Conferences related to Capacitors

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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Industrial Informatics, Computational Intelligence, Control and Systems, Cyber-physicalSystems, Energy and Environment, Mechatronics, Power Electronics, Signal and InformationProcessing, Network and Communication Technologies


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 15th International Workshop on Advanced Motion Control (AMC)

1. Advanced Motion Control2. Haptics, Robotics and Human-Machine Systems3. Micro/Nano Motion Control Systems4. Intelligent Motion Control Systems5. Nonlinear, Adaptive and Robust Control Systems6. Motion Systems for Robot Intelligence and Humanoid Robotics7. CPG based Feedback Control, Morphological Control8. Actuators and Sensors in Motion System9. Motion Control of Aerial/Ground/Underwater Robots10. Advanced Dynamics and Motion Control11. Motion Control for Assistive and Rehabilitative Robots and Systems12. Intelligent and Advanced Traffic Controls13. Computer Vision in Motion Control14. Network and Communication Technologies in Motion Control15. Motion Control of Soft Robots16. Automation Technologies in Primary Industries17. Other Topics and Applications Involving Motion Dynamics and Control


2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


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Periodicals related to Capacitors

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Capacitors

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Xplore Articles related to Capacitors

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Modularized Equalization Architecture with Voltage Multiplier-Based Cell Equalizer and Switchless Switched Capacitor Converter-Based Module Equalizer for Series-Connected Electric Double-Layer Capacitors

[{u'author_order': 1, u'affiliation': u'Faculty of Engineering, Ibaraki University, Hitachi, Ibaraki Japan 316-8511 (e-mail: uno.m@mx.ibaraki.ac.jp)', u'full_name': u'Masatoshi Uno'}, {u'author_order': 2, u'affiliation': u'Nippon Chemi Con Corp, 358625 Shinagawa-ku, Tokyo Japan (e-mail: k-yashi@nippon.chemi-con.co.jp)', u'full_name': u'Kazuki Yashiro'}, {u'author_order': 3, u'affiliation': u'Ibaraki University College of Engineering, 83901 Hitachi, Ibaraki Japan (e-mail: 17nm630a@vc.ibaraki.ac.jp)', u'full_name': u'Koki Hasegawa'}] IEEE Transactions on Power Electronics, None

This paper proposes a novel modular equalization architecture for series- connected electric double-layer capacitor (EDLC) modules, each consisting of multiple cells connected in series. Cell voltages in a module are equalized by an inductive voltage divider (IVD)-voltage multiplier (VM)-based cell equalizer while module voltages are unified by switched capacitor converters (SCCs). Square wave voltages generated at switching nodes of the ...


Evolution and Optimization of BEOL MOM Capacitors Across Advanced CMOS Nodes

[{u'author_order': 1, u'affiliation': u'GLOBALFOUNDRIES Singapore, 60Woodlands, Ind Park D, Street 2, 738406, Singapore', u'full_name': u'Jinglin Shi'}, {u'author_order': 2, u'affiliation': u'GLOBALFOUNDRIES Dresden, Wilschdorfer LandstraBe 101, Dresden, 01109, Germany', u'full_name': u'A. Sidelnicov'}, {u'author_order': 3, u'affiliation': u'GLOBALFOUNDRIES Singapore, 60Woodlands, Ind Park D, Street 2, 738406, Singapore', u'full_name': u'Kok Wai J. Chew'}, {u'author_order': 4, u'affiliation': u'GLOBALFOUNDRIES Singapore, 60Woodlands, Ind Park D, Street 2, 738406, Singapore', u'full_name': u'Mei See Chin'}, {u'author_order': 5, u'affiliation': u'GLOBALFOUNDRIES Singapore, 60Woodlands, Ind Park D, Street 2, 738406, Singapore', u'full_name': u'C. Schippel'}, {u'author_order': 6, u'affiliation': u'GLOBALFOUNDRIES Dresden, Wilschdorfer LandstraBe 101, Dresden, 01109, Germany', u'full_name': u'J. M. M. dos Santos'}, {u'author_order': 7, u'affiliation': u'GLOBALFOUNDRIES Dresden, Wilschdorfer LandstraBe 101, Dresden, 01109, Germany', u'full_name': u'F. Schlaphof'}, {u'author_order': 8, u'affiliation': u'GLOBALFOUNDRIES Dresden, Wilschdorfer LandstraBe 101, Dresden, 01109, Germany', u'full_name': u'L. Meinshausen'}, {u'author_order': 9, u'affiliation': u'Dept. of Electrical and Computer Engineering, University of Waterloo, Canada', u'full_name': u'John R. Long'}, {u'author_order': 10, u'affiliation': u'GLOBALFOUNDRIES Dresden, Wilschdorfer LandstraBe 101, Dresden, 01109, Germany', u'full_name': u'D. L. Harame'}] 2018 48th European Solid-State Device Research Conference (ESSDERC), None

Metal-oxide-metal (MOM) capacitors fabricated in CMOS back-end-of-line (BEOL) interconnect layers are widely used for advanced digital, RF and mm-wave applications. This paper describes the impact of CMOS scaling trends on key MOM figures of merit across advanced CMOS nodes. A methodology for maximizing the operating voltage by trading-off footprint for increased working voltage during MOM development is presented. In addition, ...


