Conferences related to Capacitors

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term inportance to the participating power electronics engineer.


2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

ICCAD serves EDA and Design professionals highlighting new challenges and innovative solutions for integrated circuit design technologies and systems. ICCAD covers the full range of CAD topics from device and circuit-level CAD up through system level CAD and embedded software as well as CAD for post CMOS design and novel application areas, such as biology and nanotechnology.

  • 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions and integrated circuit design technologies and systems. ICCAD covers the full range of CAD topics from device and circuit-level CAD up through system-level CAD and embedded software, as well as CAD for post-CMOS design and novel application areas, such as biology and nanotechnology.

  • 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of CAD topics from device and circuit-level CAD up through systemlevel CAD and embedded software, as well as CAD for post-CMOS design and novel application areas, such as biology and nanotechnology.

  • 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of traditional CAD topics; in addition, it also covers CAD for supporting post-CMOS design, as well as design automation for novel application areas, such as biology and nanotechnology.

  • 2009 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    ICCAD serves EDA and design professionals, highlighting new challenges and innovative solutions for Integrated Circuit Design Technologies and Systems. ICCAD covers the full range of traditional CAD topics; in addition, it also covers CAD for supporting post-CMOS design, as well as design automation for novel application areas, such as biology and nanotechnology. Original technical submissions on, but not limited to, the following topics are invited:

  • 2008 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

    The premier conference on for electronic design technology

  • 2007 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)


2011 International Symposium on Electrical Insulating Materials (ISEIM)

The IEISIM 2011 provides opportunities to discuss technical issues around the dielectrics and electrical insulating materials, to exchange information about application of dielectrics and electrical insulating materials to the actual power apparatus, electronic equipment, etc., and to develop new technology related to dielectrics and electrical insulating materials.


1999 18th Capacitor and Resistor Technology Symposium (CARTS '99)


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Periodicals related to Capacitors

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.


Power Electronics, IEEE Transactions on

Fundamental technologies used in the control and conversion of electric power. Topics include dc-to- dc converter design, direct off-line switching power supplies, inverters, controlled rectifiers, control techniques, modeling, analysis and simulation techniques, the application of power circuit components (power semiconductors, magnetics, capacitors), and thermal performance of electronic power systems.



Most published Xplore authors for Capacitors

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Xplore Articles related to Capacitors

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A Low Noise CMOS Preamplifier for Quartz-Based Gyro-Meter

M. Zhang; N. Llaser 2007 14th IEEE International Conference on Electronics, Circuits and Systems, 2007

In this paper, a low noise preamplifier used for a quartz-based gyro-meter is proposed. The preamplifier is based on charge amplifier. Unlike a traditional charge amplifier, which needs a high value of feedback resistance to stabilize its operation, the stability of the proposed preamplifier is ensured by resetting of the feedback capacitor periodically. As a result, the proposed preamplifier is ...


Discrete Models of Slow Voltage Dynamics for Under Load Tap-Changing Transformer Coordination

Juraj Medanic; Marija Ilic-Spong; John Christensen IEEE Power Engineering Review, 1987

First Page of the Article ![](/xploreAssets/images/absImages/05526889.png)


Fast Resonant Extraction from the CERN SPS

K. H. Kissler; J. Riche; W. Scandale; G. Schroder IEEE Transactions on Nuclear Science, 1979

Two different modes of fast resonant extraction are used at the SPS: non- coherent half-integer extraction with a spill duration from 1 ms to 3 ms and coherent half-integer extraction with a spill duration from about 70 μs (two 23 μs bursts separated by a 23 μs interval) to 1 ms. A special requirement is to stop a 2 ms ...


