Conferences related to 3D

Back to Top

2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 16th International Conference on Megagauss Magnetic Field Generation and Related Topics (MEGAGAUSS)

The MG-XVI conference will take place between September 25-29, 2018 at the UTokyo Kashiwa Campus, near Tokyo, Japan. The MG XVI conference will serve as a platform for scientists to exchange information and ideas among the members of the international scientific community in the domain of generation and application of ultra-high magnetic fields, high-energy and high-current pulsed power physics and technology, magnetic-flux compression technologies for the production of multi-megagauss fields, high magnetic field applications in basic and applied research in solid-state physics, atomic physics and chemistry, high energy density physics and for other related and novel technical applications. The MG XVI conference encourages opportunities for a strong interaction and networking among experienced and young scientists, engineers, and students involved in this extremely interesting and unique research area.


2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2018 22nd International Conference on System Theory, Control and Computing (ICSTCC)

The International Conference on System Theory, Control and Computing ICSTCC 2018 aims at bringing together under a unique forum, scientists from academia and industry to discuss the state of the art and the new trends in system theory, control and computer engineering, and to present recent research results and prospects for development in this rapidly evolving area.

  • 2017 21st International Conference on System Theory, Control and Computing (ICSTCC)

    The International Conference on System Theory, Control and Computing ICSTCC 2017 aims at bringing together under a unique forum, scientists from academia and industry to discuss the state of the art and the new trends in system theory, control and computer engineering, and to present recent research results and prospects for development in this rapidly evolving area.

  • 2016 20th International Conference on System Theory, Control and Computing (ICSTCC)

    The main goal of this conference is to provide a multidisciplinary forum between researchers from industry and academia to discuss state-of-the-art topics in system theory, control and computing, and to present recent research results and prospects for development in this evolving area. The outcome of ICSTCC 2016 can be a better understanding of some leading research areas, as already System Theory, Control and Computing have demonstrated.

  • 2015 19th International Conference on System Theory, Control and Computing (ICSTCC)

    International Conference on System Theory, Control and Computing - ICSTCC 2015 - aims at bringing together, under a unique forum, scientists from Academia and Industry to discuss the state of the art and the new trends in System Theory, Control and Computer Engineering, and at promoting professional interactions and fellowships. ICSTCC 2015 will feature several kinds of presentations including invited plenary papers, contributed papers and invited sessions. The outcome of ICSTCC 2015 will be a better understanding of some leading research areas for which System Theory, Control and Computing are representative.The conference has reached its sixth edition and it represents the result of a merger of three different scientific events previously hosted by “Dunarea de Jos” University of Galati, “Gheorghe Asachi” Technical University of Iasi and University of Craiova.

  • 2014 18th International Conference on System Theory, Control and Computing (ICSTCC)

    The International Conference on System Theory, Control and Computing ICSTCC 2014 aims at bringing together under a unique forum, scientists from academia and industry to discuss the state of the art and the new trends in system theory, control and computer engineering, and to present recent research results and prospects for development in this rapidly evolving area.

  • 2013 17th International Conference on System Theory, Control and Computing (ICSTCC)

    The main goal of this conference is to provide amultidisciplinary forum between researchers from industry and academia to discuss state-of-the-art topics in system theory, control and computing, and to present recent research results and prospects for development in this evolving area.

  • 2012 16th International Conference on System Theory, Control and Computing (ICSTCC)

    The ICSTCC 2012 aims at bringing together, under a unique forum, scientists from Academia and Industry to discuss the state of the art and the new trends in System Theory, Control and Computing.

  • 2011 15th International Conference on System Theory, Control and Computing (ICSTCC)

    The ICSTCC 2011 aims at bringing together, under a unique forum, scientists from Academia and Industry to discuss the state of the art and the new trends in System Theory, Control and Computer Engineering. It will feature several kinds of presentations including invited and contributed papers, special sessions and poster sessions.


More Conferences

Periodicals related to 3D

Back to Top

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


More Periodicals

Most published Xplore authors for 3D

Back to Top

Xplore Articles related to 3D

Back to Top

Five-contact silicon structure based integrated 3D Hall sensor

[{u'author_order': 1, u'full_name': u'Ch.S. Roumenin'}, {u'author_order': 2, u'affiliation': u'Inst. of Control & Syst. Res., Bulgarian Acad. of Sci., Sofia, Bulgaria', u'full_name': u'D.I. Nikolov'}] Electronics Letters, 2003

A new silicon integrated 3D Hall sensor for high-accuracy magnetic field measurements is suggested and tested. Its unique device design in having only five n/sup +/ contacts allows simultaneous and independent obtaining of the full information about the three components of the magnetic field vector. The device is manufactured through a simple planar process and requires the use of four ...


