Conferences related to Bonding

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.


2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Advanced Electronics Packaging Technologies.

  • 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2009 11th Electronics Packaging Technology Conference - (EPTC 2009)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2008 10th Electronics Packaging Technology Conference - (EPTC 2008)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.


2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses on the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging, Optoelectronics Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    IEEE CPMT Symposium Japan provides component, packaging, and manufacturing researchers/engineers who wish to extend their activities beyond borders with opportunities to exchange technical information and perspective.

  • 2008 9th VLSI Packaging Workshop of Japan

    The VLSI Packaging Workshop in Japan focuses the most advanced packaging technology for the semiconductor devices, such as System in a Package (SiP), 3D Packaging & COC (Chip on Chip) and Wafer Level CSP within Materials and Electrical Performance & Thermal Management.


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Periodicals related to Bonding

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Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...




Xplore Articles related to Bonding

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Theoretical verification of microwave-induced chemistry on the basis of density-functional-theory-based molecular modeling

Shozo Yanagida; Takeko Matsumura 2016 Progress in Electromagnetic Research Symposium (PIERS), 2016

Microwave (MW) energy is becoming the most environment-friendly heating method for chemical synthesis because of higher yields and shorter reaction times. In general, efficient and effective chemical reactions start from ground-state molecules that are interacting bindingly via van der Waals and Coulombic interactions. On the other hand, molecular modeling based onmolecular mechanics (MM) and quantum mechanic calculation (QM) is a ...


The design and implement of Scene Management in 3D engine SR

Cao Xu-Yang; Zhang Yan-Feng; Gao Shun-De; Teng Ru-Min; Wang Xin 2010 International Conference on Mechanic Automation and Control Engineering, 2010

Scene Management is the spirit of the 3D engine. Its design is directly affects the efficiency of rendering and conflict detection. If we don't manage the object in the scene specially or we just use the link-list to manage the object simplify, all of the object in the scene need to be clipped, transformed, lighted and doing raster by the ...


High-power 1320-nm wafer-bonded VCSELs with tunnel junctions

V. Jayaraman; M. Mehta; A. W. Jackson; S. Wu; Y. Okuno; J. Piprek; J. E. Bowers IEEE Photonics Technology Letters, 2003

A new long-wavelength vertical-cavity surface-emitting laser structure is described that utilizes AlGaAs-GaAs mirrors bonded to AlInGaAs-InP quantum wells with an intracavity buried tunnel junction. This structure offers complete wavelength flexibility in the 1250-1650 nm fiber communication bands and reduces the high free-carrier losses and bonded junction voltage drops in previous devices. The intracavity contacts electrically bypass the bonded junctions to ...


Low-cost microbolometer with nano-scaled plasmonic absorbers for far infrared thermal imaging applications

Fabian Utermöhlen; Daniel B. Etter; David Borowsky; Ingo Herrmann; Christoph Schelling; Franz X. Hutter; Shen Hue Sun; Joachim N. Burghartz 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014

We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The performance loss due to the resulting backside illumination of the sensor is compensated by an optimized microbolometer design including nano-scaled plasmonic absorbers, a dedicated pixel geometry and ...


Tribology of a solid fluorocarbon, film on magnetic recording media

T. E. Karis; G. W. Tyndall; M. S. Crowder 1998 IEEE International Magnetics Conference (INTERMAG), 1998

First Page of the Article ![](/xploreAssets/images/absImages/00737104.png)


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Educational Resources on Bonding

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eLearning

Theoretical verification of microwave-induced chemistry on the basis of density-functional-theory-based molecular modeling

Shozo Yanagida; Takeko Matsumura 2016 Progress in Electromagnetic Research Symposium (PIERS), 2016

Microwave (MW) energy is becoming the most environment-friendly heating method for chemical synthesis because of higher yields and shorter reaction times. In general, efficient and effective chemical reactions start from ground-state molecules that are interacting bindingly via van der Waals and Coulombic interactions. On the other hand, molecular modeling based onmolecular mechanics (MM) and quantum mechanic calculation (QM) is a ...


