Conferences related to Conductivity

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2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference will cover diverse topics ranging from biomedical engineering to healthcare technologies to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions and oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by IEEE Xplore and Medline/PubMed.

  • 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The Annual International Conference of the IEEE Engineering in Medicine and Biology Society covers a broad spectrum of topics from biomedical engineering and physics to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions, oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by PubMed and EI. Prop

  • 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2011 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc.

  • 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The general theme of EMBC'08 is "Personalized Healthcare through Technology", covering a broad spectrum of topics from biomedical and clinical engineering and physics to medical and clinical applications. Transfer of research results from academia to industry will also be a focus of the conference.

  • 2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)


2013 ICME International Conference on Complex Medical Engineering (CME)

The objective of CME 2013 is to provide a forum for researchers, educators,engineers, and government officials involved in the general areas of biomedical engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

  • 2012 ICME International Conference on Complex Medical Engineering (CME)

    The aim of the conference is to bring together researchers, engineers and practitioners from diverse fields to stimulate future research and development of new theory, approaches, and tools in the field of Complex Medical Engineering.

  • 2012 ICME International Conference on Complex Medical Engineering (CME)

    The objective of CME 2012 is to provide a forum for researchers, educators,engineers, and government officials involved in the general areas of biomedical engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

  • 2011 ICME International Conference on Complex Medical Engineering - CME 2011

    The objective of CME 2011 is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of biomedical engineering to disseminate their latest research results and exchange views on the future research directions of these fields.

  • 2010 ICME International Conference on Complex Medical Engineering - CME 2010

    TBD


2011 8th Intl. Symp. on Noninvasive Functional Source Imaging of the Brain & Heart and the 8th Intl. Conference on Bioelectromagnetism (NFSI & ICBEM)

All aspects of bioelectromagnetic field measurement and noninvasive functional imaging of the human body. Research tools include EEG/MEG source analyzers, fMRI, PET, SPECT, EIT and NIRS applied, for example, to cognition and to the neurological and psychiatric disorders of the brain and to the electromechanical coupling in the heart.

  • 2007 Joint Mtg. of the 6th Intl. Symp. on Noninvasive Functional Source Imaging & the Intl. Conf. on Functional Biomedical Imaging (NFSI & ICFBI)



Periodicals related to Conductivity

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Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Medical Imaging, IEEE Transactions on

Imaging methods applied to living organisms with emphasis on innovative approaches that use emerging technologies supported by rigorous physical and mathematical analysis and quantitative evaluation of performance.


Microwave Theory and Techniques, IEEE Transactions on

Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.


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Most published Xplore authors for Conductivity

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Xplore Articles related to Conductivity

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Comparison of DI and JI lateral IGBTs

Y. S. Huang; B. J. Baliga; S. Tandon; A. Reisman Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00991234.png)


Ultrafast thin disk lasers: Towards intralaser extreme nonlinear optics

T. Südmeyer; C. J. Saraceno; C. Schriber; A. Diebold; F. Emaury; M. Golling; A. Klenner; S. Schilt; U. Keller 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

Ultrafast thin disk lasers generate higher power levels than any other femtosecond oscillator technology. We review the current state of the art and give an outlook towards new applications such as intralaser extreme nonlinear optics.


Magnetic properties of the insulating state of the organic superconductor, /spl Beta/-[(CH/sub 3/)/sub 4/N][Pd(dmit)/sub 2/L/sub 2/

K. Seya; Y. Kobayashi; T. Nakarnura; T. Takahashi; Y. Osako; H. Kobayashi; R. Kato; A. Kobayashi; H. Iguchi International Conference on Science and Technology of Synthetic Metals, 1994

First Page of the Article ![](/xploreAssets/images/absImages/00835432.png)


Structural analysis of a prototype fast shutter for ITER cCXRS diagnostic

A. Panin; W. Biel; Y. Krasikov; O. Neubauer; D. Bardawil 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

Optical lifetime of the first mirror is a critical issue for the ITER upper port plug core charge exchange spectroscopy diagnostic (cCXRS). A fast shutter is engaged to protect the mirror from depositions between measurements. The prototype shutter will be examined in a test vacuum vessel that is now under development in the Forschungszentrum Jülich, Germany. Being located near the ...


