Conferences related to Carbon Nanotubes

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 56th ACM/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM//IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


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Periodicals related to Carbon Nanotubes

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electromagnetic Compatibility, IEEE Transactions on

EMC standards; measurement technology; undesired sources; cable/grounding; filters/shielding; equipment EMC; systems EMC; antennas and propagation; spectrum utilization; electromagnetic pulses; lightning; radiation hazards; and Walsh functions


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Most published Xplore authors for Carbon Nanotubes

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Xplore Articles related to Carbon Nanotubes

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Simulation of carbon nanotubes polymer based piezoresistive flexible pressure sensor for ultra sensitive electronic skin

[{u'author_order': 1, u'affiliation': u'Center for Nanotechnology, Andhra University College of Engineering(A), Visakhapatnam, India', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086457372', u'full_name': u'Roopa Hegde', u'id': 37086457372}, {u'author_order': 2, u'affiliation': u'Dr. B. R. Ambedkar University, Srikakulam, India', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086456841', u'full_name': u'K. Ramji', u'id': 37086456841}, {u'author_order': 3, u'affiliation': u'Dept. of Instrumentation Technology, Andhra University College of Engineering(A), Visakhapatnam, India', u'authorUrl': u'https://ieeexplore.ieee.org/author/37062909200', u'full_name': u'P. Swapna', u'id': 37062909200}] 2018 2nd International Conference on Electronics, Materials Engineering & Nano-Technology (IEMENTech), 2018

The design and sensitivity of a piezoresistive pressure sensor based on single-walled carbon nanotubes-polymer nanocomposite and multi-walled carbon nanotubes-polymer nanocomposite has been investigated. The paper dwells on the nuances of modeling flexible piezoresistive pressure sensor using COMSOL Multiphysics Finite Element Modeling (FEM) software. The response of each of the above sensor has been simulated for pressure loading (0-130 Pa). The ...


The Effect of Ultrasonic Dispersion on the Surface Chemistry of Carbon Nanotubes in the Jeffamine D-230 Polyetheramine Medium

[{u'author_order': 1, u'affiliation': u'Faculty of Engineering Sciences, Department of Materials Science, Tampere University of Technology, Tampere, Finland', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086151371', u'full_name': u'Mohsen Shahshahan', u'id': 37086151371}, {u'author_order': 2, u'affiliation': u'Faculty of Engineering Sciences, Department of Materials Science, Tampere University of Technology, Tampere, Finland', u'authorUrl': u'https://ieeexplore.ieee.org/author/37086150028', u'full_name': u'Pasi Kein\xe4nen', u'id': 37086150028}, {u'author_order': 3, u'affiliation': u'Faculty of Engineering Sciences, Department of Materials Science, Tampere University of Technology, Tampere, Finland', u'authorUrl': u'https://ieeexplore.ieee.org/author/37443950800', u'full_name': u'Jyrki Vuorinen', u'id': 37443950800}] IEEE Transactions on Nanotechnology, 2017

This paper studies changes in the surface chemistry of carbon nanotubes (CNTs) where they are under ultrasonication process in Jeffamine D-230 polyetheramine medium. Jeffamine is used as a curing agent in the nanocomposite manufacturing process. In the nanocomposite technology, ultrasonication process is employed as a method for dispersion of CNTs in a suspension. This research tries to investigate the effect ...


A generalized model for the signal propagation along single- and multi-walled carbon nanotubes with arbitrary chirality

[{u'author_order': 1, u'affiliation': u'Dipartimento di Ingegneria Elettrica, Universit\xe0 di Napoli Federico II, 80125 Napoli, Italy', u'authorUrl': u'https://ieeexplore.ieee.org/author/37569736800', u'full_name': u'Carlo Forestiere', u'id': 37569736800}, {u'author_order': 2, u'affiliation': u'Dipartimento di Ingegneria Elettrica, Universit\xe0 di Napoli Federico II, 80125 Napoli, Italy', u'authorUrl': u'https://ieeexplore.ieee.org/author/37275613200', u'full_name': u'Giovanni Miano', u'id': 37275613200}, {u'author_order': 3, u'affiliation': u'D.A.E.I.M.I. Universit\xe0 di Cassino 03043 Cassino, Italy', u'authorUrl': u'https://ieeexplore.ieee.org/author/37275604800', u'full_name': u'Antonio Maffucci', u'id': 37275604800}] 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO), 2009

