Conferences related to Stress Test

Back to Top

2013 8th International Conference for Internet Technology and Secured Transactions (ICITST)

The ICITST is an international refereed conference dedicated to the advancement of the theory and practical implementation of secured Internet transactions and to fostering discussions on information technology evolution.

  • 2012 7th International Conference for Internet Technology and Secured Transactions (ICITST)

    The ICITST is an international refereed conference dedicated to the advancement of the theory and practical implementation of secured Internet transactions and to fostering discussions on information technology evolution. The ICITST aims to provide a highly professional and comparative academic research forum that promotes collaborative excellence between academia and industry.

  • 2011 6th International Conference for Internet Technology and Secured Transactions (ICITST)

    The ICITST is an international refereed conference dedicated to the advancement of the theory and practical implementation of secured Internet transactions and to fostering discussions on information technology evolution. The ICITST aims to provide a highly professional and comparative academic research forum that promotes collaborative excellence between academia and industry.

  • 2009 4th International Conference for Internet Technology and Secured Transactions (ICITST)

    The ICITST aims to provide a highly professional and comparative academic research forum that promotes collaborative excellence between academia and industry. The objectives of the ICITST are to bridge the knowledge gap between academia and industry, promote research esteem in secured Internet transactions and the importance of information technology evolution to secured transactions. The ICITST-2009 invites and welcomes research papers that encompass conceptual analysis, design implementation and p


2013 IEEE Sixth International Conference on Software Testing, Verification and Validation (ICST)

ICST seeks to address the problems in verification and validation, by bringing together researchers and practitioners for a conference that includes all aspects of software testing, as it is most widely construed. Thus, ICST welcomes research papers as well as industrial experience reports from software development and testing practitioners.

  • 2012 IEEE Fifth International Conference on Software Testing, Verification and Validation (ICST)

    ICST is the premier conference in all areas related to software quality, software quality assurance, software validation and verification, and software testing.

  • 2011 IEEE Fourth International Conference on Software Testing, Verification and Validation (ICST)

    Testing, verification and validation activities are already flourishing areas with an active participation of a large community of researchers, experts, and industrialists. This community is highly aware of the importance and impact of testing on the future deployment and use of software and software intensive systems. As a leading software testing and verification&validation conference ICST has been very successful in bringing industry and research together to help shape the future of testing.

  • 2010 3rd IEEE International Conference on Software Testing, Verification and Validation (ICST)

    ICST bring industry and research together to help shape the future of software testing

  • 2009 2nd IEEE International Conference on Software Testing, Verification and Validation (ICST)

    ICST is the premier conference in all areas related to software quality. ICST bridges research and practice with tracks for research and industry papers, student papers, fast abstracts, and specilaized workshops.

  • 2008 1st IEEE International Conference on Software Testing, Verification and Validation (ICST)

    The new IEEE International Conference on Software Testing Verification and Validation (ICST) will offer an open forum for software testing, verification and validation research and its transfer to practice. Among other things, it aims at stimulating scientific research on model-based software testing, domain specific testing, empirical studies of testing techniques, and the technology transfer of research results to software development practices.


2013 Workshop on Accelerated Stress Testing & Reliability (ASTR)

ASTR 2013 will provide a forum to exchange knowledge and share ideas that address industry endeavors to limit field failures of products and to revisit existing qualification procedures. The focus will be on improving strategies to screen defects and weaknesses in electronic, electro-mechanical, and structural systems while reconciling high product Quality and Reliability with low product development cost and time to market. The program will feature industry leading keynote speakers and selected presentations.


2011 IEEE 6th International Workshop on Electronic Design, Test and Application (DELTA)

Original contributions are sought in the wide and multi-disciplinary areas of digital and analog electronics design, test and applications.


