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The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.
Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM
WiOpt 2018 welcomes original papers related to modeling, performance evaluation, and optimization of wireless networks. The scope covers all types of wireless networks: cellular, ad hoc, content-driven, delay-tolerant, mesh, metropolitan, sensor, cognitive, vehicular, robotic, Internet of Things, virtualized, etc. The focus is on issues at and above the MAC layer, although cross-layer techniques encompassing the physical layer are equally welcome. We encourage both theoretical contributions and submissions relating to real world empirical measurements, experimental studies.
Core/Access Networks and Switching Subsystems, Transmission Systems and Their Subsystems, Optical Fibers, Fiber Amplifiers, and Related Devices, Optical Active Devices and Modules, Passive Devices and Modules
System on Chip
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)
No Xplore Articles are currently tagged "Broadband"
Design of Monolithic Silicon-Based Envelope-Tracking Power Amplifiers for Broadband Wireless Applications
IMS 2011 Microapps - The Design and Test of Broadband Launches Up to 50GHz on Thin and Thick Substrates
Arogyaswami J. Paulraj
Single Die Broadband CMOS Power Amplifier and Tracker with 37% Overall Efficiency for TDD/FDD LTE Applications: RFIC Industry Forum
Fast Broadband Impedance Matching with Automatic Circuit Synthesis: MicroApps 2015 - Keysight Technologies
IMS 2014: Broadband Continuous-mode Power Amplifiers
Browsing the World's Oldest Phonebook
Brooklyn 5G Summit: Spectrum for 5G
Broadband IQ, Image Reject, and Single Sideband Mixers: MicroApps 2015 - Marki Microwave
Founder of the Wikipedia Encyclopedia Talks About It's Global Impact
John Brzozowski: IPv6 at Comcast - InterOp-Ware Industry Forum Panel: WF IoT 2016
NR - Design For Future - Mikael Hook: Brooklyn 5G Summit 2017
Panel 3: Mobile Broadband in mmW bands - FCC Perspective - Brooklyn 5G - 2015
How To Get Congress To Give You $240 Billion
ICASSP 2010 - New Signal Processing Application Areas
2011 IEEE Awards Alexander Graham Bell Medal - Arogyaswami J. Paulraj
Making 5G NR a Reality - Durga Malladi: Brooklyn 5G Summit 2017
Millimeter Wave Mobile Communications for 5G Cellular: It Will Work!
Marks and Stanwood: WirelessMAN Inside the IEEE 802.16 Standard
The scope of this standard is to provide testing and verification standards for the commonly used hardware, primarily couplers, and enclosures, for broadband over power line (BPL) installations, and provide standard installation methods to enable compliance with applicable codes and standards. This standard does not cover repeater/node hardware, data transmission, protocols, or other aspects of BPL related to the internal ...
This standard represents the Protocol Implementation Conformance Statement (PICS) Proforma, per ISO/IEC Standard 9646-7 (1995) and ITU-T X.296, for conformance specification of base stations and subscriber stations based upon the air interface specified in IEEE P802.16-REVd for frequencies below 11 GHz.
This standard represents the Radio Conformance Test (RCT) specification for base stations and subscriber stations based upon the WirelessMAN-SC (TM) (10-66 GHz) air interface specified in IEEE Standard 802.16.
This standard amends the IEEE 802.16 WirelessMAN-OFDMA specification to provide an advanced air interface for operation in licensed bands. It meets the cellular layer requirements of IMT-Advanced next generation mobile networks. This amendment provides continuing support for legacy WirelessMAN-OFDMA equipment.
Postdoctoral Research Fellow, Scholarship
Lulea University of Technology
Faculty Openings Department of Electronic Engineering, Tsinghua University
Joint Professorship (W3) Semiconductor Technology & Scientific-Technical Directorship of IHP
IHP Gmbh - Innovations for High Performance microelectronics