Calorimetry

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Calorimetry is the science of measuring the heat of chemical reactions or physical changes. (Wikipedia.org)






Conferences related to Calorimetry

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2018 53rd International Universities Power Engineering Conference (UPEC)

UPEC is a long-established international conference which provides a major forum for scientists, young researchers, PhD students and engineers worldwide to present, review and discuss the latest developments in Electrical Power Engineering and relevant technologies including energy storage and renewables

  • 2016 51st International Universities Power Engineering Conference (UPEC)

    UPEC is a long-established conference, which is very popular with young researchers, PhD students and engineers from the electrical power industry. The aim of the conference is to allow participants to exchange experiences and discuss the most up-to-date topics in Power Engineering. The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grid systems in developing countries require significant research input in the area. UPEC is an ideal forum to address some of these issues, and to network and meet with talented engineers and innovators in these areas.

  • 2015 50th International Universities Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2014 49th International Universities Power Engineering Conference (UPEC)

    Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges. It also provides the opportunity to network and to meet the experts in these areas.

  • 2013 48th Universities' Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2012 47th International Universities Power Engineering Conference (UPEC)

    A major international forum for the presentation, discussion and exchange of information concerning new trends in electrical power engineering. To become better informed about the latest developments in the field of power engineering.

  • 2010 45th International Universities Power Engineering Conference (UPEC)

    The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grids in developing countries require significant research effort and the need for talented engineers and innovators is critical to the electrical energy industry. UPEC is an ideal forum to address such issues, and to network and meet experts in these areas

  • 2009 44th International Universities Power Engineering Conference (UPEC)

    UPEC has been long-established as a major annual international forum for the presentation, discussion and exchange of information concerning new trends in all areas of electric power engineering. Contributions from younger engineers and researchers are particularly encouraged at UPEC, where ideas can be aired freely and new relationships developed.

  • 2008 43rd International Universities Power Engineering Conference (UPEC)

    Its aim will be to provide a professional forum for engineers and research scientists from the universities, consultants, and in the manufacturing and supply industries opportunities to present their work and explore potential trends and recent developments, current practices in Power Engineering and related fields.

  • 2007 Universities Power Engineering Conference (UPEC)

  • 2006 International Universities Power Engineering Conference (UPEC)

  • 2004 International Universities Power Engineering Conference (UPEC)


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 Conference on Precision Electromagnetic Measurements (CPEM 2018)

CPEM is the most important scientific and technological conference in the domain of electromagnetic measurements at the highest accuracy levels. This conference covers the frequency range from DC to the optical region.2018 is expected to be a watershed year in the history of the international system of units (SI), with the adoption of the new definitions for the kilogram, the ampere, the kelvin and the mole. All the SI units will then be based on a set of seven defining constants. CPEM 2018 will provide a privileged opportunity to mark this milestone of the SI through a natural focus on quantum devices that relate electrical measurement standards to fundamental constants of physics. CPEM 2018 will also be the place to share knowledge on research in electromagnetic metrology focused on present and future challenges regarding industry and society in sectors such as Energy, ICT, quantum engineering, Industry 4.0, etc.


2018 IEEE-NPSS Real Time Conference (RT)

Real time computing applications involving both hardware and software development in nuclear, particle, plasma and other related fields.


2017 12th International Forum on Strategic Technology (IFOST)

New materials and nanotechnologies , Information and communication technologies , Information and communication technologies , Power engineering and electric power electronics , etc


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Periodicals related to Calorimetry

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


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Most published Xplore authors for Calorimetry

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Xplore Articles related to Calorimetry

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Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

R. C. Dunne; S. K. Sitaraman; S. Luo; C. P. Wong; W. E. Estes; M. Periyasamy; J. Coburn 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, the processing temperatures and the thermomechanical properties of the dielectric and substrate materials. In this work, a prospective epoxy-based dielectric material for such sequentially built up (SBU) high density-interconnect printed wiring ...


Scintillation Calorimetry and Readout Techniques

Eckart Lorenz IEEE Transactions on Nuclear Science, 1984

The status and prospects of new scintillation materials for calorimetry applications in high energy physics are reviewed. New readout methods are discussed with emphasis on the operation of high resolution scintillation calorimeters in magnetic fields.