2010 International Conference on Mechanic Automation and Control Engineering (MACE)

Manufacturing Control and Automation Engineering,CAD/CAM/CIM and Simulation, Materials Processing and Control, Instruments and Vibration Control


More Conferences

Periodicals related to Stress Test

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Engineering in Medicine and Biology Magazine, IEEE

Both general and technical articles on current technologies and methods used in biomedical and clinical engineering; societal implications of medical technologies; current news items; book reviews; patent descriptions; and correspondence. Special interest departments, students, law, clinical engineering, ethics, new products, society news, historical features and government.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


More Periodicals


Xplore Articles related to Stress Test

Back to Top

Estimating lifetime of PP, PI and PVDF under artificial void conditions using step-stress tests

W. Khachen; J. R. Laghari IEEE Transactions on Electrical Insulation, 1992

Lifetimes of three different capacitor dielectrics. polypropylene (PP), polyimide (PI), and polyvinylidene fluoride (PVDF), were evaluated under high electric field using a step-stress method. Three layers of the insulating film were used for each dielectric material. To determine the influence of a void in the middle layer, two different configurations were used: with and without an artificial void in the ...


The ΔQT/ΔHR index for coronary artery disease evidence

S. Wong; F. Ng; D. Almeida; F. Mora; M. F. Hernandez; G. Passariello Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE, 1997

Repolarization phase is not yet a fully understood phenomenon, the most common method for evaluation of ventricular repolarization is a measurement of QT interval duration directly on electrocardiographic strips. This simple time interval is such a difficult parameter to measure because its value is affected by several physiological factors. In this study the authors propose an index, calculated as the ...


Sensitivity of T-wave alternans identification algorithms to residual physiological noise affecting the ECG after preprocessing

S. Bini; L. Burattini; R. Burattini 2010 Computing in Cardiology, 2010

To address the issue as to how and at what extent physiological noise that survives preprocessing affects TWA detection and quantification, a test was performed here on the fast-Fourier-transform spectral method (FFTSM), modified-moving-average method (MMAM), and adaptive-match-filter method (AMFM). These methods were applied to four synthetic ECG tracings respectively affected by no TWA, stationary TWA, and time-varying TWA. Absence and ...


On the electrical endurance characterization of insulating materials by constant and progressive stress test

G. C. Montanari; M. Cacciari IEEE Transactions on Electrical Insulation, 1992

Expressions for the generalized probability distributions of failure times obtained from constant-stress and progressive-stress tests are presented. Three types of life models are considered for this purpose, i.e. linear inverse-power and exponential models, and a threshold life model based on the inverse-power law. Moreover, two types of progressive-stress tests are examined, i.e. tests at linearly increasing voltage starting either from ...


AlGaAs/GaAs heterojunction bipolar transistor reliability: Device modeling and SPICE simulation

J. J. Liou; S. Sheu; C. I. Huang 1997 21st International Conference on Microelectronics. Proceedings, 1997

The physical mechanisms contributing to the reliability of AlGaAs/GaAs heterojunction bipolar transistor (HBT) are investigated, and a new AlGaAs/GaAs HBT model for SPICE circuit simulation is presented. Such a model includes the effects of base and collector leakage currents and the stress- induced abnormal base current, thus allowing the simulation of the performance of HBT circuits subjected to the electrical/thermal ...


More Xplore Articles

Educational Resources on Stress Test

Back to Top

eLearning

Estimating lifetime of PP, PI and PVDF under artificial void conditions using step-stress tests

W. Khachen; J. R. Laghari IEEE Transactions on Electrical Insulation, 1992

Lifetimes of three different capacitor dielectrics. polypropylene (PP), polyimide (PI), and polyvinylidene fluoride (PVDF), were evaluated under high electric field using a step-stress method. Three layers of the insulating film were used for each dielectric material. To determine the influence of a void in the middle layer, two different configurations were used: with and without an artificial void in the ...


The ΔQT/ΔHR index for coronary artery disease evidence

S. Wong; F. Ng; D. Almeida; F. Mora; M. F. Hernandez; G. Passariello Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE, 1997

Repolarization phase is not yet a fully understood phenomenon, the most common method for evaluation of ventricular repolarization is a measurement of QT interval duration directly on electrocardiographic strips. This simple time interval is such a difficult parameter to measure because its value is affected by several physiological factors. In this study the authors propose an index, calculated as the ...


Sensitivity of T-wave alternans identification algorithms to residual physiological noise affecting the ECG after preprocessing

S. Bini; L. Burattini; R. Burattini 2010 Computing in Cardiology, 2010

To address the issue as to how and at what extent physiological noise that survives preprocessing affects TWA detection and quantification, a test was performed here on the fast-Fourier-transform spectral method (FFTSM), modified-moving-average method (MMAM), and adaptive-match-filter method (AMFM). These methods were applied to four synthetic ECG tracings respectively affected by no TWA, stationary TWA, and time-varying TWA. Absence and ...


