Lithography

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Lithography (from Greek λίθος - lithos, 'stone' + γράφειν - graphein, 'to write') is a method for printing using a stone or a metal plate with a completely smooth surface. Invented in 1796 by Bavarian author Alois Senefelder as a low-cost method of publishing theatrical works, lithography can be used to print text or artwork onto paper or another suitable material. (Wikipedia.org)






Conferences related to Lithography

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2020 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

Ferroelectric materials and applications


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

Circuits and Systems, Computers, Information Technology, Communication Systems, Control and Instrumentation, Electrical Power Systems, Power Electronics, Signal Processing


2018 15th International Workshop on Advanced Motion Control (AMC)

1. Advanced Motion Control2. Haptics, Robotics and Human-Machine Systems3. Micro/Nano Motion Control Systems4. Intelligent Motion Control Systems5. Nonlinear, Adaptive and Robust Control Systems6. Motion Systems for Robot Intelligence and Humanoid Robotics7. CPG based Feedback Control, Morphological Control8. Actuators and Sensors in Motion System9. Motion Control of Aerial/Ground/Underwater Robots10. Advanced Dynamics and Motion Control11. Motion Control for Assistive and Rehabilitative Robots and Systems12. Intelligent and Advanced Traffic Controls13. Computer Vision in Motion Control14. Network and Communication Technologies in Motion Control15. Motion Control of Soft Robots16. Automation Technologies in Primary Industries17. Other Topics and Applications Involving Motion Dynamics and Control


2018 19th International Symposium on Quality Electronic Design (ISQED)

19th International Symposium on Quality Electronic Design (ISQED 2018) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integratedcircuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality.


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Periodicals related to Lithography

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Lithography

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Xplore Articles related to Lithography

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Optimization of electron beam dose for reliable nanoscale growth template formation in electron beam lithography system

[{u'author_order': 1, u'affiliation': u'Department of Electronic Science, University of Calcutta, Kolkata - 700009, India', u'full_name': u'Shrabani Guhathakurata'}, {u'author_order': 2, u'affiliation': u'Department of Electronic Science, University of Calcutta, Kolkata - 700009, India', u'full_name': u'Sanatan Chattopadhyay'}, {u'author_order': 3, u'affiliation': u'Centre for Research in Nanoscience and Nanotechnology, University of Calcutta, Kolkata 700098, India', u'full_name': u'Mainak Palit'}] 2018 International Symposium on Devices, Circuits and Systems (ISDCS), None

Dose optimization of electron beam has been performed for transferring nano- dimension patterns by employing electron beam lithography. An extensive study has been conducted for optimizing lithographic features with e-beam resist PMMA of different thicknesses. It has been possible to obtain sub-80 nm circular dot patterns with good resolution and high aspect ratio. Au template has been developed by employing ...


Cost effective maskless lithography: Direct UV laser writing of microstructures for microfluidics applications

[{u'author_order': 1, u'affiliation': u'Mechanical Engineering Department, United Arab Emirates University, Al Ain, United Arab Emirates', u'full_name': u'Mohammed Ziauddin'}, {u'author_order': 2, u'affiliation': u'Mechanical Engineering Department, United Arab Emirates University, Al Ain, United Arab Emirates', u'full_name': u'Abdel-Hamid I. Mourad'}, {u'author_order': 3, u'affiliation': u'Mechanical Engineering Department, Jordan University of Science and Technology, Irbid, Jordan', u'full_name': u'Saud A. Khashan'}] 2018 Advances in Science and Engineering Technology International Conferences (ASET), None

Maskless lithography has improved manufacturing process of microstructures with time, cost, and flexibility of producing complex designs. It has dramatically overcome the shortcomings of traditional or conventional lithography technique that utilizes masks for patterning. However, commercially available maskless lithography systems are highly expensive for small institutions that uses the system for small production or research purposes. Among the cost-effective methods, ...