The CLEO-III trigger: analog and digital calorimetry

C. Bebek; T. J. Bergfeld; J. A. Ernst; G. D. Gollin; M. J. Haney; R. M. Hans; E. E. Johnson; C. L. Plager; C. Sedlack; M. A. Selen; C. R. Strohman; J. Williams 2000 IEEE Nuclear Science Symposium. Conference Record (Cat. No.00CH37149), 2000

The calorimetry subsystem of the CLEO-III trigger incorporates both analog and digital electronics to provide pipelined trigger information every 42 ns with a latency of approximately 2.5 μs. This paper describes the pipelined signal- processing and pattern-recognition schemes used to provide calorimeter information to the experiment trigger, with somewhat greater emphasis on the analog components of the system. Analog processing ...


Die-attach materials for high-density memory stacked die packaging

Mark Huang; Jaspreet Gandhi; Shijian Luo; Tom Jiang 2008 58th Electronic Components and Technology Conference, 2008

In this paper, several die attach adhesives (A to E) from different suppliers are investigated. The objective is to better understand the comprehensive properties of adhesives and to choose the right adhesive for a high-density memory stacked die packaging with improved packaging reliability. Differential scanning calorimetry (DSC) is used to investigate curing behavior and curing kinetics. Thermogravimetric analysis (TGA) is ...


Development of the wafer level compressive-flow underfill process and its required materials

S. H. Shi; T. Yamashita; C. P. Wong 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999

This paper described a wafer-level compressive flow underfill process and its involved materials for a novel SMT transparent flip-chip technology. In this flip-chip technology, a liquid fluxable wafer level compressive flow underfill (WLCFU) material is coated on the active side of an entire patterned and bumped wafer at first. The WLCFU layer is dried up at an elevated temperature to ...


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Educational Resources on Calorimetry

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eLearning

Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

R. C. Dunne; S. K. Sitaraman; S. Luo; C. P. Wong; W. E. Estes; M. Periyasamy; J. Coburn 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, the processing temperatures and the thermomechanical properties of the dielectric and substrate materials. In this work, a prospective epoxy-based dielectric material for such sequentially built up (SBU) high density-interconnect printed wiring ...


Scintillation Calorimetry and Readout Techniques

Eckart Lorenz IEEE Transactions on Nuclear Science, 1984

The status and prospects of new scintillation materials for calorimetry applications in high energy physics are reviewed. New readout methods are discussed with emphasis on the operation of high resolution scintillation calorimeters in magnetic fields.


The CLEO-III trigger: analog and digital calorimetry

C. Bebek; T. J. Bergfeld; J. A. Ernst; G. D. Gollin; M. J. Haney; R. M. Hans; E. E. Johnson; C. L. Plager; C. Sedlack; M. A. Selen; C. R. Strohman; J. Williams 2000 IEEE Nuclear Science Symposium. Conference Record (Cat. No.00CH37149), 2000

The calorimetry subsystem of the CLEO-III trigger incorporates both analog and digital electronics to provide pipelined trigger information every 42 ns with a latency of approximately 2.5 μs. This paper describes the pipelined signal- processing and pattern-recognition schemes used to provide calorimeter information to the experiment trigger, with somewhat greater emphasis on the analog components of the system. Analog processing ...


Die-attach materials for high-density memory stacked die packaging

Mark Huang; Jaspreet Gandhi; Shijian Luo; Tom Jiang 2008 58th Electronic Components and Technology Conference, 2008

In this paper, several die attach adhesives (A to E) from different suppliers are investigated. The objective is to better understand the comprehensive properties of adhesives and to choose the right adhesive for a high-density memory stacked die packaging with improved packaging reliability. Differential scanning calorimetry (DSC) is used to investigate curing behavior and curing kinetics. Thermogravimetric analysis (TGA) is ...


Development of the wafer level compressive-flow underfill process and its required materials

S. H. Shi; T. Yamashita; C. P. Wong 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999

This paper described a wafer-level compressive flow underfill process and its involved materials for a novel SMT transparent flip-chip technology. In this flip-chip technology, a liquid fluxable wafer level compressive flow underfill (WLCFU) material is coated on the active side of an entire patterned and bumped wafer at first. The WLCFU layer is dried up at an elevated temperature to ...


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