Conferences related to 3D

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IGARSS 2015 - 2015 IEEE International Geoscience and Remote Sensing Symposium

The Geoscience and Remote Sensing Society (GRSS) seeks to advance science and technology in geoscience, remote sensing and related fields using conferences, education and other resources. Its fields of interest are the theory, concepts and techniques of science and engineering as they apply to the remote sensing of the earth, oceans, atmosphere, and space, as well as the processing, interpretation and dissemination of this information.


2014 IEEE International Conference on Consumer Electronics (ICCE)

Key technologies, products, services and architectures for consumerentertainment and information delivery are first seen at ICCE


2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)

ASP-DAC 2013 is the eighteenth annual international conference on VLSI design automation in Asia and South Pacific region, one of the most active regions of design and fabrication of silicon ships in the world.

  • 2012 17th Asia and South Pacific Design Automation Conference (ASP-DAC)

    ASP-DAC 2012 will be the seventeenth annual international conference on VLSI design automation in Asia and South Pacific region, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promo

  • 2011 16th Asia and South Pacific Design Automation Conference ASP-DAC 2011

    ASP-DAC 2011 is the sixteenth annual international conference on VLSI design automation in Asia and South Pacific region, one of the most active regions of design and fabrication of silicon chips in the world.

  • 2010 15th Asia and South Pacific Design Automation Conference ASP-DAC 2010

    The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA).


2013 21st International Conference on Geoinformatics

GIS in Regional Economic Development and Environmental Protection under Globalization


2012 11th International Conference on Signal Processing (ICSP 2012)

Signal Processing; Speech and Audio Coding; Image Processing; Computer Vision;; Video compression; Pattern Recognition; Statistic Machine Learning; Wireless and Communications; Radar Signal Processing; Biometrics; Authentification; Sonar Signal Processing ; Sensor Networks

  • 2010 10th International Conference on Signal Processing (ICSP 2010)

    Digital Signal Processing (DSP); Spectrum Estimation & Modeling; TF Spectrum Analysis & Wavelet; Higher Order Spectral Analysis; Adaptive Filtering &SP; Array Signal Processing; Hardware Implementation for SP; Speech and Audio Coding; Speech Synthesis & Recognition; Image Processing & Understanding; PDE for Image Processing;Video compression &Streaming; Computer Vision & VR; Multimedia & Human-computer Interaction; Statistic Learning,ML & Pattern Recognition; AI & Neural Networks; Communication Signal proce


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Periodicals related to 3D

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Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Image Processing, IEEE Transactions on

Signal-processing aspects of image processing, imaging systems, and image scanning, display, and printing. Includes theory, algorithms, and architectures for image coding, filtering, enhancement, restoration, segmentation, and motion estimation; image formation in tomography, radar, sonar, geophysics, astronomy, microscopy, and crystallography; image scanning, digital half-toning and display, andcolor reproduction.


Multimedia, IEEE Transactions on

The goal of IEEE Transactions on Multimedia is to integrate all aspects of multimedia systems and technology, signal processing, and applications. It will cover various aspects of research in multimedia technology and applications including, but not limited to: circuits, algorithms and macro/micro-architectures, software, detailed design, synchronization, interaction, joint processing and coordination of multimedia and multimodal signals/data, compression, storage, retrieval, communication, ...


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Xplore Articles related to 3D

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Fast multipole method for scattering from an arbitrary PEC target above or buried in a lossy half space

N. Geng; A. Sullivan; L. Carin IEEE Transactions on Antennas and Propagation, 2001

The fast multipole method (FMM) was originally developed for perfect electric conductors (PECs) in free space, through exploitation of the spectral properties of the free-space Green's function. In the work reported here, the FMM is modified, for scattering from an arbitrary three-dimensional (3-D) PEC target above or buried in a lossy half space. The "near" terms in the FMM are ...


Near-optimal deterministic attitude filtering

Mohammad Zamani; Jochen Trumpf; Robert Mahony 49th IEEE Conference on Decision and Control (CDC), 2010

A deterministic attitude filter is derived based on the principles of minimum- energy filtering. The proposed filter is applied to the attitude kinematics of a rigid body in 3D space and is posed directly on the rotation group SO(3). The proposed filter generalizes recently published work by Coote et al. on deterministic filtering on the unit circle. The filter is ...


3D balance quantization encoding based on variable size matrix segmentation

Aijun Sang; Hexin Chen; Moncef Gabbouj The 2010 IEEE International Conference on Information and Automation, 2010

Variable size matrix segmentation and variable size transform are used in the colour image compression methods based on three dimensional matrix widely discrete cosine transform (3DMWDCT). However the coefficients have different statistical properties since different areas of an image and difference size blocks have difference energy centralization. 3D balance quantization based human visual system was proposed in this paper. After ...


