Conferences related to Bonding

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.


2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Advanced Electronics Packaging Technologies.

  • 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2009 11th Electronics Packaging Technology Conference - (EPTC 2009)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2008 10th Electronics Packaging Technology Conference - (EPTC 2008)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.


2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses on the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging, Optoelectronics Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    IEEE CPMT Symposium Japan provides component, packaging, and manufacturing researchers/engineers who wish to extend their activities beyond borders with opportunities to exchange technical information and perspective.

  • 2008 9th VLSI Packaging Workshop of Japan

    The VLSI Packaging Workshop in Japan focuses the most advanced packaging technology for the semiconductor devices, such as System in a Package (SiP), 3D Packaging & COC (Chip on Chip) and Wafer Level CSP within Materials and Electrical Performance & Thermal Management.


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Periodicals related to Bonding

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Microelectromechanical Systems, Journal of

A journal covering Microsensing, Microactuation, Micromechanics, Microdynamics, and Microelectromechanical Systems (MEMS). Contains articles on devices with dimensions that typically range from macrometers to millimeters, microfabrication techniques, microphenomena; microbearings, and microsystems; theoretical, computational, modeling and control results; new materials and designs; tribology; microtelemanipulation; and applications to biomedical engineering, optics, fluidics, etc. The Journal is jointly sponsored by the IEEE Electron Devices ...


Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...


Quantum Electronics, IEEE Journal of

Generation, amplification, modulation, detection, waveguiding, or techniques and effects that can affect the propagation characteristics of coherent electromagnetic radiation having submillimeter and shorter wavelengths


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.




Xplore Articles related to Bonding

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Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


Test of a bond-correction formula for ultrasonic velocity measurement

G. Mozurkewich IEEE 1992 Ultrasonics Symposium Proceedings, 1992

A formula for the shift of a resonance frequency induced by a bond of nonvanishing thickness is tested. Experiments are performed on a solid rod of polycrystalline nickel that is machined into three segments, representing specimen, bond, and transducer. Acoustic waves are launched and detected magnetostrictively. Measured patterns of frequency shift vs. frequency for various lengths and diameters of the ...


134/spl deg/ C continuous-wave operation of a 1.33-/spl mu/m wafer-bonded VCSEL

M. Mehta; V. Jayaraman; A. Jackson; S. Wu; Y. Okuno; J. Piprek; J. E. Bowers Lasers and Electro-Optics, 2003. CLEO '03. Conference on, 2003

We demonstrate the first long-wavelength VCSEL to operate continuous-wave at or above 130/spl deg/ C and show /spl sim/2 mW continuous-wave output power at room temperature in the 1290-1360 nm range.


Conformation and motion of monolayer lubricant molecule on magnetic disks

K. Fukuzawa; S. Itoh; K. Suzuki; Y. Kawai; Hedong Zhang; Y. Mitsuya IEEE Transactions on Magnetics, 2005

The conformation and diffusive motion of molecules of monolayer perfluoropolyether lubricants on magnetic disks have been clarified by investigating surface energy and spreading characteristics. A mobile molecule lies flat on the disk surface and a bonded molecule lies less flat than a mobile one. In addition, a model for the diffusive motion of the mobile molecule is presented. The diffusive ...


Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques

Shuming T. Wang; Zhi-Feng Xie; Tzu-Te Liu; Rey-Chue Hwang 2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics, 2007

Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good ...


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Educational Resources on Bonding

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eLearning

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


Test of a bond-correction formula for ultrasonic velocity measurement

G. Mozurkewich IEEE 1992 Ultrasonics Symposium Proceedings, 1992

A formula for the shift of a resonance frequency induced by a bond of nonvanishing thickness is tested. Experiments are performed on a solid rod of polycrystalline nickel that is machined into three segments, representing specimen, bond, and transducer. Acoustic waves are launched and detected magnetostrictively. Measured patterns of frequency shift vs. frequency for various lengths and diameters of the ...


134/spl deg/ C continuous-wave operation of a 1.33-/spl mu/m wafer-bonded VCSEL

M. Mehta; V. Jayaraman; A. Jackson; S. Wu; Y. Okuno; J. Piprek; J. E. Bowers Lasers and Electro-Optics, 2003. CLEO '03. Conference on, 2003

We demonstrate the first long-wavelength VCSEL to operate continuous-wave at or above 130/spl deg/ C and show /spl sim/2 mW continuous-wave output power at room temperature in the 1290-1360 nm range.


