Conferences related to Capacitors

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term inportance to the participating power electronics engineer.


2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

ICCAD serves EDA and Design professionals highlighting new challenges and innovative solutions for integrated circuit design technologies and systems. ICCAD covers the full range of CAD topics from device and circuit-level CAD up through system level CAD and embedded software as well as CAD for post CMOS design and novel application areas, such as biology and nanotechnology.

  • 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions and integrated circuit design technologies and systems. ICCAD covers the full range of CAD topics from device and circuit-level CAD up through system-level CAD and embedded software, as well as CAD for post-CMOS design and novel application areas, such as biology and nanotechnology.

  • 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of CAD topics from device and circuit-level CAD up through systemlevel CAD and embedded software, as well as CAD for post-CMOS design and novel application areas, such as biology and nanotechnology.

  • 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of traditional CAD topics; in addition, it also covers CAD for supporting post-CMOS design, as well as design automation for novel application areas, such as biology and nanotechnology.

  • 2009 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of traditional CAD topics; in addition, it also covers CAD for supporting post-CMOS design, as well as design automation for novel application areas, such as biology and nanotechnology. Original technical submissions on, but not limited to, the following topics are invited:

  • 2008 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    The premier conference on for electronic design technology

  • 2007 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)


2011 International Symposium on Electrical Insulating Materials (ISEIM)

The IEISIM 2011 provides opportunities to discuss technical issues around the dielectrics and electrical insulating materials, to exchange information about application of dielectrics and electrical insulating materials to the actual power apparatus, electronic equipment, etc., and to develop new technology related to dielectrics and electrical insulating materials.


1999 18th Capacitor and Resistor Technology Symposium (CARTS '99)


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Periodicals related to Capacitors

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.


Power Electronics, IEEE Transactions on

Fundamental technologies used in the control and conversion of electric power. Topics include dc-to- dc converter design, direct off-line switching power supplies, inverters, controlled rectifiers, control techniques, modeling, analysis and simulation techniques, the application of power circuit components (power semiconductors, magnetics, capacitors), and thermal performance of electronic power systems.



Most published Xplore authors for Capacitors

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Xplore Articles related to Capacitors

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IEEE Draft Standard for Definitions of High Voltage Circuit Breakers Above 1000 Vac and 3200 Vdc, and Reclosers and Other Distribution Equipment from 1000 Vac to 38,000 Vac

IEEE PC37.100.5/D2, February 2016, 2017

The terms and definitions in the standard are intended to encompass the products within the scope of the C37 series of power switchgear standards for high-voltage circuit breakers (above 1000 Vac and 3200 Vdc) and for reclosers and other distribution equipment (above 1000 Vac to 38,000 Vac) as used primarily in connection with generation, transmission, distribution, and conversion of electric ...


A 2.7-GHz digitally-controlled ring oscillator with supply sensitivity of 0.0014%-f<inf>DCO</inf>/1%-V<inf>DD</inf> using digital current-regulated tuning

Te Han; Weixin Gai 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

A method to reduce the supply voltage sensitivity of digitally-controlled ring oscillators (DCROs) using digital current-regulated tuning is presented. By regulating the supply current of ring oscillator instead of its supply voltage, the proposed technique overcomes the limitations of conventional voltage regulator, achieves high supply-noise rejection performance and digital tuning of current-regulated DCRO. The proposed DCRO system implemented in a ...


4 &#xd7; 4 matrix keyboard interface circuit achieved by single port lines

Zhiqi Lin; Xinrong Shi Electronics Letters, 2016

It is usual that eight pins is used to connect the single-chip with 4 × 4 matrix keyboard by the method of scanning. A method without any other active element is raised. Only one pin, four capacitors and four resistances are used to connect the single-chip with 4 × 4 matrix keyboard without any other chip and active element.


An evaluation of the DC-link capacitor heating in adjustable speed drive systems with different utility interface options

D. Rendusara; E. Cengelci; P. Enjeti; D. C. Lee Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual, 1999

In this paper, an evaluation of DC-link capacitor heating in adjustable speed drive systems with different utility interface options is presented. The evaluation is based on the level of ripple currents DC-link capacitors can endure that lead to self-heating and reduction of capacitors' operating life. Three popular utility interface options for ASD systems are considered for evaluation. First, a standard ...


Behaviour of series and parallel resonant inverters for induction heating in short-circuit conditions

E. J. Dede; J. Jordan; V. Esteve; J. M. Espi; S. Casans Proceedings IPEMC 2000. Third International Power Electronics and Motion Control Conference (IEEE Cat. No.00EX435), 2000

Series and parallel resonant inverters are the common structures in high power industrial generators for induction heating applications. In practical working conditions, short-circuiting of the heating coil is very common, producing normally overvoltages that can damage the power transistors of the inverter if no special precautions are taken. The aim of the paper is to show the mechanism of how ...


