Conferences related to Microwave Integrated Circuits

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2019 URSI International Symposium on Electromagnetic Theory (EMTS)

The interest of Commission B is fields and waves, encompassing theory, analysis, computation, experiments, validation and applications. Areas of emphasis are 1) Time-domain and frequency-domain phenomena, 2) Scattering and diffraction, 3) General propagation including waves in specialised media, 4) Guided waves, 5) Antennas and radiation, and 6) Inverse scattering and imaging.The Commission fosters the creation, development, and refinement of analytical, numerical, and measurement techniques to understand these phenomena. It encourages innovation and seeks to apply interdisciplinary concepts and methods.


2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 31st IEEE International System-on-Chip Conference (SOCC)

System on Chip


2018 48th European Microwave Conference (EuMC)

The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessionsand workshops are held on the full range of microwave technology from field theory, throughcomponents and subsystems to systems.

  • 2017 47th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2016 46th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology. The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2015 European Microwave Conference (EuMC 2015)

    The 45th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2015, the largest event in Europe dedicated to microwave components, systems and technology. It is the premier event to present the current status and future trends in the field of microwave, millimeter-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.The European Microwave Conference provides many opportunities of networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. In addition to scientific papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defense systems.

  • 2014 44th European Microwave Conference (EuMC)

    EuMC is the premier European conference in the microwave field, which represent the ideal venue for prospective authors to present the status and trends in microwave and millimetre-wave systems and frequency related topics, from materials and technologies to integrated circuits, systems their aspects: theory, simulation, design and measurement including passive components, design of high frequency and high data rate photonics, highly stable and noiseless microwave wave sources, new linearisation techniques and the impact of new packaging technologies.

  • 2013 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre -wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in alltheir aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development

  • 2012 European Microwave Conference (EuMC)

    Microwave and millimeter wave: active/passive devices, antennas, electromagnetics, bio-interaction, circuits, manufacturing and measurement, MEMS, meta-materials, sensor networks, cognitive radio, 4G communications, space technology and applications.

  • 2011 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development app

  • 2010 European Microwave Conference (EuMC)

    The European Microwave Conference is the premier forum for presentation of the present status and future trends in the field of microwave, millimetre- and submillimetre-wave systems and technologies.

  • 2009 European Microwave Conference (EuMC)

    The 39th European Microwave Conference (EuMC), is the core of the European Microwave Week 2009, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2008 European Microwave Conference (EuMC)

    The 38th European Microwave Conference (EuMC) in Amsterdam, The Netherlands, from 27 to 31 October, is the core of the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2007 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging.

  • 2006 European Microwave Conference (EuMC)

  • 2005 European Microwave Conference (EuMC)

  • 2004 European Microwave Conference (EuMC)

  • 2003 European Microwave Conference (EuMC)

  • 1998 28th European Microwave Conference (EuMC)

  • 1997 27th European Microwave Conference (EuMC)


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Periodicals related to Microwave Integrated Circuits

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


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Most published Xplore authors for Microwave Integrated Circuits

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Xplore Articles related to Microwave Integrated Circuits

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The features of chip resistors usage in hybrid microwave integrated circuits

[{u'author_order': 1, u'affiliation': u'Peter the Great Saint-Petersburg Polytechnic University', u'full_name': u'A. B. Nikitin'}, {u'author_order': 2, u'affiliation': u'Peter the Great Saint-Petersburg Polytechnic University', u'full_name': u'E. I. Khabitueva'}] 2016 International Conference on Actual Problems of Electron Devices Engineering (APEDE), None

High frequency measurements from 3 to 15 GHz of chip-resistors are reported in this paper. The chip-resistors under test have been mounted in the gap of the microstrip line in two ways: with the resistive layer up (<;<;wrap around>>) and with the resistive layer down (<;<;flip chip>>). The impedance of chip- resistors depends on its mounting method. Flip chip mounting ...


