Conferences related to Bonding

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2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 56th ACM/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM//IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.


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Periodicals related to Bonding

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Bonding

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Xplore Articles related to Bonding

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A novel approach to assembly and interconnection for micro electro mechanical systems

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37265443400', u'full_name': u'T. Suga', u'id': 37265443400}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37282265200', u'full_name': u'N. Hosoda', u'id': 37282265200}] Proceedings IEEE Micro Electro Mechanical Systems. 1995, 1995

None


Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

[{u'author_order': 1, u'affiliation': u'National Center for Advanced Packaging, Wuxi 214135, Jiangsu Province, China', u'full_name': u'Chongshen Song'}, {u'author_order': 2, u'affiliation': u'National Center for Advanced Packaging, Wuxi 214135, Jiangsu Province, China', u'full_name': u'Wenqi Zhang'}, {u'author_order': 3, u'affiliation': u'National Center for Advanced Packaging, Wuxi 214135, Jiangsu Province, China', u'full_name': u'Dongkai Shangguan'}] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2014

This paper discusses the application of conductive wafer bonding, especially wafer level hybrid Cu-Cu bonding, for realizing high density inter-chip interconnection. 3D integration process using conductive wafer bonding and the test vehicle for bonding process evaluation are described. Different pre- bonding surface treatment methods and bonding procedures are studied and compared for yield and throughput optimization.


Permanent & temporary wafer bonding for 3DICs: Market & applications overview

[{u'author_order': 1, u'affiliation': u'Yole D\xe9veloppement, 75 cours Emile Zola, 69100 Villeurbanne, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/37949811700', u'full_name': u'Eric Mounier', u'id': 37949811700}, {u'author_order': 2, u'affiliation': u'Yole D\xe9veloppement, 75 cours Emile Zola, 69100 Villeurbanne, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/38266411000', u'full_name': u'J\xe9r\xf4me Baron', u'id': 38266411000}, {u'author_order': 3, u'affiliation': u'Yole D\xe9veloppement, 75 cours Emile Zola, 69100 Villeurbanne, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/38268479200', u'full_name': u'Amandine Pizzagalli', u'id': 38268479200}] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012

This paper gives an overview of the markets and applications for permanent and temporary bonding technologies.


Overview of wafer direct bonding technology: From substrate engineering to heterogeneous integration enabled by 3D wafer stacking

[{u'author_order': 1, u'affiliation': u'SOITEC, Parc Technologique des Fontaines, 38926 Bernin, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/37318307900', u'full_name': u'Ionut Radu', u'id': 37318307900}] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012

The recent advances of the wafer direct bonding technology will be presented in this talk. The overview covers the technology perspective with respect to the fabrication of engineered substrates as well as 3D wafer stacking in light of the different applications for semiconductor industry.


Graphene-mediated wafer bonding to prepare monolayer-cored double heterostructures for high-performance nanooptoelectronics

[{u'author_order': 1, u'affiliation': u'Department of Chemical Engineering, Kyoto University, Nishikyo-ku, Kyoto 615-8510, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085990904', u'full_name': u'Takenori Naito', u'id': 37085990904}, {u'author_order': 2, u'affiliation': u'Department of Chemical Engineering, Kyoto University, Nishikyo-ku, Kyoto 615-8510, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37395319600', u'full_name': u'Katsuaki Tanabe', u'id': 37395319600}] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2017

We have fabricated for the first time a monolayer-cored double heterostructure, towards the realization of high-efficiency nanooptoelectronic devices. We prepared a Si/graphene/Si stack by means of graphene-mediated wafer bonding and verified the interfacial mechanical stability and interlayer electrical connection, demonstrating a new application of wafer bonding.


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Educational Resources on Bonding

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eLearning

No eLearning Articles are currently tagged "Bonding"

IEEE-USA E-Books

  • Salient Pole Rotor Winding Failure Mechanisms and Repair

    Modern salient pole winding designs use aramid paper ground and turn insulation in strip-on-edge windings, resin-bonded glass laminate pole washers DacronTMand glass-covered high-temperature enamel turn insulation in wire wound poles, and thermosetting bonding resins. Insulation aging from thermal cycling occurs mainly in synchronous motors and generators that are started and stopped frequently. Salient pole rotor windings, especially strip-on-edge types, are generally susceptible to failure from contamination by conducting materials because they rely on adequate creepage distances between bare copper conductors to prevent shorts. Abrasive dust from the surrounding atmosphere carried into the interior of a motor or generator by cooling air will abrade the rotor winding insulation surfaces. Among the most common causes of failure in salient pole rotor windings are the continuous centrifugal forces imposed on them by rotation and the cyclic centrifugal forces induced by starting and stopping.

  • CMOS 3‐D‐Integrated MEMS Sensor

    This chapter presents one TSV‐less 3‐D complimentary metal‐oxide semiconductor (CMOS)‐on‐micro‐electro‐mechanical system (MEMS) integration technique using direct metal bonding. The CMOS‐on‐MEMS integration leads to a simultaneous formation of electrical, mechanical, and hermetic bonds, eliminates chip‐to‐chip wire‐bonding, and hence presents competitive advantages over hybrid or monolithic solutions. The MEMS sensor is a capacitive accelerometer. The basic working principle of the MEMS accelerometer is the displacement of a small proof mass etched into the silicon surface of the integrated circuit and suspended by small beams. The CMOS readout circuit for MEMS consists of a low‐noise, band‐pass gain stage, a fully differential synchronous demodulator, and an off‐chip, low‐pass filter. The chapter illustrates a figure of the heterogeneous 3‐D TSV‐less accelerometer structure. The CMOS readout circuit is stacked on the MEMS accelerometer using face‐to‐face (F2F) direct metal bonding, which provides smaller form factor, latency, and power.



Standards related to Bonding

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No standards are currently tagged "Bonding"