Conferences related to Capacitors

Back to Top

2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 15th International Workshop on Advanced Motion Control (AMC)

1. Advanced Motion Control2. Haptics, Robotics and Human-Machine Systems3. Micro/Nano Motion Control Systems4. Intelligent Motion Control Systems5. Nonlinear, Adaptive and Robust Control Systems6. Motion Systems for Robot Intelligence and Humanoid Robotics7. CPG based Feedback Control, Morphological Control8. Actuators and Sensors in Motion System9. Motion Control of Aerial/Ground/Underwater Robots10. Advanced Dynamics and Motion Control11. Motion Control for Assistive and Rehabilitative Robots and Systems12. Intelligent and Advanced Traffic Controls13. Computer Vision in Motion Control14. Network and Communication Technologies in Motion Control15. Motion Control of Soft Robots16. Automation Technologies in Primary Industries17. Other Topics and Applications Involving Motion Dynamics and Control


2018 IEEE 18th International Power Electronics and Motion Control Conference (PEMC)

Promote and co-ordinate the exchange and the publication of technical, scientific and economic information in the field of Power Electronics and Motion Control with special focus on countries less involved in IEEE related activities. The main taget is to create a forum for industrial and academic community.

  • 2016 IEEE International Power Electronics and Motion Control Conference (PEMC)

    The IEEE Power Electronics and Motion Control (IEEE-PEMC) conference continues to be the oldest in Europe and is a direct continuation of the conferences held since 1970. Its main goal is to promote and co-ordinate the exchange and publication of technical, scientific and economic information on Power Electronics and Motion Control. One of its main objectives is the cooperation and integration between the long-time divided Western and Eastern Europe, this goal expressed in the conference logo, as well. The conference attracts now a large number (roughly 500+) of participants from the world. An exhibition is organised in parallel with every PEMC Conference, offering space for the industry to present their latest products for Power Electronics and Motion Control. In addition to the regular oral sessions, key notes, round tables, tutorials, workshops, seminars, exhibitions, the dialogue sessions (enlarged “poster” presentations) present to the speakers a better cooperation opportunity.

  • 2014 16th International Power Electronics and Motion Control Conference (PEMC)

    The purpose of the 16th International Power Electronics and Motion Control Conference and Exposition (PEMC) is to bring together researchers, engineers and practitioners from all over the world, interested in the advances of power systems, power electronics, energy, electrical drives and education. The PEMC seeks to promote and disseminate knowledge of the various topics and technologies of power engineering, energy and electrical drives. The PEMC aims to present the important results to the international community of power engineering, energy, electrical drives fields and education in the form of research, development, applications, design and technology. It is therefore aimed at assisting researchers, scientists, manufacturers, companies, communities, agencies, associations and societies to keep abreast of new developments in their specialist fields and to unite in finding power engineering issues.

  • 2012 EPE-ECCE Europe Congress

    Power Electronics and Motion Control.

  • 2010 14th International Power Electronics and Motion Control Conference (EPE/PEMC 2010)

    Semiconductor Devices and Packaging, Power Converters, Electrical Machines, Actuators, Motion Control, Robotics, Adjustable Speed Drives, Application and Design of Power Electronics circuits, Measurements, Sensors, Observing Techniques, Electromagnetic Compatibility, Power Electronics in Transportation, Mechatronics, Power Electronics in Electrical Energy Generation, Transmission and Distribution, Renewable Energy Sources, Active Filtering, Power Factor Correction

  • 2008 13th International Power Electronics and Motion Control Conference (EPE/PEMC 2008)

  • 2006 12th International Power Electronics and Motion Control Conference (EPE/PEMC 2006)


2018 IEEE International Conference on Power Electronics, Drives and Energy Systems (PEDES)

The conference will deal will all aspects of power electronics, motor drives and Power electronics applications to energy systems.


2018 IEEE PES Transmission & Distribution Conference and Exhibition - Latin America (T&D-LA)

The conference will focus on the current state of the art and lessons learned from techniques and practices developed by leading international companies and utilities.


More Conferences

Periodicals related to Capacitors

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


More Periodicals

Most published Xplore authors for Capacitors

Back to Top

Xplore Articles related to Capacitors

Back to Top

A Simple Method for Breakdown Voltage Measurements in Thin Films

S. Sapieha; M. R. Wertheimer; A. Yelon IEEE Transactions on Electrical Insulation, 1979

First Page of the Article ![](/xploreAssets/images/absImages/04080647.png)


Design and Experimental Evaluation of Fast Model Predictive Control for Modular Multilevel Converters

Zheng Gong; Peng Dai; Xibo Yuan; Xiaojie Wu; Guosheng Guo IEEE Transactions on Industrial Electronics, 2016

In recent years, modular multilevel converters (MMCs) are very popular in medium/high-voltage motor drive systems and high-voltage direct-current (HVDC) applications. The conventional model predictive control (MPC) strategies for the MMC are not practical due to their substantial calculation requirements, especially under high number of voltage levels. To solve this problem, a fast MPC strategy combined with a submodule (SM)-voltage sorting ...


