Conferences related to 3D

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Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 56th ACM/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM//IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


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Periodicals related to 3D

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


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Most published Xplore authors for 3D

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Xplore Articles related to 3D

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Five-contact silicon structure based integrated 3D Hall sensor

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37285573700', u'full_name': u'Ch.S. Roumenin', u'id': 37285573700}, {u'author_order': 2, u'affiliation': u'Inst. of Control & Syst. Res., Bulgarian Acad. of Sci., Sofia, Bulgaria', u'authorUrl': u'https://ieeexplore.ieee.org/author/37266218400', u'full_name': u'D.I. Nikolov', u'id': 37266218400}] Electronics Letters, 2003

A new silicon integrated 3D Hall sensor for high-accuracy magnetic field measurements is suggested and tested. Its unique device design in having only five n/sup +/ contacts allows simultaneous and independent obtaining of the full information about the three components of the magnetic field vector. The device is manufactured through a simple planar process and requires the use of four ...


Coupling between microstrip lines embedded in polyimide layers for 3D-MMICs on Si

[{u'author_order': 1, u'affiliation': u'NASA Glenn Res. Center, Cleveland, OH, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37300708600', u'full_name': u'G.E. Ponchak', u'id': 37300708600}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37297930900', u'full_name': u'E.M. Tentzeris', u'id': 37297930900}, {u'author_order': 3, u'authorUrl': u'https://ieeexplore.ieee.org/author/37279047700', u'full_name': u'J. Papapolymerou', u'id': 37279047700}] IEE Proceedings - Microwaves, Antennas and Propagation, 2003

Three-dimensional circuits built on multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimetre-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrade circuit performance. We present finite difference time domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between ...


Monolithic 3D layout using 2D EDA for embedded memory-rich designs

[{u'author_order': 1, u'affiliation': u'3D-EDA SRL Iasi, Romania', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085737666', u'full_name': u'Ionica Pletea', u'id': 37085737666}, {u'author_order': 2, u'affiliation': u'MonolithIC 3D Inc. San Jose, CA 95124', u'authorUrl': u'https://ieeexplore.ieee.org/author/37085461812', u'full_name': u"Ze'ev Wurman", u'id': 37085461812}, {u'author_order': 3, u'affiliation': u'MonolithIC 3D Inc. San Jose, CA 95124', u'authorUrl': u'https://ieeexplore.ieee.org/author/38276271700', u'full_name': u'Zvi Or-Bach', u'id': 38276271700}, {u'author_order': 4, u'affiliation': u'Technical University of Moldova, Chisnau, Moldova', u'authorUrl': u'https://ieeexplore.ieee.org/author/38131075100', u'full_name': u'Victor Sontea', u'id': 38131075100}] 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015

Monolithic 3D integration has generated considerable interest in recent years due it its inherent capability of supporting heterogeneous devices, and its rich vertical connectivity allowing for increased integration while reducing wire-length and power. Few commercial EDA 3D tools are in existence and prior work focused on partitioning logic between two or more logic strata, capitalizing on harnessing existing 2D tools ...


Algorithm for 3D reconstruction with both visible and missing data

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/38198072500', u'full_name': u'Li Tang', u'id': 38198072500}, {u'author_order': 2, u'affiliation': u"ISN Nat. Key Lab., Xidian Univ., Xi'an, China", u'authorUrl': u'https://ieeexplore.ieee.org/author/37290269500', u'full_name': u'Chengke Wu', u'id': 37290269500}, {u'author_order': 3, u'authorUrl': u'https://ieeexplore.ieee.org/author/37437953700', u'full_name': u'H.T. Tsui', u'id': 37437953700}, {u'author_order': 4, u'authorUrl': u'https://ieeexplore.ieee.org/author/37538547200', u'full_name': u'Shigang Liu', u'id': 37538547200}] Electronics Letters, 2003

