Conferences related to Stress Test

Back to Top

2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Industrial Informatics, Computational Intelligence, Control and Systems, Cyber-physicalSystems, Energy and Environment, Mechatronics, Power Electronics, Signal and InformationProcessing, Network and Communication Technologies


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2018 26th European Signal Processing Conference (EUSIPCO)

Audio and acoustic signal processingSpeech and language processingImage and video processingMultimedia signal processingSignal processing theory and methodsSensor array and multichannel signal processingSignal processing for communicationsRadar and sonar signal processingSignal processing over graphs and networksNonlinear signal processingStatistical signal processingCompressed sensing and sparse modelingOptimization methodsMachine learningBio-medical image and signal processingSignal processing for computer vision and roboticsComputational imaging/ Spectral imagingInformation forensics and securitySignal processing for power systemsSignal processing for educationBioinformatics and genomicsSignal processing for big dataSignal processing for the internet of thingsDesign/implementation of signal processing systemsOther signal processing areas

  • 2017 25th European Signal Processing Conference (EUSIPCO)

    Audio and acoustic signal processingSpeech and language processingImage and video processingMultimedia signal processingSignal processing theory and methodsSensor array and multichannel signal processingSignal processing for communicationsRadar and sonar signal processingSignal processing over graphs and networksNonlinear signal processingStatistical signal processingCompressed sensing and sparse modelingOptimization methodsMachine learningBio-medical image and signal processingSignal processing for computer vision and roboticsInformation forensics and securitySignal processing for power systemsSignal processing for educationBioinformatics and genomicsSignal processing for big dataSignal processing for the internet of thingsDesign and implementation of signal processing systemsOther signal processing areas

  • 2016 24th European Signal Processing Conference (EUSIPCO)

    EUSIPCO is the flagship conference of the European Association for Signal Processing (EURASIP). The 24th edition will be held in Budapest, Hungary, from 29th August - 2nd September 2016. EUSIPCO 2016 will feature world-class speakers, oral and poster sessions, keynotes, exhibitions, demonstrations and tutorials and is expected to attract in the order of 600 leading researchers and industry figures from all over the world.

  • 2015 23rd European Signal Processing Conference (EUSIPCO)

    EUSIPCO is the flagship conference of the European Association for Signal Processing (EURASIP). The 23rd edition will be held in Nice, on the French Riviera, from 31st August - 4th September 2015. EUSIPCO 2015 will feature world-class speakers, oral and poster sessions, keynotes, exhibitions, demonstrations and tutorials and is expected to attract in the order of 600 leading researchers and industry figures from all over the world.

  • 2014 22nd European Signal Processing Conference (EUSIPCO)

    EUSIPCO is one of the largest international conferences in the field of signal processing and addresses all the latest developments in research and technology. The conference will bring together individuals from academia, industry, regulation bodies, and government, to discuss and exchange ideas in all the areas and applications of signal processing. The conference will feature world-class keynote speakers, special sessions, plenary talks, tutorials, and technical sessions.

  • 2013 21st European Signal Processing Conference (EUSIPCO)

    The EUSIPCO is organized by the European Association for Signal, Speech, and Image Processing (EURASIP). The focus will be on signal processing theory, algorithms, and applications.

  • 2012 20th European Signal Processing Conference

    The focus: signal processing theory, algorithms and applications. Papers will be accepted based on quality, relevance, and novelty and will be indexed in the main databases. Organizers: University POLITEHNICA of Bucharest and Telecom ParisTech.


More Conferences

Periodicals related to Stress Test

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


More Periodicals

Most published Xplore authors for Stress Test

Back to Top

Xplore Articles related to Stress Test

Back to Top

Evaluation of T-wave alternans in comparison with ECG stress test and scintigraphic examination in patients with coronary artery disease