A Three-Level Converter With Reduced Filter Size Using Two Transformers and Flying Capacitors

Duk-You Kim; Jae-Kuk Kim; Gun-Woo Moon IEEE Transactions on Power Electronics, 2013

This paper proposes a pulse-width modulation three-level converter with reduced filter size using two transformers. The proposed converter has many advantages. All switches sustain only the half of the input voltage and since the secondary rectified voltage is a three-level waveform, the output filter inductor can be reduced. Also, because of the power sharing of transformer and reduced output inductor, ...


Investigation of topologies for IGCT three-level inverter

Qiongxuan Ge; Yaohua Li; Li Kong 2008 IEEE International Conference on Industrial Technology, 2008

The integrated gate-commutated thyristor (IGCT) is a new device with low inductance and integrated gate-driver which is widely used in high power inverter. This paper presents the principle of IGCT clamping snubber, investigates several topologies with different turn-on clamping snubber for NPC three-level IGCT inverter and compares inverter topology with turn-off snubber to topology without turn-off snubber by a PSIM ...


Modular multilevel converters and HVDC/FACTS: A success story

Hans-Joachim Knaak Proceedings of the 2011 14th European Conference on Power Electronics and Applications, 2011

The first modular multilevel converter for HVDC application went operational in 2010. The Trans Bay Cable project transfers 400 MW of electrical power from Pittsburg, CA to the city of San Francisco, via a subsea cable of 88 km. It clearly demonstrated that the advantages of this technology are not only of theoretical nature, but can also be achieved in ...


More Xplore Articles

Educational Resources on Capacitors

Back to Top

eLearning

A Simple Method for Breakdown Voltage Measurements in Thin Films

S. Sapieha; M. R. Wertheimer; A. Yelon IEEE Transactions on Electrical Insulation, 1979

First Page of the Article ![](/xploreAssets/images/absImages/04080647.png)


Design and Experimental Evaluation of Fast Model Predictive Control for Modular Multilevel Converters

Zheng Gong; Peng Dai; Xibo Yuan; Xiaojie Wu; Guosheng Guo IEEE Transactions on Industrial Electronics, 2016

In recent years, modular multilevel converters (MMCs) are very popular in medium/high-voltage motor drive systems and high-voltage direct-current (HVDC) applications. The conventional model predictive control (MPC) strategies for the MMC are not practical due to their substantial calculation requirements, especially under high number of voltage levels. To solve this problem, a fast MPC strategy combined with a submodule (SM)-voltage sorting ...


A Three-Level Converter With Reduced Filter Size Using Two Transformers and Flying Capacitors

Duk-You Kim; Jae-Kuk Kim; Gun-Woo Moon IEEE Transactions on Power Electronics, 2013

This paper proposes a pulse-width modulation three-level converter with reduced filter size using two transformers. The proposed converter has many advantages. All switches sustain only the half of the input voltage and since the secondary rectified voltage is a three-level waveform, the output filter inductor can be reduced. Also, because of the power sharing of transformer and reduced output inductor, ...


Investigation of topologies for IGCT three-level inverter

Qiongxuan Ge; Yaohua Li; Li Kong 2008 IEEE International Conference on Industrial Technology, 2008

The integrated gate-commutated thyristor (IGCT) is a new device with low inductance and integrated gate-driver which is widely used in high power inverter. This paper presents the principle of IGCT clamping snubber, investigates several topologies with different turn-on clamping snubber for NPC three-level IGCT inverter and compares inverter topology with turn-off snubber to topology without turn-off snubber by a PSIM ...


Modular multilevel converters and HVDC/FACTS: A success story

Hans-Joachim Knaak Proceedings of the 2011 14th European Conference on Power Electronics and Applications, 2011

The first modular multilevel converter for HVDC application went operational in 2010. The Trans Bay Cable project transfers 400 MW of electrical power from Pittsburg, CA to the city of San Francisco, via a subsea cable of 88 km. It clearly demonstrated that the advantages of this technology are not only of theoretical nature, but can also be achieved in ...


