Capacitance

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In electromagnetism and electronics, capacitance is the ability of a body to hold an electrical charge. Capacitance is also a measure of the amount of electrical energy stored (or separated) for a given electric potential. (Wikipedia.org)






Conferences related to Capacitance

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 11th Global Symposium on Millimeter Waves (GSMM)

The main theme of the GSMM2018 is Millimeter-wave Propagation: Hardware, Measurements and Systems. It covers millimeter-wave and THz devices, circuits, systems, and applications, with a special focus on mmWave propagation. The conference will include keynote talks, technical sessions, panels, and exhibitions on the listed topics.

  • 2017 10th Global Symposium on Millimeter-Waves (GSMM)

    The main theme of the symposium is Millimeter-Wave and Terahertz Sensing and Communications. It covers millimeter- wave and THz antennas, circuits, devices, systems and applications.

  • 2016 Global Symposium on Millimeter Waves (GSMM) & ESA Workshop on Millimetre-Wave Technology and Applications

    The main theme of the conference is millimeter-wave and terahertz sensing and communications and the conference covers different topics related to millimeter-wave and terahertz technologies, such as: antennas and propagation, passive and active devices, radio astronomy, earth observation and remote sensing, communications, wireless power transfer, integration and packaging, photonic systems, and emerging technologies.

  • 2015 Global Symposium On Millimeter Waves (GSMM)

    The main theme of the GSMM 2015 is “Future Millimeter-wave and Terahertz Wireless and Wireline”. It will cover all emerging and future millimeter wave and terahertz software and hardware aspects ranging from communicating devices, circuits, systems and applications to passive and active sensing and imaging technologies and applications. The GSMM 2015 will feature world-class keynote speeches, technical sessions, panel discussions and industrial exhibitions in the following (but not limited to) topics listed below.In addition to the regular program, the GSMM 2015 will organize a unique industrial forum for presenting and discussing future wireless technologies and trends including 5G and Terahertz Wireless Systems.

  • 2012 5th Global Symposium on Millimeter Waves (GSMM 2012)

    The aim of the conferences is to bring together people involved in research and development of millimeter-wave components, equipment and systems, and to explore common areas.

  • 2009 Global Symposium On Millimeter Waves (GSMM 2009)

    The GSMM2009 will be held in Sendai, Japan from April 20 to April 22, 2009. The GSMM2009 is the second international conference in its name after the three conferences of TSMMW, MINT-MIS, and MilliLab Workshop on Millimeter-wave Technology and Applications were integrated into GSMM (Global Symposium on Millimeter Waves) in 2007. The main theme of the GSMM2009 is "Millimeter Wave Communications at Hand" and it will focus on millimeter wave devices and systems to realize Giga-bit wireless applications. The

  • 2008 Global Symposium On Millimeter Waves (GSMM 2008)

    Frequency Management and Utilization, Millimeter-Wave Communication Systems, Devices and Circuit Technologies, Wireless Access Systems, Mobile Access Systems, Satellite Communications, LANs and PANs, Home Link Systems, Photonics, Antennas and Propagation, Phased Array Antennas, Signal Processing, Wearable Devices and Systems, Automotive Radars and Remote Sensing, Supporting and Related Technologies


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 15th International Workshop on Advanced Motion Control (AMC)

1. Advanced Motion Control2. Haptics, Robotics and Human-Machine Systems3. Micro/Nano Motion Control Systems4. Intelligent Motion Control Systems5. Nonlinear, Adaptive and Robust Control Systems6. Motion Systems for Robot Intelligence and Humanoid Robotics7. CPG based Feedback Control, Morphological Control8. Actuators and Sensors in Motion System9. Motion Control of Aerial/Ground/Underwater Robots10. Advanced Dynamics and Motion Control11. Motion Control for Assistive and Rehabilitative Robots and Systems12. Intelligent and Advanced Traffic Controls13. Computer Vision in Motion Control14. Network and Communication Technologies in Motion Control15. Motion Control of Soft Robots16. Automation Technologies in Primary Industries17. Other Topics and Applications Involving Motion Dynamics and Control


