Microwave Integrated Circuits
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2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD)
The NSS/MIC offers an outstanding opportunity for scientists and engineers interested in the fields of nuclear science, radiation detection, accelerators, high energy physics and astrophysics, and related software to present their latest developments and ideas. The scientific program provides a comprehensive review of the latest developments in technology and covers a wide range of applications from radiation and accelerator instrumentation, new detector materials, to complex detector systems for physical sciences, and advanced imaging systems for biological and medical research.
2014 IEEE International Conference on Ultra-WideBand (ICUWB)
Antennas and Propagation, Hardware Architectures and implementation, Cognitive Radio and Cooperation, Standardization and Regulatory Issues, UWB Applications
2014 IEEE International Vacuum Electronics Conference (IVEC)
2014 IEEE Radio and Wireless Symposium (RWS)
RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state -of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.
2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)
The symposium will cover the entire scope of electromagnetic compatibility including emerging technologies. Topics are: management and standards, measurements, EMC environment, high power electromagnetics, EMC in space and transport, IC and semiconductor EMC, signal and power integrity, computational electromagnetics, bio-medical EMC, nanotechnology and EMC and electromagnetic radiation hazards.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
Theory, concepts, and techniques of science and engineering as applied to sensing the earth, oceans, atmosphere, and space; and the processing, interpretation, and dissemination of this information.
Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European, 2012
Novel X-band high-power monolithic SPST/SPDT switches in coplanar GaN technology are presented. The SPDT switch exhibits 1:6dB on-state insertion loss and better than 20dB isolation. Power handling measurements have shown that the 1dB compression point occurs with an input power equal to 38dBm at 10GHz. A combination of techniques were used to yield higher power handling while preserving low loss ...
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European, 2012
In this paper, we describe the development of a millimeter-wave reflectarray intended for use in a millimeter-wave identification or imaging applications. Design, simulations, and millimeter-wave near-field measurements of the reflectarray are presented. An in-house genetic algorithm is used in determining the required phase shift by the reflectarray elements. The elements are realized in a lithographic process and are based on ...
Telecommunications, 2003. ICT 2003. 10th International Conference on, 2003
Transport coding is the method of transmitting data in a network based on the use of error-correcting coding, which reduces the dispersion of the packet delay with some increase in the mean packet delay. The use of transport coding decreases the mean message delay in packet switching network. The use of transport coding for the transmission of priority messages instead ...
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European, 2012
Scalability of the photo-injected Fresnel zone plate technique for adaptive beam forming and non-mechanical steering to higher sub-mm wave frequencies is discussed. This method proves to be an attractive option for a range of applications, where at higher frequencies larger F/D ratios are shown to yield optimal performance, with marginal increases in required irradiation densities. Experimental data is also presented ...
Solid-State Circuits, IEEE Journal of, 2004
A dual-band front-end with two gain modes operating at the 2.4 Industrial Scientific and Medical (ISM) band and 5.15-GHz Unlicensed National Information Infrastructure (UNII) band has been demonstrated in a 0.18-μm foundry CMOS process. The front-end uses a single set of RF blocks. A dual-band low noise amplifier (LNA) with two inputs is tuned to the two resonant frequencies by ...
Hassna Ouassal; Jafar Shaker; Langis Roy; Reza Chaharmir 2015 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2015
A novel electromagnetic band gap structure composed of stacked U-shaped- periodic array of metallic open square rings (OSRs) and its potential application to microwave integrated circuits is presented. Specifically, the dispersion diagrams and field patterns of an infinite array of cells are computed and shown. Different geometrical parameters are shown to produce varying band gap at various frequencies. Using this ...
K. Hettak; G. A. Morin The 5th European Microwave Integrated Circuits Conference, 2010
The design and results of a compact reflective-type phase shifter with transformed single-resonant loads for integrated SiGe phased-array implementations are presented. This circuit has been fabricated using a commercial 0.35 μm SiGe HBT process. A 3-dB 90° coupler with lumped elements instead of microstrip lines is used to allow for a more compact implementation. Phase control is enabled using a ...