[{u'author_order': 1, u'affiliation': u'Nalecz Institute of Biocybernetics and Biomedical Engineering, Warsaw, Poland', u'full_name': u'D. Janusek'}, {u'author_order': 2, u'affiliation': u'Nalecz Institute of Biocybernetics and Biomedical Engineering, Warsaw, Poland', u'full_name': u'M. Kania'}, {u'author_order': 3, u'affiliation': u'Nalecz Institute of Biocybernetics and Biomedical Engineering, Warsaw, Poland', u'full_name': u'H. Zavala-Fernandez'}, {u'author_order': 4, u'affiliation': u'Nalecz Institute of Biocybernetics and Biomedical Engineering, Warsaw, Poland', u'full_name': u'R. Maniewski'}, {u'author_order': 5, u'affiliation': u'Medical University of Warsaw, Warsaw, Poland', u'full_name': u'R. Zaczek'}, {u'author_order': 6, u'affiliation': u'Medical University of Warsaw, Warsaw, Poland', u'full_name': u'M. Kobylecka'}, {u'author_order': 7, u'affiliation': u'Medical University of Warsaw, Warsaw, Poland', u'full_name': u'G. Opolski'}, {u'author_order': 8, u'affiliation': u'Medical University of Warsaw, Warsaw, Poland', u'full_name': u'L. Krolicki'}] 2012 IEEE 12th International Conference on Bioinformatics & Bioengineering (BIBE), 2012

The results of study on T-wave alternans in the group of patients with ischemic heart disease are shown. The body surface potential maps were recorded with use of 67 channel high-resolution ECG system. Electrocardiographic stress test was performed during the patient examinations. The T-wave alternans ratio was calculated and results were compared with data obtained by single-photon emission computed tomography ...


Research and application of network load stress test for smart substation

[{u'author_order': 1, u'affiliation': u'State Grid Jiangxi Electric Power Company, Maintenance Branch, Nanchang, Jiangxi, China', u'full_name': u'Ming Cai'}, {u'author_order': 2, u'affiliation': u'State Grid Jiangxi Electric Power Company, Maintenance Branch, Nanchang, Jiangxi, China', u'full_name': u'Qi Xiao'}, {u'author_order': 3, u'affiliation': u'State Grid Jiangxi Electric Power Company, Maintenance Branch, Nanchang, Jiangxi, China', u'full_name': u'Yuyun Chen'}, {u'author_order': 4, u'affiliation': u'State Grid Jiangxi Electric Power Company, Maintenance Branch, Nanchang, Jiangxi, China', u'full_name': u'Wenxing Cheng'}, {u'author_order': 5, u'affiliation': u'State Grid Jiangxi Electric Power Company, Maintenance Branch, Nanchang, Jiangxi, China', u'full_name': u'Xiaobing Zhou'}, {u'author_order': 6, u'affiliation': u'Wuhan Kemov Electric Company Ltd, Wuhan, Hubei, China', u'full_name': u'Zhihua Wang'}] 2015 5th International Conference on Electric Utility Deregulation and Restructuring and Power Technologies (DRPT), 2015

Load stress test of secondary equipment network is important for the large- scale construction of smart substations. In this article, several secondary equipment network schemes and their influence on relays related IEDs are discussed, and then stress test objects, principles for smart substation are proposed. Based on embedded CPU and large-scale FPGA, load stress testing device for secondary equipment network ...


Cycle stress test equipment for automated short circuit testing of smart power switches according to the AEC Q100-012 standard

[{u'author_order': 1, u'affiliation': u'KAI-Kompetenzzentrum Automobil- und Industrieelektronik GmbH Europastrasse 8, 9500 Villach, Austria', u'full_name': u'Michael Glavanovics'}, {u'author_order': 2, u'affiliation': u'KAI-Kompetenzzentrum Automobil- und Industrieelektronik GmbH Europastrasse 8, 9500 Villach, Austria', u'full_name': u'Hans-Peter Kreuter'}, {u'author_order': 3, u'affiliation': u'KAI-Kompetenzzentrum Automobil- und Industrieelektronik GmbH Europastrasse 8, 9500 Villach, Austria', u'full_name': u'Roland Sleik'}, {u'author_order': 4, u'affiliation': u'Infineon Technologies Austria AG, Villach, Austria', u'full_name': u'Christoph Schreiber'}] 2009 13th European Conference on Power Electronics and Applications, 2009

We present the design of a cycle test system for automated stress testing of smart power switches under automotive load short circuit conditions up to 250A / 50V. A fast overcurrent detection and shutdown strategy protects the test equipment from damage. Device degradation and failure data are recorded individually for statistical analysis of time-to-failure distributions. Representative measurements show that our ...


Stress test and finite element analysis of a 10×10<sup>4</sup>m<sup>3</sup>crude oil tank

[{u'author_order': 1, u'affiliation': u'College of Architecture and Environment, Sichuan University, Chengdu, China', u'full_name': u'Xiaoyang Peng'}, {u'author_order': 2, u'affiliation': u'College of Architecture and Environment, Sichuan University, Chengdu, China', u'full_name': u'Qi Ge'}, {u'author_order': 3, u'affiliation': u'College of Architecture and Environment, Sichuan University, Chengdu, China', u'full_name': u'Feng Xiong'}] 2011 International Conference on Multimedia Technology, 2011

The large crude oil storage tank with a capacity of 10×104m3has been widely used in China currently. In order to obtain the stress distribution in the wall board, bottom board, big fillet weld and manhole, and to verify the rationality of tank design, a stress test which combining the method of static resistance strain test (SRST) and optical fiber strain ...