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Periodicals related to Capacitance

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


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Most published Xplore authors for Capacitance

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Xplore Articles related to Capacitance

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A high performance solar - Flyback inverter scheme for Ac motors

[{u'author_order': 1, u'affiliation': u'School of Electrical Sciences, Karunya University, Coimbatore, Tamilnadu, India', u'full_name': u'Chinnu P Ravi'}, {u'author_order': 2, u'affiliation': u'School of Electrical Sciences, Karunya University, Coimbatore, Tamilnadu, India', u'full_name': u'J. Jency Joseph'}] 2014 International Conference on Computation of Power, Energy, Information and Communication (ICCPEIC), None

This paper deals with the analysis, design and control of a small solar photovoltaic system. A PV array of 54V is taken as an input and its output voltage is achieved as 230V AC using a flyback inverter. A closed loop control for maximum power point tracking (MPPT) and a current shaping are used to optimize the system. And incremental ...


On the measurement of parasitic capacitances of device with more than two external terminals using an LCR meter

[{u'author_order': 1, u'affiliation': u'Intel Corp., Santa Clara, CA, USA', u'full_name': u'W. W. Lin'}, {u'author_order': 2, u'affiliation': u'Intel Corp., Santa Clara, CA, USA', u'full_name': u'P. C. Chan'}] IEEE Transactions on Electron Devices, 1991

A general methodology of directly measuring parasitic capacitance using an LCR meter in devices with more than two terminals is discussed. It is concluded that the accuracy of the measurement cannot be guaranteed in such devices since it is dependent on the internal structure of the device. This is demonstrated using the conventional (bulk silicon) MOSFET structure, showing that substrate ...


Diagnosis of hydrophobic condition of silicone rubber using dielectric measurement and image analysis

[{u'author_order': 1, u'affiliation': u'Gifu Nat. Coll. of Technol., Japan', u'full_name': u'T. Tokoro'}, {u'author_order': 2, u'affiliation': u'Gifu Nat. Coll. of Technol., Japan', u'full_name': u'S. Yanagihara'}, {u'author_order': 3, u'affiliation': u'Gifu Nat. Coll. of Technol., Japan', u'full_name': u'M. Kosaki'}] CEIDP '05. 2005 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 2005., None

Dielectric measurement and image analysis are used to evaluate the hydrophobic condition of silicone rubber surface. Hydrophobicity of silicone rubber surface was studied by using image data analysis of sprayed water droplets on the sample surface. Hydrophobicity class, HC from 1 to 7, is evaluated by the analyzed image data indices. The water droplets on the sample surface are digitized ...


Steady-state performance of a self-excited reluctance generator under unbalanced excitation capacitors

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan', u'full_name': u'Yung-Shan Wang'}, {u'author_order': 2, u'full_name': u'Li Wang'}] 2000 IEEE Power Engineering Society Winter Meeting. Conference Proceedings (Cat. No.00CH37077), None

This paper presents a novel scheme on steady-state performance of an isolated three-phase self-excited reluctance generator (SERG) under unbalanced excitation capacitors. It is assumed that the Y-connected excitation capacitor bank is properly connected at the machine's stator terminals. The values of excitation capacitance of both phases b and c are kept to be the same. The excitation capacitance of phase ...


Geometric computation and the art of sampling (tutorial)

[{u'author_order': 1, u'affiliation': u'Charles University', u'full_name': u'J. Matougek'}] Proceedings 39th Annual Symposium on Foundations of Computer Science (Cat. No.98CB36280), None

First Page of the Article ![](/xploreAssets/images/absImages/00743421.png)


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Educational Resources on Capacitance

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eLearning

No eLearning Articles are currently tagged "Capacitance"

IEEE-USA E-Books

  • Practical Thermal Management of LEDs

    This chapter starts¿¿¿off by giving an easily understood analytical method for calculating thermals. It then turns to an in¿¿¿depth look at the environment in which LEDs operate, and a variety of methods for keeping them cool. The chapter looks at reducing the resistance of the thermal conduction path. This is typically done with a heat sink, a piece of metal attached either directly or indirectly to the LEDs. A thermal resistance that can be minimized is the convection. Convection in air is moderately effective at cooling, but it can be dramatically enhanced by a fan. Fans and blowers work by forcing air to move across the hot surface. One more area that one should consider for reduction of thermal resistance is the thermal radiation. The chapter also considers some thermal management of the ballast. The ballasts are fairly immune to high temperatures.

