Conferences related to Dielectric Breakdown

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2020 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

Ferroelectric materials and applications


2018 53rd International Universities Power Engineering Conference (UPEC)

UPEC is a long-established international conference which provides a major forum for scientists, young researchers, PhD students and engineers worldwide to present, review and discuss the latest developments in Electrical Power Engineering and relevant technologies including energy storage and renewables

  • 2016 51st International Universities Power Engineering Conference (UPEC)

    UPEC is a long-established conference, which is very popular with young researchers, PhD students and engineers from the electrical power industry. The aim of the conference is to allow participants to exchange experiences and discuss the most up-to-date topics in Power Engineering. The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grid systems in developing countries require significant research input in the area. UPEC is an ideal forum to address some of these issues, and to network and meet with talented engineers and innovators in these areas.

  • 2015 50th International Universities Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2014 49th International Universities Power Engineering Conference (UPEC)

    Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges. It also provides the opportunity to network and to meet the experts in these areas.

  • 2013 48th Universities' Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2012 47th International Universities Power Engineering Conference (UPEC)

    A major international forum for the presentation, discussion and exchange of information concerning new trends in electrical power engineering. To become better informed about the latest developments in the field of power engineering.

  • 2010 45th International Universities Power Engineering Conference (UPEC)

    The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grids in developing countries require significant research effort and the need for talented engineers and innovators is critical to the electrical energy industry. UPEC is an ideal forum to address such issues, and to network and meet experts in these areas

  • 2009 44th International Universities Power Engineering Conference (UPEC)

    UPEC has been long-established as a major annual international forum for the presentation, discussion and exchange of information concerning new trends in all areas of electric power engineering. Contributions from younger engineers and researchers are particularly encouraged at UPEC, where ideas can be aired freely and new relationships developed.

  • 2008 43rd International Universities Power Engineering Conference (UPEC)

    Its aim will be to provide a professional forum for engineers and research scientists from the universities, consultants, and in the manufacturing and supply industries opportunities to present their work and explore potential trends and recent developments, current practices in Power Engineering and related fields.

  • 2007 Universities Power Engineering Conference (UPEC)

  • 2006 International Universities Power Engineering Conference (UPEC)

  • 2004 International Universities Power Engineering Conference (UPEC)


2018 IEEE International Conference on Plasma Science (ICOPS)

Plasma Science


2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC )

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2018 IEEE International Reliability Physics Symposium (IRPS)

Reliability issues associated with semiconductors, foundries, IoT and other areas


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Periodicals related to Dielectric Breakdown

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


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Most published Xplore authors for Dielectric Breakdown

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Xplore Articles related to Dielectric Breakdown

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Dielectric Breakdown-Based Microsensor for On-Chip Ambient Pressure Monitoring

[{u'author_order': 1, u'affiliation': u'Advanced Technology Development Centre, IIT Kharagpur, Kharagpur, India', u'full_name': u'Tania Mukherjee'}, {u'author_order': 2, u'affiliation': u'Advanced Technology Development Centre, IIT Kharagpur, Kharagpur, India', u'full_name': u'Ambarish Paul'}] IEEE Transactions on Electron Devices, 2018

The continuous monitoring of ambient pressure requires fast and stable device response. In this paper, we report the development of controllable, spatially steady, and sustained dielectric breakdown (DB) assisted ionization (DBAI)-based microdevice, suitable for continuous pressure monitoring. This steady output in DBAI process is attributed to the: 1) generation of stable E in the effective interelectrode gap $d_{text {int}}^{prime }$ ...


A comparison study of time-dependent dielectric breakdown for analog and digital circuit's optimal accelerated test regions

[{u'author_order': 1, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA', u'full_name': u'Kexin Yang'}, {u'author_order': 2, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA', u'full_name': u'Taizhi Liu'}, {u'author_order': 3, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA', u'full_name': u'Rui Zhang'}, {u'author_order': 4, u'affiliation': u'School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA', u'full_name': u'Linda Milor'}] 2017 32nd Conference on Design of Circuits and Integrated Systems (DCIS), None

This paper investigates not only the traditional reliability concern, frontend-of-line dielectric breakdown (GTDDB), but also the newly emerging wearout mechanism, Middle-of-Line (MOL) time dependent dielectric breakdown (MTDDB). The optimal accelerated test conditions for these mechanisms are presented, which involves separate test conditions for each mechanism. To perform circuit-level accelerated life test, the optimal conditions vary for analog and digital circuits ...


