Conferences related to Conductivity

Back to Top

2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference will cover diverse topics ranging from biomedical engineering to healthcare technologies to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions and oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by IEEE Xplore and Medline/PubMed.

  • 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The Annual International Conference of the IEEE Engineering in Medicine and Biology Society covers a broad spectrum of topics from biomedical engineering and physics to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions, oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by PubMed and EI. Prop

  • 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2011 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc.

  • 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The general theme of EMBC'08 is "Personalized Healthcare through Technology", covering a broad spectrum of topics from biomedical and clinical engineering and physics to medical and clinical applications. Transfer of research results from academia to industry will also be a focus of the conference.

  • 2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)


2013 ICME International Conference on Complex Medical Engineering (CME)

The objective of CME 2013 is to provide a forum for researchers, educators,engineers, and government officials involved in the general areas of biomedical engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

  • 2012 ICME International Conference on Complex Medical Engineering (CME)

    The aim of the conference is to bring together researchers, engineers and practitioners from diverse fields to stimulate future research and development of new theory, approaches, and tools in the field of Complex Medical Engineering.

  • 2012 ICME International Conference on Complex Medical Engineering (CME)

    The objective of CME 2012 is to provide a forum for researchers, educators,engineers, and government officials involved in the general areas of biomedical engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

  • 2011 ICME International Conference on Complex Medical Engineering - CME 2011

    The objective of CME 2011 is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of biomedical engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

  • 2010 ICME International Conference on Complex Medical Engineering - CME 2010

    TBD


2011 8th Intl. Symp. on Noninvasive Functional Source Imaging of the Brain & Heart and the 8th Intl. Conference on Bioelectromagnetism (NFSI & ICBEM)

All aspects of bioelectromagnetic field measurement and noninvasive functional imaging of the human body. Research tools include EEG/MEG source analyzers, fMRI, PET, SPECT, EIT and NIRS applied, for example, to cognition and to the neurological and psychiatric disorders of the brain and to the electromechanical coupling in the heart.

  • 2007 Joint Mtg. of the 6th Intl. Symp. on Noninvasive Functional Source Imaging & the Intl. Conf. on Functional Biomedical Imaging (NFSI & ICFBI)



Periodicals related to Conductivity

Back to Top

Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Medical Imaging, IEEE Transactions on

Imaging methods applied to living organisms with emphasis on innovative approaches that use emerging technologies supported by rigorous physical and mathematical analysis and quantitative evaluation of performance.


Microwave Theory and Techniques, IEEE Transactions on

Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.


More Periodicals

Most published Xplore authors for Conductivity

Back to Top

Xplore Articles related to Conductivity

Back to Top

Piezoresistive sensor technology for RFMEMS using p-type polycrystalline diamond

Zongliang Cao; Dean Aslam 2009 IEEE Nanotechnology Materials and Devices Conference, 2009

Design, simulation, fabrication and testing of p-type polycrystalline diamond (poly-C) piezoresistive RFMEMS is reported for the first time. The use piezoresistive detection in RFMEMS can lead to an output impedance in the ranges of 20 - 500 Omega and several MOmega for intra- and inter-grain piezoresistors, respectively. The inter-grain gauge factor of the poly-C film with a resistivity of 22 ...


Glass-ceramic on metal substrates for high performance packaging

E. A. Logan; D. Holland; J. S. Thorp; G. Partridge Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium, 1988

Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass- ceramic to ...


Low temperature microwave annealing of S/D

Bo Lojek 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008

Microwave annealing of ion-implanted layers in semiconductors is an emerging application of thermal processing of semiconductors, with low processing temperature eliminating unwanted diffusion as the main potential advantage. In this work, requirements and limitations of the microwave processing chamber are discussed first, and secondly, for the first time, results from a processed manufacturing lot using microwave annealing are discussed. The ...


Two-dimensional current density and temperature development in the return rail of an EM launcher with temperature-dependent properties

P. A. Drake; C. E. Rathmann IEEE Transactions on Magnetics, 1991

A method used to model the two-dimensional current and temperature development in the return rail of an electromagnetic launcher (EML) during launch, incorporating temperature-dependent electrical and thermal material properties, is presented. Due to these temperature dependencies and the nonlinearities they introduce, the derived equations must be solved numerically. Comparisons of the current and temperature responses are made with the results ...


Origin of local temperature variation during spike anneal and millisecond anneal

R. Beneyton; A. Colin; H. Bono; F. Cacho; M. Bidaud; B. Dumont; P. Morin; K. Barla 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008

Local thermal variation occurring during light enhanced rapid thermal process (RTP) and millisecond anneals called "pattern effects" have various origin, with more or less impact as function of the used process. The main issues concern the variation of thermal conductivity and the variation of the light absorption by optical interference or diffraction effects. In this paper, a large panel of ...