Application of scatterometry-based machine learning to control multiple electron beam lithography: AM: Advanced metrology

[{u'author_order': 1, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Nivea Figueiro'}, {u'author_order': 2, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Francisco Sanchez'}, {u'author_order': 3, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Roy Koret'}, {u'author_order': 4, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Michael Shifrin'}, {u'author_order': 5, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Yoav Etzioni'}, {u'author_order': 6, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Shay Wolfling'}, {u'author_order': 7, u'affiliation': u'Nova Measuring Instruments, Rehovot, Israel', u'full_name': u'Matthew Sendelbach'}, {u'author_order': 8, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Yoann Blancquaert'}, {u'author_order': 9, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Thibault Labbaye'}, {u'author_order': 10, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Guido Rademaker'}, {u'author_order': 11, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Jonathan Pradelles'}, {u'author_order': 12, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Lucie Mourier'}, {u'author_order': 13, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Stephane Rey'}, {u'author_order': 14, u'affiliation': u'CEA-LETI, Minatec Campus, Grenoble, France', u'full_name': u'Laurent Pain'}] 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), None

The evaluation of scatterometry and machine learning for the monitoring of intended critical dimension (CD) variations within scatterometry targets is presented. Such variations mimic non-uniformities potentially caused by massively parallel e-beam Maskless Lithography (ML2). Although previous results [1] demonstrate that traditional model-based scatter-ometry can properly quantify these within-target variations, the current work shows that the application of scatterometry-based machine learning ...


Triple patterning lithography-aware detailed routing ensuring via layer decomposability

[{u'author_order': 1, u'affiliation': u'Department of Electrical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan', u'full_name': u'Hua-Yi Wu'}, {u'author_order': 2, u'affiliation': u'Department of Electrical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan', u'full_name': u'Shao-Yun Fang'}] 2018 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), None

For sub-10 nanometer technology nodes, multiple patterning technologies are still the major solutions for pushing the limit of lithography due to the delay of next generation lithography technologies. In this paper, we propose a triple patterning lithography (TPL)-aware router that guarantees the layout decomposability of via layers, which are the layers particularly requiring TPL for fabrication. In the research, the ...


Effect of stamp design on residual layer thickness and contact pressure in UV nanoimprint lithography

[{u'author_order': 1, u'affiliation': u"College of Internet of Things Engineering, Hohai University, People's Republic of China", u'full_name': u'Minqi Yin'}, {u'author_order': 2, u'affiliation': u"College of Internet of Things Engineering, Hohai University, People's Republic of China", u'full_name': u'Hongwen Sun'}, {u'author_order': 3, u'affiliation': u"College of Internet of Things Engineering, Hohai University, People's Republic of China", u'full_name': u'Haibin Wang'}] IET Micro & Nano Letters, 2018

Pattern density is an important factor in UV nanoimprint stamp design. Various pattern densities may affect the thickness of the residual layer and its uniformity. This work investigated the effect of pattern density as well as other stamp parameters, including stamp material, stamp thickness and cavity height, on residual layer thickness (RLT), contact pressure, and imprint quality. Two kinds of ...


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Educational Resources on Lithography

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eLearning

No eLearning Articles are currently tagged "Lithography"

IEEE-USA E-Books

  • How Lithography Enables Moore's Law

    Moore's Law sets the pace for the electronics industry, delivering increasing computing capabilities at stable cost. This was driven by the steady pace of the increase of components in an integrated circuit (IC), which has to a large extent been enabled by optical lithography printing increasingly smaller electronic features on a silicon wafer. This chapter quantifies what the contribution of lithography to Moore's Law has been in the past and then discusses the future lithography options to extend Moore's Law into the future. Optical lithography has always been the workhorse for IC manufacturing. The next step for optical lithography is extreme ultraviolet (EUV), which will greatly simplify patterning and thus promises faster yield ramp and lower cost. The alternative patterning techniques, Directed self¿¿¿assembly (DSA) still needs optical lithography to guide the patterns and should thus be seen as a complementary technology.

  • EUV Lithography: Today and Tomorrow

  • 32 nm: Lithography at a Crossroad

  • Design for Manufacturing

    This chapter contains sections titled: The Lithographic Challenge Software Solutions: Reticle Enhancement Techniques Hardware Solutions Process Solutions

  • Specifying and Testing Digital Optics

    This chapter contains sections titled: Fabless Lithographic Fabrication Management Specifying the Fabrication Process Fabrication Evaluation Optical Functionality Evaluation