The design and implement of Scene Management in 3D engine SR

Cao Xu-Yang; Zhang Yan-Feng; Gao Shun-De; Teng Ru-Min; Wang Xin 2010 International Conference on Mechanic Automation and Control Engineering, 2010

Scene Management is the spirit of the 3D engine. Its design is directly affects the efficiency of rendering and conflict detection. If we don't manage the object in the scene specially or we just use the link-list to manage the object simplify, all of the object in the scene need to be clipped, transformed, lighted and doing raster by the ...


High-power 1320-nm wafer-bonded VCSELs with tunnel junctions

V. Jayaraman; M. Mehta; A. W. Jackson; S. Wu; Y. Okuno; J. Piprek; J. E. Bowers IEEE Photonics Technology Letters, 2003

A new long-wavelength vertical-cavity surface-emitting laser structure is described that utilizes AlGaAs-GaAs mirrors bonded to AlInGaAs-InP quantum wells with an intracavity buried tunnel junction. This structure offers complete wavelength flexibility in the 1250-1650 nm fiber communication bands and reduces the high free-carrier losses and bonded junction voltage drops in previous devices. The intracavity contacts electrically bypass the bonded junctions to ...


Low-cost microbolometer with nano-scaled plasmonic absorbers for far infrared thermal imaging applications

Fabian Utermöhlen; Daniel B. Etter; David Borowsky; Ingo Herrmann; Christoph Schelling; Franz X. Hutter; Shen Hue Sun; Joachim N. Burghartz 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014

We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The performance loss due to the resulting backside illumination of the sensor is compensated by an optimized microbolometer design including nano-scaled plasmonic absorbers, a dedicated pixel geometry and ...


Tribology of a solid fluorocarbon, film on magnetic recording media

T. E. Karis; G. W. Tyndall; M. S. Crowder 1998 IEEE International Magnetics Conference (INTERMAG), 1998

First Page of the Article ![](/xploreAssets/images/absImages/00737104.png)


More eLearning Resources

IEEE-USA E-Books

  • Equipment

    This chapter contains sections titled: General Design Location in Underground Structures Installation Grounding and Bonding Identification

  • Progress in Prediction of Oxidation States of Cysteines via Computational Approaches

    Predicting the oxidation states of cysteines computationally usually involves first extracting commonalities from the available data obtained by observation or statistical analysis, or utilizing artificial intelligence. Then the acquired knowledge is applied to sequences with the bonding states unknown. Accuracy as calculation was based on the percentage of correct predictions among all test cases. To date, artificial intelligence achieves the highest accuracy among all computational methods attempted. Here, the authors surveyed 15 research efforts published since the 1980s in predicting cysteine oxidation states via computational methods, from the initial attempt using neural networks to the present state of the art. Most of these research efforts have reported prediction accuracy, although some of them used datasets that differed from the others. The essential information used for the predictions was first summarized all to determine the factors impacting the problem.

  • IEEE 802.11n higher data rates beyond 54 Mbit/s

    This chapter contains sections titled: Channel bonding Higher order modulation Multiple input multiple output (MIMO)

  • LowPressure OilFilled Power Transmission Cables

    This chapter contains sections titled: Introduction Elements of Oil-Filled Cable Design Cable Manufacture Tests Electrical Characteristics Principles of Oil Feeding Notes on Sheath Bonding Limitations of LPOF Cables Self-Contained High-Pressure Oil-Filled Cables Self-Contained Oil-Filled Cables for DC Application This chapter contains sections titled: References

