Lithography

View this topic in
Lithography (from Greek λίθος - lithos, 'stone' + γράφειν - graphein, 'to write') is a method for printing using a stone or a metal plate with a completely smooth surface. Invented in 1796 by Bavarian author Alois Senefelder as a low-cost method of publishing theatrical works, lithography can be used to print text or artwork onto paper or another suitable material. (Wikipedia.org)






Conferences related to Lithography

Back to Top

2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

Circuits and Systems, Computers, Information Technology, Communication Systems, Control and Instrumentation, Electrical Power Systems, Power Electronics, Signal Processing


2018 15th International Workshop on Advanced Motion Control (AMC)

1. Advanced Motion Control2. Haptics, Robotics and Human-Machine Systems3. Micro/Nano Motion Control Systems4. Intelligent Motion Control Systems5. Nonlinear, Adaptive and Robust Control Systems6. Motion Systems for Robot Intelligence and Humanoid Robotics7. CPG based Feedback Control, Morphological Control8. Actuators and Sensors in Motion System9. Motion Control of Aerial/Ground/Underwater Robots10. Advanced Dynamics and Motion Control11. Motion Control for Assistive and Rehabilitative Robots and Systems12. Intelligent and Advanced Traffic Controls13. Computer Vision in Motion Control14. Network and Communication Technologies in Motion Control15. Motion Control of Soft Robots16. Automation Technologies in Primary Industries17. Other Topics and Applications Involving Motion Dynamics and Control


2018 19th International Symposium on Quality Electronic Design (ISQED)

19th International Symposium on Quality Electronic Design (ISQED 2018) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integratedcircuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality.


More Conferences

Periodicals related to Lithography

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


More Periodicals

Most published Xplore authors for Lithography

Back to Top

Xplore Articles related to Lithography

Back to Top

Evolution, Challenges and Attributes of Near Micron Sized TaN Resistors for Mixed Signal IC Applications From a Lithography Perspective

[{u'author_order': 1, u'affiliation': u'Advanced Technology Group, Skyworks Solutions, Inc., Newbury Park, CA, USA', u'full_name': u'Tom Brown'}, {u'author_order': 2, u'affiliation': u'Advanced Technology Group, Skyworks Solutions, Inc., Newbury Park, CA, USA', u'full_name': u'Shiban Tiku'}, {u'author_order': 3, u'affiliation': u'Advanced Technology Group, Skyworks Solutions, Inc., Newbury Park, CA, USA', u'full_name': u'Sarang Kulkarni'}, {u'author_order': 4, u'affiliation': u'Advanced Technology Group, Skyworks Solutions, Inc., Newbury Park, CA, USA', u'full_name': u'Manjeet Singh'}] IEEE Transactions on Semiconductor Manufacturing, 2018

In this paper, the evolution of various lithographic processes aimed at fabricating robust tantalum nitride (TaN) resistors in GaAs-based BiFET and BiHEMT technologies are discussed in detail. Such approaches include the common image reverse photograph process (via amine poisoning) using a positive tone resist, the use of a chemically amplified negative tone resist, and also straight patterning of a positive ...


Novel Feature Vectors Considering Distances between Wires for Lithography Hotspot Detection

[{u'author_order': 1, u'full_name': u'Gaku Kataoka'}, {u'author_order': 2, u'full_name': u'Masato Inagi'}, {u'author_order': 3, u'full_name': u'Shinobu Nagayama'}, {u'author_order': 4, u'full_name': u"Shin'ichi Wakabayashi"}] 2018 21st Euromicro Conference on Digital System Design (DSD), None

In this paper, we propose some feature vectors that better represent characteristics of lithography hotspots for machine learning based hotspot detection. In the lithography process, which is one of the LSI fabrication processes, a local layout pattern with a high failure probability is called a hotspot. It is desirable to find and remove such hotspots before starting the fabrication processes, ...