The paper presents a self-consistent semi-classical model describing the electrical behavior of carbon nanotube interconnects. The model deals with the general case of arbitrary chirality and takes rigorously into account the effects of nanotube size and chirality on its electrical parameters. The general model includes as particular cases the models currently used in literature to describe metallic carbon nanotubes with ...


Study of the catalytic characteristics of metal ions decorated carbon nanotubes for waste water processing under ionizing irradiation

[{u'author_order': 1, u'affiliation': u'Shanghai Applied Radiation Institute, Shanghai University, Shanghai, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37291698000', u'full_name': u'Wenyan Shi', u'id': 37291698000}, {u'author_order': 2, u'affiliation': u'Shanghai Applied Radiation Institute, Shanghai University, Shanghai, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37290738700', u'full_name': u'Minghong Wu', u'id': 37290738700}, {u'author_order': 3, u'affiliation': u'Shanghai Applied Radiation Institute, Shanghai University, Shanghai, China. phone: +86 21-69982746; email: zjiao@staff.shu.edu.cn', u'authorUrl': u'https://ieeexplore.ieee.org/author/37285935900', u'full_name': u'Zheng Jiao', u'id': 37285935900}, {u'author_order': 4, u'affiliation': u'Shanghai Applied Radiation Institute, Shanghai University, Shanghai, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37290556800', u'full_name': u'Jianzhong Gu', u'id': 37290556800}, {u'author_order': 5, u'affiliation': u'Shanghai Applied Radiation Institute, Shanghai University, Shanghai, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37291227700', u'full_name': u'Ning Liu', u'id': 37291227700}, {u'author_order': 6, u'affiliation': u'Shanghai Applied Radiation Institute, Shanghai University, Shanghai, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37288301500', u'full_name': u'Fengwei Wu', u'id': 37288301500}] 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2006

Multiwall and singlewall carbon nanotubes were used as precursors for preparing metal ion-decorated nanotubes. The activated nanotubes catalyze metal deposition specifically onto their surfaces upon wetting the surface of nanotubes. K<sup>+</sup> , Cu<sup>2+</sup> , Mg<sup>2+</sup> , Ca<sup>2+</sup> and Fe<sup>3+</sup> decorated singlewall and multiwall carbon nanotubes, were screened for the catalytic activity in reactive violet dye waste water decomposition reaction under ...


Polysulfone-functionalized multiwalled carbon nanotubes composite membranes for potential sensing applications

[{u'author_order': 1, u'affiliation': u'University Politehnica of Bucharest, Faculty of Applied Chemistry and Materials Sciences, Str. Gheorghe Polizu 1-7, 011061 Romania', u'authorUrl': u'https://ieeexplore.ieee.org/author/38277322100', u'full_name': u'C. Trisca-Rusu', u'id': 38277322100}, {u'author_order': 2, u'affiliation': u'University Politehnica of Bucharest, Faculty of Applied Chemistry and Materials Sciences, Str. Gheorghe Polizu 1-7, 011061 Romania', u'authorUrl': u'https://ieeexplore.ieee.org/author/37399997800', u'full_name': u'A.C. Nechifor', u'id': 37399997800}, {u'author_order': 3, u'affiliation': u'Adaptative Supramolecular Nanosystems Group, Institute Europeen des Membranes, Place Eugene Bataillon, CCO47 34095 Montpellier CEDEX 5, France', u'authorUrl': u'https://ieeexplore.ieee.org/author/38272450300', u'full_name': u'S. Mihai', u'id': 38272450300}, {u'author_order': 4, u'affiliation': u'University Politehnica of Bucharest, Faculty of Applied Chemistry and Materials Sciences, Str. Gheorghe Polizu 1-7, 011061 Romania', u'authorUrl': u'https://ieeexplore.ieee.org/author/38274218400', u'full_name': u'C. Parvu', u'id': 38274218400}, {u'author_order': 5, u'affiliation': u'University Politehnica of Bucharest, Faculty of Applied Chemistry and Materials Sciences, Str. Gheorghe Polizu 1-7, 011061 Romania', u'authorUrl': u'https://ieeexplore.ieee.org/author/37594564700', u'full_name': u'S.I. Voicu', u'id': 37594564700}, {u'author_order': 6, u'affiliation': u'University Politehnica of Bucharest, Faculty of Applied Chemistry and Materials Sciences, Str. Gheorghe Polizu 1-7, 011061 Romania', u'authorUrl': u'https://ieeexplore.ieee.org/author/37604417000', u'full_name': u'G. Nechifor', u'id': 37604417000}] 2009 International Semiconductor Conference, 2009

