Conferences related to Bonding

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

The International Symposium on Microarchitecture (MICRO) is the premier forum for the presentation and discussion of new ideas in microarchitecture, compilers, hardware/software interfaces, and design of advanced computing and communication systems. The goal of MICRO is to bring together researchers in the fields of microarchitecture, compilers, and systems for technical exchange. The MICRO community has enjoyed having close interaction between academic researchers and industrial designers.

  • 2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the forum for presentation and discussion of new ideas in microarchitectures, compilers, hardware/software interfaces, and design of advanced computing and communication systems.

  • 2016 49th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the forum for presentation and discussion of new ideas in microarchitectures, compilers, hardware/software interfaces, and design of advanced computing and communication systems.

  • 2015 48th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques foradvanced computing and communication systems, providing a close interaction betweenacademic researchers andindustrial designers and bringing together researchers in fields related to microarchitecture,compilers, chips, andsystems for technical exchange on traditional microarchitecture topics and emerging researchareas.

  • 2014 47th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques foradvanced computing and communication systems, providing a close interaction betweenacademic researchers andindustrial designers and bringing together researchers in fields related to microarchitecture,compilers, chips, andsystems for technical exchange on traditional microarchitecture topics and emerging researchareas.

  • 2013 46th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques foradvanced computing and communication systems, providing a close interaction between academic researchers andindustrial designers and bringing together researchers in fields related to microarchitecture, compilers, chips, andsystems for technical exchange on traditional microarchitecture topics and emerging research areas.

  • 2012 45th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    Forum for presenting and discussing innovative microarchitecture ideas and techniques for advanced computing and communication systems, providing a close interaction between academic researchers and industrial designers and bringing together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas.

  • 2011 44th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    The International Symposium on Microarchitecture (MICRO) is the premier forum for presenting, discussing, and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goals of this symposium are to bring together researchers in fields related to microarchitecture, compilers, and systems for technical exchange on traditional microarchitectural topics as well as emerging research areas. Historically, the MICRO community has enjoyed having close interaction between academic researchers and industrial designers; we aim to continue and emphasize this tradition at MICRO-44.

  • 2010 43rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO-43 is the premier forum for presenting, discussing and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goal of this symposium is to bring together researchers in fields related to processor architecture, compilers, and systems, for technical exchange on traditional MICRO topics as well as new emerging research areas.

  • 2009 42nd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the premier forum for presenting, discussing and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goal of this symposium is to bring together researchers in fields related to processor architecture, compilers, and systems, for technical exchange on traditional MICRO topics as well as new emerging research areas.

  • 2008 41st IEEE/ACM International Symposium on Microarchitecture (MICRO)

    The 41st International Symposium on Microarchitecture is the premier forum for presenting, discussing, and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, and systems for technical exchange on traditional microarchitectural topics and emerging research areas.

  • 2007 40th IEEE/ACM International Symposium on Microarchitecture (MICRO)

    MICRO is the premier forum for presenting, discussing and debating new and innovative microarchitecture ideas and techniques for advanced computing and communication systems. The goal of this symposium is to bring together researchers in fields related to processor architecture, compilers, and systems, for technical exchange on traditional MICRO topics as well as new emerging research areas.

  • 2006 39th IEEE/ACM International Symposium on Microarchitecture (MICRO)

  • 2005 38th IEEE/ACM International Symposium on Microarchitecture (MICRO)


2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation


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Periodicals related to Bonding

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Bonding

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Xplore Articles related to Bonding

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Multi channel high aspect ratio glass microelectrode array for neuroprosthetic applications

[{u'author_order': 1, u'affiliation': u'Blackrock Microsystems 391 Chipeta Way, Suite G, Salt Lake City, UT, 84108', u'full_name': u'Sandeep Negi'}, {u'author_order': 2, u'affiliation': u'Blackrock Microsystems 391 Chipeta Way, Suite G, Salt Lake City, UT, 84108', u'full_name': u'Rajmohan Bhandari'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

To map neural signal in the brain 3D electrodes are desired. 3D electrodes are difficult fabricate due to the cumbersome assembly process. In this work, 2D array of glass electrodes were designed and later assembles into 3D by simple assembly process. Glass was used as a dielectric material to provide better electrical isolation capability and better biocompatibility compared to silicon. ...


Corrosion resistant wire for small diameter wire bonding applications

[{u'author_order': 1, u'affiliation': u'Semicond.. Packaging Mater., Mamaroneck, NY, USA', u'full_name': u'M. McKeown'}] Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, None

Wire bonding is now a major method of interconnection. Over the years, as electronic packages became more technologically advanced, the wire bonders and the wire had to mature at the same rate. Aluminum wire is one of the main components used in wire bonding these electronic devices. In some applications, this aluminum wire must be able to withstand harsh environments, ...


Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

[{u'author_order': 1, u'affiliation': u'Department of Mechanical and Material Engineering, Universiti Tunku Abdul Rahman (UTAR), 53300 Kuala Lumpur, Malaysia', u'full_name': u'Rajkumar Durairaj'}, {u'author_order': 2, u'affiliation': u'NPL, Teddington, TW11 0LW, UK', u'full_name': u'Roya Ashayer'}, {u'author_order': 3, u'affiliation': u'BCAST/Division of Engineering, Brunel University, UB8 3PH, UK', u'full_name': u'Hiren R. Kotadia'}, {u'author_order': 4, u'affiliation': u"Department of Physics, King's College London, WC2R 2LS, UK", u'full_name': u'Neil Haria'}, {u'author_order': 5, u'affiliation': u"Department of Physics, King's College London, WC2R 2LS, UK", u'full_name': u'Chris Lorenz'}, {u'author_order': 6, u'affiliation': u'Joining and Welding Research Institute, Osaka University, 565-0871 Japan', u'full_name': u'Omid Mokhtari'}, {u'author_order': 7, u'affiliation': u"Department of Physics, King's College London, WC2R 2LS, UK", u'full_name': u'Samjid H. Mannan'}] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO), None

The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered ...


3D integration of CMOS and MEMS using mechanically flexible interconnects (MFI) and through silicon vias (TSV)

[{u'author_order': 1, u'affiliation': u'Gigascale Integration (GSI) Group School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta, Georgia, 30332', u'full_name': u'Hyung Suk Yang'}, {u'author_order': 2, u'affiliation': u'Gigascale Integration (GSI) Group School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta, Georgia, 30332', u'full_name': u'Muhannad S. Bakir'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

A 3D integration scheme for integrating a state-of-the-art CMOS IC with an arbitrary MEMS/sensor chip is reported. The integration scheme consists of a CMOS IC and a MEMS chip stacked on top of each other with the electrical interconnections between the chips being made using mechanically flexible interconnects (MFIs). In order to expose the MEMS/sensor device to the environment for ...


Hot-forming of micro glass cavities for MEMS wafer level hermetic packaging

[{u'author_order': 1, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Jintang Shang'}, {u'author_order': 2, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Junwen Liu'}, {u'author_order': 3, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Chao Xu'}, {u'author_order': 4, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Di Zhang'}, {u'author_order': 5, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Boying Cheng'}, {u'author_order': 6, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Qing-An Huang'}, {u'author_order': 7, u'affiliation': u'Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096', u'full_name': u'Jieying Tang'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

Hermetic or vacuum packaging to maintain a controllable cavity pressure and low costs are required by many MEMS devices having moving parts. In this paper we propose a hot-forming process of fabricating micro glass cavity arrays for wafer-level and hermetic packaging of MEMS. First, the principle of the hot- forming process was discussed. Then, the hot-forming process for preparing cavity ...


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IEEE-USA E-Books

  • 13 Intimacy, Bonding, and Sex Robots: Examining Empirical Results and Exploring Ethical Ramifications

    Many advances in communicative technology have served to represent and express human sexuality: the printing press, motion pictures, and, not the least, the Internet. Social robotics, however, while not yet a mainstream contributor, is particularly poised to represent, enact, and affect society's sexual mores and practices. Sex robots are already manufactured and marketed by several companies, with increasing variety and capability being at least promised if not delivered.1 And although virtual reality and other computer-based avenues for sexual use are also developing rapidly, sex robots--embodied, mobile, and (to a limited degree) expressive--elicit and trade upon dimensions of physicality, intimacy, reciprocity, and social space. Robots both reflect and refract notions of what human bodies are, how they interact, touch, desire, and accompany one another. The prospect of sex robots assuming a greater presence in our societies underscores the general ethical questions raised by social robots: How will people be able to live with such robots? How will people treat each other as a result? Will social robots replace human beings in ways they should not?

  • Bonding as an Emergent Phenomenon in an Abstract Artificial Chemistry

    In this article we describe an implementation of a very simple toy artificial chemistry originally proposed as a "Gedanken" model by Groß and McMullin. They predicted that this model would have a number of interesting properties including emergent bonding, and top-down constraints on bondstability. We found that not all of the original claims could actually be verified.

  • Bonding Principles

  • Metallurgical Bonding Systems for HighTemperature Electronics

    The chip-to-package metallurgical interconnections that may be used in high- temperature electronic environments are described. These interconnections are primarily wire bonded, but include TAB(tape-automated bonding) where appropriate. Details of the most studied bonding system (Au-Al), with emphasis on its failure modes and mechanisms, are given FIRST for an understanding of the problems that may occur in interconnection metallurgies. Later, these failures are compared to many other possible metallurgical bonding systems that may be considered for hightemperature environments such as Al-Cu, Au-Cu, Ag-Au, Al-Ni, Au-Pd, Al-Pd, Al-Ag,and mono-metallic interconnections. The reliability considerations are discussed in terms of maximum temperatures and times in various high-temperature environments. Bond reliability at high temperatures is often dependent on any impurities in the weld interface as well as completeness of the weld. Therefore, these problems are discussed in context.