A novel algorithm for 3D reconstruction from image sequences is presented. Global optimisation is applied to a rough model by minimising the back projection errors in each image. Different weights are added to distinguish visible and occluded points. Satisfactory results on both simulated data and real images are reported


On the 3D documentation of the Igel Column — Original and copy: Structured 3D survey and analytical 3D information system

[{u'author_order': 1, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Martin Schaich'}, {u'author_order': 2, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Peter Jahnke'}, {u'author_order': 3, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Sebastian Knechtel'}, {u'author_order': 4, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Max Rahrig'}] 2013 Digital Heritage International Congress (DigitalHeritage), 2013

The Igel Column, 23 m high, is one of the best known Roman column monuments in Germany and is part of the UNESCO World Heritage `Roman Structures, Cathedral and Church of Our Lady' in Trier. The list also includes a faithfully reconstructed and colored one-to-one copy of the column monument from the early 20th century, which is located at the ...


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Educational Resources on 3D

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eLearning

No eLearning Articles are currently tagged "3D"

IEEE-USA E-Books

  • Temperature-Aware Design and Management for 3D Multi-Core Architectures

    Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs are subject to amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. Temperature-Aware Design and Management for 3D Multi-Core Architectures surveys recent advances in temperature-aware 3D MPSoC considerations. It explores the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations, and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. As such, it provides a global perspective, highlighting the advancements and drawbacks of the recent state-of-the-art. While the primary focus is on existing methodologies and techniques, it also provides some insights on possible future directions related to this research discipline – temperature-aware design and management. Temperature-Aware Design and Management for 3D Multi- Core Architectures is an ideal primer for researchers and practitioners working in this area.

  • Representations and Techniques for 3D Object Recognition and Scene Interpretation

    One of the grand challenges of artificial intelligence is to enable computers to interpret 3D scenes and objects from imagery. This book organizes and introduces major concepts in 3D scene and object representation and inference from still images, with a focus on recent efforts to fuse models of geometry and perspective with statistical machine learning. The book is organized into three sections: (1) Interpretation of Physical Space; (2) Recognition of 3D Objects; and (3) Integrated 3D Scene Interpretation. The first discusses representations of spatial layout and techniques to interpret physical scenes from images. The second section introduces representations for 3D object categories that account for the intrinsically 3D nature of objects and provide robustness to change in viewpoints. The third section discusses strategies to unite inference of scene geometry and object pose and identity into a coherent scene interpretation. Each section broadly surveys important ideas from cognitive science and artificial intelligence research, organizes and discusses key concepts and techniques from recent work in computer vision, and describes a few sample approaches in detail. Newcomers to computer vision will benefit from introductions to basic concepts, such as single-view geometry and image classification, while experts and novices alike may find inspiration from the book's organization and discussion of the most recent ideas in 3D scene understanding and 3D object recognition. Specific topics include: mathematics of perspective geometry; visual elements of the physical scene, structural 3D scene representations; techniques and features for image and region categorization; historical perspective, computational models, and datasets and machine learning techniques for 3D object recognition; inferences of geometrical attributes of objects, such as size and pose; and probabilistic and feature-passing approaches for contextual reasoning about 3D objects and scenes. Table of Contents: Background on 3D Scene Models / Single-view Geometry / Modeling the Physical Scene / Categorizing Images and Regions / Examples of 3D Scene Interpretation / Background on 3D Recognition / Modeling 3D Objects / Recognizing and Understanding 3D Objects / Examples of 2D 1/2 Layout Models / Reasoning about Objects and Scenes / Cascades of Classifiers / Conclusion and Future Directions

  • A, B, See... in 3D: A Workbook to Improve 3-D Visualization Skills

    The workbook provides over 100 3D visualization exercises challenging the student to create three dimensions from two. It is a powerful and effective way to help engineering and architecture educators teach spatial visualization. Most of the 3-D visualization exercises currently being used by students in Design and Graphics classes present the objects in isometric views already in 3-D, asking the viewer to create multiple views, fold patterns, manipulate, reflect, or rotate them. The exercises presenting the objects in incomplete multiview projections asking the students to add missing lines use mostly real 3D objects that are more easily recognizable to help the student correlate 2D with 3D. This workbook uses a different approach. Each view of the solid represents a letter of the alphabet. The letters are by definition 2D representations and when they are combined to create a 3D object, visualizing it becomes quite a challenge. This workbook is intended for Engineering, Architecture, and Art students and faculty that want to increase their 3-D visualization skills.

