Conferences related to Bonding

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

The International Symposium on Microarchitecture (MICRO) is the premier forum for the presentation and discussion of new ideas in microarchitecture, compilers, hardware/software interfaces, and design of advanced computing and communication systems. The goal of MICRO is to bring together researchers in the fields of microarchitecture, compilers, and systems for technical exchange. The MICRO community has enjoyed having close interaction between academic researchers and industrial designers.

  • 2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the forum for presentation and discussion of new ideas in microarchitectures, compilers, hardware/software interfaces, and design of advanced computing and communication systems.

  • 2016 49th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the forum for presentation and discussion of new ideas in microarchitectures, compilers, hardware/software interfaces, and design of advanced computing and communication systems.

  • 2015 48th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques foradvanced computing and communication systems, providing a close interaction betweenacademic researchers andindustrial designers and bringing together researchers in fields related to microarchitecture,compilers, chips, andsystems for technical exchange on traditional microarchitecture topics and emerging researchareas.

  • 2014 47th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques foradvanced computing and communication systems, providing a close interaction betweenacademic researchers andindustrial designers and bringing together researchers in fields related to microarchitecture,compilers, chips, andsystems for technical exchange on traditional microarchitecture topics and emerging researchareas.

  • 2013 46th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques foradvanced computing and communication systems, providing a close interaction between academic researchers andindustrial designers and bringing together researchers in fields related to microarchitecture, compilers, chips, andsystems for technical exchange on traditional microarchitecture topics and emerging research areas.

  • 2012 45th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques for advanced computing and communication systems, providing a close interaction between academic researchers and industrial designers and bringing together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas.

  • 2011 44th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    The International Symposium on Microarchitecture (MICRO) is the premier forum for presenting, discussing, and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goals of this symposium are to bring together researchers in fields related to microarchitecture, compilers, and systems for technical exchange on traditional microarchitectural topics as well as emerging research areas. Historically, the MICRO community has enjoyed having close interaction between academic researchers and industrial designers; we aim to continue and emphasize this tradition at MICRO-44.

  • 2010 43rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO-43 is the premier forum for presenting, discussing and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goal of this symposium is to bring together researchers in fields related to processor architecture, compilers, and systems, for technical exchange on traditional MICRO topics as well as new emerging research areas.

  • 2009 42nd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the premier forum for presenting, discussing and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goal of this symposium is to bring together researchers in fields related to processor architecture, compilers, and systems, for technical exchange on traditional MICRO topics as well as new emerging research areas.

  • 2008 41st IEEE/ACM International Symposium on Microarchitecture (MICRO)

    The 41st International Symposium on Microarchitecture is the premier forum for presenting, discussing, and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, and systems for technical exchange on traditional microarchitectural topics and emerging research areas.

  • 2007 40th IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the premier forum for presenting, discussing and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goal of this symposium is to bring together researchers in fields related to processor architecture, compilers, and systems, for technical exchange on traditional MICRO topics as well as new emerging research areas.

  • 2006 39th IEEE/ACM International Symposium on Microarchitecture (MICRO)

  • 2005 38th IEEE/ACM International Symposium on Microarchitecture (MICRO)


2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation


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Periodicals related to Bonding

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Bonding

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Xplore Articles related to Bonding

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The BaBar silicon-vertex tracker: performance, running experience, and radiation-damage studies