In order to combine the advantages of functionalized multiwalled carbon nanotubes as a highly electronic conductive chemical species to that of polysulfone as a membrane material this paper reports the results concerning the synthesis of new polymeric-carbon nanotubes composite membranes based on polysulfone with functionalized double wall (DWNT) amino carbon nanotubes with sulfated cyclodextrine, are shown, with potential applications in ...


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Educational Resources on Carbon Nanotubes

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IEEE-USA E-Books

  • Polyamide 6 Reinforced with Carbon Nanotubes for Automotive Parts (2008-36-0132)

    A polyamide 6 reinforced with multi-walled carbon nanotubes (MWCNT) was composed using the melt mixing method. The mechanical and electrical properties were assessed and the optimum concentration was obtained in terms of several properties perspectives.

  • How Devices Are and Should Be Applied to Circuits

    In the 1990s, when bulk complementary metal oxide semiconductor (CMOS) technology emerged as the dominant technology for semiconductor products, circuit engineers explored the following techniques to reduce integrated circuit (IC) power dissipation: using multithreshold devices in the same IC and using power gating technique to supply power to different circuit blocks of an IC. Scaled CMOS technology yields metal‐oxide semiconductor field‐effect transistor (MOSFETs) with the stack architecture that allows circuit blocks to have different threshold voltage values, which suppresses the energy dissipated by circuits. To replace the IC design methodology for conventional devices, such as the MOSFETs, leading scientists are investigating how emerging devices can advance circuit performance. For example, adders composed of carbon nanotube (CNT) transistors and microelectromechanical system (MEMS) sensors have been demonstrated. It is anticipated that more such studies will be performed to confirm the feasibility of using such emerging devices in future low‐energy ICs.

  • Mechanical Properties of MWCNT/Elastomer Nanocomposites and the Cellulation Model (2009-01-0606)

    We fabricated NR matrix composites where multi-wall carbon nanotubes (MWCNTs) were homogeneously dispersed, and their morphology, mechanical properties, and viscoelasticity were investigated. The incorporation of MWCNTs into NR matrix enhanced the tensile strength and the storage moduli of the composites, but the degree of enhancement was reduced when the dispersion of CNTs was not uniform. Even though left uncured, up to 250□, MWCNT/NR composites with uniform dispersion remained non-fluid, and, at the same time, free of thermal decomposition caused by chain scission. These unusual thermal properties, comparable to those of cured MWCNT/NR composites, suggested a potential for the recycling of rubber products. These phenomena were assumed to have been caused by the ‘cellulation’ of the elastomer matrix of the composites, that is to say, the elastomer matrix had been divided into small units by the interfacial region formed around MWCNTs, and with this region having functioned as cell walls, NR matrix was confined in the ‘cells’. These numerous nano-cells were thought to have behaved individually and collectively.

  • Making Regulatory Categories

    In 2009, I met Daniel Bernard for an interview. He was the head of a research unit of a major French chemical company, which set up a carbon nanotubes production unit (the largest in France) in the southwest of the country. Back then, Bernard used to say that the nature of nanotubes development within his company was “empirical.”



Standards related to Carbon Nanotubes

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