Coupling between microstrip lines embedded in polyimide layers for 3D-MMICs on Si

[{u'author_order': 1, u'affiliation': u'NASA Glenn Res. Center, Cleveland, OH, USA', u'full_name': u'G.E. Ponchak'}, {u'author_order': 2, u'full_name': u'E.M. Tentzeris'}, {u'author_order': 3, u'full_name': u'J. Papapolymerou'}] IEE Proceedings - Microwaves, Antennas and Propagation, 2003

Three-dimensional circuits built on multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimetre-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrade circuit performance. We present finite difference time domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between ...


Monolithic 3D layout using 2D EDA for embedded memory-rich designs

[{u'author_order': 1, u'affiliation': u'3D-EDA SRL Iasi, Romania', u'full_name': u'Ionica Pletea'}, {u'author_order': 2, u'affiliation': u'MonolithIC 3D Inc. San Jose, CA 95124', u'full_name': u"Ze'ev Wurman"}, {u'author_order': 3, u'affiliation': u'MonolithIC 3D Inc. San Jose, CA 95124', u'full_name': u'Zvi Or-Bach'}, {u'author_order': 4, u'affiliation': u'Technical University of Moldova, Chisnau, Moldova', u'full_name': u'Victor Sontea'}] 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015

Monolithic 3D integration has generated considerable interest in recent years due it its inherent capability of supporting heterogeneous devices, and its rich vertical connectivity allowing for increased integration while reducing wire-length and power. Few commercial EDA 3D tools are in existence and prior work focused on partitioning logic between two or more logic strata, capitalizing on harnessing existing 2D tools ...


Algorithm for 3D reconstruction with both visible and missing data

[{u'author_order': 1, u'full_name': u'Li Tang'}, {u'author_order': 2, u'affiliation': u"ISN Nat. Key Lab., Xidian Univ., Xi'an, China", u'full_name': u'Chengke Wu'}, {u'author_order': 3, u'full_name': u'H.T. Tsui'}, {u'author_order': 4, u'full_name': u'Shigang Liu'}] Electronics Letters, 2003

A novel algorithm for 3D reconstruction from image sequences is presented. Global optimisation is applied to a rough model by minimising the back projection errors in each image. Different weights are added to distinguish visible and occluded points. Satisfactory results on both simulated data and real images are reported


On the 3D documentation of the Igel Column — Original and copy: Structured 3D survey and analytical 3D information system

[{u'author_order': 1, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Martin Schaich'}, {u'author_order': 2, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Peter Jahnke'}, {u'author_order': 3, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Sebastian Knechtel'}, {u'author_order': 4, u'affiliation': u'ArcTron 3D GmbH, Altenthann, Germany', u'full_name': u'Max Rahrig'}] 2013 Digital Heritage International Congress (DigitalHeritage), 2013

The Igel Column, 23 m high, is one of the best known Roman column monuments in Germany and is part of the UNESCO World Heritage `Roman Structures, Cathedral and Church of Our Lady' in Trier. The list also includes a faithfully reconstructed and colored one-to-one copy of the column monument from the early 20th century, which is located at the ...


More Xplore Articles

Educational Resources on 3D

Back to Top

eLearning

No eLearning Articles are currently tagged "3D"

IEEE-USA E-Books

  • Temperature-Aware Design and Management for 3D Multi-Core Architectures

    Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs are subject to amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. Temperature-Aware Design and Management for 3D Multi-Core Architectures surveys recent advances in temperature-aware 3D MPSoC considerations. It explores the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations, and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. As such, it provides a global perspective, highlighting the advancements and drawbacks of the recent state-of-the-art. While the primary focus is on existing methodologies and techniques, it also provides some insights on possible future directions related to this research discipline – temperature-aware design and management. Temperature-Aware Design and Management for 3D Multi- Core Architectures is an ideal primer for researchers and practitioners working in this area.

  • Representations and Techniques for 3D Object Recognition and Scene Interpretation