Conformation and motion of monolayer lubricant molecule on magnetic disks

K. Fukuzawa; S. Itoh; K. Suzuki; Y. Kawai; Hedong Zhang; Y. Mitsuya IEEE Transactions on Magnetics, 2005

The conformation and diffusive motion of molecules of monolayer perfluoropolyether lubricants on magnetic disks have been clarified by investigating surface energy and spreading characteristics. A mobile molecule lies flat on the disk surface and a bonded molecule lies less flat than a mobile one. In addition, a model for the diffusive motion of the mobile molecule is presented. The diffusive ...


Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques

Shuming T. Wang; Zhi-Feng Xie; Tzu-Te Liu; Rey-Chue Hwang 2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics, 2007

Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good ...


More eLearning Resources

IEEE-USA E-Books

  • Metallurgical Bonding Systems for HighTemperature Electronics

    The chip-to-package metallurgical interconnections that may be used in high- temperature electronic environments are described. These interconnections are primarily wire bonded, but include TAB(tape-automated bonding) where appropriate. Details of the most studied bonding system (Au-Al), with emphasis on its failure modes and mechanisms, are given FIRST for an understanding of the problems that may occur in interconnection metallurgies. Later, these failures are compared to many other possible metallurgical bonding systems that may be considered for hightemperature environments such as Al-Cu, Au-Cu, Ag-Au, Al-Ni, Au-Pd, Al-Pd, Al-Ag,and mono-metallic interconnections. The reliability considerations are discussed in terms of maximum temperatures and times in various high-temperature environments. Bond reliability at high temperatures is often dependent on any impurities in the weld interface as well as completeness of the weld. Therefore, these problems are discussed in context.

  • Hybrid A/D Converter for 200C Operation

    This paper describes the design and development of a high performance hybrid 12 bit analog to digital converter, which will operate reliably at 200°C. A product of this type was found to be necessary in areas such as geothermal probing, oil-well logging, jet engine and nuclear reactor monitoring, and other appl ications where the environments may reach temperatures of up to 200°C. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical re1 iabil ity of hybrid circuits at 200°C. Because the circuit design of the A/D converter involved both digital and linear circuitry, this produced an opportunity to evaluate the performance of both technologies at 200°C. Initial mechanical failure modes led to researching more reliable methods of wire bonding and die attachment. The result of this work was a 12 bit A/D converter which will operate at 200°C with .05% linearity, 1% accuracy, 350 Sec conversion time, and only 455mW power consumption. This product also necessitated the development oof a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This sytem totally eliminates the formation of intermetallics at the bonding interface which can lead to bond failure.

  • Creating a Physically-based, Virtual-Metabolism with Solid Cellular Automata

    A physically-based system of Interacting polyhedral objects is used to model physical and chemical processes characteristic of living organisms. These processes include auto-catalysis, cross-catalysis and the self-assembly and spontaneous organization of complex, dynamic structures constituting virtual organisms. The polyhedra in the simulation are surfaced with bonding sites in states akin to those of cellular automata. These bonding sites interact with sites on neighbouring polyhedra to apply forces of attraction and repulsion between bodies and to trigger transitions in their states. Locally controlled assembly of this kind acts without the guidance of an external agent or central control. Such mechanisms, perhaps a defining property of biological construction, are seldom employed to create complex artificial structures. This paper therefore presents a novel model for the construction of complex virtual structures using multiple reactive, virtual elements, acting independently under virtual physical and chemical laws

  • Section 8: Valves and Pumps

    This chapter contains sections titled: A Microminiature Electric-to-Fluidic Valve The Fabrication of Integrated Mass Flow Controllers Normally Close Microvalve and Micropump Fabricated on a Silicon Wafer A Thennopneumatic Micropump Based on Micro-Engineering Techniques Variable-Flow Micro-Valve Structure Fabricated with Silicon Fusion Bonding A Pressure-Balanced Electrostatically-Actuated Microvalve Micromachined Silicon Microvalve

  • Ground System

    This chapter discusses the purpose of the neutral ground system, the equipment ground system, and the safety ground system. Grounding of an electrical power distribution system is concerned specifically with the design of an intentional electrical connection of the power system to ground or earth. The ungrounded system does not have any intentional electrical system connections to ground or earth potential. This system is used when the desire for a highly reliable electrical system is needed. Resistance grounded systems use a resistance between the source transformer neutral connection and earth. In reactance grounded system, a reactance is placed between the transformer neutral and ground connection. The grounding system affects the cable selection process for the medium voltage electrical distribution system. The function of the bonding connections between conductive structures and equipment and the ground system is to ensure the touch and step potentials are minimized to safe levels.