[{u'author_order': 1, u'affiliation': u'Universita di Bergamo, Dalmine, Italy', u'full_name': u'V. Re'}, {u'author_order': 2, u'full_name': u'C. Borean'}, {u'author_order': 3, u'full_name': u'C. Bozzi'}, {u'author_order': 4, u'full_name': u'V. Carassiti'}, {u'author_order': 5, u'full_name': u'A. C. Ramusino'}, {u'author_order': 6, u'full_name': u'L. Piemontese'}, {u'author_order': 7, u'full_name': u'A. B. Breon'}, {u'author_order': 8, u'full_name': u'D. Brown'}, {u'author_order': 9, u'full_name': u'A. R. Clark'}, {u'author_order': 10, u'full_name': u'F. Goozen'}, {u'author_order': 11, u'full_name': u'C. Hernikl'}, {u'author_order': 12, u'full_name': u'L. T. Kerth'}, {u'author_order': 13, u'full_name': u'A. Gritsan'}, {u'author_order': 14, u'full_name': u'G. Lynch'}, {u'author_order': 15, u'full_name': u'A. Perazzo'}, {u'author_order': 16, u'full_name': u'N. A. Roe'}, {u'author_order': 17, u'full_name': u'G. Zizka'}, {u'author_order': 18, u'full_name': u'D. Roberts'}, {u'author_order': 19, u'full_name': u'J. Schieck'}, {u'author_order': 20, u'full_name': u'E. Brenna'}, {u'author_order': 21, u'full_name': u'A. Citterio'}, {u'author_order': 22, u'full_name': u'F. Lanni'}, {u'author_order': 23, u'full_name': u'F. Palombo'}, {u'author_order': 24, u'full_name': u'L. Ratti'}, {u'author_order': 25, u'full_name': u'P. F. Manfredi'}, {u'author_order': 26, u'full_name': u'C. Angelini'}, {u'author_order': 27, u'full_name': u'G. Batignani'}, {u'author_order': 28, u'full_name': u'S. Bettarini'}, {u'author_order': 29, u'full_name': u'M. Bondioli'}, {u'author_order': 30, u'full_name': u'F. Bosi'}, {u'author_order': 31, u'full_name': u'F. Bucci'}, {u'author_order': 32, u'full_name': u'G. Calderini'}, {u'author_order': 33, u'full_name': u'A. Carpinelli'}, {u'author_order': 34, u'full_name': u'M. Ceccanti'}, {u'author_order': 35, u'full_name': u'F. Forti'}, {u'author_order': 36, u'full_name': u'D. Gagliardi'}, {u'author_order': 37, u'full_name': u'M. A. Giorgi'}, {u'author_order': 38, u'full_name': u'A. Lusiani'}, {u'author_order': 39, u'full_name': u'P. Mammini'}, {u'author_order': 40, u'full_name': u'M. Morganti'}, {u'author_order': 41, u'full_name': u'F. Morsani'}, {u'author_order': 42, u'full_name': u'N. Neri'}, {u'author_order': 43, u'full_name': u'E. Paoloni'}, {u'author_order': 44, u'full_name': u'A. Profeti'}, {u'author_order': 45, u'full_name': u'M. Rama'}, {u'author_order': 46, u'full_name': u'G. Rizzo'}, {u'author_order': 47, u'full_name': u'F. Sandrelli'}, {u'author_order': 48, u'full_name': u'G. Simi'}, {u'author_order': 49, u'full_name': u'G. Triggiani'}, {u'author_order': 50, u'full_name': u'J. Walsh'}, {u'author_order': 51, u'full_name': u'P. Burchat'}, {u'author_order': 52, u'full_name': u'C. Cheng'}, {u'author_order': 53, u'full_name': u'D. Kirkby'}, {u'author_order': 54, u'full_name': u'T. I. Meyer'}, {u'author_order': 55, u'full_name': u'C. Roat'}, {u'author_order': 56, u'full_name': u'A. Bona'}, {u'author_order': 57, u'full_name': u'F. Bianchi'}, {u'author_order': 58, u'full_name': u'D. Gamba'}, {u'author_order': 59, u'full_name': u'P. Trapani'}, {u'author_order': 60, u'full_name': u'L. Bosisio'}, {u'author_order': 61, u'full_name': u'G. Della Ricca'}, {u'author_order': 62, u'full_name': u'S. Dittongo'}, {u'author_order': 63, u'full_name': u'L. Lanceri'}, {u'author_order': 64, u'full_name': u'A. Pompili'}, {u'author_order': 65, u'full_name': u'P. Poropat'}, {u'author_order': 66, u'full_name': u'I. Rashevskaia'}, {u'author_order': 67, u'full_name': u'G. Vuagnin'}, {u'author_order': 68, u'full_name': u'S. Burke'}, {u'author_order': 69, u'full_name': u'D. Callahan'}, {u'author_order': 70, u'full_name': u'C. Campagnari'}, {u'author_order': 71, u'full_name': u'B. Dahmes'}, {u'author_order': 72, u'full_name': u'D. Hale'}, {u'author_order': 73, u'full_name': u'P. Hart'}, {u'author_order': 74, u'full_name': u'N. Kuznetsova'}, {u'author_order': 75, u'full_name': u'S. Kyre'}, {u'author_order': 76, u'full_name': u'S. Levy'}, {u'author_order': 77, u'full_name': u'O. Long'}, {u'author_order': 78, u'full_name': u'J. May'}, {u'author_order': 79, u'full_name': u'M. Mazur'}, {u'author_order': 80, u'full_name': u'J. Richman'}, {u'author_order': 81, u'full_name': u'W. Verkerke'}, {u'author_order': 82, u'full_name': u'M. Witherell'}, {u'author_order': 83, u'full_name': u'J. Beringer'}, {u'author_order': 84, u'full_name': u'A. A. Eisner'}, {u'author_order': 85, u'full_name': u'A. Frey'}, {u'author_order': 86, u'full_name': u'A. A. Grillo'}, {u'author_order': 87, u'full_name': u'A. Grothe'}, {u'author_order': 88, u'full_name': u'R. P. Johnson'}, {u'author_order': 89, u'full_name': u'W. Kroeger'}, {u'author_order': 90, u'full_name': u'W. S. Lockman'}, {u'author_order': 91, u'full_name': u'T. Pulliam'}, {u'author_order': 92, u'full_name': u'W. Rowe'}, {u'author_order': 93, u'full_name': u'R. E. Schmitz'}, {u'author_order': 94, u'full_name': u'A. Seiden'}, {u'author_order': 95, u'full_name': u'E. N. Spencer'}, {u'author_order': 96, u'full_name': u'M. Turri'}, {u'author_order': 97, u'full_name': u'W. Walkoviak'}, {u'author_order': 98, u'full_name': u'M. Wilder'}, {u'author_order': 99, u'full_name': u'M. Wilson'}, {u'author_order': 100, u'full_name': u'E. Charles'}, {u'author_order': 101, u'full_name': u'P. Elmer'}, {u'author_order': 102, u'full_name': u'J. Nielsen'}, {u'author_order': 103, u'full_name': u'W. Orejudos'}, {u'author_order': 104, u'full_name': u'I. Scott'}, {u'author_order': 105, u'full_name': u'H. Zobernig'}, {u'author_order': 106, u'full_name': u'S. Laplace'}] IEEE Transactions on Nuclear Science, 2002

