Conferences related to Stress Test

Back to Top

2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Industrial Informatics, Computational Intelligence, Control and Systems, Cyber-physicalSystems, Energy and Environment, Mechatronics, Power Electronics, Signal and InformationProcessing, Network and Communication Technologies


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2018 26th European Signal Processing Conference (EUSIPCO)

Audio and acoustic signal processingSpeech and language processingImage and video processingMultimedia signal processingSignal processing theory and methodsSensor array and multichannel signal processingSignal processing for communicationsRadar and sonar signal processingSignal processing over graphs and networksNonlinear signal processingStatistical signal processingCompressed sensing and sparse modelingOptimization methodsMachine learningBio-medical image and signal processingSignal processing for computer vision and roboticsComputational imaging/ Spectral imagingInformation forensics and securitySignal processing for power systemsSignal processing for educationBioinformatics and genomicsSignal processing for big dataSignal processing for the internet of thingsDesign/implementation of signal processing systemsOther signal processing areas

  • 2017 25th European Signal Processing Conference (EUSIPCO)

    Audio and acoustic signal processingSpeech and language processingImage and video processingMultimedia signal processingSignal processing theory and methodsSensor array and multichannel signal processingSignal processing for communicationsRadar and sonar signal processingSignal processing over graphs and networksNonlinear signal processingStatistical signal processingCompressed sensing and sparse modelingOptimization methodsMachine learningBio-medical image and signal processingSignal processing for computer vision and roboticsInformation forensics and securitySignal processing for power systemsSignal processing for educationBioinformatics and genomicsSignal processing for big dataSignal processing for the internet of thingsDesign and implementation of signal processing systemsOther signal processing areas

  • 2016 24th European Signal Processing Conference (EUSIPCO)

    EUSIPCO is the flagship conference of the European Association for Signal Processing (EURASIP). The 24th edition will be held in Budapest, Hungary, from 29th August - 2nd September 2016. EUSIPCO 2016 will feature world-class speakers, oral and poster sessions, keynotes, exhibitions, demonstrations and tutorials and is expected to attract in the order of 600 leading researchers and industry figures from all over the world.

  • 2015 23rd European Signal Processing Conference (EUSIPCO)

    EUSIPCO is the flagship conference of the European Association for Signal Processing (EURASIP). The 23rd edition will be held in Nice, on the French Riviera, from 31st August - 4th September 2015. EUSIPCO 2015 will feature world-class speakers, oral and poster sessions, keynotes, exhibitions, demonstrations and tutorials and is expected to attract in the order of 600 leading researchers and industry figures from all over the world.

  • 2014 22nd European Signal Processing Conference (EUSIPCO)

    EUSIPCO is one of the largest international conferences in the field of signal processing and addresses all the latest developments in research and technology. The conference will bring together individuals from academia, industry, regulation bodies, and government, to discuss and exchange ideas in all the areas and applications of signal processing. The conference will feature world-class keynote speakers, special sessions, plenary talks, tutorials, and technical sessions.

  • 2013 21st European Signal Processing Conference (EUSIPCO)

    The EUSIPCO is organized by the European Association for Signal, Speech, and Image Processing (EURASIP). The focus will be on signal processing theory, algorithms, and applications.

  • 2012 20th European Signal Processing Conference

    The focus: signal processing theory, algorithms and applications. Papers will be accepted based on quality, relevance, and novelty and will be indexed in the main databases. Organizers: University POLITEHNICA of Bucharest and Telecom ParisTech.