Measuring P2P network topology through geo-location-aware distributed crawlers

Pratama Putra; Akihiro Nakao 8th Asia-Pacific Symposium on Information and Telecommunication Technologies, 2010

Network topology information of peer-to-peer applications is useful for examining their characteristics as well as defining an accurate model to simulate their behaviors. Unfortunately, dynamic behaviors of peers such as join and leave make it difficult to obtain the accurate network topology information. In this paper, we propose a method to accurately measure the topology of a Winny network even ...


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Educational Resources on Conductivity

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eLearning

Comparison of DI and JI lateral IGBTs

Y. S. Huang; B. J. Baliga; S. Tandon; A. Reisman Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00991234.png)


Ultrafast thin disk lasers: Towards intralaser extreme nonlinear optics

T. Südmeyer; C. J. Saraceno; C. Schriber; A. Diebold; F. Emaury; M. Golling; A. Klenner; S. Schilt; U. Keller 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

Ultrafast thin disk lasers generate higher power levels than any other femtosecond oscillator technology. We review the current state of the art and give an outlook towards new applications such as intralaser extreme nonlinear optics.


Magnetic properties of the insulating state of the organic superconductor, /spl Beta/-[(CH/sub 3/)/sub 4/N][Pd(dmit)/sub 2/L/sub 2/

K. Seya; Y. Kobayashi; T. Nakarnura; T. Takahashi; Y. Osako; H. Kobayashi; R. Kato; A. Kobayashi; H. Iguchi International Conference on Science and Technology of Synthetic Metals, 1994

First Page of the Article ![](/xploreAssets/images/absImages/00835432.png)


Structural analysis of a prototype fast shutter for ITER cCXRS diagnostic

A. Panin; W. Biel; Y. Krasikov; O. Neubauer; D. Bardawil 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

Optical lifetime of the first mirror is a critical issue for the ITER upper port plug core charge exchange spectroscopy diagnostic (cCXRS). A fast shutter is engaged to protect the mirror from depositions between measurements. The prototype shutter will be examined in a test vacuum vessel that is now under development in the Forschungszentrum Jülich, Germany. Being located near the ...


Measuring P2P network topology through geo-location-aware distributed crawlers

Pratama Putra; Akihiro Nakao 8th Asia-Pacific Symposium on Information and Telecommunication Technologies, 2010

Network topology information of peer-to-peer applications is useful for examining their characteristics as well as defining an accurate model to simulate their behaviors. Unfortunately, dynamic behaviors of peers such as join and leave make it difficult to obtain the accurate network topology information. In this paper, we propose a method to accurately measure the topology of a Winny network even ...


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IEEE-USA E-Books

  • Qualitative Study of the Shock Layer in Special Cases

    This chapter contains sections titled: Negligible Bulk Viscosity, Shear Viscosity, and Thermal Conductivity, Negligible Shear Viscosity and Thermal Conductivity, Negligible Electrical Conductivity and Current Inertia, Negligible Bulk Viscosity and Shear Viscosity, Magnetic Field Parallel to Plane of Shock Wave, "Swith-on" and "Swith-off" Shocks, Interpretation of the Results

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Bulk MOSFET

    This chapter focuses on the DC characteristics of bulk metal oxide semiconductor field???effect transistor (MOSFET), and presents a theoretical analysis of the subthreshold and post???threshold current characteristics as an aid to low???energy device design. In a short???channel bulk MOSFET, drain???induced barrier lowering (DIBL) near the source junction at the front interface significantly degrades the subthreshold swing (SS). Band???to???band tunneling often occurs in the gate???drain overlap region. It is sometimes called the gate???induced drain leakage (GIDL) current. For MOSFETs with a thin gate oxide, it has a significant influence on DC and AC operation. In the bulk MOSFET, the thermal conductivity of the substrate is not so high. According to simulations, the temperature near the drain junction quickly rises to 100?????C. Since self???heating effects degrade the surface mobility of carriers, they must be taken into account. In electrostatic???discharge (ESD) protection circuits, self???heating effects reduce the temperature margin for the second breakdown.

  • Space Charge in HVDC Extruded Insulation: Storage, Effects, and Measurement Methods

    This chapter discusses space-charge storage in HVDC extruded insulation, the relevant manifold effects, and the techniques developed by researchers in order to measure the amount and distribution of space charge stored in the insulation, and the electric field profile associated with such distribution. It reviews the theoretical background of charge injection and transport in insulating polymers. The chapter illustrates the processes that result in space-charge accumulation namely charge generation - via electronic charge injection, field-assisted thermal ionization of impurities, spatially inhomogeneous electric polarization, and steady DC current coupled with a spatially varying ratio ofpermittivity to conductivity. It also reviews the space-charge measurement methods for HVDC extruded insulation. The chapter focuses on the up-to-date developments of the best-suited techniques for measuring space charges in extruded insulation for HVDC cables. It provides a comparison between the best space-charge measurement methods for power cables: pulsed electro acoustic (PEA) versus thermal step method (TSM).