More eLearning Resources

IEEE-USA E-Books

  • Index

    "Do you want to design a wireless transmitter or receiver for hand-held telephones? Have you wondered why the printed circuit wires on high-frequency circuits don't always run in a straight line? This valuable text will answer all of your questions regarding component parasitics and circuit characterization for rf/microwave amplifier, oscillator, and filter circuit design and analysis. You will understand why capacitors act as inductors and vice versa and why amplifiers work like oscillators, while oscillators for local area networks work more like local area heaters. Application of the information in Introduction to Microwave Circuits will reduce design-cycle time and costs, markedly increasing the probability of first-time success in printed circuit or monolithic microwave integrated circuit (MMIC) design. Several approaches are taken into consideration, such as the effects of currents on the ground plane, bypass and coupling capacitors, and nonlinear effects in linear cir uits. Featured topics include: * Incorporation of component parasitics in the design cycle * Closed form solution to oscillator design * Odd mode stability analysis * PIN diode analysis for high-power switching applications An integrated design example of a 1.25 GHz amplifier, oscillator, and filter printed circuit is also included, which could be useful in printed circuit board designs from tens of megahertz to tens of gigahertz. Introduction to Microwave Circuits provides the tools necessary to analyze or synthesize microwave circuits. This text is an essential reference for undergraduate students, microwave engineers, and administrators. Also, it will assist experienced designers in other fields to meet the current rapid expansion of communication system applications and work effectively in microwave circuit design. About the Author Robert J. Weber began his prolific career in the Solid State Research Laboratory at the Collins Rad o Company, later a part of Rockwell International. For 25 years, he worked on advanced development and applied research in the one- to ten-gigahertz frequency range and received several distinguished awards for his valuable contributions to the field. Dr. Weber is involved in ongoing experimental research in integrating microwave circuits with other devices such as MEMS, chemical sensors, and electro-optics. Also, he teaches microwave circuit design and fiber-optics communications at the Department of Electrical and Computer Engineering, Iowa State University. Dr. Weber is an IEEE Fellow." Sponsored by: IEEE Microwave Theory and Techniques Society.

  • About the Author

    "Do you want to design a wireless transmitter or receiver for hand-held telephones? Have you wondered why the printed circuit wires on high-frequency circuits don't always run in a straight line? This valuable text will answer all of your questions regarding component parasitics and circuit characterization for rf/microwave amplifier, oscillator, and filter circuit design and analysis. You will understand why capacitors act as inductors and vice versa and why amplifiers work like oscillators, while oscillators for local area networks work more like local area heaters. Application of the information in Introduction to Microwave Circuits will reduce design-cycle time and costs, markedly increasing the probability of first-time success in printed circuit or monolithic microwave integrated circuit (MMIC) design. Several approaches are taken into consideration, such as the effects of currents on the ground plane, bypass and coupling capacitors, and nonlinear effects in linear cir uits. Featured topics include: * Incorporation of component parasitics in the design cycle * Closed form solution to oscillator design * Odd mode stability analysis * PIN diode analysis for high-power switching applications An integrated design example of a 1.25 GHz amplifier, oscillator, and filter printed circuit is also included, which could be useful in printed circuit board designs from tens of megahertz to tens of gigahertz. Introduction to Microwave Circuits provides the tools necessary to analyze or synthesize microwave circuits. This text is an essential reference for undergraduate students, microwave engineers, and administrators. Also, it will assist experienced designers in other fields to meet the current rapid expansion of communication system applications and work effectively in microwave circuit design. About the Author Robert J. Weber began his prolific career in the Solid State Research Laboratory at the Collins Rad o Company, later a part of Rockwell International. For 25 years, he worked on advanced development and applied research in the one- to ten-gigahertz frequency range and received several distinguished awards for his valuable contributions to the field. Dr. Weber is involved in ongoing experimental research in integrating microwave circuits with other devices such as MEMS, chemical sensors, and electro-optics. Also, he teaches microwave circuit design and fiber-optics communications at the Department of Electrical and Computer Engineering, Iowa State University. Dr. Weber is an IEEE Fellow." Sponsored by: IEEE Microwave Theory and Techniques Society.

  • First- and Second-Order Circuits under Sinusoidal and Step Excitations

    This chapter contains sections titled: * Introduction * The First-Order _RC_ Low-Pass Filter (LPF) * The First-Order _RC_ High-Pass Filter (HPF) * Second-Order Circuits * Series RLC Second-Order Circuit * Second-Order Circuit in Sinusoidal Steady State: Bode Plots * Drawing the Second-Order Bode Plots Using Asymptotic Approximations * Summary * Further Reading * Problems

  • Prospects of Future Si Technologies in the Data¿¿¿Driven World

    The huge amount of information has a great impact on our daily lives, which can be filled with comfort, convenience, and safety by using and analyzing the so¿¿¿called big data. It is noteworthy that we can store, share, and utilize the huge amount of data with the aid of silicon (Si) technology; the novel Si technologies will be deployed to continuously enrich the data¿¿¿driven world of the future. This chapter reviews the evolution and prospects for the future Si technologies. The Si¿¿¿based memory and logic technologies have been successfully scaled down to 1X nm node. From the device point of view, all of the Si devices face no fundamental physical limitations down to sub¿¿¿10nm nodes. Practically, fabrication cost and manufacturability are of increasing concern. Patterning difficulties, as well as tight overlay and uniformity tolerances, will increase fabrication costs. Along with individual technology evolution, the convergence of various technologies will generate new areas of functional diversification.

