commonly used in Europe for jointing aluminum to copper, ...


Improved humidity resistance of leaded packages through solder dip process

Yeoh Lai Seng; Law Che Seong; Ng Eng Keat; Gooi Boon Hooi; Francis Classe; Susan Li 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011

Humid atmospheres may pose a critical reliability hazard in microelectronic packages, as they are comprised of metals prone to moisture-induced galvanic corrosion. Galvanic corrosion is a global issue that is affecting variety of devices in semiconductor industry. In this paper, we simulated galvanic corrosion via unbiased HAST on flash memory encapsulated in plastic lead frame packages with tin-plated copper leads. ...


Testing of power connectors-influence of testing parameters

A. Oberg; K. -E. Olsson; A. Bohlin Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

The basic principles of accelerated life testing of electrical contacts are discussed, with special emphasis on aging mechanisms and testing parameters. The testing parameters are described, and their influence on the aging behavior for a given connector type is evaluated. The influence on the aging characteristics of bolted Al/Cu high-current connectors by different testing parameters is studied. The parameters studied ...


More eLearning Resources

IEEE.tv Videos

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IEEE-USA E-Books

  • Enclosure Design Guidelines

    This chapter contains sections titled: * Metal Portions of Enclosures Should Be Connected to Chassis Ground (If this isn't possible, see III) * Portions of Enclosures That Are Metal, and Are Not Insulated,and Are Connected to Chassis Ground, Should Be Kept 2.2 mm from Exposed Electronic Components or Lines * Metal Portions of Enclosures That Aren't Connected to Chassis Ground and Are Not Insulated Must Be Kept At Least 2 cm Away From Exposed Electronic Components and Lines * Avoid Sharp Edges on Metal Components Because They Encourage Secondary Arcs * Design System Enclosures So an Operator Cannot Approach Closer Than 2 cm to Exposed Nongrounded Metal, Electronic Components, or Electronic Lines; or So a Chassis Grounded Object Is between the Operator and the Electronics (Ungrounded Screws Are an Especially Troublesome Path for ESD Entry Into a System) * The Enclosures Should Not Constrict PWB Designs So Much That It Is Impossible to Include Sufficient Logic Ground Grid or Chassis Grounding * Enclosure Designs Should Allow the I/O Devices to Remain Close to the I/O Connector and Each Other * Try to Locate the I/O Cable Entry Point in a Central Location on Each Enclosure * There Must Be a Provision for a Short, Low Corrosion Connection of Each Cable Shield to the Chassis; This Connection Must Be Within 4 cm of the Cable Entry Point(s) * Connectors Must Be Within 4 cm of the Cable Entry and Chassis Connection Point(s), So the Unshielded Portion of the Cable Doesn't Exceed 4 cm * If a Cable Has a Ferrite Added, this Ferrite Must Also Be Near the Cable Entry Point * No Slot or Hole Should Have a Long Dimension Greater Than 2cm * Use Several Small Openings Instead of One Large Opening * The Space between Openings Must Equal the Largest Dimension of the Opening * Don't Place a Slot Near a Chassis Cable Ground Connection Point, or Near Sensitive Signal Lines or Devices * Electrically Fasten the Shielding Seams at Several Points to Reduce the Slot Length That Can Exist (Screws, Clips, etc.) * If Necessary, Use Conductive Gaskets to Fill Gaps That Remain in Seams * Gaskets and Fasteners Both Should Be Chosen to Keep Corrosion to a Minimum (See the corrosion discussion in Chapter 5) * If Foil Tape Is Used, It Must Make Electrical Contact With the Rest of the Shield * A Shield Seam Should Be Overlapped, and the Overlap Should Be At Least Five Times the Gap Width, and Equal to the Distance between Contact Points * Bonding Straps Used to Connect Various Chassis, or Enclosure Sections, Must Be Kept Short and Kept Away from Sensitive Electronics. Bonding Straps Should Also Be Wide; It Is Recommended That Bonding Straps Be No More Than Five Times Longer Than They Are Wide This chapter contains sections titled: * Summary of Enclosure Design Guidelines

