Metrology

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This article is about the science of measurement. (Wikipedia.org)






Conferences related to Metrology

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2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE AUTOTESTCON

AUTOTESTCON is the world’s premier conference that brings together themilitary/aerospace automatic test industry and government/military acquirers and usersto share new technologies, discuss innovative applications, and exhibit products andservices.

  • 2018 IEEE AUTOTESTCON

    AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services

  • 2017 IEEE AUTOTESTCON

    IEEE AUTOTESTCON is also known as the Systems Readiness Technology Conference. This major conference and exposition provides focus on the maintenance aspects of systems readiness and providing Mission Assurance through Advanced ATE (Automatic Test Equpmenrt/Systems). This includes Maintenance Repair & Overhaul as well as factory and development automated test equipment. This conference brings military and aerospace industry principals together to share new concepts, technologies and applications in this essential field of supportability and sustainability. The conference includes a major exhibit of exciting new products from a wide variety of exhibitors, and provides the opportunity to meet with senior military and aerospace leaders to discuss their future needs and expectations and the ways in which we can satisfy those needs.

  • 2016 IEEE AUTOTESTCON

    echnical Interchange Meeting for military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services

  • 2015 IEEE AUTOTESTCON

    IEEE AUTOTEST is an annual Technical Interchange Meeting sponsored by the Institute of Electrical and Electronic Engineers (IEEE). This event serves to gather the military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services

  • 2014 IEEE AUTOTEST

    IEEE AUTOTESTCON is the world s only conference that focuses primarily on Automated Test and related technology for military, government and aerospace applications. The conference also has an expanded focus into commercial areas that share a common technical base, including aerospace, vehicle and automotive, and commercial factory test applications. Autotestcon provides a unique opportunity to discuss platform support requirements with all DoD Branches, provides hands-on experience with test equipment, and

  • 2013 IEEE AUTOTESTCON

    Content focused on automatic test systems for US military systems.

  • 2012 IEEE AUTOTESTCON

    Automated Test Systems (ATE) and related technologies such as Test Program Sets for US military and defense equipment

  • 2011 IEEE AUTOTESTCON

    Annual conference of the automatic testing industry.

  • 2010 IEEE AUTOTESTCON

    IEEE AUTOTESTCON, The Support Systems Technology Conference, is the largest conference focused on automatic test systems for military and aerospace systems, and has been held annually since 1965. It features more than 120 quality application-focused papers and 250 Exhibits. Attendance ranges between 650 and 750 registered professionals.

  • 2009 IEEE AUTOTESTCON

    Automated Test, Test Technology, and related Support Systems for Defense Systems.

  • 2008 IEEE AUTOTESTCON

    All theoretical and application aspects for an appropriate topic dealing with system readiness, in general, and automatic test technology, in particular. In keeping with our conference theme "Surpassing the Limits-Forging Ahead" our focus will be on new ideas and concepts, unusual testing solutions, and future technologies, e.g. ATE Architectures, Artificial Intelligence in Test, ATE/TPS Development Techniques, ATE/TPS Management, BIT/BIST

  • 2007 IEEE AUTOTESTCON

  • 2006 IEEE AUTOTESTCON

  • 2005 IEEE AUTOTESTCON

  • 2004 IEEE AUTOTESTCON

  • 2003 IEEE AUTOTESTCON

  • 2002 IEEE AUTOTESTCON

  • 2001 IEEE AUTOTESTCON

  • 2000 IEEE AUTOTESTCON

  • AUTOTESTCON '99

  • AUTOTESTCON '98

  • AUTOTESTCON '97

  • AUTOTESTCON '96


2019 IEEE International Conference on Systems, Man and Cybernetics (SMC)

2019 IEEE International Conference on Systems, Man, and Cybernetics (SMC2019) will be held in the south of Europe in Bari, one of the most beautiful and historical cities in Italy. The Bari region’s nickname is “Little California” for its nice weather and Bari's cuisine is one of Italian most traditional , based of local seafood and olive oil. SMC2019 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report up-to-the-minute innovations and developments, summarize state­of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems and cybernetics. Advances have importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience, and thereby improve quality of life.


