Conferences related to Dielectric Breakdown

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2014 IEEE 41st International Conference on Plasma Sciences (ICOPS) held with 2014 IEEE International Conference on High-Power Particle Beams (BEAMS)

The International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society. Promote physical understanding of neutral and non-neutral plasma physics, leading towards energy sources and applications.


2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic dielectrics, etc... prebreakdown and breakdown in solids, liquids, gases, and vacuum surface flashover, and treeing.

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2013 IEEE Pulsed Power and Plasma Science Conference (PPPS 2013)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference

  • 2011 IEEE Pulsed Power Conference (PPC)

    The Pulsed Power Conference is held on a biannual basis and serves as the principal forum for the exchange of information on pulsed power technology and engineering.

  • 2009 IEEE Pulsed Power Conference (PPC)

    This biennial meeting is the principal medium for communicating advances in pulsed power science, technology and applications. Topics include high voltage components, dielectric breakdown, closing / opening switches, plasma processes and various applications. The Conference Proceedings constitute the most complete record of the accomplishments of the community.


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.



Periodicals related to Dielectric Breakdown

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.



Most published Xplore authors for Dielectric Breakdown

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Xplore Articles related to Dielectric Breakdown

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Study on the change tendency of electro-magnetic signal under different vacuum degree for 10kV vacuum chamber

Yuxin Mei; Huan Yuan; Xiaohua Wang; Ke Sha; Peijin Wang; Jiahao Guo; Weishuai Xu; Minzhe Rong; Wanting Wang TENCON 2015 - 2015 IEEE Region 10 Conference, 2015

Vacuum circuit breakers are widely used in low and medium electrical power system as a result of its simple structure, small volume, high dielectric breakdown strength, good breaking ability and long operating life. However, the vacuum degree will reduce for some complicated reasons during the practical operating process, which leads to a great influence on its breaking capacity and even ...


Three-Dimensional Time-Domain Finite-Element Simulation of Dielectric Breakdown Based on Nonlinear Conductivity Model

Su Yan; Jian-Ming Jin IEEE Transactions on Antennas and Propagation, 2016

Dielectric breakdown during high-power operation is hazardous to electric and electronic devices and systems. During the breakdown process, the bound charges break free and are pushed to move by the force of high-intensity fields. As a result, a reduction in the resistance of an insulator can be observed, and a portion of the insulator becomes electrically conductive. Such a process ...


The Impact of Field Enhancements and Charge Injection on the Pulsed Breakdown Strength of Water

D. A. Wetz; J. J. Mankowski; J. C. Dickens; M. Kristiansen IEEE Transactions on Plasma Science, 2006

A unique theoretical model of the breakdown mechanism in water has been developed and further tested in both simulation software and experimentation. The conducted experiments test the degree to which electrode material, surface roughness, and surface area impact the dielectric strength of water. Voltage pulses with respective rise times of roughly 200 and 20 ns were applied to a water ...


Investigation of voltage processing window for point-contacting by localised dielectric breakdown

Anqi Liao; Ned J. Western; Qilin Ye; Stephen P. Bremner 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC), 2016

The robustness of the processing window for the Point-contacting by Localized Dielectric breakdown technique has been investigated. Previous results have shown that if the voltage is increased beyond the initial breakdown voltage then catastrophic breakdown will result leading to enhanced recombination. The difference between these breakdown events represents the safe voltage processing window of the technique. Results for amorphous silicon ...


Towards a chip level reliability simulator for copper/low-k backend processes

Muhammad Bashir; Linda Milor 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 2010

A framework is proposed to analyze circuit layout geometries to predict chip lifetime due to low-k time-dependent dielectric breakdown (TDDB). The methodology uses as inputs data from test structures, which have been designed and fabricated to detect the impact of area and metal linewidth on low-k TDDB.