The WATMIC &#x2014; A software that treats microwave integrated circuits like linear antennas

[{u'author_order': 1, u'affiliation': u'University of Waterloo, Waterloo, Ontario, Canada', u'full_name': u'Y. L. Chow'}, {u'author_order': 2, u'affiliation': u'University of Waterloo, Waterloo, Ontario, Canada', u'full_name': u'G. E. Howard'}, {u'author_order': 3, u'affiliation': u'Communications Research Centre, Ottawa, Ontario, Canada', u'full_name': u'M. G. Stubbs'}] 1988 Symposium on Antenna Technology and Applied Electromagnetics, None

Without the dielectric substrate, a microwave integrated circuit is equivalent to a complex linear antenna (passive or active) backed by a ground plane. The "MIC-Antenna". fortunately, does not have significant radiation due to its small size.


Noncontact internal probing of microwave integrated circuits

[{u'author_order': 1, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Canada R3T 5V6', u'full_name': u'Dharmand Noruttun'}, {u'author_order': 2, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Canada R3T 5V6', u'full_name': u'Sunny Cheung'}, {u'author_order': 3, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Canada R3T 5V6', u'full_name': u'Leili Shafai'}, {u'author_order': 4, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Canada R3T 5V6', u'full_name': u'Greg Bridges'}] 1998 Symposium on Antenna Technology and Applied Electromagnetics, None

A non-contact probing technique for non-invasively performing vector voltage measurements at the internal points of an operating microwave integrated circuit is presented. The internal voltage amplitude and phase are extracted by sensing the localized electrostatic force between a miniature probe and point in the circuit being measured. A force nulling approach allows accurate high frequency voltage measurements to be performed ...


Noncontact voltage measurement in microwave integrated circuits

[{u'author_order': 1, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Manitoba, Canada R3T 5V6', u'full_name': u'M. Mittal'}, {u'author_order': 2, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Manitoba, Canada R3T 5V6', u'full_name': u'R. A. Said'}, {u'author_order': 3, u'affiliation': u'Department of Electrical and Computer Engineering, University of Manitoba, Winnipeg, Manitoba, Canada R3T 5V6', u'full_name': u'G. E. Bridges'}] Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 1994], None

The ability to noninvasively measure high frequency signals at the internal points of an integrated circuit is important in performing diagnostics of current high speed microelectronics. Conventional measurement techniques rely on direct electrical contact with a point on the circuit being monitored. These measurements are limited to predefined test points and are difficult to perform without disturbing the circuit's normal ...


Diakoptic theory and the complex images for microwave integrated circuits

[{u'author_order': 1, u'affiliation': u'Department of Electrical and Computer Engineering, University of Waterloo, Ontario Canada, N2L 3G1', u'full_name': u'Y. L. Chow'}] 1992 Symposium on Antenna Technology and Applied Electromagnetics, None

This paper presents an approach for rapid computation of microwave integrated circuit. The scheme includes the integral equation, a rapidly convergent Green's function by complex images, a multi-pipe method for large segments, and the diakoptic moment method. The scheme reduces the solution time of a two-stager MMIC amplifier of 411 segments to 3 minutes per frequency on a 33MHZ 80386 ...


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Educational Resources on Microwave Integrated Circuits

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eLearning

No eLearning Articles are currently tagged "Microwave Integrated Circuits"