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Periodicals related to Metrology

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


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Xplore Articles related to Metrology

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Metrology and inspection challenges for manufacturing 3D stacked IC's

[{u'author_order': 1, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37941529900', u'full_name': u'Sandip Halder', u'id': 37941529900}, {u'author_order': 2, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37070779500', u'full_name': u'Karen Stiers', u'id': 37070779500}, {u'author_order': 3, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/38240691100', u'full_name': u'Andy Miller', u'id': 38240691100}, {u'author_order': 4, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37282765200', u'full_name': u'Ingrid de Wolf', u'id': 37282765200}, {u'author_order': 5, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37401724100', u'full_name': u'Alain Phommahaxay', u'id': 37401724100}, {u'author_order': 6, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37325429500', u'full_name': u'Mireille Maenhoudt', u'id': 37325429500}, {u'author_order': 7, u'affiliation': u'Litho and Metrology Engineering imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37275277600', u'full_name': u'Eric Beyne', u'id': 37275277600}, {u'author_order': 8, u'affiliation': u'Micron Technology Belgium Kapeldreef 75, B-3001 Leuven, Belgium', u'authorUrl': u'https://ieeexplore.ieee.org/author/37070747600', u'full_name': u'Stefano Guerrieri', u'id': 37070747600}] ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference, 2013

In this paper we discuss the numerous metrology and inspection challenges that need to be overcome to really have high volume manufacturing of 3D integrated chips. The key metrology and inspections issues are addressed module wise. We start with the TSV module then move on to the wafer bonding and thinning module. This is followed by the bumping module, de-bonding ...


Inline detection for FinFET gate poly footing using e-Tilt metrology

[{u'author_order': 1, u'affiliation': u'GLOBALFOUNDRIES, 400 Stone Break Rd Extension, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086390132', u'full_name': u'Xiaoxiao Zhang', u'id': 37086390132}, {u'author_order': 2, u'affiliation': u'GLOBALFOUNDRIES, 400 Stone Break Rd Extension, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086009920', u'full_name': u'Mert Karakoy', u'id': 37086009920}, {u'author_order': 3, u'affiliation': u'GLOBALFOUNDRIES, 400 Stone Break Rd Extension, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086388838', u'full_name': u'Kejia Wu', u'id': 37086388838}, {u'author_order': 4, u'affiliation': u'GLOBALFOUNDRIES, 400 Stone Break Rd Extension, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086388854', u'full_name': u'Zhuangfei Chen', u'id': 37086388854}, {u'author_order': 5, u'affiliation': u'eBeam Inspection and Metrology Division, Applied Materials, 1 Racemark Way, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086121581', u'full_name': u'Zhenhua Ge', u'id': 37086121581}, {u'author_order': 6, u'affiliation': u'eBeam Inspection and Metrology Division, Applied Materials, 1 Racemark Way, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086389154', u'full_name': u'Navi Krishnan', u'id': 37086389154}, {u'author_order': 7, u'affiliation': u'eBeam Inspection and Metrology Division, Applied Materials, 1 Racemark Way, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086118898', u'full_name': u'Amit Siany', u'id': 37086118898}, {u'author_order': 8, u'affiliation': u'eBeam Inspection and Metrology Division, Applied Materials, 1 Racemark Way, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/38527770400', u'full_name': u'Shimon Levi', u'id': 38527770400}, {u'author_order': 9, u'affiliation': u'eBeam Inspection and Metrology Division, Applied Materials, 1 Racemark Way, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/38528027700', u'full_name': u'Ishai Schwarzband', u'id': 38528027700}, {u'author_order': 10, u'affiliation': u'eBeam Inspection and Metrology Division, Applied Materials, 1 Racemark Way, Malta, NY 12020 USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/38528014500', u'full_name': u'Roman Kris', u'id': 38528014500}] 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2018

Advanced FinFET device architecture generates new profile control requirement in 1× node and beyond. The corner at the intersection between the Gate and Fin is critical geometry for device yield and reliability. The residue-free corner at Gate-Fin interface after Polysilicon gate etch is desirable yet also a known challenge to detect and control. Current detection methods for gate poly footing, ...


Uncertainty analysis in waveform metrology: From vertical measurement to horizontal quantities

[{u'author_order': 1, u'affiliation': u'NATIONAL INSTITUTE OF METROLOGY, BEIJING, 100029, P.R. China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37538282400', u'full_name': u'Yichi Zhang', u'id': 37538282400}, {u'author_order': 2, u'affiliation': u'NATIONAL INSTITUTE OF METROLOGY, BEIJING, 100029, P.R. China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085455178', u'full_name': u'Zhao He', u'id': 37085455178}, {u'author_order': 3, u'affiliation': u'NATIONAL INSTITUTE OF METROLOGY, BEIJING, 100029, P.R. China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085680092', u'full_name': u'Xiaotao Guo', u'id': 37085680092}, {u'author_order': 4, u'affiliation': u'NATIONAL INSTITUTE OF METROLOGY, BEIJING, 100029, P.R. China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085849918', u'full_name': u'Aining Yang', u'id': 37085849918}, {u'author_order': 5, u'affiliation': u'NATIONAL INSTITUTE OF METROLOGY, BEIJING, 100029, P.R. China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085816058', u'full_name': u'Lifeng Wang', u'id': 37085816058}, {u'author_order': 6, u'affiliation': u'NATIONAL INSTITUTE OF METROLOGY, BEIJING, 100029, P.R. China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085456339', u'full_name': u'Meining Nie', u'id': 37085456339}] 2016 IEEE MTT-S International Wireless Symposium (IWS), 2016