The silicon-vertex tracker (SVT) for the BaBar Experiment at the PEP-H Asymmetric B Factory at Stanford Linear Accelerator Center (SLAC), is a five- layer double-sided ac-coupled silicon-microstrip detector. It is a crucial element for the precise measurement of the decay position of B mesons, satisfying the severe constraints imposed by the accelerator design, in terms of geometry of the interaction ...


Development of the hybrid structure for the barrel module of the ATLAS silicon-microstrip tracker

[{u'author_order': 1, u'affiliation': u'IPNS, High Energy Accelerator Organ., Ibaraki, Japan', u'full_name': u'T. Kohriki'}, {u'author_order': 2, u'affiliation': u'IPNS, High Energy Accelerator Organ., Ibaraki, Japan', u'full_name': u'Y. Ikegami'}, {u'author_order': 3, u'full_name': u'T. Akimoto'}, {u'author_order': 4, u'full_name': u'K. Hara'}, {u'author_order': 5, u'full_name': u'Y. Iwata'}, {u'author_order': 6, u'full_name': u'Y. Kato'}, {u'author_order': 7, u'full_name': u'T. Kondo'}, {u'author_order': 8, u'full_name': u'I. Nakano'}, {u'author_order': 9, u'full_name': u'T. Ohsugi'}, {u'author_order': 10, u'full_name': u'S. Shimma'}, {u'author_order': 11, u'full_name': u'R. Takashima'}, {u'author_order': 12, u'full_name': u'R. Tanaka'}, {u'author_order': 13, u'full_name': u'S. Terada'}, {u'author_order': 14, u'full_name': u'N. Ujiie'}, {u'author_order': 15, u'full_name': u'Y. Unno'}] IEEE Transactions on Nuclear Science, 2002

A novel hybrid structure for the barrel module of the ATLAS semiconductor tracker (SCT) is developed. The hybrid carries 12 bare readout chips totaling 1536 channels. A flexible copper-polyimide four-layer lamination is used as a basic circuit. The circuit is reinforced by two carbon-carbon bridges coated with Parylene polymer. The hybrid staffed by resistors, capacitors, and pitch- adaptors undergoes heat ...


Safe Installation of Metal Light Poles per NEC or NESC

[{u'author_order': 1, u'affiliation': u'Shell Exploration & Production, Houston', u'full_name': u'Paul G. Cardinal'}] 2007 IEEE Industry Applications Annual Meeting, None

Utility environments impose electrical installation complications beyond those of residential, commercial or even industrial power facilities covered by the national electrical code (NEC). Outdoor lighting circuits, though having circuit voltages similar to typical NEC installations, must face transferred potential, adjacent high voltages and lightning protection issues that those responsible for the NEC consider outside the scope of that document. This ...