On the electrical endurance characterization of insulating materials by constant and progressive stress test

G. C. Montanari; M. Cacciari IEEE Transactions on Electrical Insulation, 1992

Expressions for the generalized probability distributions of failure times obtained from constant-stress and progressive-stress tests are presented. Three types of life models are considered for this purpose, i.e. linear inverse-power and exponential models, and a threshold life model based on the inverse-power law. Moreover, two types of progressive-stress tests are examined, i.e. tests at linearly increasing voltage starting either from ...


AlGaAs/GaAs heterojunction bipolar transistor reliability: Device modeling and SPICE simulation

J. J. Liou; S. Sheu; C. I. Huang 1997 21st International Conference on Microelectronics. Proceedings, 1997

The physical mechanisms contributing to the reliability of AlGaAs/GaAs heterojunction bipolar transistor (HBT) are investigated, and a new AlGaAs/GaAs HBT model for SPICE circuit simulation is presented. Such a model includes the effects of base and collector leakage currents and the stress- induced abnormal base current, thus allowing the simulation of the performance of HBT circuits subjected to the electrical/thermal ...


More eLearning Resources

IEEE.tv Videos

IMS 2012 Microapps - Use of FPGAs for Faster Test Times and Repeatability on Cellular Measurements
IMS 2011 Microapps - The Design and Test of Broadband Launches Up to 50GHz on Thin and Thick Substrates
IMS 2012 Microapps - The Next Generation of Communications Design, Validate, and Test Dr. Mark Pierpoint
Research, Development and Field Test of Robotic Observation Systems for Active Volcanic Areas in Japan
Agilent: Test up to 1500 amps and 10,000 volts!
Carl Selinger: Stuff you Don't Learn in Engineering School
APEC 2011-Intersil Promo Apec 2011
26th Annual MTT-AP Symposium and Mini Show - Dr. Rob Holland
Micro-Apps 2013: Environment Simulation for Counter-IED Jammer Test
CES 2009: Telekinesis is Child's Play With Mattel's Mindflex
IMS 2011 Microapps - Pulsed S-Parameter Measurements Using PXI Instruments
5G Wireless A Measurement and Metrology Perspective: MicroApps 2015 - Keysight Technologies
IEEE Authoring Part 5: Ethics
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
Micro-Apps 2013: Power Added Efficiency (PAE) Analysis with 8990B Peak Power Analyzer
Microwave Journal Panel Session Path to 5G - Design and Test Challenges - MicroApps IMS 2015
Micro-Apps 2013: Creating and Analyzing Multi-Emitter Environment Test Signals with COTS Equipment
IMS 2011 Microapps - Maximizing VSA Dynamic Range Through Appropriate IF Path Selection
Meet the Users of IEEE Collabratec
GeoOrbital E-Wheel Allows Effortless Biking

IEEE-USA E-Books

  • Investigations in Thick Film Components for High Temperature Systems

    In the near future electronic systems and circuits which are able to work at high temperatures will be used for sensor and actuator applications, especially where cooling is not possible or very difficult. A second reason for developing high temperature sensor systems is to avoid long signal ways between sensor and signal processing electronic in order to improve EMC- properties. Using thick film hybrid technology provides an easy way of constructing high temperature electronics. But normally thick film components are not specified for temperatures higher than 423 K. Our goal is to characterize and to optimize thick film components for a large temperature range. In order to get information about high temperature behaviour, it is necessary to use suitable testing techniques. This report will introduce some methods like linear test or step stress test which allow accelerated life tests in order to extract the temperature coefficient as well as the behaviour of degradation. In case of thick films, results for preselections can be easily obtained. Results of examined thick film resistors tested up to 773 K will be presented as an example.



Standards related to Stress Test

Back to Top

Guide for the statistical analysis of electrical insulation breakdown data


IEEE Guide for Making Corona (Partial Discharge) Measurements on Electronics Transformers

This guide covers the detection of corona (partial discharge) and the measurement of its magnitude in electronics transformers. Test conditions, test apparatus, and test requirements are included.



Jobs related to Stress Test

Back to Top