Lithography independent nanostructuring of Bi<inf>2</inf>Te<inf>3</inf> thermoelectric devices

[{u'author_order': 1, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Micro- and Nanotechnologies Group, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'D. Merten'}, {u'author_order': 2, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Micro- and Nanotechnologies Group, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'K. T. Kallis'}, {u'author_order': 3, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Micro- and Nanotechnologies Group, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'F. J. Giebel'}, {u'author_order': 4, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Intelligent Microsystems Institute, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'J. Zimmermann'}, {u'author_order': 5, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Intelligent Microsystems Institute, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'R. P. Poloczek'}, {u'author_order': 6, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Intelligent Microsystems Institute, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'H. L. Fiedler'}, {u'author_order': 7, u'affiliation': u'Faculty of Electrical Engineering and Information Technology, Intelligent Microsystems Institute, TU Dortmund University, Dortmund, D-44227, Germany', u'full_name': u'P. Lilienthal'}] 2017 14th IEEE India Council International Conference (INDICON), None

In order to combine the excellent thermoelectric features of nanostructured bismuth telluride (Bi2Te3) at room temperature without using any expensive lithography processes, the formation of Bi2Te3-thermolegs inside an in-plane thermoelectric device is executed with a lithography independent deposition- and reactive ion back-etching process. The resulting nanostructured thermolegs have a width and height in the magnitude of a few hundred nanometers ...


A stretchable translucent conductive film based on polymer microspheres lithography technology

[{u'author_order': 1, u'affiliation': u'College of Information &#x0026; Technology, Jilin Normal University, Changchun, China', u'full_name': u'Xinyu Zhang'}, {u'author_order': 2, u'affiliation': u'Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China', u'full_name': u'Yougen Hu'}, {u'author_order': 3, u'affiliation': u'College of Information &#x0026; Technology, Jilin Normal University, Changchun, China', u'full_name': u'Wenlong Jiang'}, {u'author_order': 4, u'affiliation': u'Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China', u'full_name': u'Pengli Zhu'}, {u'author_order': 5, u'affiliation': u'Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China', u'full_name': u'Rong Sun'}, {u'author_order': 6, u'affiliation': u'Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong, China', u'full_name': u'Ching-Ping Wong'}] 2018 19th International Conference on Electronic Packaging Technology (ICEPT), None

Transparent and translucent conductor has played an important role in various of photoelectric device electrodes, including photovoltaics (PVs), light- emitting diodes (LEDs), liquid-crystal displays (LCDs), touch-screen panels (TSPs), and radiofrequency identification (RFID) and so on [1], [2]. Some conductive oxides are transparent but do not stretchable. We have confirmed a method based on polystyrene (PS) microspheres lithography technology to obtain ...


Optical Approaches to Study Cell Invasiveness: From 2 Photon Lithography to Optogenetics

[{u'author_order': 1, u'affiliation': u'Istituto Italiano di Tecnologia, CBN, Lecce, 73010, Italy', u'full_name': u'Barbara Spagnolo'}, {u'author_order': 2, u'affiliation': u'Istituto Italiano di Tecnologia, CBN, Lecce, 73010, Italy', u'full_name': u'Marco Pisanello'}, {u'author_order': 3, u'affiliation': u'Istituto Italiano di Tecnologia, CBN, Lecce, 73010, Italy', u'full_name': u'Leonardo Sileo'}, {u'author_order': 4, u'affiliation': u'Istituto Italiano di Tecnologia, CBN, Lecce, 73010, Italy', u'full_name': u'Filippo Pisano'}, {u'author_order': 5, u'affiliation': u'Istituto Italiano di Tecnologia, CBN, Lecce, 73010, Italy', u'full_name': u'Ferruccio Pisanello'}, {u'author_order': 6, u'affiliation': u'Istituto Italiano di Tecnologia, CBN, Lecce, 73010, Italy', u'full_name': u'Massimo De Vittorio'}] 2018 20th International Conference on Transparent Optical Networks (ICTON), None

The mechanisms of tumor formation and spreading are defined by several concurrent factors, including genetic, molecular, chemical and mechanical ones. With the genetic and molecular fields being the main source of the available data about cancer formation, development and treatment, intense research effort has recently focused on the development of new methodologies to study tumor cells mechanical properties and their ...


More Xplore Articles

Educational Resources on Lithography

Back to Top

eLearning

No eLearning Articles are currently tagged "Lithography"

IEEE-USA E-Books

  • How Lithography Enables Moore&#39;s Law

    Moore's Law sets the pace for the electronics industry, delivering increasing computing capabilities at stable cost. This was driven by the steady pace of the increase of components in an integrated circuit (IC), which has to a large extent been enabled by optical lithography printing increasingly smaller electronic features on a silicon wafer. This chapter quantifies what the contribution of lithography to Moore's Law has been in the past and then discusses the future lithography options to extend Moore's Law into the future. Optical lithography has always been the workhorse for IC manufacturing. The next step for optical lithography is extreme ultraviolet (EUV), which will greatly simplify patterning and thus promises faster yield ramp and lower cost. The alternative patterning techniques, Directed self¿¿¿assembly (DSA) still needs optical lithography to guide the patterns and should thus be seen as a complementary technology.