Impact of transistor scaling on the time-dependent dielectric breakdown (TDDB) reliability of analog circuits

[{u'author_order': 1, u'affiliation': u'Istanbul Technical University Electronics and Communications Engineering Department', u'full_name': u'Mustafa Tank Sani\xe7'}, {u'author_order': 2, u'affiliation': u'Istanbul Technical University Electronics and Communications Engineering Department', u'full_name': u'Mustafa Berke Yelten'}] 2017 10th International Conference on Electrical and Electronics Engineering (ELECO), None

This paper discusses the dielectric breakdown reliability of a two-stage operational amplifier across four short-channel device technologies. For a long time, time dependent dielectric breakdown (TDDB) impact was only confined to digital circuits as the electric field across the gate oxide is relatively large despite being applied in accordance with the activity factor. However, in analog circuits, electric field is ...


An enhanced operational definition of dielectric breakdown for DC voltage step-up tests

[{u'author_order': 1, u'affiliation': u'Materials Physics Group, Utah State University, 4415 Old Main Hill, Logan, UT 84322 USA', u'full_name': u'Allen Andersen'}, {u'author_order': 2, u'affiliation': u'Materials Physics Group, Utah State University, 4415 Old Main Hill, Logan, UT 84322 USA', u'full_name': u'J. R. Dennison'}] 2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), None

The imprecise definition of breakdown in the ASTM D3755-14 standard can misidentify breakdown. If the recommended test circuit current sensing element threshold is set too high, breakdown may occur undetected. Conversely, false positives may result from designating a low current threshold. An operational definition of breakdown much less sensitive to these pitfalls is outlined herein. This enhanced definition of breakdown ...


Dielectric breakdown of high-k epoxy-based anisotropic composites

[{u'author_order': 1, u'affiliation': u'LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France', u'full_name': u'Guillaume Belijar'}, {u'author_order': 2, u'affiliation': u'LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France', u'full_name': u'Elena Samartean'}, {u'author_order': 3, u'affiliation': u'LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France', u'full_name': u'Zarel Valdez-Nava'}, {u'author_order': 4, u'affiliation': u'LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France', u'full_name': u'Sombel Diaham'}, {u'author_order': 5, u'affiliation': u'LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France', u'full_name': u'Thierry Lebey'}] 2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), None

New polymer-based high-permittivity materials often depend on the addition of high-k particles such as BaTiO3. In the present work we propose the use of dielectrophoretically-aligned composites with anisotropic properties in the direction of the applied ac field during the curing process. The results on the dielectric permittivity of epoxy-based BaTiO3 ant SrTiO3 composites show that permittivity is increased for the ...


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Educational Resources on Dielectric Breakdown

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IEEE-USA E-Books

  • Dielectric Breakdown of Gate Oxides: Physics and Experiments

  • Loss and Power¿¿¿dependent Effects in Microstrip

    This chapter describes the sources of loss with microstrip lines. It begins by defining the quality factor, the Q, used to characterize energy storage relative to loss. This important metric enables different components to be compared and in particular different sources of loss and the performance of different transmission line systems. Separate mechanisms can be identified for power losses and parasitic effects associated with microstrip lines and also applicable to all planar lines. There are two main aspects to any consideration of power¿¿¿handling in microstrip: continuously working (CW) and pulse operation. Under CW conditions the major problems and limitations are thermal, whereas under pulse conditions the principal limitation is dielectric breakdown. One of the unexpected power¿¿¿dependent effects that can occur with microstrip transmission lines is passive intermodulation distortion (PIM). Design guidelines for minimizing PIM on planar transmission lines are provided in the chapter.

  • Dielectric Characterization and Reliability Methodology



Standards related to Dielectric Breakdown

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IEEE Standard for Low-Voltage DC Power Circuit Breakers Used in Enclosures

Revision to incorporate both 1000V and 1200V maximum design voltage ratings. Review and revise as necessary the requirements for peak current design testing. Revise for metrification requirement.



Jobs related to Dielectric Breakdown

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