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Educational Resources on Dielectric Breakdown

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eLearning

Study on the change tendency of electro-magnetic signal under different vacuum degree for 10kV vacuum chamber

Yuxin Mei; Huan Yuan; Xiaohua Wang; Ke Sha; Peijin Wang; Jiahao Guo; Weishuai Xu; Minzhe Rong; Wanting Wang TENCON 2015 - 2015 IEEE Region 10 Conference, 2015

Vacuum circuit breakers are widely used in low and medium electrical power system as a result of its simple structure, small volume, high dielectric breakdown strength, good breaking ability and long operating life. However, the vacuum degree will reduce for some complicated reasons during the practical operating process, which leads to a great influence on its breaking capacity and even ...


Three-Dimensional Time-Domain Finite-Element Simulation of Dielectric Breakdown Based on Nonlinear Conductivity Model

Su Yan; Jian-Ming Jin IEEE Transactions on Antennas and Propagation, 2016

Dielectric breakdown during high-power operation is hazardous to electric and electronic devices and systems. During the breakdown process, the bound charges break free and are pushed to move by the force of high-intensity fields. As a result, a reduction in the resistance of an insulator can be observed, and a portion of the insulator becomes electrically conductive. Such a process ...


The Impact of Field Enhancements and Charge Injection on the Pulsed Breakdown Strength of Water

D. A. Wetz; J. J. Mankowski; J. C. Dickens; M. Kristiansen IEEE Transactions on Plasma Science, 2006

A unique theoretical model of the breakdown mechanism in water has been developed and further tested in both simulation software and experimentation. The conducted experiments test the degree to which electrode material, surface roughness, and surface area impact the dielectric strength of water. Voltage pulses with respective rise times of roughly 200 and 20 ns were applied to a water ...


Investigation of voltage processing window for point-contacting by localised dielectric breakdown

Anqi Liao; Ned J. Western; Qilin Ye; Stephen P. Bremner 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC), 2016

The robustness of the processing window for the Point-contacting by Localized Dielectric breakdown technique has been investigated. Previous results have shown that if the voltage is increased beyond the initial breakdown voltage then catastrophic breakdown will result leading to enhanced recombination. The difference between these breakdown events represents the safe voltage processing window of the technique. Results for amorphous silicon ...


Towards a chip level reliability simulator for copper/low-k backend processes

Muhammad Bashir; Linda Milor 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 2010

A framework is proposed to analyze circuit layout geometries to predict chip lifetime due to low-k time-dependent dielectric breakdown (TDDB). The methodology uses as inputs data from test structures, which have been designed and fabricated to detect the impact of area and metal linewidth on low-k TDDB.


More eLearning Resources

IEEE-USA E-Books

  • Dielectric Breakdown of Gate Oxides: Physics and Experiments

    This chapter contains sections titled: Introduction Physics of Degradation and Breakdown Physical Models for Oxide Degradation and Breakdown Experimental Results of Oxide Breakdown Post-Breakdown Phenomena References

  • Dielectric Characterization and Reliability Methodology

    This chapter contains sections titled: Introduction Fundamentals of Insulator Physics and Characterization Measurement of Dielectric Reliability Fundamentals of Dielectric Breakdown Statistics Summary and Future Trends References

  • Loss and Power¿¿¿dependent Effects in Microstrip

    This chapter describes the sources of loss with microstrip lines. It begins by defining the quality factor, the Q, used to characterize energy storage relative to loss. This important metric enables different components to be compared and in particular different sources of loss and the performance of different transmission line systems. Separate mechanisms can be identified for power losses and parasitic effects associated with microstrip lines and also applicable to all planar lines. There are two main aspects to any consideration of power¿¿¿handling in microstrip: continuously working (CW) and pulse operation. Under CW conditions the major problems and limitations are thermal, whereas under pulse conditions the principal limitation is dielectric breakdown. One of the unexpected power¿¿¿dependent effects that can occur with microstrip transmission lines is passive intermodulation distortion (PIM). Design guidelines for minimizing PIM on planar transmission lines are provided in the chapter.



Standards related to Dielectric Breakdown

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Jobs related to Dielectric Breakdown

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