Conferences related to Dielectric Breakdown

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2014 IEEE 41st International Conference on Plasma Sciences (ICOPS) held with 2014 IEEE International Conference on High-Power Particle Beams (BEAMS)

The International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society. Promote physical understanding of neutral and non-neutral plasma physics, leading towards energy sources and applications.


2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014)

Topics of interest to the Conference include: Aging, Bio-dielectrics, Charge storage and transport, Electro-hydrodynamics, Flow electrification, High-field effects, High frequency dielectric phenomena, Measurement techniques, Nano-dielectrics, Outdoor insulation, Partial discharge measurements, Polarization phenomena, Pre-breakdown and breakdown in solids, liquids, gases, and vacuum, Surface flashover, Treeing, and Cryogenic dielectrics

  • 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, charge storage and transport cryogenic dielectrics, etc... prebreakdown and breakdown in solids, liquids, gases, and vacuum surface flashover, and treeing.

  • 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011)

    CEIDP provides an international forum for the discussion and presentations of current research on electrical insulation, dielectric phenomena, and related topics. The Conference provides a great opportunity for researchers and scientists from all over the world to meet and discuss ongoing research. Topics of interest to the Conference include: aging, biodielectrics, outdoor insulation, nanodilectrics, partial discharges, surface flashover, high field effects, polarization phenomena.

  • 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2010)

    CEIDP provides an international forum for teh discussion and presentation of current research on electrical insulation, dielectric phenomena and realted topics. The ocnference provides a great opportunity for researchers and scientists from around teh world to meet and discuss onglong research. Topics of interest to the Conference include:aging, biodielectrics, outdoor insulation, surface flashover, partial discharge measurements, polarization phenomena, measurement techniques, flow electrification, schrag

  • 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2009)

    CEIDP provides an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss ongoing research. Topics of interest to the Conference include: aging; biodielectrics; outdoor insulation; surface flashover; polarization phenomena; measurement techniques; partial discharge measurements; flow electrification; charge storage and transport; electrohy

  • 2008 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2008)

    To provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2007 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2007)

    The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics.

  • 2006 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2006)

  • 2005 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2005)


2013 IEEE Pulsed Power and Plasma Science Conference (PPPS 2013)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference

  • 2011 IEEE Pulsed Power Conference (PPC)

    The Pulsed Power Conference is held on a biannual basis and serves as the principal forum for the exchange of information on pulsed power technology and engineering.

  • 2009 IEEE Pulsed Power Conference (PPC)

    This biennial meeting is the principal medium for communicating advances in pulsed power science, technology and applications. Topics include high voltage components, dielectric breakdown, closing / opening switches, plasma processes and various applications. The Conference Proceedings constitute the most complete record of the accomplishments of the community.


2012 IEEE 10th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

The purpose of this conference is to provide a platform for researchers, scientists and engineers from all over the world to exchange ideas and discuss recent progress in electrical insulation, dielectric and practical applications. The focus of the conference is on dielectrics, its phenomena and applications in developing technologies such as nanotechnology, dielectric for superconductivity, dielectric discharges and others.

  • 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

    The IEEE International Conference on Properties and Applications of Dielectric Materials (ICPADM) is devoted to dielectrics and electrical insulation research. It attracts experts from around the world, and particularly from the fast growing economies of the Pacific Region.



Periodicals related to Dielectric Breakdown

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.




Xplore Articles related to Dielectric Breakdown

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Dielectric breakdown in plasma-polymerized aniline film

Pedrow, P.D.; Tamirisa, P.A.; Liddell, K.C.; Osman, M.A.; Chinn, D. Plasma Science, 2002. ICOPS 2002. IEEE Conference Record - Abstracts. The 29th IEEE International Conference on, 2002

Summary form only given, as follows. Plasma-polymerized films have been considered for use in applications such as photoemission, electron field emission displays, low dielectric constant material used for microelectronic interlayer dielectrics, and as protective coatings for superconductors. Molecules used as the monomer feed material have become high in molecular weight and complex in structure including aromatic hydrocarbons and dyes. In ...


A Comparison of Voltage Ramp and Time Dependent Dielectric Breakdown Tests for Evaluation of 45nm Low-k SiCOH Reliability

Chen, F.; McLaughlin, P.; Gambino, J.; Gill, J. International Interconnect Technology Conference, IEEE 2007, 2007

A comparison of the relationship between voltage ramp dielectric breakdown (VRDB) test and constant-voltage time-dependent dielectric breakdown (TDDB) stress has been performed as part of a 45 nm low-k SiCOH reliability evaluation. Although some correlation was observed between VRDB and TDDB, it was found that the fast VRDB test can't replace TDDB to evaluate true long- term time-dependent behavior, which ...


Enhanced dielectric breakdown lifetime of the copper/silicon nitride/silicon dioxide structure

Takeda, Ken-ichi; Hinode, K.; Oodake, I.; Oohashi, N.; Yamaguchi, H. Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International, 1998

Time-dependent dielectric breakdown (TDDB) of MIS and MIM capacitors with Cu electrodes is investigated. The dielectric breakdown lifetime strongly depends on (1) the material and (2) the electric field strength of the dielectrics in contact with the Cu anode, while the dependence of the TDDB lifetime on the dielectric thickness and the capacitor structure (single-layer or multilayer) is small. In ...


Differentiation between electric breakdowns and dielectric breakdown in thin silicon oxides

Jackson, J.C.; Robinson, T.; Oralkan, O.; Dumin, D.J.; Brown, G.A. Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on, 1997

It has been known for some time that non-destructive electric breakdowns precede destructive thermal dielectric breakdown. We have been studying both processes in oxides between 5 nm and 80 nm in thickness. We have shown that the electric breakdowns can trigger dielectric breakdown under certain conditions. This triggering of dielectric breakdown causes TDDB distributions to be non-unique. The TDDB distributions ...


Applying amorphous CoNbZr shield to improve the dielectric-breakdown voltage of the gap layers of narrow-gap read heads

Hoshino, Katsumi; Odai, Shiroyasu; Hatatani, Masahiko Magnetics, IEEE Transactions on, 2003

We investigated the dependence of the dielectric-breakdown voltage of the gap layer on lower shield material. The dielectric breakdown voltage of the gap layer is higher for the test elements with the CoNbZr shield than that with the NiFe shield, especially in the thin-gap range. The dielectric-breakdown voltage is about twice as high with the CoNbZr shield as with the ...


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