  • LowPressure OilFilled Power Transmission Cables

    This chapter contains sections titled: Introduction Elements of Oil-Filled Cable Design Cable Manufacture Tests Electrical Characteristics Principles of Oil Feeding Notes on Sheath Bonding Limitations of LPOF Cables Self-Contained High-Pressure Oil-Filled Cables Self-Contained Oil-Filled Cables for DC Application This chapter contains sections titled: References

  • Section 11: Bulk Micromachining

    This chapter contains sections titled: Fabrication of Hemispherical Structures Using Semiconductor Technology for use in Thermonuclear Fusion Research Micromachining of Silicon Mechanical Structures Strings, Loops, and Pyramids-Building Blocks for Microstructures Corner Compensation Structures for (110) Oriented Silicon A Study on Compensating Comer Undercutting in Anisotropic Etching of (100) Silicon A New Silicon-on-Glass Process for Integrated Sensors Mechanisms of Anodic Bonding of Silicon to Pyrex® Glass Silicon Fusion Bonding for Pressure Sensors Low-temperature Silicon-to-silicon Anodic Bonding with Intermediate Low Melting Point Glass Fusing Silicon Wafers with Low Melting Temperature Glass Silicon Fusion Bonding for Fabrication of Sensors, Actuators and Microstructures Scaling and Dielectric Stress Compensation of Ultrasensitive Boron-Doped Silicon Microstructures Field Oxide Microbridges, Cantilever Beams, Coils and Suspended Membranes in SACMOS Technology Micromachining of Quartz and its Application to an Acceleration Sensor

  • The Place of Face-to-Face Communication in Distributed Work

    This chapter contains sections titled: The Value of Face-to-Face Communication, Face-to-Face Interaction Engenders Social Bonding, Negative Aspects of Face-to-Face Communication, Media Ecologies, References

  • Materials and Processing Considerations

    This chapter contains sections titled: Introduction Substrate Materials Dielectric Materials Metallization Planarization Chip Bonding Technologies Die Attach Summary This chapter contains sections titled: Exercises References

  • Enclosure Design Guidelines

    This chapter contains sections titled: Metal Portions of Enclosures Should Be Connected to Chassis Ground (If this isn't possible, see III) Portions of Enclosures That Are Metal, and Are Not Insulated,and Are Connected to Chassis Ground, Should Be Kept 2.2 mm from Exposed Electronic Components or Lines Metal Portions of Enclosures That Aren't Connected to Chassis Ground and Are Not Insulated Must Be Kept At Least 2 cm Away From Exposed Electronic Components and Lines Avoid Sharp Edges on Metal Components Because They Encourage Secondary Arcs Design System Enclosures So an Operator Cannot Approach Closer Than 2 cm to Exposed Nongrounded Metal, Electronic Components, or Electronic Lines; or So a Chassis Grounded Object Is between the Operator and the Electronics (Ungrounded Screws Are an Especially Troublesome Path for ESD Entry Into a System) The Enclosures Should Not Constrict PWB Designs So Much That It Is Impossible to Include Sufficient Logic Ground Grid or Chassis Grounding Enclosure Designs Should Allow the I/O Devices to Remain Close to the I/O Connector and Each Other Try to Locate the I/O Cable Entry Point in a Central Location on Each Enclosure There Must Be a Provision for a Short, Low Corrosion Connection of Each Cable Shield to the Chassis; This Connection Must Be Within 4 cm of the Cable Entry Point(s) Connectors Must Be Within 4 cm of the Cable Entry and Chassis Connection Point(s), So the Unshielded Portion of the Cable Doesn't Exceed 4 cm If a Cable Has a Ferrite Added, this Ferrite Must Also Be Near the Cable Entry Point No Slot or Hole Should Have a Long Dimension Greater Than 2cm Use Several Small O penings Instead of One Large Opening The Space between Openings Must Equal the Largest Dimension of the Opening Don't Place a Slot Near a Chassis Cable Ground Connection Point, or Near Sensitive Signal Lines or Devices Electrically Fasten the Shielding Seams at Several Points to Reduce the Slot Length That Can Exist (Screws, Clips, etc.) If Necessary, Use Conductive Gaskets to Fill Gaps That Remain in Seams Gaskets and Fasteners Both Should Be Chosen to Keep Corrosion to a Minimum (See the corrosion discussion in Chapter 5) If Foil Tape Is Used, It Must Make Electrical Contact With the Rest of the Shield A Shield Seam Should Be Overlapped, and the Overlap Should Be At Least Five Times the Gap Width, and Equal to the Distance between Contact Points Bonding Straps Used to Connect Various Chassis, or Enclosure Sections, Must Be Kept Short and Kept Away from Sensitive Electronics. Bonding Straps Should Also Be Wide; It Is Recommended That Bonding Straps Be No More Than Five Times Longer Than They Are Wide This chapter contains sections titled: Summary of Enclosure Design Guidelines



Standards related to Bonding

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No standards are currently tagged "Bonding"