Resonance suppressed magnetic probe for measuring electromagnetic field intensity

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Electron. Eng, Yonsei Univ., Seoul, South Korea', u'full_name': u'Jung-Min Kim'}, {u'author_order': 2, u'full_name': u'Woo-Young Song'}, {u'author_order': 3, u'full_name': u'Jong-Gwan Yook'}] IEEE Antennas and Propagation Society Symposium, 2004., None

A rectangular magnetic field probe incorporating bonding wire is proposed, and its calculated and measured characteristics are presented. The proposed probe effectively suppresses the emission of electromagnetic fields from the edge of the ground plane, and as a result the scanning range of the probe is enhanced as compared with that of the conventional ones. With the probe tangential magnetic ...


Investigation of bonding strength and photoluminescence properties of InP/Si surface activated bonding

[{u'author_order': 1, u'affiliation': u'Department of Electrical and Electronic Engineering, Tokyo Institute of Technology 2-12-1-S9-5 O-okayama, Meguro-ku, Tokyo 152-8552, Japan', u'full_name': u'Simon Kondo'}, {u'author_order': 2, u'affiliation': u'Department of Electrical and Electronic Engineering, Tokyo Institute of Technology 2-12-1-S9-5 O-okayama, Meguro-ku, Tokyo 152-8552, Japan', u'full_name': u'Tadashi Okumura'}, {u'author_order': 3, u'affiliation': u'Department of Electrical and Electronic Engineering, Tokyo Institute of Technology 2-12-1-S9-5 O-okayama, Meguro-ku, Tokyo 152-8552, Japan', u'full_name': u'Ryo Osabe'}, {u'author_order': 4, u'affiliation': u'Department of Electrical and Electronic Engineering, Tokyo Institute of Technology 2-12-1-S9-5 O-okayama, Meguro-ku, Tokyo 152-8552, Japan', u'full_name': u'Nobuhiko Nishiyama'}, {u'author_order': 5, u'affiliation': u'Department of Electrical and Electronic Engineering, Tokyo Institute of Technology 2-12-1-S9-5 O-okayama, Meguro-ku, Tokyo 152-8552, Japan', u'full_name': u'Shigehisa Arai'}] 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM), None

A low-temperature direct wafer bonding technique has been researched by using plasma treatment. Si-to-Si direct bonding strength was 1.6 MPa by using plasma pretreatment prior to the heating and weighting. 1.4 MPa of InP/Si bonding strength was obtained by improving chemical cleaning process. On the other hand, photoluminescence properties of GaInAs/InP quantum wells bonded on Si substrate were investigated. An ...


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  • Salient Pole Rotor Winding Failure Mechanisms and Repair

    Modern salient pole winding designs use aramid paper ground and turn insulation in strip-on-edge windings, resin-bonded glass laminate pole washers DacronTM and glass-covered high-temperature enamel turn insulation in wire wound poles, and thermosetting bonding resins. Insulation aging from thermal cycling occurs mainly in synchronous motors and generators that are started and stopped frequently. Salient pole rotor windings, especially strip-on-edge types, are generally susceptible to failure from contamination by conducting materials because they rely on adequate creepage distances between bare copper conductors to prevent shorts. Abrasive dust from the surrounding atmosphere carried into the interior of a motor or generator by cooling air will abrade the rotor winding insulation surfaces. Among the most common causes of failure in salient pole rotor windings are the continuous centrifugal forces imposed on them by rotation and the cyclic centrifugal forces induced by starting and stopping.

  • CMOS 3‐D‐Integrated MEMS Sensor

    This chapter presents one TSV‐less 3‐D complimentary metal‐oxide semiconductor (CMOS)‐on‐micro‐electro‐mechanical system (MEMS) integration technique using direct metal bonding. The CMOS‐on‐MEMS integration leads to a simultaneous formation of electrical, mechanical, and hermetic bonds, eliminates chip‐to‐chip wire‐bonding, and hence presents competitive advantages over hybrid or monolithic solutions. The MEMS sensor is a capacitive accelerometer. The basic working principle of the MEMS accelerometer is the displacement of a small proof mass etched into the silicon surface of the integrated circuit and suspended by small beams. The CMOS readout circuit for MEMS consists of a low‐noise, band‐pass gain stage, a fully differential synchronous demodulator, and an off‐chip, low‐pass filter. The chapter illustrates a figure of the heterogeneous 3‐D TSV‐less accelerometer structure. The CMOS readout circuit is stacked on the MEMS accelerometer using face‐to‐face (F2F) direct metal bonding, which provides smaller form factor, latency, and power.



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