IEEE.tv Videos

IEEE Custom Integrated Circuits Conference
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Multi-Level Optical Weights in Integrated Circuits - IEEE Rebooting Computing 2017
26th Annual MTT-AP Symposium and Mini Show - Dr. AnhVu Pham
IMS 2011 Microapps - STAN Tool: A New Method for Linear and Nonlinear Stability Analysis of Microwave Circuits
IEEE Photonics Conference 2017 Recap
Education for Analog ICs
IMS 2014:Active 600GHz Frequency Multiplier-by-Six S-MMICs for Submillimeter-Wave Generation
IMS 2011 Microapps - Memory Effects in RF Circuits: Definition, Manifestations and Fast, Accurate Simulation
Interview with Takao Nishitani - IEEE Donald O. Pederson Award in Solid-State Circuits Co-Recipient 2017
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Co-design of Power Amplifier and Dynamic Power Supplies for Radar and Communications Transmitters
IMS 2011-100 Years of Superconductivity (1911-2011) - Existing and Emerging RF Applications of Superconductivity
2011 IEEE Medal of Honor: Morris Chang
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
MicroApps: Radar Design Flow with NI-AWR Integrated Framework (National Instruments)
BSIM Spice Model Enables FinFET and UTB IC Design
MicroApps: NI-AWR Integrated Framework for WLAN 802.11ac (AWR)
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
ON-CHIP VOLTAGE AND TIMING DIAGNOSTIC CIRCUITS

IEEE-USA E-Books

  • The Evolution of Electromagnetic Waveguides: From Hollow Metallic Guides to Microwave Integrated Circuits

  • Worldwide Regulations

    This chapter contains sections titled: United States Japan Korea Europe China Summary References

  • Passive Microwave Design

    This chapter first presents detailed theory of various types of passive components. The components can be categorized into three types according to operation, namely cascaded multiresonator, backscatterer, and ultra‐wide band (UWB) antenna. The chapter also presents the theory of operation for two types of chipless radio‐frequency identification (RFID) sensor. The first type of sensor is cascaded multiresonator‐based partial discharge (PD) sensor. The second type of sensor is based on planar backscatterer. It incorporates a highly compact multislot patch resonator for data encoding and electric inductive‐capacitive (ELC) metamaterial for physical parameter sensing. The chapter then provides circuit layout for various passive microwave components and integrated sensor. It shows generic design guideline for realizing a fully passive, planar, backscatterer‐based chipless RFID sensor. Next, the chapter describes the fabrication method of microwave components. Finally, it gives detailed simulation and measured results for the designed passive microwave components and integrated sensor.

  • Microwave Line&#x2010;of&#x2010;Sight Systems

    This chapter contains sections titled: Engineering of Line‐of‐Sight Systems Design of Line‐of‐Sight Microwave Radio Link: Interferometric Method Link Budget Methods of Prediction Protection against Jamming Frequency Reuse Techniques Comparison between Various Diversity Techniques Availability of Microwave Line‐of‐Sight Systems

  • Remaining Challenges and Future Directions

    This chapter contains sections titled: References

  • Introduction to Design Using Microstrip and Planar Lines

    The microstrip line is the most widely used interconnect at radio frequency (RF) and microwave frequencies. When microwave engineers refer to microstrip design they are referring to the design of RF and microwave circuits using the major types of planar transmission line technologies. The origins of microstrip trace back to the development, by Rumsey and Jamieson during the early 1940s, of a coaxial line with a flat center conductor forming a rectangular coaxial line. The great majority of RF and microwave design engineers are employed in realizing microwave systems using RF and microwave modules. This includes the design of modules using smaller modules such as monolithically integrated circuits (ICs). Interconnect issues related to delay, path loss, signal integrity, and coupling between interconnects can largely be eliminated in high¿¿¿speed digital circuits by using well¿¿¿defined and well¿¿¿spaced microwave transmission lines.

  • Planar Interconnect Technologies

    Interconnect technologies continue to evolve as operating frequencies increase and compactness results in increased coupling of signals on adjacent interconnects. This chapter discusses planar interconnect technologies, and examines several alternative transmission line structures. High¿¿¿speed interconnects on semiconductor chips (integrated circuits (ICs)), stacked ICs (3DICs), and multichip modules (MCMs) (and also on card) are now extending into gigabit rates, which means that transmission line design issues apply. The chapter lists a variety of possible substrate materials for planar transmission lines. The combination of thick¿¿¿ and thin¿¿¿film hybrid microcircuit technology and ¿¿¿chip¿¿¿ components such as microwave transistors has formed a powerful design vehicle for modern integrated systems. The chapter reviews the essential properties of PCBs, and discusses the design of hybrid and monolithic circuits, with a specific emphasis on the circuit design itself, that is, not active devices.

