Conferences related to Bonding

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.


2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Advanced Electronics Packaging Technologies.

  • 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2009 11th Electronics Packaging Technology Conference - (EPTC 2009)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2008 10th Electronics Packaging Technology Conference - (EPTC 2008)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.


2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses on the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging, Optoelectronics Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    IEEE CPMT Symposium Japan provides component, packaging, and manufacturing researchers/engineers who wish to extend their activities beyond borders with opportunities to exchange technical information and perspective.

  • 2008 9th VLSI Packaging Workshop of Japan

    The VLSI Packaging Workshop in Japan focuses the most advanced packaging technology for the semiconductor devices, such as System in a Package (SiP), 3D Packaging & COC (Chip on Chip) and Wafer Level CSP within Materials and Electrical Performance & Thermal Management.


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Periodicals related to Bonding

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Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...




Xplore Articles related to Bonding

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30 MHz medical imaging arrays incorporating 2-2 composites

T. Ritter; K. K. Shung; X. Geng; H. Wang; T. R. Shrout 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102), 1998

Methods for fabricating and modeling high frequency 2-2 composites and arrays are presented. The composites are suitable for arrays and small aperture single element devices. Coupling coefficients above 0.65 and lateral mode frequencies near 60 MHz have been achieved. Two prototype 4 element 30 MHz linear arrays were designed and built using this composite. Backing and matching layers were fabricated ...


Ipolythiophene derivatives having crown-ethereal subunit prepared by dehalogenation polycondensation with ni(0)-complex

Y. Miyazaki; T. Yamamoto International Conference on Science and Technology of Synthetic Metals, 1994

First Page of the Article ![](/xploreAssets/images/absImages/00835307.png)


AlGaInP-sapphire glue bonded light-emitting diodes

Shoou-Jinn Chang; Yan-Kuin Su; T. Yang; Chih-Sung Chang; Tzer-Peng Chen; Kuo-Hsin Huang IEEE Journal of Quantum Electronics, 2002

A novel method was proposed to glue an AlGaInP-GaAs light-emitting diode (LED) onto a transparent sapphire substrate. The absorbing GaAs was subsequently removed by selective wet etching. It was found that the emission efficiency could reach 401 m/W under 20-mA current injection for the 622-nm glue bonded (GB) AlGaInP-sapphire LED. It was also found that these GB LEDs are highly ...


An investigation of corrosion on integrated circuits via pressure-temperature-humidity-bias stressing

D. VanOverloop IEEE Transactions on Reliability, 1990

Pressure-temperature-humidity-bias (PTHB) is a consistent, repeatable stress capable of reducing qualification and evaluation cycle time through acceleration of moisture- and bias-induced failure mechanisms. Moreover, PTHB is more capable of finding susceptibility to corrosion than either THB or autoclave stressing, as illustrated by the historical monitor and precondition stressing results. Therefore, PTHB was implemented as the primary humidity stress in environmental ...


Horizontal Estimation for the Solution of Multitarget Multisensor Tracking Problems

Alan M. Fahmy; Harold A. Titus 1987 American Control Conference, 1987

In recent years, there has been a considerable increase in both the variety and number of sensors which need to be tied together. A distributed estimation architecture for Distributed Sensors Networks (DSN) is introduced. It is called Horizontal Estimation Architecture (HEA). The term horizontal is used to imply that the geographically dispersed nodes do not differ in rank and are ...


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Educational Resources on Bonding

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eLearning

30 MHz medical imaging arrays incorporating 2-2 composites

T. Ritter; K. K. Shung; X. Geng; H. Wang; T. R. Shrout 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102), 1998

Methods for fabricating and modeling high frequency 2-2 composites and arrays are presented. The composites are suitable for arrays and small aperture single element devices. Coupling coefficients above 0.65 and lateral mode frequencies near 60 MHz have been achieved. Two prototype 4 element 30 MHz linear arrays were designed and built using this composite. Backing and matching layers were fabricated ...


Ipolythiophene derivatives having crown-ethereal subunit prepared by dehalogenation polycondensation with ni(0)-complex

Y. Miyazaki; T. Yamamoto International Conference on Science and Technology of Synthetic Metals, 1994

First Page of the Article ![](/xploreAssets/images/absImages/00835307.png)


AlGaInP-sapphire glue bonded light-emitting diodes

Shoou-Jinn Chang; Yan-Kuin Su; T. Yang; Chih-Sung Chang; Tzer-Peng Chen; Kuo-Hsin Huang IEEE Journal of Quantum Electronics, 2002

A novel method was proposed to glue an AlGaInP-GaAs light-emitting diode (LED) onto a transparent sapphire substrate. The absorbing GaAs was subsequently removed by selective wet etching. It was found that the emission efficiency could reach 401 m/W under 20-mA current injection for the 622-nm glue bonded (GB) AlGaInP-sapphire LED. It was also found that these GB LEDs are highly ...


An investigation of corrosion on integrated circuits via pressure-temperature-humidity-bias stressing

D. VanOverloop IEEE Transactions on Reliability, 1990

Pressure-temperature-humidity-bias (PTHB) is a consistent, repeatable stress capable of reducing qualification and evaluation cycle time through acceleration of moisture- and bias-induced failure mechanisms. Moreover, PTHB is more capable of finding susceptibility to corrosion than either THB or autoclave stressing, as illustrated by the historical monitor and precondition stressing results. Therefore, PTHB was implemented as the primary humidity stress in environmental ...