  • Method of Moments

    Method of moments (MoM) is a numerical technique used to approximately solve linear operator equations such as differential equations or integral equations. This chapter outlines the steps to approximate the unknown function in linear operator equations in terms of a known finite series. It then presents the Fourier series (FS) expansion of a continuous function in a specified finite region to reinforce the concept of minimizing error or residual. The basics of MoM are presented next. A few simple examples are included to better understand the MoM procedure. Finally, complex radiating and scattering problems that cannot be handled via analytical methods are simulated with MoM and compared with other numerical models.

  • Computer Aided Design of Microstrip Antennas

    **This book focuses on new techniques, analysis, applications and future trends of microstrip and printed antenna technologies, with particular emphasis to recent advances from the last decade** In this book, the authors address topics such as reconfigurable antennas, ultra-wideband (UWB) antennas, reflectarrays, antennas for RFID systems and wearable antennas for body area networks. Antennas using metamaterials and defected ground structures (DGSs) are also explained. The authors discuss essential aspects including advanced design, analysis and optimization, and cover fundamental concepts and techniques, their practical applications and the future scope of developments. **_Key Features:_** * Addresses emerging hot topics of research and applications in microstrip and printed antennas * Considers the fundamental concepts, techniques, applications and future scope of such technologies * Discusses modern applications such as wireless base st tion to mobile handset, satellite earth station to airborne communication systems, radio frequency identification (RFID) to body area networks, etc. * Contributions from highly regarded experts and pioneers from the US, Europe and Asia _Microstrip and Printed Antennas: New Trends, Techniques and Applications_ provides a reference for R&D researchers, professors, practicing engineers, and scientists working in these fields. Graduate students studying/working on related subjects will find this book insightful.

  • Ultra-Capacitor Energy Storage Devices

    The ultra-capacitor as an emerging energy storage device dedicated to power conversion applications. The ultra-capacitor structure, operation principle and a macro (electrical) model are discussed intensively. Charging and discharging techniques and methods such as constant voltage/resistance, constant current and constant power are addressed and analysed. The ultra- capacitor charging and discharging process is not a loss-free process. The charging/discharging losses equations are derived and discussed. Thermal models of the ultra-capacitor are also addressed. With the theoretical analysis, practical examples, and exercises presented, this chapter gives an overview of how an ultra-capacitor operates as energy storage device and what are the essential properties to be consider in design of a power conversion system. The chapter is concluded with an overview of state of the arte ultra- capacitor technologies as well as ultra-capacitor under short and long term development.

  • Performance Prospects of Fully Depleted SOI MOSFET¿¿¿Based Diodes Applied to Schenkel Circuits for RF¿¿¿ID Chips

    The feasibility of using the silicon¿¿¿on insulator metal oxide semiconductor field¿¿¿effect transistor (SOI¿¿¿MOSFET) as a quasidiode to replace the Schottky¿¿¿barrier diode in the Schenkel circuit is examined, primarily by device simulations but also with some experiments. Practical equations giving boost¿¿¿up efficiency for DC and AC conditions are proposed and are examined using simulations. It is shown that the SOI¿¿¿MOSFET¿¿¿based quasidiode is a promising device for the Schenkel circuit because high boost¿¿¿up efficiency can be gained easily. An AC analysis indicates that the fully depleted condition is required to suppress the floating¿¿¿body effect for gigahertz¿¿¿level RF applications of a quasidiode.