  • EUV Lithography: Today and Tomorrow

  • 32 nm: Lithography at a Crossroad

  • Design for Manufacturing

    This chapter contains sections titled: The Lithographic Challenge Software Solutions: Reticle Enhancement Techniques Hardware Solutions Process Solutions

  • Specifying and Testing Digital Optics

    This chapter contains sections titled: Fabless Lithographic Fabrication Management Specifying the Fabrication Process Fabrication Evaluation Optical Functionality Evaluation

  • Semiconductor Manufacturing

    In this chapter, we describe the fundamentals of semiconductor manufacturing, popularly known as ?>chip manufacturing?>. Starting with the use of larger single crystal silicon wafers and defect density reduction techniques necessary for manufacturing chips with lower cost, the principles of lithography and etching are presented. The basic sequence in integrated circuit (IC) manufacturing is transistor formation (front-end processing), interconnect formation (back-end processing), and assembly and test. Advancements in lithography, single-wafer processing and advanced process control have played key roles in manufacturing semiconductor products with critical dimension (CD) as small as about 20 nm today. Process variability is one of the key challenges that the industry faces as CDs are scaled to roughly the 10 nm regime. Fundamental research on new materials, their interfaces, new processes and new devices is certainly required if we are ever to achieve practical ICs with sufficiently low power consumption for products manufactured with critical dimensions approaching 5 nm and beyond.

  • Manufacturability Aware Routing in Nanometer VLSI

    This paper surveys key research challenges and recent results of manufacturability aware routing in nanometer VLSI designs. The manufacturing challenges have their root causes from various integrated circuit (IC) manufacturing processes and steps, e.g., deep sub-wavelength lithography, random defects, via voids, chemical-mechanical polishing, and antenna-effects. They may result in both functional and parametric yield losses. The manufacturability aware routing can be performed at different routing stages including global routing, track routing, and detail routing, guided by both manufacturing process models and manufacturing-friendly rules. The manufacturability/yield optimization can be performed through both correct-by- construction (i.e., optimization during routing) as well as construct-by- correction (i.e., post-routing optimization). This paper will provide a holistic view of key design for manufacturability issues in nanometer VLSI routing.

  • Nanofabrication Techniques for Chipless RFID Sensors

    This chapter first presents an overview of various fabrication techniques that can be used for the development of various chipless radio‐frequency identification (RFID) sensors. It then reviews innovative micro‐ and nanofabrication technologies suitable for roll‐to‐roll chipless RFID sensor printing. Next, the chapter highlights the limitations of conventional fabrication processes and provides industrial solutions for on‐demand, high‐speed printing for flexible, robust, mass productivity of chipless RFID sensor. The state‐of‐the‐art micro‐/nanofabrication processes that can be used to develop the chipless RFID sensor are electrodeposition, physical and chemical vapor deposition, laser ablation and direct pattern writing by photolithography/electron beam lithography (EBL)/ion beam lithography. The nanofabrication processes also include nanoimprint lithography (NIL) and etching, material modification by ion implantation, diffusion, doping, and thermal annealing. Finally, the chapter gives a general survey and comparison of the different fabrication techniques.

  • Digital Optics Fabrication Techniques

    This chapter contains sections titled: Holographic Origination Diamond Tool Machining Photo‐reduction Microlithographic Fabrication of Digital Optics Micro‐refractive Element Fabrication Techniques Direct Writing Techniques Gray‐scale Optical Lithography Front/Back Side Wafer Alignments and Wafer Stacks A Summary of Fabrication Techniques

  • Future of Digital Silicon

    There are reasons to be concerned about the future of digital silicon. It looks bright to many, as long as the future is about the next???generation technology and products. Some might be even braver and willing to bet on the EUV lithography finally making its mark in the next wave of chips coming to the market. Unimaginable obstacles and uncertainties have never been short of supply in this space, unmatched by any seen in all fields of engineering except perhaps for the spirit of creativity, imagination, and determination. This book examines a wide range of microelectronic???related fields, including solid???state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. The book provides contributions from leading industry professionals in semiconductor micro??? and nano???electronics.



Standards related to Lithography

Back to Top

No standards are currently tagged "Lithography"


Jobs related to Lithography

Back to Top