K. Goverdhanam; R. N. Simons; L. P. B. Katehi 2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496), 2001
In this paper, novel low loss, wide bandwidth, compact coplanar stripline/coplanar waveguide vertical interconnects with 180/spl deg/ phase shift and vertically interconnected baluns for RF/microwave integrated circuits are demonstrated. The interconnects and baluns are fabricated on high resistivity silicon wafers with a thin layer of spin-on glass as an insulator between the buried and the elevated strip conductors which are ...
Michael D. Yore; Corey A. Nevers; Philippe Córtese The 5th European Microwave Integrated Circuits Conference, 2010
In this paper the design, fabrication and measurement of a high performance SP7T GaAs pHEMT switch for cellular phone applications is discussed. The antenna switch design uses a state of the art E/D-mode pHEMT process with an Ron*Coff Figure of Merit of 145 Ohm-fF. Excellent broadband insertion loss measurements across all cellular bands are less than 0.5dB, isolations are greater ...
Apostolos Samelis; Edward Whittaker; Michael Ball; Alasdair Bruce; John Nisbet; Lui Lam; William Vaillancourt 2014 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications (PAWR), 2014
A SiGe BiCMOS, CMOS/SOI front-end module (FEM) for WLAN applications in the 2GHz band is presented. In the transmit mode it delivers 29dB small-signal gain and 3% EVM at 19.3dBm. In the receive mode, it achieves a noise figure of 1.85dB, 14dB gain, and an IIP3 level of 3dBm with 9mA current consumption. The FEM employs bias control circuitry that ...
Education for Analog ICs
IMS 2011 Microapps - STAN Tool: A New Method for Linear and Nonlinear Stability Analysis of Microwave Circuits
IMS 2011 Microapps - Memory Effects in RF Circuits: Definition, Manifestations and Fast, Accurate Simulation
2011 IEEE Medal of Honor: Morris Chang
Fabricating a Prototype
Sources of Innovation
IMS 2011 Closing Ceremony
IMS Special Sessions - Memorial Session for Roger Sudbury
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
IMS 2011 Microapps - Improved Microwave Device Characterization and Qualification Using Affordable Microwave Microprobing Techniques for High-Yield Production of Microwave Components
IMS 2010 - International Microwave Symposium
IMS MicroApps: Multi-Chip Module Design Challenges
Coal Gasification at Polk Power Station
IMS 2011 Microapps - Vector-Receiver Load Pull - Measurement Accuracy at its Best
IMS 2011 Overview
IMS 2011 Microapps - Techniques for Validating a Vector Network Analyzer Calibration When Using Microwave Probes
IMS MicroApps: Analyzing and Understanding the Performance of an LTE System
IMS 2011 Preview of International Microwave Symposium
Maker Faire 2008: Spectrum's Digital Clock Contest Winner
The objective of this two-volume book is the systematic and comprehensive description of the most competitive time-domain computational methods for the efficient modeling and accurate solution of modern real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applications. Outlining the present volume, numerical investigations delve into printed circuit boards, monolithic microwave integrated circuits, radio frequency microelectromechanical systems as well as to the critical issues of electromagnetic interference, immunity, shielding, and signal integrity. Biomedical problems and EMC test facility characterizations are also thoroughly covered by means of diverse time-domain models and accurate implementations. Furthermore, the analysis covers the case of large-scale applications and electrostatic discharge problems, while special attention is drawn to the impact of contemporary materials in the EMC world, such as double negative metamaterials, bi-isotropic media, and several others. Table of Contents: Introduction / Printed Circuit Boards in EMC Structures / Electromagnetic Interference, Immunity, Shielding, and Signal Integrity / Bioelectromagnetic Problems: Human Exposure to Electromagnetic Fields / Time- Domain Characterization of EMC Test Facilities / Large-Scale EMC and Electrostatic Discharge Problems / Contemporary Material Modeling in EMC Applications