Elevation beam profile measurement : a simple test object for evaluation of arrays and 3D imaging performance

B. Richard; B. Robert 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102), 1998

Beam characteristics in the elevation plane of linear and curvilinear arrays are difficult to test. With a set of oblique reflecting planes crossing the scan plane at a 45° angle, the elevation beam profile is clearly displayed on the standard echographic image. Such a test object is useful to test 1D arrays with fixed geometrical focusing and 1.5D arrays with ...


Constructing 3D package component broadband electrical models with correct DC values

Jinwoo Choi; Zhaoqing Chen; Wiren D. Becker; Jason Morsey; Barry Rubin 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems, 2010

Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models extending to DC while retaining passivity and causality. The model derived by this method is suitable for transient simulations of packaging interconnect systems.


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Educational Resources on 3D

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eLearning

Fast multipole method for scattering from an arbitrary PEC target above or buried in a lossy half space

N. Geng; A. Sullivan; L. Carin IEEE Transactions on Antennas and Propagation, 2001

The fast multipole method (FMM) was originally developed for perfect electric conductors (PECs) in free space, through exploitation of the spectral properties of the free-space Green's function. In the work reported here, the FMM is modified, for scattering from an arbitrary three-dimensional (3-D) PEC target above or buried in a lossy half space. The "near" terms in the FMM are ...


Near-optimal deterministic attitude filtering

Mohammad Zamani; Jochen Trumpf; Robert Mahony 49th IEEE Conference on Decision and Control (CDC), 2010

A deterministic attitude filter is derived based on the principles of minimum- energy filtering. The proposed filter is applied to the attitude kinematics of a rigid body in 3D space and is posed directly on the rotation group SO(3). The proposed filter generalizes recently published work by Coote et al. on deterministic filtering on the unit circle. The filter is ...


3D balance quantization encoding based on variable size matrix segmentation

Aijun Sang; Hexin Chen; Moncef Gabbouj The 2010 IEEE International Conference on Information and Automation, 2010

Variable size matrix segmentation and variable size transform are used in the colour image compression methods based on three dimensional matrix widely discrete cosine transform (3DMWDCT). However the coefficients have different statistical properties since different areas of an image and difference size blocks have difference energy centralization. 3D balance quantization based human visual system was proposed in this paper. After ...


Elevation beam profile measurement : a simple test object for evaluation of arrays and 3D imaging performance

B. Richard; B. Robert 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102), 1998

Beam characteristics in the elevation plane of linear and curvilinear arrays are difficult to test. With a set of oblique reflecting planes crossing the scan plane at a 45° angle, the elevation beam profile is clearly displayed on the standard echographic image. Such a test object is useful to test 1D arrays with fixed geometrical focusing and 1.5D arrays with ...


Constructing 3D package component broadband electrical models with correct DC values

Jinwoo Choi; Zhaoqing Chen; Wiren D. Becker; Jason Morsey; Barry Rubin 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems, 2010

Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models extending to DC while retaining passivity and causality. The model derived by this method is suitable for transient simulations of packaging interconnect systems.


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IEEE-USA E-Books

  • 3DTV/3DV Encoding Approaches

    This chapter contains sections titled: 3D Mastering Methods More Advanced Methods Short-term Approach for Signal Representation and Compression Displays References Appendix A3: Color Encoding Appendix B3: Additional Details on Video Encoding Standards

  • Finite-Element Method

    The finite-element method (FEM) is a full-wave numerical method that discretizes the variational of a functional. The evolution of this method within the scope of electromagnetics traces back to the solving of two classes of problems, namely, the eigenmode problems and the deterministic problems. If we try to use some examples to illustrate the most typical and the most complete techniques with the most complete solution, the eigenmode problem of a dielectrically loaded waveguide and the wave propagation in a three- dimensional (3D) discontinuous waveguide are good candidates representing the eigenmode and the closed-domain solutions, respectively. As for the open- domain scattering problem and radiating problems, the authors consider the essential and key parts are presented in solving the 3D scattering problems. For this reason, we will illustrate the theoretical basics, the critical solving techniques and the typical skills involved in FEM through solving of the above three specific problems. At the end of this chapter, we will also briefly review the FEM solution for some other problems.