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Educational Resources on Capacitors

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eLearning

IEEE Draft Standard for Definitions of High Voltage Circuit Breakers Above 1000 Vac and 3200 Vdc, and Reclosers and Other Distribution Equipment from 1000 Vac to 38,000 Vac

IEEE PC37.100.5/D2, February 2016, 2017

The terms and definitions in the standard are intended to encompass the products within the scope of the C37 series of power switchgear standards for high-voltage circuit breakers (above 1000 Vac and 3200 Vdc) and for reclosers and other distribution equipment (above 1000 Vac to 38,000 Vac) as used primarily in connection with generation, transmission, distribution, and conversion of electric ...


A 2.7-GHz digitally-controlled ring oscillator with supply sensitivity of 0.0014%-f<inf>DCO</inf>/1%-V<inf>DD</inf> using digital current-regulated tuning

Te Han; Weixin Gai 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

A method to reduce the supply voltage sensitivity of digitally-controlled ring oscillators (DCROs) using digital current-regulated tuning is presented. By regulating the supply current of ring oscillator instead of its supply voltage, the proposed technique overcomes the limitations of conventional voltage regulator, achieves high supply-noise rejection performance and digital tuning of current-regulated DCRO. The proposed DCRO system implemented in a ...


4 &#xd7; 4 matrix keyboard interface circuit achieved by single port lines

Zhiqi Lin; Xinrong Shi Electronics Letters, 2016

It is usual that eight pins is used to connect the single-chip with 4 × 4 matrix keyboard by the method of scanning. A method without any other active element is raised. Only one pin, four capacitors and four resistances are used to connect the single-chip with 4 × 4 matrix keyboard without any other chip and active element.


An evaluation of the DC-link capacitor heating in adjustable speed drive systems with different utility interface options

D. Rendusara; E. Cengelci; P. Enjeti; D. C. Lee Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual, 1999

In this paper, an evaluation of DC-link capacitor heating in adjustable speed drive systems with different utility interface options is presented. The evaluation is based on the level of ripple currents DC-link capacitors can endure that lead to self-heating and reduction of capacitors' operating life. Three popular utility interface options for ASD systems are considered for evaluation. First, a standard ...


Behaviour of series and parallel resonant inverters for induction heating in short-circuit conditions

E. J. Dede; J. Jordan; V. Esteve; J. M. Espi; S. Casans Proceedings IPEMC 2000. Third International Power Electronics and Motion Control Conference (IEEE Cat. No.00EX435), 2000

Series and parallel resonant inverters are the common structures in high power industrial generators for induction heating applications. In practical working conditions, short-circuiting of the heating coil is very common, producing normally overvoltages that can damage the power transistors of the inverter if no special precautions are taken. The aim of the paper is to show the mechanism of how ...


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IEEE-USA E-Books

  • Loop Components

    This chapter contains sections titled: Phase Detector Voltage-Controlled Oscillator (VCO) Loop Filter Filter Reference Voltage Note on the Form of the Filter Equation Capacitors in Loop Filters Higher-Order Filters Appendix: Integrated Circuit Doubly Balanced Mixer - Details Appendix: Op-Amps in Loop Filters

  • No title

    Intended as an introduction to the field of biomedical engineering, this book covers the topics of biomechanics (Part I) and bioelectricity (Part II). Each chapter emphasizes a fundamental principle or law, such as Darcy's Law, Poiseuille's Law, Hooke's Law, Starling's Law, levers, and work in the area of fluid, solid, and cardiovascular biomechanics. In addition, electrical laws and analysis tools are introduced, including Ohm's Law, Kirchhoff's Laws, Coulomb's Law, capacitors, and the fluid/electrical analogy. Culminating the electrical portion are chapters covering Nernst and membrane potentials and Fourier transforms. Examples are solved throughout the book and problems with answers are given at the end of each chapter. A semester-long Major Project that models the human systemic cardiovascular system, utilizing both a Matlab numerical simulation and an electrical analog circuit, ties many of the book's concepts together. Table of Contents: Ohm's Law: Current, Voltage and Resistance / Kirchhoff's Voltage and Current Laws: Circuit Analysis / Operational Amplifiers / Coulomb's Law, Capacitors and the Fluid/Electrical Analogy / Series and Parallel Combinations / Thevenin Equivalent Circuits / Nernst Potential: Cell Membrane Equivalent Circuit / Fourier Transforms: Alternating Currents (AC)

  • No title

    Intended as an introduction to the field of biomedical engineering, this book covers the topics of biomechanics (Part I) and bioelectricity (Part II). Each chapter emphasizes a fundamental principle or law, such as Darcy's Law, Poiseuille's Law, Hooke's Law, Starling's Law, levers, and work in the area of fluid, solid, and cardiovascular biomechanics. In addition, electrical laws and analysis tools are introduced, including Ohm's Law, Kirchhoff's Laws, Coulomb's Law, capacitors, and the fluid/electrical analogy. Culminating the electrical portion are chapters covering Nernst and membrane potentials and Fourier transforms. Examples are solved throughout the book and problems with answers are given at the end of each chapter. A semester-long Major Project that models the human systemic cardiovascular system, utilizing both a Matlab numerical simulation and an electrical analog circuit, ties many of the book's concepts together.