    One of the grand challenges of artificial intelligence is to enable computers to interpret 3D scenes and objects from imagery. This book organizes and introduces major concepts in 3D scene and object representation and inference from still images, with a focus on recent efforts to fuse models of geometry and perspective with statistical machine learning. The book is organized into three sections: (1) Interpretation of Physical Space; (2) Recognition of 3D Objects; and (3) Integrated 3D Scene Interpretation. The first discusses representations of spatial layout and techniques to interpret physical scenes from images. The second section introduces representations for 3D object categories that account for the intrinsically 3D nature of objects and provide robustness to change in viewpoints. The third section discusses strategies to unite inference of scene geometry and object pose and identity into a coherent scene interpretation. Each section broadly surveys important ideas from cognitive science and artificial intelligence research, organizes and discusses key concepts and techniques from recent work in computer vision, and describes a few sample approaches in detail. Newcomers to computer vision will benefit from introductions to basic concepts, such as single-view geometry and image classification, while experts and novices alike may find inspiration from the book's organization and discussion of the most recent ideas in 3D scene understanding and 3D object recognition. Specific topics include: mathematics of perspective geometry; visual elements of the physical scene, structural 3D scene representations; techniques and features for image and region categorization; historical perspective, computational models, and datasets and machine learning techniques for 3D object recognition; inferences of geometrical attributes of objects, such as size and pose; and probabilistic and feature-passing approaches for contextual reasoning about 3D objects and scenes. Table of Contents: Background on 3D Scene Models / Single-view Geometry / Modeling the Physical Scene / Categorizing Images and Regions / Examples of 3D Scene Interpretation / Background on 3D Recognition / Modeling 3D Objects / Recognizing and Understanding 3D Objects / Examples of 2D 1/2 Layout Models / Reasoning about Objects and Scenes / Cascades of Classifiers / Conclusion and Future Directions

  • A, B, See... in 3D: A Workbook to Improve 3-D Visualization Skills

    The workbook provides over 100 3D visualization exercises challenging the student to create three dimensions from two. It is a powerful and effective way to help engineering and architecture educators teach spatial visualization. Most of the 3-D visualization exercises currently being used by students in Design and Graphics classes present the objects in isometric views already in 3-D, asking the viewer to create multiple views, fold patterns, manipulate, reflect, or rotate them. The exercises presenting the objects in incomplete multiview projections asking the students to add missing lines use mostly real 3D objects that are more easily recognizable to help the student correlate 2D with 3D. This workbook uses a different approach. Each view of the solid represents a letter of the alphabet. The letters are by definition 2D representations and when they are combined to create a 3D object, visualizing it becomes quite a challenge. This workbook is intended for Engineering, Architecture, and Art students and faculty that want to increase their 3-D visualization skills.

  • Deformable Surface 3D Reconstruction from Monocular Images

    Being able to recover the shape of 3D deformable surfaces from a single video stream would make it possible to field reconstruction systems that run on widely available hardware without requiring specialized devices. However, because many different 3D shapes can have virtually the same projection, such monocular shape recovery is inherently ambiguous. In this survey, we will review the two main classes of techniques that have proved most effective so far: The template-based methods that rely on establishing correspondences with a reference image in which the shape is already known, and non-rigid structure-from-motion techniques that exploit points tracked across the sequences to reconstruct a completely unknown shape. In both cases, we will formalize the approach, discuss its inherent ambiguities, and present the practical solutions that have been proposed to resolve them. To conclude, we will suggest directions for future research. Table of Contents: Introduction / Early Approaches to Non-Rigid Reconstruction / Formalizing Template-Based Reconstruction / Performing Template-Based Reconstruction / Formalizing Non- Rigid Structure from Motion / Performing Non-Rigid Structure from Motion / Future Directions

  • Hybrid Integral Equation Modeling Methods for 3D Integration

    This chapter contains sections titled: * Introduction * 3D Hybrid Integral Equation Method * Conclusion * References ]]>

  • Modeling of Through-Silicon Vias (TSV) in 3D Integration

    This chapter contains sections titled: * Introduction * Equivalent Circuit Model for TSV * MOS Capacitance Effect of TSV * Conclusion * References ]]>

  • 2.5D Simulation Method for 3D Integrated Systems

    This chapter contains sections titled: * Introduction * Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems * Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes * Numerical Simulations for Finite Structures * Modeling of 3D Electronic Package Structure * Conclusion * References ]]>

  • Systematic Microwave Network Analysis for 3D Integrated Systems

    This chapter contains sections titled: * Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair * Parallel Plane Pair Model * Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias * References ]]>

  • Macromodeling of Complex Interconnects in 3D Integration

    This chapter contains sections titled: * Introduction * Network Parameters: Impedance, Admittance, and Scattering Matrices * Rational Function Approximation with Partial Fractions * Vector Fitting (VF) Method * Macromodel Synthesis * Stability, Causality, and Passivity of Macromodel * Macromodeling Applied to High-Speed Interconnects and Circuits * Conclusion * References ]]>

  • Mobile 3D Graphics

    This chapter contains sections titled: * Principles of Mobile 3D Graphics * Mobile 3D Graphics APIs * Summary and Future Directions * References



Standards related to 3D

Back to Top

No standards are currently tagged "3D"


Jobs related to 3D

Back to Top