Conferences related to Stress Test

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2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - MTT 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2020 IEEE/MTT-S International Microwave Symposium - IMS 2020

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2019 IEEE/MTT-S International Microwave Symposium - MTT 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - MTT 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


2017 12th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Industrial Informatics, Computational Intelligence, Control and Systems, Cyber-physical Systems, Energy and Environment, Mechatronics, Power Electronics, Signal and Information Processing, Network and Communication Technologies


2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

The Internet of Things, including wearable devices and smart home products, will again be a big theme. To cater for the technology trends, the theme of IMPACT-IAAC 2016 highlights "IMPACT on the Next Big Things" and will arrange panel sessions, invited talks, industrial sessions and outstanding paper presentations.


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Periodicals related to Stress Test

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Xplore Articles related to Stress Test

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Problems with IO to all other IOs ESD stress test: Two case studies

Yen-Yi Lin; Steve Marum; Charvaka Duvuury; Joe Schichl; Ricky Watson 2005 Electrical Overstress/Electrostatic Discharge Symposium, 2005

We report an unusual ESD failure when testing according to the recommended stress combination of IO to all other IO pins. In two independent product cases we observed devices failing for this test while the same devices pass when tested for all possible IO pin to IO pin combinations. These results strongly suggest a revision of this test methodology.


Improved humidity resistance of leaded packages through solder dip process

Yeoh Lai Seng; Law Che Seong; Ng Eng Keat; Gooi Boon Hooi; Francis Classe; Susan Li 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011

Summary form only given. Strong light-matter coupling has been recently successfully explored in the GHz and THz [1] range with on-chip platforms. New and intriguing quantum optical phenomena have been predicted in the ultrastrong coupling regime [2], when the coupling strength Ω becomes comparable to the unperturbed frequency of the system ω. We recently proposed a new experimental platform where ...


Cycle stress test equipment for automated short circuit testing of smart power switches according to the AEC Q100-012 standard

Michael Glavanovics; Hans-Peter Kreuter; Roland Sleik; Christoph Schreiber 2009 13th European Conference on Power Electronics and Applications, 2009

We present the design of a cycle test system for automated stress testing of smart power switches under automotive load short circuit conditions up to 250A / 50V. A fast overcurrent detection and shutdown strategy protects the test equipment from damage. Device degradation and failure data are recorded individually for statistical analysis of time-to-failure distributions. Representative measurements show that our ...


Detect Android Malware Variants Using Component Based Topology Graph

Tong Shen; Yibing Zhongyang; Zhi Xin; Bing Mao; Hao Huang 2014 IEEE 13th International Conference on Trust, Security and Privacy in Computing and Communications, 2014

Smartphone has experienced explosive growth recently. At present, Android system is the most popular mobile platform and attracts lots of developers as well as malware authors. In order to evade detection, malware authors often apply obfuscation techniques to morph malware. Since traditional malware detectors are based on pure syntax, they may fail to detect obfuscated malware variants. We present a ...


Evolving MEMS qualification requirements

Andrew Olney 2010 IEEE International Reliability Physics Symposium, 2010

In the early 1990s, Microelectromechanical Systems (MEMS) products were qualified using a suite of application-specific stress tests that were previously developed and used for mechanical sensors. For example, automotive companies required MEMS accelerometers to pass the same stress tests as mechanical accelerometers, including shock, vibration, temperature cycling, acceleration, and operating life tests. Semiconductor companies augmented these traditional stress tests with ...


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Educational Resources on Stress Test

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eLearning

Problems with IO to all other IOs ESD stress test: Two case studies

Yen-Yi Lin; Steve Marum; Charvaka Duvuury; Joe Schichl; Ricky Watson 2005 Electrical Overstress/Electrostatic Discharge Symposium, 2005

We report an unusual ESD failure when testing according to the recommended stress combination of IO to all other IO pins. In two independent product cases we observed devices failing for this test while the same devices pass when tested for all possible IO pin to IO pin combinations. These results strongly suggest a revision of this test methodology.


Improved humidity resistance of leaded packages through solder dip process

Yeoh Lai Seng; Law Che Seong; Ng Eng Keat; Gooi Boon Hooi; Francis Classe; Susan Li 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011

Summary form only given. Strong light-matter coupling has been recently successfully explored in the GHz and THz [1] range with on-chip platforms. New and intriguing quantum optical phenomena have been predicted in the ultrastrong coupling regime [2], when the coupling strength Ω becomes comparable to the unperturbed frequency of the system ω. We recently proposed a new experimental platform where ...


Cycle stress test equipment for automated short circuit testing of smart power switches according to the AEC Q100-012 standard

Michael Glavanovics; Hans-Peter Kreuter; Roland Sleik; Christoph Schreiber 2009 13th European Conference on Power Electronics and Applications, 2009

We present the design of a cycle test system for automated stress testing of smart power switches under automotive load short circuit conditions up to 250A / 50V. A fast overcurrent detection and shutdown strategy protects the test equipment from damage. Device degradation and failure data are recorded individually for statistical analysis of time-to-failure distributions. Representative measurements show that our ...


Detect Android Malware Variants Using Component Based Topology Graph

Tong Shen; Yibing Zhongyang; Zhi Xin; Bing Mao; Hao Huang 2014 IEEE 13th International Conference on Trust, Security and Privacy in Computing and Communications, 2014

Smartphone has experienced explosive growth recently. At present, Android system is the most popular mobile platform and attracts lots of developers as well as malware authors. In order to evade detection, malware authors often apply obfuscation techniques to morph malware. Since traditional malware detectors are based on pure syntax, they may fail to detect obfuscated malware variants. We present a ...


Evolving MEMS qualification requirements

Andrew Olney 2010 IEEE International Reliability Physics Symposium, 2010

In the early 1990s, Microelectromechanical Systems (MEMS) products were qualified using a suite of application-specific stress tests that were previously developed and used for mechanical sensors. For example, automotive companies required MEMS accelerometers to pass the same stress tests as mechanical accelerometers, including shock, vibration, temperature cycling, acceleration, and operating life tests. Semiconductor companies augmented these traditional stress tests with ...


More eLearning Resources

IEEE.tv Videos

IMS 2012 Microapps - Use of FPGAs for Faster Test Times and Repeatability on Cellular Measurements
IMS 2011 Microapps - The Design and Test of Broadband Launches Up to 50GHz on Thin and Thick Substrates
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IEEE-USA E-Books

  • Investigations in Thick Film Components for High Temperature Systems

    In the near future electronic systems and circuits which are able to work at high temperatures will be used for sensor and actuator applications, especially where cooling is not possible or very difficult. A second reason for developing high temperature sensor systems is to avoid long signal ways between sensor and signal processing electronic in order to improve EMC- properties. Using thick film hybrid technology provides an easy way of constructing high temperature electronics. But normally thick film components are not specified for temperatures higher than 423 K. Our goal is to characterize and to optimize thick film components for a large temperature range. In order to get information about high temperature behaviour, it is necessary to use suitable testing techniques. This report will introduce some methods like linear test or step stress test which allow accelerated life tests in order to extract the temperature coefficient as well as the behaviour of degradation. In case of thick films, results for preselections can be easily obtained. Results of examined thick film resistors tested up to 773 K will be presented as an example.



Standards related to Stress Test

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Guide for the statistical analysis of electrical insulation breakdown data


IEEE Guide for Making Corona (Partial Discharge) Measurements on Electronics Transformers

This guide covers the detection of corona (partial discharge) and the measurement of its magnitude in electronics transformers. Test conditions, test apparatus, and test requirements are included.



Jobs related to Stress Test

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