This paper investigates the covariance-matrix-based uncertainty propagation of waveforms from time-domain vertical measurements to horizontal parameters. Following the Guide to the Expression of Uncertainty in Measurement (GUM), the uncertainty of timebase, corresponding to target amplitude, of a measured waveform is evaluated upon the vertical measurement uncertainties, where the waveform function is used to determine the Jacobian matrix. As a result, ...


Optical frequency metrology with optical lattice clocks and optical frequency combs

[{u'author_order': 1, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37274253400', u'full_name': u'Feng-Lei Hong', u'id': 37274253400}, {u'author_order': 2, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37397110600', u'full_name': u'Masami Yasuda', u'id': 37397110600}, {u'author_order': 3, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37540557900', u'full_name': u'Daisuke Akamatsu', u'id': 37540557900}, {u'author_order': 4, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37399261200', u'full_name': u'Takuya Kohno', u'id': 37399261200}, {u'author_order': 5, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37396532600', u'full_name': u'Kazumoto Hosaka', u'id': 37396532600}, {u'author_order': 6, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37280632200', u'full_name': u'Hajime Inaba', u'id': 37280632200}, {u'author_order': 7, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37408614300', u'full_name': u'Yoshiaki Nakajima', u'id': 37408614300}, {u'author_order': 8, u'affiliation': u'National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology, (AIST), Central 3, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8563, Japan', u'authorUrl': u'https://ieeexplore.ieee.org/author/37274792100', u'full_name': u'Atsushi Onae', u'id': 37274792100}] 2012 Conference on Precision electromagnetic Measurements, 2012

Laser frequency stabilization and atom manipulation are important techniques for optical frequency metrology. We report on the development of an ytterbium (<sup>171</sup>Yb) and a strontium (<sup>87</sup>Sr) optical lattice clock at the National Metrology Institute of Japan (NMIJ). The result of absolute frequency measurement of the <sup>171</sup>Yb lattice clock is shown. We also report on narrow-linewidth fiber-based frequency combs that are ...


Siberian Research Institute of Metrology. Stages of 70-year-old way and today tasks

[{u'author_order': 1, u'affiliation': u'FSUE &#x00AB;Siberian Red Labor Banner Research Institute of Metrology&#x00BB;, Russia', u'authorUrl': u'https://ieeexplore.ieee.org/author/37076522900', u'full_name': u'G.V. Shuvalov', u'id': 37076522900}, {u'author_order': 2, u'affiliation': u'FSUE &#x00AB;Siberian Red Labor Banner Research Institute of Metrology&#x00BB;, Russia', u'authorUrl': u'https://ieeexplore.ieee.org/author/38192966900', u'full_name': u'V.I. Evgrafov', u'id': 38192966900}, {u'author_order': 3, u'affiliation': u'FSUE &#x00AB;Siberian Red Labor Banner Research Institute of Metrology&#x00BB;, Russia', u'full_name': u'V.Ya. Cherepanov'}, {u'author_order': 4, u'affiliation': u'FSUE &#x00AB;Siberian Red Labor Banner Research Institute of Metrology&#x00BB;, Russia', u'authorUrl': u'https://ieeexplore.ieee.org/author/37937291000', u'full_name': u'Yu.A. Palchun', u'id': 37937291000}] 2014 12th International Conference on Actual Problems of Electronics Instrument Engineering (APEIE), 2014

The paper presents the main results of the research and development carried out in the Siberian Research Institute of Metrology for 70 years of its existence. There is represented the history of the Institute, as well as tasks that are met by members of the Institute nowadays.


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Educational Resources on Metrology

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Standards related to Metrology

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IEEE Guide for Measurement of Environmental Sensitivities of Standard Frequency Generators

This project is a revision of the existing guide for measurements of environmental sensitivities of standard frequency generators. It includes effects and metrology of acceleration; temperature, humidity, and pressure; electrical and magnetic fields; ionizing and particle radiation; and aging, warm-up time and retrace.


IEEE Standard Definitions of Physical Quantities for Fundamental Frequency and Time Metrology--Random Instabilities



Jobs related to Metrology

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