More Xplore Articles

Educational Resources on Conductivity

Back to Top

eLearning

Piezoresistive sensor technology for RFMEMS using p-type polycrystalline diamond

Zongliang Cao; Dean Aslam 2009 IEEE Nanotechnology Materials and Devices Conference, 2009

Design, simulation, fabrication and testing of p-type polycrystalline diamond (poly-C) piezoresistive RFMEMS is reported for the first time. The use piezoresistive detection in RFMEMS can lead to an output impedance in the ranges of 20 - 500 Omega and several MOmega for intra- and inter-grain piezoresistors, respectively. The inter-grain gauge factor of the poly-C film with a resistivity of 22 ...


Glass-ceramic on metal substrates for high performance packaging

E. A. Logan; D. Holland; J. S. Thorp; G. Partridge Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium, 1988

Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass- ceramic to ...


Low temperature microwave annealing of S/D

Bo Lojek 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008

Microwave annealing of ion-implanted layers in semiconductors is an emerging application of thermal processing of semiconductors, with low processing temperature eliminating unwanted diffusion as the main potential advantage. In this work, requirements and limitations of the microwave processing chamber are discussed first, and secondly, for the first time, results from a processed manufacturing lot using microwave annealing are discussed. The ...


Two-dimensional current density and temperature development in the return rail of an EM launcher with temperature-dependent properties

P. A. Drake; C. E. Rathmann IEEE Transactions on Magnetics, 1991

A method used to model the two-dimensional current and temperature development in the return rail of an electromagnetic launcher (EML) during launch, incorporating temperature-dependent electrical and thermal material properties, is presented. Due to these temperature dependencies and the nonlinearities they introduce, the derived equations must be solved numerically. Comparisons of the current and temperature responses are made with the results ...


Origin of local temperature variation during spike anneal and millisecond anneal

R. Beneyton; A. Colin; H. Bono; F. Cacho; M. Bidaud; B. Dumont; P. Morin; K. Barla 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008

Local thermal variation occurring during light enhanced rapid thermal process (RTP) and millisecond anneals called "pattern effects" have various origin, with more or less impact as function of the used process. The main issues concern the variation of thermal conductivity and the variation of the light absorption by optical interference or diffraction effects. In this paper, a large panel of ...


More eLearning Resources

IEEE-USA E-Books

  • Hall Effect and Magnetoresistive Sensors

    Usually magnetic sensors output a signal voltage along with little or no current. The magnetic fields sensed may vary over an extremely broad range. Magnetic sensors using the Hall effect are very common, small, and inexpensive. This chapter examines the behavior, accuracy, and construction of typical Hall sensors. Along with the Hall effect, it describes a related parameter called magnetoresistance. The chapter discusses Hall voltage equation, Hall effect conductivity tensor, finite-element computation of Hall fields, position sensors, mangnetoresistive heads, and giant magnetoresistance (GMR) sensors.

  • Space Charge in HVDC Extruded Insulation: Storage, Effects, and Measurement Methods

    This chapter discusses space-charge storage in HVDC extruded insulation, the relevant manifold effects, and the techniques developed by researchers in order to measure the amount and distribution of space charge stored in the insulation, and the electric field profile associated with such distribution. It reviews the theoretical background of charge injection and transport in insulating polymers. The chapter illustrates the processes that result in space-charge accumulation namely charge generation - via electronic charge injection, field-assisted thermal ionization of impurities, spatially inhomogeneous electric polarization, and steady DC current coupled with a spatially varying ratio ofpermittivity to conductivity. It also reviews the space-charge measurement methods for HVDC extruded insulation. The chapter focuses on the up-to-date developments of the best-suited techniques for measuring space charges in extruded insulation for HVDC cables. It provides a comparison between the best space-charge measurement methods for power cables: pulsed electro acoustic (PEA) versus thermal step method (TSM).

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Mobility

    This chapter contains sections titled: Introduction Conductivity Mobility Hall Effect and Mobility Magnetoresistance Mobility Time-of-Flight Drift Mobility MOSFET Mobility Contactless Mobility Strengths and Weaknesses Appendix 8.1 Semiconductor Bulk Mobilities Appendix 8.2 Semiconductor Surface Mobilities Appendix 8.3 Effect of Channel Frequency Response Appendix 8.4 Effect of Interface Trapped Charge References Problems Review Questions

  • Electrical Safety Aspects of the Resistance Property of Materials

    Electrical shock is caused by the passage of electrical current through the body. Electrical burns can be among the most severe because the current passes through the body and internal organs. The amount of current that flows through the body is estimated in many sources as the ratio of the applied voltage to the resistance to current flow presented by the human body. This chapter examines the phenomenon of body resistance and its inverse, body conductance. In the case of shock hazards, circuit resistance in combination with body resistance will help to determine the magnitude and duration of the exposure to voltage and current. The hazards associated with high power industrial resistors are primarily due to their open construction, which is necessary for cooling. The chapter talks about sheet resitivity, spreading resistance, particle conductivity, and cable resistance.