  • Enclosure Design Guidelines

    This chapter contains sections titled: Metal Portions of Enclosures Should Be Connected to Chassis Ground (If this isn't possible, see III) Portions of Enclosures That Are Metal, and Are Not Insulated,and Are Connected to Chassis Ground, Should Be Kept 2.2 mm from Exposed Electronic Components or Lines Metal Portions of Enclosures That Aren't Connected to Chassis Ground and Are Not Insulated Must Be Kept At Least 2 cm Away From Exposed Electronic Components and Lines Avoid Sharp Edges on Metal Components Because They Encourage Secondary Arcs Design System Enclosures So an Operator Cannot Approach Closer Than 2 cm to Exposed Nongrounded Metal, Electronic Components, or Electronic Lines; or So a Chassis Grounded Object Is between the Operator and the Electronics (Ungrounded Screws Are an Especially Troublesome Path for ESD Entry Into a System) The Enclosures Should Not Constrict PWB Designs So Much That It Is Impossible to Include Sufficient Logic Ground Grid or Chassis Grounding Enclosure Designs Should Allow the I/O Devices to Remain Close to the I/O Connector and Each Other Try to Locate the I/O Cable Entry Point in a Central Location on Each Enclosure There Must Be a Provision for a Short, Low Corrosion Connection of Each Cable Shield to the Chassis; This Connection Must Be Within 4 cm of the Cable Entry Point(s) Connectors Must Be Within 4 cm of the Cable Entry and Chassis Connection Point(s), So the Unshielded Portion of the Cable Doesn't Exceed 4 cm If a Cable Has a Ferrite Added, this Ferrite Must Also Be Near the Cable Entry Point No Slot or Hole Should Have a Long Dimension Greater Than 2cm Use Several Small O penings Instead of One Large Opening The Space between Openings Must Equal the Largest Dimension of the Opening Don't Place a Slot Near a Chassis Cable Ground Connection Point, or Near Sensitive Signal Lines or Devices Electrically Fasten the Shielding Seams at Several Points to Reduce the Slot Length That Can Exist (Screws, Clips, etc.) If Necessary, Use Conductive Gaskets to Fill Gaps That Remain in Seams Gaskets and Fasteners Both Should Be Chosen to Keep Corrosion to a Minimum (See the corrosion discussion in Chapter 5) If Foil Tape Is Used, It Must Make Electrical Contact With the Rest of the Shield A Shield Seam Should Be Overlapped, and the Overlap Should Be At Least Five Times the Gap Width, and Equal to the Distance between Contact Points Bonding Straps Used to Connect Various Chassis, or Enclosure Sections, Must Be Kept Short and Kept Away from Sensitive Electronics. Bonding Straps Should Also Be Wide; It Is Recommended That Bonding Straps Be No More Than Five Times Longer Than They Are Wide This chapter contains sections titled: Summary of Enclosure Design Guidelines

  • Grounding, Shielding, and BondingThis chapter is contributed by Sisir K. Das, SAMEER Centre for Electromagnetics, Madras 600 013, India.

    This chapter contains sections titled: EMC Technology Grounding Shielding Electrical Bonding Summary Illustrative Examples References Assignments

  • Cable in Underground Structures

    This chapter contains sections titled: General Installation Grounding and Bonding Fireproofing Communication Cables Containing Special Supply Circuits

  • Hybrid A/D Converter for 200C Operation

    This paper describes the design and development of a high performance hybrid 12 bit analog to digital converter, which will operate reliably at 200°C. A product of this type was found to be necessary in areas such as geothermal probing, oil-well logging, jet engine and nuclear reactor monitoring, and other appl ications where the environments may reach temperatures of up to 200°C. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical re1 iabil ity of hybrid circuits at 200°C. Because the circuit design of the A/D converter involved both digital and linear circuitry, this produced an opportunity to evaluate the performance of both technologies at 200°C. Initial mechanical failure modes led to researching more reliable methods of wire bonding and die attachment. The result of this work was a 12 bit A/D converter which will operate at 200°C with .05% linearity, 1% accuracy, 350 Sec conversion time, and only 455mW power consumption. This product also necessitated the development oof a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This sytem totally eliminates the formation of intermetallics at the bonding interface which can lead to bond failure.

  • Bonding as an Emergent Phenomenon in an Abstract Artificial Chemistry

    In this article we describe an implementation of a very simple toy artificial chemistry originally proposed as a "Gedanken" model by Groß and McMullin. They predicted that this model would have a number of interesting properties including emergent bonding, and top-down constraints on bondstability. We found that not all of the original claims could actually be verified.

  • Materials and Processing Considerations

    This chapter contains sections titled: Introduction Substrate Materials Dielectric Materials Metallization Planarization Chip Bonding Technologies Die Attach Summary This chapter contains sections titled: Exercises References



Standards related to Bonding

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No standards are currently tagged "Bonding"