This monograph is a comprehensive presentation of state-of-the-art methodologies that can dramatically enhance the efficiency of the finite- difference time-domain (FDTD) technique, the most popular electromagnetic field solver of the time-domain form of Maxwell's equations. These methodologies are aimed at optimally tailoring the computational resources needed for the wideband simulation of microwave and optical structures to their geometry, as well as the nature of the field solutions they support. That is achieved by the development of robust "adaptive meshing" approaches, which amount to varying the total number of unknown field quantities in the course of the simulation to adapt to temporally or spatially localized field features. While mesh adaptation is an extremely desirable FDTD feature, known to reduce simulation times by orders of magnitude, it is not always robust. The specific techniques presented in this book are characterized by stability and robustness. T erefore, they are excellent computer analysis and design (CAD) tools. The book starts by introducing the FDTD technique, along with challenges related to its application to the analysis of real-life microwave and optical structures. It then proceeds to developing an adaptive mesh refinement method based on the use of multiresolution analysis and, more specifically, the Haar wavelet basis. Furthermore, a new method to embed a moving adaptive mesh in FDTD, the dynamically adaptive mesh refinement (AMR) FDTD technique, is introduced and explained in detail. To highlight the properties of the theoretical tools developed in the text, a number of applications are presented, including: Microwave integrated circuits (microstrip filters, couplers, spiral inductors, cavities). Optical power splitters, Y-junctions, and couplers Optical ring resonators Nonlinear optical waveguides. Building on first principles of time-domain electromagnetic simulations, this book presents advanced concepts and cu ting-edge modeling techniques in an intuitive way for programmers, engineers, and graduate students. It is designed to provide a solid reference for highly efficient time-domain solvers, employed in a wide range of exciting applications in microwave/millimeter-wave and optical engineering.
A coplanar waveguide (CPW) is a type of planar transmission line used in microwave integrated circuits (MICs) as well as in monolithic microwave integrated circuits (MMICs). The unique feature of this transmission line is that it is uniplanar in construction, which implies that all of the conductors are on the same side of the substrate. This attribute simplifies manufacturing and allows fast and inexpensive characterization using on-wafer techniques. This chapter gives an overview of the advantages, types, and typical applications of CPW.
This chapter contains sections titled: Speed-Up Methods for the FDTD Algorithm Characterization of Microstrip Antennas Using the TLM Simulation Associated with a Prony-Pisarenko Method A Combination of FD-TD and Prony's Methods for Analyzing Microwave Integrated Circuits Enhancing Finite-Difference Time-Domain Analysis of Dielectric Resonators Using Spectrum Estimation Techniques Recursive Covariance Ladder Algorithms for ARMA System Identification The Segmentation MethodÂ -Â An Approach to the Analysis of Microwave Planar Circuits The Implementation of Time-Domain Diakoptics in the FDTD Method Transmission Line Matrix Modeling of Dispersive Wide-Band Absorbing Boundaries with Time-Domain Diakoptics for S-Parameter Extraction Fast Sequential FDTD Diakoptics Method Using the System Identification Technique
The chapter addresses the development of compound semiconductor and Si-based technologies and devices for RF, microwave and millimeter wave analog applications. Section 1 covers compound semiconductor III-V technologies and devices based on GaAs and InP substrates; after describing the development of III-V FET transistors (MESFETs and then HEMTs) and related Monolithic Microwave Integrated Circuits (MMICs), III-V-based heterojunctionbipolars (HBT) on GaAs and InP are described. Section 2 concerns the development of RF and microwave Si-based technologies, including RF MOSFETs and Si-Ge based HBTs and FETs. Section 3 finally addresses recent advances in widegap semiconductor devices for RF and microwave power applications, including SiC and GaN-based fiedl-effect transistors.
This chapter contains sections titled: Hollow Metallic Waveguides The Transformation to Microwave Integrated Circuits References
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