  • Reduction of a Ship's Magnetic Field Signatures

    Decreasing the magnetic field signature of a naval vessel will reduce its susceptibility to detonating naval influence mines and the probability of a submarine being detected by underwater barriers and maritime patrol aircraft. Both passive and active techniques for reducing the magnetic signatures produced by a vessel's ferromagnetism, roll-induced eddy currents, corrosion- related sources, and stray fields are presented. Mathematical models of simple hull shapes are used to predict the levels of signature reduction that might be achieved through the use of alternate construction materials. Also, the process of demagnetizing a steel-hulled ship is presented, along with the operation of shaft-grounding systems, paints, and alternate configurations for power distribution cables. In addition, active signature reduction technologies are described, such as degaussing and deamping, which attempt to cancel the fields surrounding a surface ship or submarine rather than eliminate its source. able of Contents: Introduction / Passive Magnetic Silencing Techniques / Active Signature Compensation / Summary

  • Characteristics of Cable Materials

    This chapter contains sections titled: * Introduction * Metallic Conductors * Conductor and Insulation Semiconducting Shields * Insulation * Materials for Protective Coverings * Armoring Materials * Coverings for Corrosion Protection * Conclusion * Glossary of Cable Materials Technology This chapter contains sections titled: * References

  • Amorphous Metallizations for HighTemperature Semiconductor Device Applications

    In this paper we present the initial results of work on a new class of semiconductor metallizations which appear to hold great promise as primary metallizations and diffusion barriers for high-temperature device applications. These metallizations consist of sputter-deposited films of high- Tg amorphous-metal alloys which (primarily because of the absence of grain boundaries) exhibit exceptionally good corrosion resistance and low diffusion coefficients. Amorphous films of the alloys Ni-Nb, Ni-Mo, W-Si, and Mo-Si have been deposited on Si, GaAs, GaP, and various insulating substrated, The films adhere extremely well to the substrates and remain amorphous during thermal cycling to at least 500¿¿C. Rutherford Backscattering (RBS) and Auger Electron Spectroscopy (AES) measurements indicate atomic diffusivities in the 10- 19 cm 2/S range at 450¿¿C.

  • Water Treatment

    This chapter discusses the various types of water streams utilized in an electric generation facility. Power plants use water in many systems for many different functions. The quality of the water directly impacts the ability of the system to function reliably. For example, in the power plant thermal cycle, the hardness of the water is critical to the heat transfer capability of the tubes in the boiler. Treatment of the water systems at the power plant utilizes various processes or series of processes depending on the type of material being removed from the water system and for the service that it will be placed in. The processes include the following: sedimentation, clarification, filtration, softening, oxidation, degasification, and demineralization. Demineralization can further be broken down into the processes used to remove minerals and ions and these three processes are evaporation, ion exchange, and reverse osmosis.

  • Mechanical Performance and Reliability

    This chapter contains sections titled: Introduction, Component Reliability, Component Failure Rates, System Reliability, Comparison of System Reliabilities, System Maintenance, Control Systems, Corrosion and Scaling, Conclusions, References

  • Bonding Principles

    This chapter contains sections titled: * Objectives of Bonding * Bond Impedance Requirements * Types of Bonds * Surface Treatment * Dissimilar Metals Consideration: Corrosion Control * Bibliography

  • Corrosion of Refractories by Liquid Slags and Glasses

    This chapter contains sections titled: Introduction, Basic for Experimental Evaluation, Experimental Arrangements, Model Systems, Conclusions, References, Acknowledgement



Standards related to Corrosion

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IEEE Guide for Detection, Mitigation, and Control of Concentric Neutral Corrosion in Medium-Voltage Underground Cables

The primary focus of this guide is unjacketed, underground distribution cable installed direct buried or in conduit. The causes of corrosion in cable concentric neutral wires and straps and the methods available to detect this corrosion are described. The purpose of the concentric neutral and consequences of significant loss of the concentric neutral are discussed. Recommendations are made for the ...