  • RF and Microwave Semiconductor Technologies

    The chapter addresses the development of compound semiconductor and Si-based technologies and devices for RF, microwave and millimeter wave analog applications. Section 1 covers compound semiconductor III-V technologies and devices based on GaAs and InP substrates; after describing the development of III-V FET transistors (MESFETs and then HEMTs) and related Monolithic Microwave Integrated Circuits (MMICs), III-V-based heterojunctionbipolars (HBT) on GaAs and InP are described. Section 2 concerns the development of RF and microwave Si-based technologies, including RF MOSFETs and Si-Ge based HBTs and FETs. Section 3 finally addresses recent advances in widegap semiconductor devices for RF and microwave power applications, including SiC and GaN-based fiedl-effect transistors.

  • Adaptive Mesh Refinement in Time-Domain Numerical Electromagnetics

    This monograph is a comprehensive presentation of state-of-the-art methodologies that can dramatically enhance the efficiency of the finite- difference time-domain (FDTD) technique, the most popular electromagnetic field solver of the time-domain form of Maxwell's equations. These methodologies are aimed at optimally tailoring the computational resources needed for the wideband simulation of microwave and optical structures to their geometry, as well as the nature of the field solutions they support. That is achieved by the development of robust "adaptive meshing" approaches, which amount to varying the total number of unknown field quantities in the course of the simulation to adapt to temporally or spatially localized field features. While mesh adaptation is an extremely desirable FDTD feature, known to reduce simulation times by orders of magnitude, it is not always robust. The specific techniques presented in this book are characterized by stability and robustness. T erefore, they are excellent computer analysis and design (CAD) tools. The book starts by introducing the FDTD technique, along with challenges related to its application to the analysis of real-life microwave and optical structures. It then proceeds to developing an adaptive mesh refinement method based on the use of multiresolution analysis and, more specifically, the Haar wavelet basis. Furthermore, a new method to embed a moving adaptive mesh in FDTD, the dynamically adaptive mesh refinement (AMR) FDTD technique, is introduced and explained in detail. To highlight the properties of the theoretical tools developed in the text, a number of applications are presented, including: Microwave integrated circuits (microstrip filters, couplers, spiral inductors, cavities). Optical power splitters, Y-junctions, and couplers Optical ring resonators Nonlinear optical waveguides. Building on first principles of time-domain electromagnetic simulations, this book presents advanced concepts and cu ting-edge modeling techniques in an intuitive way for programmers, engineers, and graduate students. It is designed to provide a solid reference for highly efficient time-domain solvers, employed in a wide range of exciting applications in microwave/millimeter-wave and optical engineering.

  • Modern EMC Analysis Techniques Volume II:Models and Applications

    The objective of this two-volume book is the systematic and comprehensive description of the most competitive time-domain computational methods for the efficient modeling and accurate solution of modern real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applications. Outlining the present volume, numerical investigations delve into printed circuit boards, monolithic microwave integrated circuits, radio frequency microelectromechanical systems as well as to the critical issues of electromagnetic interference, immunity, shielding, and signal integrity. Biomedical problems and EMC test facility characterizations are also thoroughly covered by means of diverse time-domain models and accurate implementations. Furthermore, the analysis covers the case of large-scale applications and electrostatic discharge problems, while special attention is drawn to the impact of contemporary materials in the EMC world, such as double negative metamaterials, bi-isotropic media, and several others. Table of Contents: Introduction / Printed Circuit Boards in EMC Structures / Electromagnetic Interference, Immunity, Shielding, and Signal Integrity / Bioelectromagnetic Problems: Human Exposure to Electromagnetic Fields / Time- Domain Characterization of EMC Test Facilities / Large-Scale EMC and Electrostatic Discharge Problems / Contemporary Material Modeling in EMC Applications



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