More Conferences

Periodicals related to Stress Test

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


More Periodicals

Most published Xplore authors for Stress Test

Back to Top

Xplore Articles related to Stress Test

Back to Top

The Corrosion Behavior of Au/Al Interface under High Accelerated Stress Test

[{u'author_order': 1, u'affiliation': u'Institute of Microelectronic Materials & Technology School of Materials Science and Engineering, Shanghai Jiao, Tong University, Shanghai, 200240, P.R. China', u'full_name': u'Tao Chen'}, {u'author_order': 2, u'affiliation': u'Institute of Microelectronic Materials & Technology School of Materials Science and Engineering, Shanghai Jiao, Tong University, Shanghai, 200240, P.R. China', u'full_name': u'Mengyuan Xue'}, {u'author_order': 3, u'affiliation': u'Institute of Microelectronic Materials & Technology School of Materials Science and Engineering, Shanghai Jiao, Tong University, Shanghai, 200240, P.R. China', u'full_name': u'Xundi Zhang'}, {u'author_order': 4, u'affiliation': u'Institute of Microelectronic Materials & Technology School of Materials Science and Engineering, Shanghai Jiao, Tong University, Shanghai, 200240, P.R. China', u'full_name': u'Liming Gao'}, {u'author_order': 5, u'affiliation': u'Institute of Microelectronic Materials & Technology School of Materials Science and Engineering, Shanghai Jiao, Tong University, Shanghai, 200240, P.R. China', u'full_name': u'Ming Li'}] 2018 19th International Conference on Electronic Packaging Technology (ICEPT), None

Different cure time has significantly impact on the Au/Al interface corrosion behavior during high accelerated stress test (HAST). A detailed IMC evolution of Au/Al wire bonding interface during HAST is discussed in this paper. After 96hrs/144hrs 130 °C and 85%RH HAST, wire pull ball lift fail rate decreased with the increase of cure time. IMC phase at Au/Al interface were ...


Reliabilities and Failure Analysis of Printed Circuit Boards Interconnect Stress Test

[{u'author_order': 1, u'affiliation': u'Reliability Research and Analysis Center, China CEPREI Laboratory, Guangzhou, China', u'full_name': u'Ying Yang'}] 2018 19th International Conference on Electronic Packaging Technology (ICEPT), None

Interconnect Stress Testing is currently being used more and more in PCB industries. It is an accelerated aging method providing vivid insight into plated through holes reliability of high performance boards. The test data analysis provides a detailed understanding of PTH life during assembly and/or rework. The testing mechanism of IST, test coupons and test methods are detailed in this ...


Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test

[{u'author_order': 1, u'affiliation': u'Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA', u'full_name': u'Pradeep Lall'}, {u'author_order': 2, u'affiliation': u'Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA', u'full_name': u'Yihua Luo'}, {u'author_order': 3, u'affiliation': u'Texas Instrum., Inc., Santa Clara, CA, USA', u'full_name': u'Luu Nguyen'}] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), None

A novel multiphysics model for the corrosion of Cu-Al wirebonds operating under highly accelerated stress test conditions has been developed. Corrosion kinetics of the Cu-Al WB system has been modeled using a combination of Butler-Volmer Equation and the Nernst-Planck Equation to capture the diffusion mechanisms and the corrosion kinetics. The Tafel Parameters have been from polarization curves measured under a ...


Evaluating telemetric ECG body sensor signal in exercise stress test: Pilot study

[{u'author_order': 1, u'affiliation': u'Department of Communication Systems, Jožef Stefan Institute, Jamova 38, Ljubljana, Slovenia', u'full_name': u'B. Siraiy'}, {u'author_order': 2, u'affiliation': u'Department of Exercise Physiology and Biochemistry, Faculty of Sport and Physical Education University of Belgrade, Blagoja Parovića 156, Belgrade, Serbia', u'full_name': u'V. Ili\u0107'}, {u'author_order': 3, u'affiliation': u'Department of Communication Systems, Jožef Stefan Institute, Jamova 38, Ljubljana, Slovenia', u'full_name': u'R. Trobec'}] 2018 41st International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO), None

The aim of this pilot study is to find out a maximal heart rate that can be assessed with telemetric ECG body sensors during exercise stress tests. Twenty subjects were randomly divided into two experimental groups. A first group of ten subjects has been tested on a treadmill and a second group of ten subjects on a cycle ergometer. Two ...


Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling

[{u'author_order': 1, u'affiliation': u'Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany', u'full_name': u'Georg M. Reuther'}, {u'author_order': 2, u'affiliation': u'Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany', u'full_name': u'Reinhard Pufall'}, {u'author_order': 3, u'affiliation': u'Technische Universität Chemnitz, Reichenhainer Str. 70, 09126 Chemnitz, Germany', u'full_name': u'Bernhard Wunderle'}] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), None

We present a novel, highly accelerated stress test method that addresses disruption of metallisation layers in standard microelectronic components, a major reliability risk. This failure mode typically arises from large time- dependent temperature gradients due to strong cyclic current pulses. The test vehicle behind is a Silicon-based micro-cantilever beam with aluminium (Al) metallisation meander on top. By resonant excitation of ...


More Xplore Articles

Educational Resources on Stress Test

Back to Top

eLearning

No eLearning Articles are currently tagged "Stress Test"

IEEE.tv Videos

IMS 2012 Microapps - Use of FPGAs for Faster Test Times and Repeatability on Cellular Measurements
IMS 2011 Microapps - The Design and Test of Broadband Launches Up to 50GHz on Thin and Thick Substrates
IMS 2012 Microapps - The Next Generation of Communications Design, Validate, and Test Dr. Mark Pierpoint
Research, Development and Field Test of Robotic Observation Systems for Active Volcanic Areas in Japan
Agilent: Test up to 1500 amps and 10,000 volts!
IMS 2012 Microapps - Linking RF Design thru to Test: Intro to Model Extraction
APEC 2011-Intersil Promo Apec 2011
26th Annual MTT-AP Symposium and Mini Show - Dr. Rob Holland
IMS 2011 Microapps - Pulsed S-Parameter Measurements Using PXI Instruments
Carl Selinger: Stuff you Don't Learn in Engineering School
CES 2009: Telekinesis is Child's Play With Mattel's Mindflex
Micro-Apps 2013: Environment Simulation for Counter-IED Jammer Test
Micro-Apps 2013: Creating and Analyzing Multi-Emitter Environment Test Signals with COTS Equipment
5G Wireless A Measurement and Metrology Perspective: MicroApps 2015 - Keysight Technologies
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
IEEE Authoring Part 5: Ethics
Meet the Users of IEEE Collabratec
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Microwave Journal Panel Session Path to 5G - Design and Test Challenges - MicroApps IMS 2015
Micro-Apps 2013: Power Added Efficiency (PAE) Analysis with 8990B Peak Power Analyzer

IEEE-USA E-Books

  • Investigations in Thick Film Components for High Temperature Systems

    In the near future electronic systems and circuits which are able to work at high temperatures will be used for sensor and actuator applications, especially where cooling is not possible or very difficult. A second reason for developing high temperature sensor systems is to avoid long signal ways between sensor and signal processing electronic in order to improve EMC- properties. Using thick film hybrid technology provides an easy way of constructing high temperature electronics. But normally thick film components are not specified for temperatures higher than 423 K. Our goal is to characterize and to optimize thick film components for a large temperature range. In order to get information about high temperature behaviour, it is necessary to use suitable testing techniques. This report will introduce some methods like linear test or step stress test which allow accelerated life tests in order to extract the temperature coefficient as well as the behaviour of degradation. In case of thick films, results for preselections can be easily obtained. Results of examined thick film resistors tested up to 773 K will be presented as an example.



Standards related to Stress Test

Back to Top

Guide for the statistical analysis of electrical insulation breakdown data


IEEE Guide for Gas-Insulated Substations

This guide provides information of special relevance to the planning, design, testing, installation, operation and maintenance of gas-insulated substations(GIS) and equipment. This guide is intended to supplement IEEE Std C37-122- 1993(R2002). In general, this guide is applicable to all GIS above 52 kV. However the importance of the topics covered varies with application category. For example, issues related to advanced ...


IEEE Guide for Making Corona (Partial Discharge) Measurements on Electronics Transformers

This guide covers the detection of corona (partial discharge) and the measurement of its magnitude in electronics transformers. Test conditions, test apparatus, and test requirements are included.



Jobs related to Stress Test

Back to Top