Horizontal Estimation for the Solution of Multitarget Multisensor Tracking Problems

Alan M. Fahmy; Harold A. Titus 1987 American Control Conference, 1987

In recent years, there has been a considerable increase in both the variety and number of sensors which need to be tied together. A distributed estimation architecture for Distributed Sensors Networks (DSN) is introduced. It is called Horizontal Estimation Architecture (HEA). The term horizontal is used to imply that the geographically dispersed nodes do not differ in rank and are ...


More eLearning Resources

IEEE-USA E-Books

  • The Chemoton: A Model for the Origin of Long RNA Templates.

    How could genomes have arisen? Two models based on Ganti's Chemoton are presented which demonstrate that under increasingly realistic assumptions, template replication is facilitated without the need of enzymes. It can do this because the template state is stoichiometrically coupled to the cell cycle. The first model demonstrates that under certain kinetic and environmental conditions there is an optimal template length, i.e. one which facilitates fastest replication of the Chemoton. This is in contradiction to previous findings by Csendes who claimed that longer templates allowed more rapid replication. In the second model, hydrogen bonding, phosphodiester bonding and template structure is modeled, so allowing dimer and oligomer formation, hydrolysis and elongation of templates. Here, monomer concentration oscillates throughout the cell cycle so that double strands form at low monomer concentrations and separate at high monomer concentrations. Therefore, this simulation provides evidence that a protocell with Chemoton organization is a plausible mechanism for the formation of long templates, a notorious problem for studies of the origin of life.

  • Materials and Processing Considerations

    This chapter contains sections titled: Introduction Substrate Materials Dielectric Materials Metallization Planarization Chip Bonding Technologies Die Attach Summary This chapter contains sections titled: Exercises References

  • Salient Pole Rotor Winding Failure Mechanisms and Repair

    Modern salient pole winding designs use aramid paper ground and turn insulation in strip-on-edge windings, resin-bonded glass laminate pole washers DacronTM and glass-covered high-temperature enamel turn insulation in wire wound poles, and thermosetting bonding resins. Insulation aging from thermal cycling occurs mainly in synchronous motors and generators that are started and stopped frequently. Salient pole rotor windings, especially strip-on-edge types, are generally susceptible to failure from contamination by conducting materials because they rely on adequate creepage distances between bare copper conductors to prevent shorts. Abrasive dust from the surrounding atmosphere carried into the interior of a motor or generator by cooling air will abrade the rotor winding insulation surfaces. Among the most common causes of failure in salient pole rotor windings are the continuous centrifugal forces imposed on them by rotation and the cyclic centrifugal forces induced by starting and stopping.

  • Section 8: Valves and Pumps

    This chapter contains sections titled: A Microminiature Electric-to-Fluidic Valve The Fabrication of Integrated Mass Flow Controllers Normally Close Microvalve and Micropump Fabricated on a Silicon Wafer A Thennopneumatic Micropump Based on Micro-Engineering Techniques Variable-Flow Micro-Valve Structure Fabricated with Silicon Fusion Bonding A Pressure-Balanced Electrostatically-Actuated Microvalve Micromachined Silicon Microvalve

  • Grounding, Shielding, and BondingThis chapter is contributed by Sisir K. Das, SAMEER Centre for Electromagnetics, Madras 600 013, India.

    This chapter contains sections titled: EMC Technology Grounding Shielding Electrical Bonding Summary Illustrative Examples References Assignments

  • An Evolvable Artificial Chemistry Featuring Continuous Physics and Discrete Reactions

    This paper describes an artificial chemistry featuring atoms and molecules moving and colliding in a continuous manner in a viscous fluid filling a 2D cellular space. Chemical reactions are mappings of discrete cellular configurations to parameterized actions on atoms. Actions allow atom creation and destruction, bonding and unbonding to make and break molecules, orientation, type change, and propulsion. Actions are easily added in this extensible model. An example involving a complex "foraging" reaction is provided as a demonstration of the capabilities of the framework. The reaction rules can be evolved by a genetic algorithm to exhibit a desired set of reactions. A portion of the foraging reaction was evolved to demonstrate this.

  • Equipment

    This chapter contains sections titled: General Design Location in Underground Structures Installation Grounding and Bonding Identification

  • Progress in Prediction of Oxidation States of Cysteines via Computational Approaches

    Predicting the oxidation states of cysteines computationally usually involves first extracting commonalities from the available data obtained by observation or statistical analysis, or utilizing artificial intelligence. Then the acquired knowledge is applied to sequences with the bonding states unknown. Accuracy as calculation was based on the percentage of correct predictions among all test cases. To date, artificial intelligence achieves the highest accuracy among all computational methods attempted. Here, the authors surveyed 15 research efforts published since the 1980s in predicting cysteine oxidation states via computational methods, from the initial attempt using neural networks to the present state of the art. Most of these research efforts have reported prediction accuracy, although some of them used datasets that differed from the others. The essential information used for the predictions was first summarized all to determine the factors impacting the problem.

  • Social Capital, Networks, and Communities of Knowledge

    This chapter contains sections titled: Introduction, Interactions Between Bonding and Bridging Social Capital, Mapping SC in Knowledge Economies, Conclusion, Notes, References

  • Bonding Principles

    This chapter contains sections titled: Objectives of Bonding Bond Impedance Requirements Types of Bonds Surface Treatment Dissimilar Metals Consideration: Corrosion Control Bibliography



Standards related to Bonding

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No standards are currently tagged "Bonding"