Voltage Ramp Stress Test to determine TDDB performance in SRAM vehicle

[{u'author_order': 1, u'affiliation': u'Si Technology Group, Programmable Platforms Development, Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124, USA', u'full_name': u'Jae-Gyung Ahn'}, {u'author_order': 2, u'affiliation': u'Si Technology Group, Programmable Platforms Development, Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124, USA', u'full_name': u'Suresh Parameswaran'}, {u'author_order': 3, u'affiliation': u'Reliability Engineering Group, Quality and New Product, Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124, USA', u'full_name': u'Dean Tsaggaris'}, {u'author_order': 4, u'affiliation': u'NPI Product Engineering Group, Quality and New Product, Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124, USA', u'full_name': u'Chien-Wei Ku'}, {u'author_order': 5, u'affiliation': u'Si Technology Group, Programmable Platforms Development, Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124, USA', u'full_name': u'Ping-Chin Yeh'}, {u'author_order': 6, u'affiliation': u'Si Technology Group, Programmable Platforms Development, Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124, USA', u'full_name': u'Jonathan Chang'}] 2014 IEEE International Reliability Physics Symposium, 2014

We applied Voltage Ramp Stress Test (VRST) to an SRAM test vehicle and compared the obtained Vfail distribution with theoretical predictions from various TDDB failure criteria. Measured Vfail results are matched with the prediction from TDDB failure criterion of Ig/Ig0=1000 or more. We developed a numerical method to predict effective Igate with TDDB stress. It was applied to VRST condition ...


More Xplore Articles

Educational Resources on Stress Test

Back to Top

eLearning

No eLearning Articles are currently tagged "Stress Test"

IEEE.tv Videos

IMS 2012 Microapps - Use of FPGAs for Faster Test Times and Repeatability on Cellular Measurements
IMS 2011 Microapps - The Design and Test of Broadband Launches Up to 50GHz on Thin and Thick Substrates
IMS 2012 Microapps - The Next Generation of Communications Design, Validate, and Test Dr. Mark Pierpoint
Research, Development and Field Test of Robotic Observation Systems for Active Volcanic Areas in Japan
Agilent: Test up to 1500 amps and 10,000 volts!
IMS 2012 Microapps - Linking RF Design thru to Test: Intro to Model Extraction
IMS 2011 Microapps - Pulsed S-Parameter Measurements Using PXI Instruments
APEC 2011-Intersil Promo Apec 2011
26th Annual MTT-AP Symposium and Mini Show - Dr. Rob Holland
Carl Selinger: Stuff you Don't Learn in Engineering School
Micro-Apps 2013: Environment Simulation for Counter-IED Jammer Test
CES 2009: Telekinesis is Child's Play With Mattel's Mindflex
Micro-Apps 2013: Creating and Analyzing Multi-Emitter Environment Test Signals with COTS Equipment
5G Wireless A Measurement and Metrology Perspective: MicroApps 2015 - Keysight Technologies
IEEE Authoring Part 5: Ethics
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
Microwave Journal Panel Session Path to 5G - Design and Test Challenges - MicroApps IMS 2015
Micro-Apps 2013: Power Added Efficiency (PAE) Analysis with 8990B Peak Power Analyzer
Meet the Users of IEEE Collabratec
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)

IEEE-USA E-Books



Standards related to Stress Test

Back to Top

Guide for the statistical analysis of electrical insulation breakdown data


IEEE Guide for Gas-Insulated Substations

This guide provides information of special relevance to the planning, design, testing, installation, operation and maintenance of gas-insulated substations(GIS) and equipment. This guide is intended to supplement IEEE Std C37-122- 1993(R2002). In general, this guide is applicable to all GIS above 52 kV. However the importance of the topics covered varies with application category. For example, issues related to advanced ...


IEEE Guide for Making Corona (Partial Discharge) Measurements on Electronics Transformers

This guide covers the detection of corona (partial discharge) and the measurement of its magnitude in electronics transformers. Test conditions, test apparatus, and test requirements are included.



Jobs related to Stress Test

Back to Top