  • Semiconductor Manufacturing

    In this chapter, we describe the fundamentals of semiconductor manufacturing, popularly known as ?>chip manufacturing?>. Starting with the use of larger single crystal silicon wafers and defect density reduction techniques necessary for manufacturing chips with lower cost, the principles of lithography and etching are presented. The basic sequence in integrated circuit (IC) manufacturing is transistor formation (front-end processing), interconnect formation (back-end processing), and assembly and test. Advancements in lithography, single-wafer processing and advanced process control have played key roles in manufacturing semiconductor products with critical dimension (CD) as small as about 20 nm today. Process variability is one of the key challenges that the industry faces as CDs are scaled to roughly the 10 nm regime. Fundamental research on new materials, their interfaces, new processes and new devices is certainly required if we are ever to achieve practical ICs with sufficiently low power consumption for products manufactured with critical dimensions approaching 5 nm and beyond.

  • Manufacturability Aware Routing in Nanometer VLSI

    This paper surveys key research challenges and recent results of manufacturability aware routing in nanometer VLSI designs. The manufacturing challenges have their root causes from various integrated circuit (IC) manufacturing processes and steps, e.g., deep sub-wavelength lithography, random defects, via voids, chemical-mechanical polishing, and antenna-effects. They may result in both functional and parametric yield losses. The manufacturability aware routing can be performed at different routing stages including global routing, track routing, and detail routing, guided by both manufacturing process models and manufacturing-friendly rules. The manufacturability/yield optimization can be performed through both correct-by- construction (i.e., optimization during routing) as well as construct-by- correction (i.e., post-routing optimization). This paper will provide a holistic view of key design for manufacturability issues in nanometer VLSI routing.

  • Nanofabrication Techniques for Chipless RFID Sensors

    This chapter first presents an overview of various fabrication techniques that can be used for the development of various chipless radio‐frequency identification (RFID) sensors. It then reviews innovative micro‐ and nanofabrication technologies suitable for roll‐to‐roll chipless RFID sensor printing. Next, the chapter highlights the limitations of conventional fabrication processes and provides industrial solutions for on‐demand, high‐speed printing for flexible, robust, mass productivity of chipless RFID sensor. The state‐of‐the‐art micro‐/nanofabrication processes that can be used to develop the chipless RFID sensor are electrodeposition, physical and chemical vapor deposition, laser ablation and direct pattern writing by photolithography/electron beam lithography (EBL)/ion beam lithography. The nanofabrication processes also include nanoimprint lithography (NIL) and etching, material modification by ion implantation, diffusion, doping, and thermal annealing. Finally, the chapter gives a general survey and comparison of the different fabrication techniques.

  • Digital Optics Fabrication Techniques

    This chapter contains sections titled: Holographic Origination Diamond Tool Machining Photo‐reduction Microlithographic Fabrication of Digital Optics Micro‐refractive Element Fabrication Techniques Direct Writing Techniques Gray‐scale Optical Lithography Front/Back Side Wafer Alignments and Wafer Stacks A Summary of Fabrication Techniques

  • Gallium Nitride¿¿¿Based Lateral and Vertical Nanowire Devices

    This chapter focuses on the first fabrication and characterization of GaN¿¿¿based lateral and vertical nanowire (NW) field¿¿¿effect transistors (FETs) by using top¿¿¿down approach, where one combined conventional e¿¿¿beam lithography and dry etching techniques with strong anisotropic tetramethyl ammonium hydroxide (TMAH) wet etching. Wet etching usually provides high etching selectivity that often offers an advantage in simplifying the fabrication process compared to the dry plasma etching. To fabricate the AlGaN/GaN O¿¿¿shaped¿¿¿gate nanowire FET, the GaN epitaxial layers were first grown on c¿¿¿plane sapphire substrate by MOCVD. The epitaxial structure of Si¿¿¿doped GaN/undoped¿¿¿GaN/Si¿¿¿doped GaN stack was grown by MOCVD on sapphire substrate. The AlGaN¿¿¿/GaN¿¿¿based omega¿¿¿gate NW FETs have been fabricated using TMAH orientation¿¿¿selective lateral wet etching of atomic layer¿¿¿deposited (ALD)¿¿¿deposited HfO2 sidewall spacer. The top¿¿¿down approach provides a viable pathway toward gate¿¿¿all¿¿¿around (GAA) devices for III¿¿¿nitride semiconductors, which are very promising candidates for steep¿¿¿switching power device applications.



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