Failure Analysis of Multi-layer Ceramic Capacitors under Board Level Shock Environment

[{u'author_order': 1, u'affiliation': u'Beijing Innovation Center for Future Chips, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing, 100084, China', u'full_name': u'Jialu Li'}, {u'author_order': 2, u'affiliation': u'Beijing Innovation Center for Future Chips, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing, 100084, China', u'full_name': u'Jiahao Zhao'}, {u'author_order': 3, u'affiliation': u'Beijing Innovation Center for Future Chips, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing, 100084, China', u'full_name': u'Zheng You'}] 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), None

The possible failure modes of the multi-layer ceramic capacitor (MLCC) under board-level shock environment are studied through modeling, simulation and experiment. In this work, a finite element model is established to simulate the stress distribution. A Machete hammer test system is set up to measure the shock resistance of MLCC. It is indicated that pad peeling off, fracture of metal ...


Incipient Damage Detection for Large Area Structures Monitored With a Network of Soft Elastomeric Capacitors Using Relative Entropy

[{u'author_order': 1, u'affiliation': u'Department of Mechanical Engineering, University of South Carolina, Columbia, SC, USA', u'full_name': u'Austin Downey'}, {u'author_order': 2, u'affiliation': u'Department of Mechanical Engineering, Iowa State University, Ames, IA, USA', u'full_name': u'Mohammadkazem Sadoughi'}, {u'author_order': 3, u'affiliation': u'Department of Civil, Environmental, and Construction Engineering, Iowa State University, Ames, IA, USA', u'full_name': u'Simon Laflamme'}, {u'author_order': 4, u'affiliation': u'Department of Mechanical Engineering, Iowa State University, Ames, IA, USA', u'full_name': u'Chao Hu'}] IEEE Sensors Journal, 2018

Structural health monitoring of mesoscale structures is difficult due to their large sizes and often complex geometries. A solution to this challenge lies in the development of sensing skins. Sensing skins are an emerging technology that enables a broad range of sensors and their associated electronics to be integrated onto a single sheet, therefore, reducing the cost and complexity associated ...


Analysis of NBTI Degradation in nMOS-Capacitors and nMOSFETs

[{u'author_order': 1, u'affiliation': u'Microelectronics and Nanotechnology Division, Centre de Développement des Technologies Avancées (CDTA), 20 Août 1956, Baba Hassen, BP: 17, Algiers 16303, Algeria.', u'full_name': u'Abdelmadjid Benabdelmoumene'}, {u'author_order': 2, u'affiliation': u'Microelectronics and Nanotechnology Division, Centre de Développement des Technologies Avancées (CDTA), 20 Août 1956, Baba Hassen, BP: 17, Algiers 16303, Algeria.', u'full_name': u'Boualem Djezzar'}, {u'author_order': 3, u'affiliation': u'Microelectronics and Nanotechnology Division, Centre de Développement des Technologies Avancées (CDTA), 20 Août 1956, Baba Hassen, BP: 17, Algiers 16303, Algeria.', u'full_name': u'Amel Chenouf'}, {u'author_order': 4, u'affiliation': u'Microelectronics and Nanotechnology Division, Centre de Développement des Technologies Avancées (CDTA), 20 Août 1956, Baba Hassen, BP: 17, Algiers 16303, Algeria.', u'full_name': u'Boumediene Zatout'}, {u'author_order': 5, u'affiliation': u'LCMS, Faculty of Physics, University of Sciences and Technology (USTHB), BP 32 El-Alia, Algiers, Algeria.', u'full_name': u'Mohamed Kechouane'}] IEEE Transactions on Device and Materials Reliability, None

This paper presents a new attempt to more understand negative bias temperature instability (NBTI) stress in semiconductor devices. NBTI impact has been experimentally investigated on both p-substrate MOS (nMOS-capacitor) and nMOS transistors under accumulation condition, and new findings have been revealed. Indeed, nMOS-capacitor's flat band shift (VFB) under NBTI stress has disclosed that time exponent (n) and activation energy (Ea) ...