  • 2.5D Simulation Method for 3D Integrated Systems

    This chapter contains sections titled: Introduction Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes Numerical Simulations for Finite Structures Modeling of 3D Electronic Package Structure Conclusion References

  • Maxwell's Equations

    This chapter presents electromagnetic (EM) techniques that are based on Maxwell's equations. It provides a general overview of the different possible forms of Maxwell's equations and the resultant differential and integral equation formulations. The chapter emphasizes existing results and conclusions based on Maxwell's equations instead of derivations of the fundamentals on which they are based. It aims to provide essential tools for connecting lumped circuit analysis and electromagnetic modeling and concentrates on solutions that have practical relevance for partial element equivalent circuit (PEEC) modeling. The fundamental idea of PEEC is to model Maxwell's equations to the circuit domain and a formula that is fundamental to the PEEC method is the integral equation derived in the chapter. The chapter also talks about the Green's function, is the basic solution of the wave equation for a local source, which is a point source for 3D.

  • Data Processing in Current 3D Robotic Perception Systems

    This chapter introduces the data processing methods for two typical robotic perception systems: light detection and ranging (LIDAR)-based and Flash LIDAR Camera (FLC)-based systems. The most popular 3D perception sensors in robotics include stereovision system and light detection and ranging (LIDAR). The representative applications of stereovision have been demonstrated in NASA's Mars Exploration Rover [4, 5] program and the DARPA's Learning Applied to Ground Robots [6-9] program. A LIDAR system outperforms a stereovision system in terms of the completeness and accuracy of range data. An FLC illuminates the entire scene with a single laser pulse (or modulated infrared light) and focuses the image onto the 3D sensor's focal plane array (FPA). The sensors used for mapping and navigation include a 2D LIDAR and a three-axis fiber optic gyro. A robotic device is a portable robotic system with navigational functions such as positioning, obstacle detection, and scene recognition.

  • Video???Based Parking Management

    This chapter examines the state of the art in visual parking space monitoring. Available methods for occupancy detection are presented, beginning with two???dimensional (2D) methods. Vehicle detectors which are based on background modeling, feature detection, and more specific appearance???based histogram of oriented gradient (HOG) and HOG/local binary pattern (LBP) detectors are analyzed. The second part of the chapter treats 3D methods for parking space monitoring and focuses mainly on stereoscopic imaging. It includes the detailed analysis of a state???of???the???art 3D stereo system system.

  • 3DTV Standardization and Related Activities

    This chapter contains sections titled: Moving Picture Experts Group (MPEG) MPEG Industry Forum (MPEGIF) Society of Motion Picture and Television Engineers (SMPTE) 3D Home Entertainment Task Force Rapporteur Group On 3DTV of ITU-R Study Group 6 TM-3D-SM Group of Digital Video Broadcast (DVB) Consumer Electronics Association (CEA) HDMI Licensing, LLC Blu-ray Disc Association (BDA) Other Advocacy Entities References

  • Finite-Difference Time-Domain Method

    The finite-difference time-domain (FDTD) method is a full-wave numerical method that directly discretizes the Maxwell's equations in the time-domain partial differential form. The Chinese American K.S. Yee developed the Yee discretizing scheme in the 1960s, by replacing the partial differential operator with the finite difference operator in the computational electromagnetics. In Yee's scheme, the electric and magnetic field components are defined in an interleaving way both in a three-dimensional (3D) space and in time. This provides a beautifully simple picture of 3D space being filled by an interlinked array of Faraday's law and Ampere's law contours, representing the physical EM wave propagation. This scheme is versatile and easy to use, and does not require much preknowledge. Due to these merits, this method is popular and gains vast applications. In this chapter, we still use a 3D scattering problem to illustrate the general idea and key issues of Yee scheme. Then, some special treatments will be overviewed, followed by the comparison of the three computational methods, namely, MoM, FEM and FDTD, as a summary.

  • Three-Dimensional Nand Flash Cell

    This chapter introduces major three-dimensional (3D) cells. The bit cost scalable (BiCS) cell has a new structure of the stacked control gate layers and vertical poly-silicon channel. The thinner poly-silicon channel can obtain the easier electrostatic control performed by the gate electrode over the thinner body and the smaller poly-silicon grains which reduce the impact on the channel current of statistical variation of smaller grain size configuration. Terabit cell array transistor (TCAT) has a similar structure of BiCS, with a vertical poly-silicon channel, stacked word lines, and a silicon nitride (SiN) charge storage layer of the surrounding gate SONOS cell. The chapter describes a process sequence of vertical gate NAND (VG-NAND) cell and proposes a dual control gate with a surrounding floating-gate (DC-SF) cell for 3D NAND flash memory. This structure allows to apply floating gate to a 3D stacked cell structure with minimal cell size and high coupling ratio.

  • Hybrid Integral Equation Modeling Methods for 3D Integration

    This chapter contains sections titled: Introduction 3D Hybrid Integral Equation Method Conclusion References



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