  • Magnetohydrodynamics Formulation

    Magnetohydrodynamics (MHD) was originally applied mostly to astrophysics and geophysics. In MHD the motion of collective charged particles is described by an electrically conducting fluid with the usual fluid dynamic variables of velocity, density and pressure or temperature. The interactions of fluid dynamics and electromagnetics are exclusively derived from the magnetic flux density. This chapter presents a systematic derivation of the governing equations of MHD. The first and foremost assumption for MHD formulation is that the physical phenomena are describable by macroscopic scales or in the framework of continuum mechanics. The electromagnetic waves are compound waves for which the compression and rarefaction components can coexist and the direct consequence of the nonconvexity of the ideal MHD equations. The chapter discusses additional computational simulations to show the lack of detailed plasma composition that is required for determining electric conductivity of plasma in the MHD formulation.

  • Lorentz-Force Actuator

    This chapter discusses the remote energy deposition through plasma injection or a microwave beam, and the resulting stagnation point heat transfer mitigation. An outstanding feature of plasma in an extremely strong externally applied magnetic field is that the magnetic lines are frozen in charged particle motion. An idealized upper theoretical limit for stagnation point heat transfer mitigation is demonstrated by Gaitonde and Poggie by solving the MHD equations with a value of electric conductivity determined by a square power-law dependence to local temperature. The computational results produce only the periodic electrostatic force of the direct current discharge (DBD), which is the driving mechanism of the electric wind, but the experimental data are the measured resultant force through the interaction of the charged and neutral particles. A numerical simulation of micro jets will definitely open a new avenue for research into enhancing combustion stability, plasma-assisted ignition, and wound pathologies.

  • Smart m???Health Sensing

    This chapter presents a new taxonomy of m???Health sensing. It also charts the evolution of medical sensing from the early remote monitoring principles to recent advances in true m???Health monitoring with wearable technologies, body area networks (BAN), wireless implantable bimolecular sensors, and many more devices. The new m???Health sensor taxonomy was composed of the following categories: health and wellness monitoring sensors; diagnostic sensors; prognostic and treatment sensors; and assistive sensors. The chapter describes briefly each of these categories and subcategories for completeness. There are a number of universal physiological and physical parameters for bio???sensing and wireless monitoring. Among these are the electrocardiogram, electroencephalogram (EEG), electromyogram (EMG), blood pressure (systolic and dia???stolic), body or skin temperature, respiratory rate (RR), oxygen saturation, heart rate, perspiration (sweating or skin) conductivity, heart sounds, blood glucose level, and body movements. Smartphones are increasingly acting to sense, collect, process, and distribute medical data.

  • On the Field???Induced Insulator???Metal Transition in VO2 Films

    First???order metal???insulator transitions (MITs) in crystalline materials correspond to a transformation between states with a dielectric and metallic types of conductivity. These transitions occur under the influence of external parameters, such as temperature and pressure, as well as with varying material composition. Materials exhibiting these phenomena include many transition metal oxides. First???order metal insulator phase transitions in thin vanadium dioxide (VO2) films can be controlled by an applied electric field. This chapter discusses the conditions under which the transition can be induced in the entire film, rather than its top sliver. It shows that the favorable situation can be realized when the film is sufficiently thin, so that the energy cost of converting the entire film into the metallic phase is smaller than the would???be cost of creating a domain boundary between the two phases. The chapter argues that in thin enough films, the entire???film transition can be stabilized by the domain boundary energy.

  • Complex Permittivity of Propagating Media

    This chapter contains sections titled: Introduction Basic Mechanisms of the Propagating Material Permittivity of Permanent Polar Molecules Induced Dipole Moments Induced Dipole Response Function, G() Frequency Character of the Permittivity Kramers-Kronig Relations for Induced Moments Arbitrary Time Stimulus Conduction Electron Permittivity Conductivity Response Function Permittivity of Plasma Oscillations Permittivity Summary Empirical Permittivity Theory Applied to Empirical Permittivity Dispersion of a Signal Propagating through a Medium with Complex Permittivity Endnotes



Standards related to Conductivity

Back to Top

Guide for In-Service Use, Care, Maintenance and Testing of Conductive Clothing for Use on Voltages up to 765 kV AC and 750 kV DC

This guide provides recommendations for the in-service visual inspection, use, care, maintenance, and electrical testing of conductive clothing, including suits, gloves, socks, and boots, for use during linework on voltages up to 765 kV ac and ±750 kV dc. Testing pertains only to nondestructive electrical tests that can be performed periodically to check if there is any reduction in the ...



Jobs related to Conductivity

Back to Top