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Educational Resources on Capacitors

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No eLearning Articles are currently tagged "Capacitors"

IEEE-USA E-Books

  • Energy StoragePower Storage Super Capacitors

    This chapter contains sections titled: * Energy Storage and the Future for Renewable Energy Sources * Advantages of Energy Storage * Factors for Choosing Type and Rating of a Storage System * Nature of Support by Electricity Storage Systems * Load Density, Short-Circuit Capacity, and Storage of Energy * Photovoltaic Energy¿¿¿¿¿¿-¿¿¿¿¿¿PV Energy in Residential Applications * Maximum PV Penetration and Maximum Allowable Storage go Hand in Hand * Planning the Size of a Store for PV Inclusion in a Distribution System * Types of Storage Devices for PV Systems * Wind Energy * Storage Technologies * Determining the Size Storage for Wind Power * Control Modes for Stores and WTG * Energy Rating of Stores * Categories of Energy Storages * Appendix 16-1 A Supercapacitor * References

  • NonIdeal and NonClassical MOS Capacitors

    This chapter contains sections titled: * Introduction * Flat-Band Voltage * Inhomogeneous Substrate * Polysilicon Depletion Effect * Non-classical MOS Structures * MOS Capacitor With Stacked Gate * References

  • Resistors, Capacitors, and Inductors

  • Electrical Performance of Integrated Capacitors

  • Processing Integrated Capacitors

  • Dielectric Materials for Integrated Capacitors

  • Size and Configuration of Integrated Capacitors

  • High Temperature Performance of Polymer Film Capacitors

    The development of compact, thermally stable, high energy density, power conditioning capacitors has been identified to be one of the most difficult technological barriers in the design of high temperature electronic systems. High energy density capacitors are made of multiple, very thin layers of high dielectric constant insulating material. However, the polymer insulating films which are mechanically and electrically stable to the highest temperature, such as polyimide and teflon, also have the lowest dielectric constants and are the most difficult to make in very thin layers. This paper presents the collected results of research efforts to characterize and improve the high temperature performance of polymer capacitors. Temperature boundaries and the variation in dielectric properties with temperature and time are identified for a number of these films.

  • Electrical Characterization of Glass, Teflon, and Tantalum Capacitors at High Temperatures

    Dielectric materials and electrical components and devices employed in radiation fields and space environment are often exposed to elevated temperatures among other things. These systems must, therefore, withstand the high temperature exposure while still providing good electrical and other functional properties. In this work, experiments were carried out to evaluate glass, teflon, and tantalum capacitors for potential use in high temperature applications. The capacitors were characterized in terms of their capacitance and dielectric loss as a function of temperature up to 200 ¿¿C. At a given temperature, these properties were obtained in a frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed in a temperature range from 20 to 200 ¿¿C. The results obtained are discussed and conclusions are made concerning the suitability of the capacitors investigated for high temperature applications.

  • Power Conversion and Energy Storage Applications

    The fundamentals of power conversion, static power converters and power conversion applications are presented and discussed in this chapter. The need for integration of a short term energy storage device into a power conversion system is identified and selection of an appropriate energy storage device discussed. Ultra-capacitors and electrochemical batteries, as two major rivals are compared and the selection guide-line is given. Power conversion applications such as controlled electric drives, renewable sources (Wind, PV and Marine ?>current?> generator), power generation and transmission devices (STATCOM), home appliances, mobile diesel electric gen-sets, UPS, earth moving machines and traction drives are applications that require integration of a short term energy storage into the system. These applications and the energy storage integration techniques are discussed intensively case by case. Benefits and advantages of having integrated energy storage are also discussed.



Standards related to Capacitors

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Guide for Application and Specification of Harmonic Filters

Provide guidelines for the application and specification of passive shunt harmonic fileters for use on 50 and 60 Hz power systems at 216 volts and above.


IEEE Guide for Control of Small Hydroelectric Power Plants


IEEE Standard for Shunt Power Capacitors

This standard applies to capacitors rated 216V or higher, 2.5 kvar or more, and designed for shunt connection to alternating current transmission and distribution systems operating at a nominal frequency of 50 or 60 Hz.


IEEE Standard Requirements for Capacitor Switches for AC Systems (1 kV to 38 kV)

This standard applies to single- or multi-pole ac switches for rated maximum voltage above 1 kV to 38 kV for use in switching shunt capacitor banks (see the note in this clause). This standard covers the application of capacitive load switching wherein the capacitive loads are separated by sufficient inductance to limit the high-frequency transient-making peak current to the peak ...



Jobs related to Capacitors

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