  • Symmetries, Images, and Dielectrics

    The physical symmetries in a geometry description can be used to reduce the number of variables required for a given resolution model. Because of the physical and voltage symmetries of the geometry description, there is no need to include the extra equation to guarantee charge neutrality. The modeling procedure using images for the stripline and microstripline transmission lines is useful in that it produces numbers for the characteristic impedance and the line end fringing capacitance and allows us to model junctions of dissimilar lines. Any of the stripline or microstripline models (both without and with a dielectric) described in this chapter, especially the very high resolution of the two-dimensional cross-sectional calculation, can be used to examine the charge profile on the line(s). For a given material system and a given allowed cross-sectional area of the line, the power loss can be minimized by minimizing current bunching.

  • Power Management Technologies

    Semiconductor processes and packages are discussed in the second chapter. The physics of semiconductor devices like diodes and bipolar transistors is reviewed first. Then the chapter goes in to the process construction of bipolar, CMOS and DMOS transistors and passive components like resistors and capacitors in integrated circuits as well as popular packages for integrated circuits. In the second part of the chapter the process technology for modern MOSFET discrete transistors is reviewed both from silicon and package stand- point.

  • Passive Electrical Components

    This chapter contains sections titled: * Resistors * Capacitors * Inductors * Batteries * Active Components

  • Bypassing and Decoupling

    This chapter contains sections titled: * Review of Resonance * Physical Characteristics * Capacitors in Parallel * Power and Ground Plane Capacitance * Lead-Length Inductance * Placement * Selection of a Decoupling Capacitor * Selection of Bulk Capacitors * Designing a Capacitor Internal to a Component's Package * Vias and Their Effects in Solid Power Planes * References

  • HVDC technology overview

    The chapter first provides an introduction for the technology of both converter technologies and the system aspects, as well as the transmission line technology. It then focuses on the technology of point-to-point connections. Two types of high-voltage direct current (HVDC) technologies, namely, line commutated converters (LCC) and voltage source converters (VSC- HVDC), are described in the chapter. For both technologies, the relevant components in the system are described: the converter, transformers, filters, overhead lines and cables. The aim of the alternate-arm converter (AAC) is to reduce the number of cells, hence the volume and losses of the converter station. Operation of converters produces harmonic current and DC voltage ripples on one terminal which can propagate further into the DC network to other terminal. It is important to consider the transient voltage variation constraint when the size of the DC capacitors is selected.

  • Technology Development

    Chapter 1 provides a detailed description of IBM's Silicon Germanium BiCMOS technology development program. This family of technologies provides high- performance SiGe HBTs combined with advanced CMOS enablement, and a variety of advanced passive devices critical for realizing an integrated AMS SoCs. The technologies have been utilized by internal and external customers through IBM's foundry offerings to produce ICs in a wide-ranging variety of applications - as discussed throughout the book. This chapter also reviews the IBM process development and integration methodologies, as well as the device characteristics. The discussions described how the development and device selection was geared towards usage in mixed-signal IC development. Key points brought out in this chapter include: * The development of active devices, namely NPN bipolars and FETs. * The development of advanced passive devices - such as resistors, capacitors, and inductors - as well as ESD protection devices. * Overview of many of the issues in process integration, including manufacturing - namely predictability, reliability, and yield. * Discussion of the technology implications of the different implementation choices.



Standards related to Capacitors

Back to Top

Guide for Application and Specification of Harmonic Filters

Provide guidelines for the application and specification of passive shunt harmonic fileters for use on 50 and 60 Hz power systems at 216 volts and above.


IEEE Standard for Shunt Power Capacitors

This standard applies to capacitors rated 216V or higher, 2.5 kvar or more, and designed for shunt connection to alternating current transmission and distribution systems operating at a nominal frequency of 50 or 60 Hz.


IEEE Standard Requirements for Capacitor Switches for AC Systems (1 kV to 38 kV)

This standard applies to single- or multi-pole ac switches for rated maximum voltage above 1 kV to 38 kV for use in switching shunt capacitor banks (see the note in this clause). This standard covers the application of capacitive load switching wherein the capacitive loads are separated by sufficient inductance to limit the high-frequency transient-making peak current to the peak ...



Jobs related to Capacitors

Back to Top