Calorimetry

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Calorimetry is the science of measuring the heat of chemical reactions or physical changes. (Wikipedia.org)






Conferences related to Calorimetry

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2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


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Periodicals related to Calorimetry

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


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Most published Xplore authors for Calorimetry

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Xplore Articles related to Calorimetry

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Very high resolution hadron calorimetry

[{u'author_order': 1, u'affiliation': u'Fermi National Accelerator Laboratory, Batavia, IL 60510, USA', u'full_name': u'Krzysztof Genser'}, {u'author_order': 2, u'affiliation': u'Fermi National Accelerator Laboratory, Batavia, IL 60510, USA', u'full_name': u'Adam Para'}, {u'author_order': 3, u'affiliation': u'Fermi National Accelerator Laboratory, Batavia, IL 60510, USA', u'full_name': u'Hans Wenzel'}] 2011 IEEE Nuclear Science Symposium Conference Record, None

Experiments at the next generation of High Energy Physics accelerators will pose particularly strong requirements on the performance of hadron calorimeters. Significant progress in understanding of the fundamental limitations of hadron calorimeters combined with the major technological advances in dense inorganic scintillators and compact photodetectors enables development of new concept of hadron calorimetry based on a total absorption homogeneous hadron ...


Recent DIII-D neutral beam calibration results

[{u'author_order': 1, u'affiliation': u'General Atomics, San Diego, CA, USA', u'full_name': u'J. Wight'}, {u'author_order': 2, u'affiliation': u'General Atomics, San Diego, CA, USA', u'full_name': u'R. -M. Hong'}, {u'author_order': 3, u'affiliation': u'General Atomics, San Diego, CA, USA', u'full_name': u'J. Phillips'}] [Proceedings] The 14th IEEE/NPSS Symposium Fusion Engineering, None

The fundamental parameters by which injected DIII-D neutral beam power is calculated have all been recently measured using waterflow calorimetry and target tile thermocouples. The measured neutralization efficiency is 66%, close to the modeled equilibrium value of 70% for a 75 kV deuterium beam. Waterflow calorimetry has proven to be a useful tool to measure the neutralization efficiency, contrary to ...


Bonding development for non-conductive paste (NCP)

[{u'author_order': 1, u'affiliation': u'Micron Semicond. Asia Pte Ltd., Singapore, Singapore', u'full_name': u'T. K. Lee'}, {u'author_order': 2, u'affiliation': u'Micron Semicond. Asia Pte Ltd., Singapore, Singapore', u'full_name': u'E. Lua'}, {u'author_order': 3, u'affiliation': u'Micron Semicond. Asia Pte Ltd., Singapore, Singapore', u'full_name': u'K. C. Low'}, {u'author_order': 4, u'affiliation': u'Micron Semicond. Asia Pte Ltd., Singapore, Singapore', u'full_name': u'A. Ng'}, {u'author_order': 5, u'affiliation': u'Micron Semicond. Asia Pte Ltd., Singapore, Singapore', u'full_name': u'H. W. Ng'}] 2005 7th Electronic Packaging Technology Conference, None

Non-conductive paste (NCP) bonding offers fine pitch, simplified process, low packaging cost, and a lead-free interconnect system for flip-chip packaging. However, NCP bonding faces challenges in bonding yield rates. This paper studies bonding optimization through a closed-loop feedback system in order to understand the interaction of NCP materials with the bonding process for gold stud bumps on a rigid substrate. ...


Fast, long-wavelength scintillators and waveshifters

[{u'author_order': 1, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'K. Andert'}, {u'author_order': 2, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'B. Baumbaugh'}, {u'author_order': 3, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'A. Brothers'}, {u'author_order': 4, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'A. David'}, {u'author_order': 5, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'H. Gunther'}, {u'author_order': 6, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'J. Gurrola'}, {u'author_order': 7, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'D. Karmgard'}, {u'author_order': 8, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'T. Madlem'}, {u'author_order': 9, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'J. Marchant'}, {u'author_order': 10, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'P. McGough'}, {u'author_order': 11, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'M. McKenna'}, {u'author_order': 12, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'R. Ruchti'}, {u'author_order': 13, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'J. Thompson'}, {u'author_order': 14, u'affiliation': u'Dept. of Phys., Notre Dame Univ., IN, USA', u'full_name': u'M. Vigneault'}, {u'author_order': 15, u'full_name': u'L. Hernandez'}, {u'author_order': 16, u'full_name': u'C. Hurlbut'}] IEEE Nuclear Science Symposium Conference Record, 2005, None

Studies are presented of new blue-green to red emitting scintillator and waveshifter materials for tracking and calorimetry applications for the detection of ionizing radiation. Materials include plastic scintillators, liquid scintillators, and plastic scintillating and waveshifting fibers. Program goals are to develop faster and more efficient detection media for a variety of experimental applications


Study on modeling of multispectral emissivity and optimization algorithm

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Harbin Inst. of Technol., Heilongjiang, China', u'full_name': u'Chunling Yang'}, {u'author_order': 2, u'affiliation': u'Dept. of Electr. Eng., Harbin Inst. of Technol., Heilongjiang, China', u'full_name': u'Yong Yu'}, {u'author_order': 3, u'affiliation': u'Dept. of Electr. Eng., Harbin Inst. of Technol., Heilongjiang, China', u'full_name': u'Dongyang Zhao'}, {u'author_order': 4, u'affiliation': u'Dept. of Electr. Eng., Harbin Inst. of Technol., Heilongjiang, China', u'full_name': u'Guoliang Zhao'}] IEEE Transactions on Neural Networks, 2006

Target's spectral emissivity changes variously, and how to obtain target's continuous spectral emissivity is a difficult problem to be well solved nowadays. In this letter, an activation-function-tunable neural network is established, and a multistep searching method which can be used to train the model is proposed. The proposed method can effectively calculate the object's continuous spectral emissivity from the multispectral ...


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