  • Design of Z-Source and Quasi-Z-Source Inverters

    Inductance and capacitance are the two main parameters to be designed in the Z-source/quasi-Z-source inverter. This chapter focuses on the network parameters, loss calculations, voltage and current stress, coupled inductor of Z-source/quasi-Z source inverters and also efficiency, cost, and volume, in comparison to the conventional inverter. For three-phase qZSI, the inductor and capacitor should be designed to limit the switching frequency current and voltage ripple. However, for single-phase qZSI, the double line-frequency ripple will be the main concern for design of the inductor and capacitor, because larger inductance and capacitance are required to limit the switching frequency ripple. The total loss consists of those of the H-bridge device, qZS diode, inductor, and capacitor of qZS network. The voltage and current stresses depend on the modulation methods. The presented modeling, circuit analysis, and power loss evaluation provided an illustration for the future building and development of impedance source inverters/converters.

  • Introduction

    This introduction presents the key concepts discussed in the subsequent chapters of the book. The book introduces electromagnetic partial element equivalent circuit (PEEC) models in a practical useful way. It presents all aspects of building PEEC models in a logical way and dedicates the computation of capacitances ¿¿¿ an integral part of PEEC models. PEEC provides a stable dc solution, which is important for many realistic electromagnetic and circuit (EM/Ckt) problems. Circuit¿¿¿based EM approaches are usually differential equation (DE) based. This includes the transmission line method (TLM) method. Other equivalent circuit methods are derived from DEs. The book considers important aspects of inductance calculations and discusses the development of partial inductance concepts since they are the fundamental building block of most PEEC models. It also presents the building details for PEEC models that utilize partial inductances as well as partial coefficients of potential and resistances.

  • Periodic Synthesized Transmission Lines with Two¿¿¿Dimensional Routing

    In this chapter, a new sort of one¿¿¿dimensional periodic synthesized transmission lines with two¿¿¿dimensional routing capability is introduced using the printed circuit board (PCB) technology. The fundamental building block is a square unit cell composed of crossed conducting strips and metallic pads interleaved between strips. Two out of the four conducting strips are selected as the input/output ports, making the design fulfill two¿¿¿dimensional layout routing. The periodic cells are etched on the signal traces to function as transmission lines with low¿¿¿pass nature, while those in the PBG are designed to cover the entire ground plane and serve mainly as a bandgap structure. The quarter¿¿¿wavelength periodic synthesized lines are then applied to realize a number of dividers and couplers, including a Wilkinson power divider, branch¿¿¿line coupler, rat¿¿¿race coupler, and broadside¿¿¿coupled directional coupler. Finally, on¿¿¿chip implementation on the integrated passive device (IPD) substrate is introduced and analyzed.

  • SEIGs for Autonomous Power Systems

    This chapter contains sections titled: * Introduction * Three-Phase SEIG with the Steinmetz Connection * SEIG with Asymmetrically Connected Impedances and Excitation Capacitances * Self-regulated SEIG for Single-Phase Loads * SEIG with the Smith Connection * References

  • Bulk MOSFET

    This chapter focuses on the DC characteristics of bulk metal oxide semiconductor field¿¿¿effect transistor (MOSFET), and presents a theoretical analysis of the subthreshold and post¿¿¿threshold current characteristics as an aid to low¿¿¿energy device design. In a short¿¿¿channel bulk MOSFET, drain¿¿¿induced barrier lowering (DIBL) near the source junction at the front interface significantly degrades the subthreshold swing (SS). Band¿¿¿to¿¿¿band tunneling often occurs in the gate¿¿¿drain overlap region. It is sometimes called the gate¿¿¿induced drain leakage (GIDL) current. For MOSFETs with a thin gate oxide, it has a significant influence on DC and AC operation. In the bulk MOSFET, the thermal conductivity of the substrate is not so high. According to simulations, the temperature near the drain junction quickly rises to 100¿¿¿¿¿C. Since self¿¿¿heating effects degrade the surface mobility of carriers, they must be taken into account. In electrostatic¿¿¿discharge (ESD) protection circuits, self¿¿¿heating effects reduce the temperature margin for the second breakdown.




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