  • Deformable Surface 3D Reconstruction from Monocular Images

    Being able to recover the shape of 3D deformable surfaces from a single video stream would make it possible to field reconstruction systems that run on widely available hardware without requiring specialized devices. However, because many different 3D shapes can have virtually the same projection, such monocular shape recovery is inherently ambiguous. In this survey, we will review the two main classes of techniques that have proved most effective so far: The template-based methods that rely on establishing correspondences with a reference image in which the shape is already known, and non-rigid structure-from-motion techniques that exploit points tracked across the sequences to reconstruct a completely unknown shape. In both cases, we will formalize the approach, discuss its inherent ambiguities, and present the practical solutions that have been proposed to resolve them. To conclude, we will suggest directions for future research. Table of Contents: Introduction / Early Approaches to Non-Rigid Reconstruction / Formalizing Template-Based Reconstruction / Performing Template-Based Reconstruction / Formalizing Non- Rigid Structure from Motion / Performing Non-Rigid Structure from Motion / Future Directions

  • Publishing and Consuming 3D Content on the Web: A Survey

    Recently tools such as 3D printing, 3D viewers, and editing systems embedded in common operating systems have seen 3D data evolve from specialized content, used by a few professionals, to completely integrated web content used by many internet users. These new trends are pushing 3D content towards ubiquitous use, whereby data management, user interactions, and crossmedia integration are open issues still to be solved. The growth in widely available tools for 3D web content has given rise to complicated situations for those developers and users with a poor awareness of the peculiar needs of each specific combination of 3D data and application domain requirements. This monograph presents a comprehensive survey of the currently available Web3D tools and their applications. The authors define a schema of the available possibilities and features supported by enabling technologies and implemented systems. This results in providing a roadmap that, depending on the application field, navigates the user through the technical characteristics needed to build an efficient and effective Web3D presentation. Publishing and Consuming 3D Content on the Web will be of interest to all readers wishing to master the concepts which characterize the different phases of the Web3D publishing process.

  • Hybrid Integral Equation Modeling Methods for 3D Integration

    This chapter contains sections titled: * Introduction * 3D Hybrid Integral Equation Method * Conclusion * References ]]>

  • Modeling of Through-Silicon Vias (TSV) in 3D Integration

    This chapter contains sections titled: * Introduction * Equivalent Circuit Model for TSV * MOS Capacitance Effect of TSV * Conclusion * References ]]>

  • 2.5D Simulation Method for 3D Integrated Systems

    This chapter contains sections titled: * Introduction * Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems * Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes * Numerical Simulations for Finite Structures * Modeling of 3D Electronic Package Structure * Conclusion * References ]]>

  • Systematic Microwave Network Analysis for 3D Integrated Systems

    This chapter contains sections titled: * Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair * Parallel Plane Pair Model * Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias * References ]]>

  • Macromodeling of Complex Interconnects in 3D Integration

    This chapter contains sections titled: * Introduction * Network Parameters: Impedance, Admittance, and Scattering Matrices * Rational Function Approximation with Partial Fractions * Vector Fitting (VF) Method * Macromodel Synthesis * Stability, Causality, and Passivity of Macromodel * Macromodeling Applied to High-Speed Interconnects and Circuits * Conclusion * References ]]>



Standards related to 3D

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No standards are currently tagged "3D"