  • Advanced DSL Techniques and Home Networking

    The use of repeaters diminished greatly as modern DSL and fiber technology became prevalent. The use of repeaters has become relatively rare, but the use of multi‐pair bonding is growing, because bonding avoids most of the drawbacks of repeaters. Dynamic spectrum management (DSM) introduces the concept of a spectrum management center (SMC). The SMC is a central management system that has knowledge of most or all of the lines in the cable, and it is aware of the service attributes for each line. Vectoring is a technique to reduce the effects of the crosstalk between DSLs operating in the same cable. DSL vectoring may consist of receiver‐based noise cancellation techniques and transmitter‐based precoding techniques. Femtocell wireless technology is a way to extend the benefits of broadband access throughout the home or business.

  • Electronics for FPA Operation

    The combination of detectors and readout integrated circuit (ROIC) is commonly referred to in the industry as a focal plane array (FPA). This chapter focuses on the drive signals and outputs of FPA. The drive signals is divided into two main groups: biases and clocks. ROIC outputs are either analog or digital. The choice must consider several characteristics, but the primary advantages of analog outputs are lower power consumption, better noise performance, and less area on the ROIC. Data from FPAs is normally organized as frames of data, where each frame includes one value for each pixel in the array. Testing FPAs requires all the power supply and reference voltages along with clocking and control signals to operate the ROIC. FPAs are commonly mounted on a leadless ceramic chip carrier (LCCC) for wire‐bonding before test, and for the test itself. The wire‐bonding process is standard to the general semiconductor business.

  • DSL Standards

    ANSI standard T1.417 (now known as ATIS‐0600417.2003) was originally published in 2001, specifying spectrum management guidelines for DSL transmission on telephone lines. This standard was developed by standards working group T1E1.4. The purpose of the T1.417 DSL spectrum management standard is to set a limit on the interference produced by DSL modem crosstalk. The success of DSL technology has led to a vast number of alternative modes and options. ITU‐T Rec. G.994.1 specifies a set of parameters describing all standard DSL modes and options. Ethernet‐based bonding is specified in ITU‐T G.998.2, which is nearly identical to the ATIS T1.427.02 standard, and these were both derived from the earlier IEEE 802.3ah standard. ITU‐T Recommendation G.996.1 provides a common, defined set of twisted‐pair line characteristics, inhome wiring models, and noise models to be used for performance testing of DSL modems.

  • Ground System

    This chapter discusses the purpose of the neutral ground system, the equipment ground system, and the safety ground system. Grounding of an electrical power distribution system is concerned specifically with the design of an intentional electrical connection of the power system to ground or earth. The ungrounded system does not have any intentional electrical system connections to ground or earth potential. This system is used when the desire for a highly reliable electrical system is needed. Resistance grounded systems use a resistance between the source transformer neutral connection and earth. In reactance grounded system, a reactance is placed between the transformer neutral and ground connection. The grounding system affects the cable selection process for the medium voltage electrical distribution system. The function of the bonding connections between conductive structures and equipment and the ground system is to ensure the touch and step potentials are minimized to safe levels.

  • LITHIUM¿¿¿ION BATTERY MANUFACTURING FOR ELECTRIC VEHICLES: A CONTEMPORARY OVERVIEW

    Battery electric vehicles (BEVs) fall into one of the following four categories: hybrid electric vehicle (HEV), plug¿¿¿in electric vehicle (PHEV), extended range electric vehicle (EREV), and pure BEV. This chapter reviews different formats and structures of Li¿¿¿ion battery cells, modules, and packs in BEVs. It focuses on the characteristics relevant to the joining, assembly, and packaging rather than the battery chemistries, functions, and performances. A number of BEV manufactures use pouch cells for lightweighting, better volumetric energy density, and high spatial efficiency. The chapter reviews a few selected joining technologies that are pertinent to Li¿¿¿on battery cell and pack manufacturing, that is, ultrasonic welding, resistance welding, laser welding, wire bonding, and mechanical joining. It discusses the advantages and limitations as well as the applications in major BEVs. The chapter also discusses the battery manufacturing processes and particularly the joining processes. The chapter focuses on the manufacturing processes most relevant to BEVs in today's marketplace.

  • Various Cables Used in Practice

    Applications of HVAC cable systems are recently proposed more often for transmission expansions, which creates an increased need to study cable system transients. Cable modeling for the studies on cable system transients requires the understanding of cable systems. This chapter first discusses the cable itself and then introduces the laying configuration and the sheath bonding. Both land cables and submarine cables used in practice are explained with the focus on how the physical characteristics of cable systems affect their electrical characteristics.



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