Single-stage AC-DC converter with PFC based on continuous input current charge-pump topologies

Cícero S. Postiglione; André L. Fuerback; Claudinor B. Nascimento; Arnaldo J. Perin 2009 Brazilian Power Electronics Conference, 2009

This paper presents a single-stage power factor corrected (PFC) AC-DC converter. The topology is based on CIC-CPPFC (continuous input current charge-pump power factor correction) technique, achieving continuous conduction mode (CCM) input current with high power factor by using a coupled inductor, meeting IEC 61000-3-2 regulations for wide load range without additional input filter. Two different switching laws are tested. The ...


Design and fabrication of a MEMS capacitive chemical sensor system

V. Saxena; T. J. Plum; J. R. Jessing; R. Jacob Baker 2006 IEEE Workshop on Microelectronics and Electron Devices, 2006. WMED '06., 2006

This paper describes the development of a MEMS sensor system to detect volatile compounds. The sensor consists of a MEMS capacitive sensor element monolithically integrated with a sensing circuit. The sensor element is a parallel plate capacitor using a chemically sensitive polymer as the dielectric. In presence of the target analyte, the polymer swells and changes the capacitance of the ...


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Educational Resources on Capacitors

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eLearning

A Low Noise CMOS Preamplifier for Quartz-Based Gyro-Meter

M. Zhang; N. Llaser 2007 14th IEEE International Conference on Electronics, Circuits and Systems, 2007

In this paper, a low noise preamplifier used for a quartz-based gyro-meter is proposed. The preamplifier is based on charge amplifier. Unlike a traditional charge amplifier, which needs a high value of feedback resistance to stabilize its operation, the stability of the proposed preamplifier is ensured by resetting of the feedback capacitor periodically. As a result, the proposed preamplifier is ...


Discrete Models of Slow Voltage Dynamics for Under Load Tap-Changing Transformer Coordination

Juraj Medanic; Marija Ilic-Spong; John Christensen IEEE Power Engineering Review, 1987

First Page of the Article ![](/xploreAssets/images/absImages/05526889.png)


Fast Resonant Extraction from the CERN SPS

K. H. Kissler; J. Riche; W. Scandale; G. Schroder IEEE Transactions on Nuclear Science, 1979

Two different modes of fast resonant extraction are used at the SPS: non- coherent half-integer extraction with a spill duration from 1 ms to 3 ms and coherent half-integer extraction with a spill duration from about 70 μs (two 23 μs bursts separated by a 23 μs interval) to 1 ms. A special requirement is to stop a 2 ms ...


Single-stage AC-DC converter with PFC based on continuous input current charge-pump topologies

Cícero S. Postiglione; André L. Fuerback; Claudinor B. Nascimento; Arnaldo J. Perin 2009 Brazilian Power Electronics Conference, 2009

This paper presents a single-stage power factor corrected (PFC) AC-DC converter. The topology is based on CIC-CPPFC (continuous input current charge-pump power factor correction) technique, achieving continuous conduction mode (CCM) input current with high power factor by using a coupled inductor, meeting IEC 61000-3-2 regulations for wide load range without additional input filter. Two different switching laws are tested. The ...


Design and fabrication of a MEMS capacitive chemical sensor system

V. Saxena; T. J. Plum; J. R. Jessing; R. Jacob Baker 2006 IEEE Workshop on Microelectronics and Electron Devices, 2006. WMED '06., 2006

This paper describes the development of a MEMS sensor system to detect volatile compounds. The sensor consists of a MEMS capacitive sensor element monolithically integrated with a sensing circuit. The sensor element is a parallel plate capacitor using a chemically sensitive polymer as the dielectric. In presence of the target analyte, the polymer swells and changes the capacitance of the ...


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IEEE-USA E-Books

  • Power Distribution Fidelity of Wirebond Compared to FlipChip Devices in Grid Array Packages

    We have simulated the power fidelity of wirebond and flip chip grid array packages suitable for next generation microprocessors. The DC power droop across the chip from resistive losses and the AC power noise from switching events were studied as a function of the number of package power planes, dielectric constant. the number of chip connections, decoupling capacitors and their location.

