Conferences related to Dielectric Breakdown

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2014 IEEE 41st International Conference on Plasma Sciences (ICOPS)

The International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society. The conference features a technical program with reports about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.

  • 2013 IEEE Pulsed Power and Plasma Science Conference (PPPS 2013)

    Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference

  • 2011 IEEE Pulsed Power Conference (PPC)

    The Pulsed Power Conference is held on a biannual basis and serves as the principal forum for the exchange of information on pulsed power technology and engineering.

  • 2009 IEEE Pulsed Power Conference (PPC)

    This biennial meeting is the principal medium for communicating advances in pulsed power science, technology and applications. Topics include high voltage components, dielectric breakdown, closing / opening switches, plasma processes and various applications. The Conference Proceedings constitute the most complete record of the accomplishments of the community.


2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic di

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2014 IEEE International Reliability Physics Symposium (IRPS)

reliability, physics, irps


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.



Periodicals related to Dielectric Breakdown

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.




Xplore Articles related to Dielectric Breakdown

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Impedance and nonlinear dielectric testing at high AC voltages using waveforms

Obrzut, J.; Kano, K. Instrumentation and Measurement, IEEE Transactions on, 2005

This paper presents the application of a waveform technique that can determine the complex impedance and nonlinear response of dielectric composite films at high ac voltages using a data acquisition (DAQ) card and virtual instrumentation. The voltage waveforms are Fourier transformed from the time domain to the frequency domain to obtain the fundamental and higher order harmonic responses as complex ...


Non-linear dielectric testing at high AC voltages using waveforms and harmonies

Obrzut, J.; Kano, K. Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on, 2005

Complex impedance and non-linear response were measured for high-dielectric composite films at AC voltages using a waveform technique. With decreasing dielectric thickness, these materials operate at higher electric fields, which cause non-linear dielectric effects and lead to a time dependent dielectric- breakdown. The waveforms were Fourier transformed from time domain to frequency domain and analyzed at fundamental and higher order ...


High dielectric constant composites for high power antennas

O'Connor, K.A.; Curry, R.D. Pulsed Power Conference (PPC), 2011 IEEE, 2011

The volume and weight of high power antennas can be a limiting factor for compact pulsed power transmitters. Options for antenna minimization are limited due to the relationship between an antenna's physical dimensions and the frequencies which can be transmitted. Thus, low frequency antennas often require dimensions on the order of meters. An effort undertaken at the University of Missouri ...


Dielectric Characteristics of Laminated Paper and Polymer Sheets Used for Lapping Dielectric Structure at 77 K

Xin Yang; Meng Song; Kun Nan Cao; Da Da Wang; Bin Wei Applied Superconductivity, IEEE Transactions on, 2014

110 kV cold dielectric high temperature superconducting (HTS) cable has been developing in China. Generally, the lapped dielectric structure is adapted for cable body, so dielectric characteristics of dielectric sheets are very important. Polyimide, Polypropylene laminated paper (PPLP) and polyimide and poly tetra fluoro ethylene (PTFE) are widespread dielectric sheet materials for HTS equipments with lapped structure. In this paper, ...


Gate dielectric breakdown: A focus on ESD protection

Weir, Bonnie E.; Che-Choi Leung; Silverman, Paul J.; Alam, M.A. Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International, 2004

The challenge of electrostatic discharge (ESD) design is that as scaling continues and operating voltages are lowered, the interface to the outside world and therefore the ESD specifications remain the same. Moreover, as has been highlighted by Duvvury et al. (1996), the first breakdown voltage for snapback of a transistor and the median breakdown voltage of the gate dielectric are ...


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