  • AC???DC???AC Converters for Distributed Power Generation Systems

    The Chapter ???AC???DC???AC converters for distributed power generation systems??? is devoted to various topologies of AC???DC???AC converters and its components design. List of presented topologies are: classical three???phase/three???phase transistor???based AC???DC???AC converters (2???level and 3???level Diode Clamped Converters (DCC) and Flying Capacitors Converters (FCC)), and simplified AC???DC???AC converters (2???level and 3???level three???phase/one???phase and three???phase/three???phase DCC). All presented topologies are compared briefly.The space vector modulation and control algorithms are selected and described. Solutions for DC???link capacitors voltage balancing in DCC and flying capacitors voltage balancing in FCC are presented. Then, an approach related with controllers (machine side converter: flux, torque, and speed; grid???side converter: current, power, DC???link voltage) design are given. Finally, an improvement of power flow dynamics between machine???side converter and grid???side converter are proposed by active power feed???forward (APFF) loop. The APFF allows for 10 times reduction of the DC???link capacitance and provides better active power flow control accuracy in the AC???DC???AC converter. The laboratory results example is presented for control algorithm Direct Power and Torque Control with Space Vector Modulations of AC???DC???AC converter with APFF.

  • Electrical Characterization of Glass, Teflon, and Tantalum Capacitors at High Temperatures

    Dielectric materials and electrical components and devices employed in radiation fields and space environment are often exposed to elevated temperatures among other things. These systems must, therefore, withstand the high temperature exposure while still providing good electrical and other functional properties. In this work, experiments were carried out to evaluate glass, teflon, and tantalum capacitors for potential use in high temperature applications. The capacitors were characterized in terms of their capacitance and dielectric loss as a function of temperature up to 200 °C. At a given temperature, these properties were obtained in a frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed in a temperature range from 20 to 200 °C. The results obtained are discussed and conclusions are made concerning the suitability of the capacitors investigated for high temperature applications.

  • Recurrent Neural Networks

    This chapter considers a class of neural networks that have a recurrent structure, including Grossberg network, Hopfield network, and cellular neural networks. The Hopfield network is a form of recurrent artificial neural network invented by John Hopfield in 1982. It consists of a set of neurons and a corresponding set of unit time delays, formatting a multiple-loop feedback system. There are three components to the Grossberg network: Layer 1, Layer 2, and the adaptive weights. Layer 1 is a rough model of the operation of the retina, while Layer 2 represents the visual cortex. Cellular neural networks contain linear and nonlinear circuit elements, which typically are linear capacitors, linear resistors, linear and nonlinear controlled sources, and independent sources. The chapter also describes the mathematical model of a nonlinear dynamic system, and discusses some of the important issues involved in neurodynamics.

  • SeriesCompensated Line Protection

    This chapter contains sections titled: Introduction Faults with Unbypassed Series Capacitors Series Capacitor Bank Protection Relay Problems Due to Compensation Protection of Series Compensated Lines Line Protection Experience References Problems

  • Passive Components

    Passive components (resistors, capacitors, inductors, transformers) are of different relevance for the various applications of microelectronics. While digital CMOS can virtually sustain without any passives, their quality is crucial for the performance of radio-frequency (RF) transceivers, they outnumber the active devices and occupy much of the chip area in such integrated RF systems. In analog applications passive components with excellent linearity and minimum temperature coefficient are required. Besides those desired passive components there are also unwanted ones, i.e. the parasitics that are a consequence of device integration, which likewise need to be considered in a successful design of an integrated circuit.

  • Index

    No abstract.

  • Matrix Converter Fed MV Drives

    This chapter presents a relatively new type of medium voltage (MV) drives using a multi???module cascaded matrix converters (CMCs) topology. The matrix converter has a unique topology that performs direct AC to AC power conversion with a single power stage without a DC link that is normally required by the voltage source converter (VSC) and current source converter (CSC) fed drives. The classic matrix converter (MC) is a single???stage converter that converts power directly from three???phase AC inputs with a fixed voltage and frequency to three???phase AC outputs with a variable voltage and frequency. The chapter presents three???module and six???module CMC topologies for the MV drive; and provides typical output voltage waveforms and input current waveforms for these converters. The DC???link capacitor is costly and bulky since it should be medium???voltage film capacitor instead of low???voltage electrolytic capacitors that are commonly used in low???voltage drives.



Standards related to Capacitors

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Guide for Application and Specification of Harmonic Filters

Provide guidelines for the application and specification of passive shunt harmonic fileters for use on 50 and 60 Hz power systems at 216 volts and above.


IEEE Standard for Shunt Power Capacitors

This standard applies to capacitors rated 216V or higher, 2.5 kvar or more, and designed for shunt connection to alternating current transmission and distribution systems operating at a nominal frequency of 50 or 60 Hz.


IEEE Standard Requirements for Capacitor Switches for AC Systems (1 kV to 38 kV)

This standard applies to single- or multi-pole ac switches for rated maximum voltage above 1 kV to 38 kV for use in switching shunt capacitor banks (see the note in this clause). This standard covers the application of capacitive load switching wherein the capacitive loads are separated by sufficient inductance to limit the high-frequency transient-making peak current to the peak ...



Jobs related to Capacitors

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