  • Magnetohydrodynamics Formulation

    Magnetohydrodynamics (MHD) was originally applied mostly to astrophysics and geophysics. In MHD the motion of collective charged particles is described by an electrically conducting fluid with the usual fluid dynamic variables of velocity, density and pressure or temperature. The interactions of fluid dynamics and electromagnetics are exclusively derived from the magnetic flux density. This chapter presents a systematic derivation of the governing equations of MHD. The first and foremost assumption for MHD formulation is that the physical phenomena are describable by macroscopic scales or in the framework of continuum mechanics. The electromagnetic waves are compound waves for which the compression and rarefaction components can coexist and the direct consequence of the nonconvexity of the ideal MHD equations. The chapter discusses additional computational simulations to show the lack of detailed plasma composition that is required for determining electric conductivity of plasma in the MHD formulation.

  • A New Class of Semiconductors Using Quantum Confinement of Silicon in a Dielectric Matrix

    This chapter contains sections titled: Introduction Proof of Concept Experimental Approach Requirements for Tandem Cells Mobility and Conductivity Doping Excitons Conclusions Acknowledgments References

  • Complex Permittivity of Propagating Media

    This chapter contains sections titled: Introduction Basic Mechanisms of the Propagating Material Permittivity of Permanent Polar Molecules Induced Dipole Moments Induced Dipole Response Function, G() Frequency Character of the Permittivity Kramers-Kronig Relations for Induced Moments Arbitrary Time Stimulus Conduction Electron Permittivity Conductivity Response Function Permittivity of Plasma Oscillations Permittivity Summary Empirical Permittivity Theory Applied to Empirical Permittivity Dispersion of a Signal Propagating through a Medium with Complex Permittivity Endnotes

  • Transforming an Effect into an Artifact: The Thermionic Valve

    This chapter contains sections titled: Claiming the Valve: Invented, Improved, and Litigated, New Effect in Edison's Laboratory (the ???Edison Effect???), Fleming's Early Research on the Edison Effect, Conceptualizing and Utilizing ???Unilateral Conductivity???, The Canonical Story about the Valve and Its Problems, Scientific and Corporate Contexts, 1903???04, Rectifiers, Photometry, and the ???Happy Thought???, Constructing the Use of the Valve, From Laboratory Effect to Technological Artifact

  • Mobility

    This chapter contains sections titled: Introduction Conductivity Mobility Hall Effect and Mobility Magnetoresistance Mobility Time-of-Flight Drift Mobility MOSFET Mobility Contactless Mobility Strengths and Weaknesses Appendix 8.1 Semiconductor Bulk Mobilities Appendix 8.2 Semiconductor Surface Mobilities Appendix 8.3 Effect of Channel Frequency Response Appendix 8.4 Effect of Interface Trapped Charge References Problems Review Questions

  • On the Field???Induced Insulator???Metal Transition in VO2 Films

    First???order metal???insulator transitions (MITs) in crystalline materials correspond to a transformation between states with a dielectric and metallic types of conductivity. These transitions occur under the influence of external parameters, such as temperature and pressure, as well as with varying material composition. Materials exhibiting these phenomena include many transition metal oxides. First???order metal insulator phase transitions in thin vanadium dioxide (VO2) films can be controlled by an applied electric field. This chapter discusses the conditions under which the transition can be induced in the entire film, rather than its top sliver. It shows that the favorable situation can be realized when the film is sufficiently thin, so that the energy cost of converting the entire film into the metallic phase is smaller than the would???be cost of creating a domain boundary between the two phases. The chapter argues that in thin enough films, the entire???film transition can be stabilized by the domain boundary energy.



Standards related to Conductivity

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Guide for In-Service Use, Care, Maintenance and Testing of Conductive Clothing for Use on Voltages up to 765 kV AC and 750 kV DC

This guide provides recommendations for the in-service visual inspection, use, care, maintenance, and electrical testing of conductive clothing, including suits, gloves, socks, and boots, for use during linework on voltages up to 765 kV ac and ±750 kV dc. Testing pertains only to nondestructive electrical tests that can be performed periodically to check if there is any reduction in the ...