  • MOSFET Transistors

    This chapter contains sections titled: Principles of Operation: Long-Channel Transistors Threshold Voltage in MOS Transistors Parasitic Capacitors in MOS Transistors Device Scaling: Short-Channel MOS Transistors Summary References Exercises

  • Size and Configuration of Integrated Capacitors

    This chapter contains sections titled: Comparison of Integrated and Discrete Areas Layout Options Tolerance Mixed Dielectric Strategies CV Product Maximum Capacitance Density and Breakdown Voltage References

  • Interface DC-DC Converters

    In this chapter, interface dc-dc converters for ultra-capacitor energy storage applications are discussed. The background of dc-dc power conversion is given and different converter concepts and topologies are briefly compared. Topology selection process and guideline are given. The theoretical background of two- cell interleaved dc-dc converters is given. The operating principle is described in detail. The analysis is then extended to a general N-cell interleaved dc-dc interface converter. The converter's main parameters, such as the output current ripple and the dc bus current ripple, are analyzed and the solution is given as closed form equations. To give practical value to this chapter, the converter design procedure is discussed in great detail. The design and selection of passive components, such as the output filter inductor and coupling transformer (ICT), the dc bus capacitor and output filter capacitor, are described step by step. The selection process of power semiconductors is also addressed step by step. At the end of the chapter, thermal management of power converters is discussed in general. The origin of the conversion losses and the loss mechanisms in power semiconductors, transformers, inductors, and capacitors is fully addressed. With the theoretical analysis, practical examples, and exercises presented, this chapter gives a clear overview of how to select and design an interface dc-dc converter for ultra-capacitor energy storage applications.

  • Opening Switches

    Opening switches are critical components for inductive storage systems and also find applications in pulse compression and power distribution systems. Inductive storage systems are very attractive because the stored energy density is orders of magnitude larger than can be stored in capacitors. This chapter shows a typical schematic of an inductive energy storage device. The key to unlocking the potential of inductive energy storage is the opening switch, and numerous opening switch concepts have been proposed for singleshot operation. Repetitive operation of opening switches would impose additional design requirements for efficient heat removal. The chapter discusses the basic concepts and principal features of various opening switch configurations. The overall efficiency of an opening switch in an inductive energy storage system is determined by conduction time and opening time of the switch, the trigger sources for opening and closing the switch, and the rate at which the dielectric recovers its electrical strength.

  • Power Rail Segmentation and Deployment

    Power supply rails, often simply referred as power rails, for road???powered electric vehicles (RPEVs) are often segmented like the conventional iron rails. We do not want to turn on the power rail with no running EVs on it and we want to turn on the power rail only for providing wireless power to EVs. There are a few power rail segmentation methods, mainly developed by Chun T. Rim, which will be introduced in this chapter.New cross???segmented power supply rails for RPEVs are explained in this chapter for reducing the construction cost and EMF. The proposed rail consists of two pairs of power cables, core, bidirectional power switches, a transformer, capacitors, and harness. Each rail is connected through a switch box, which can change the current direction of a pair of power cables. Hence, adding the current of the two pairs of power cables results in the activation mode while nullifying the current performs the silence mode. A coupling transformer with two capacitors is introduced to compensate for the variable line inductance of the rail due to the change of current direction. Therefore, multiple rails can be concurrently activated by selective turning the power switches on and off using an inverter. In addition, the EMF for the silence mode is drastically reduced if a twisted pair of power cables and copper nets are used, so that the ICNIRP Guideline 6.25 ??T at 20 kHz operating frequency can be met. The proposed cross???segmented power supply rail was implemented for experiments and verified for practical applications.This chapter is based on the paper by S. Choi, J. Huh, S. Lee, and C.T. Rim, ???New cross???segmented power supply rails for road powered electric vehicles,??? IEEE Trans. on Power Electronics, vol. 28, no. 12, pp. 5832???5841, December 2013.

  • Voltage and Capacitance

    This chapter contains sections titled: Introduction Charges and Electrons The Electric Force Field Field Representations The Definition of Voltage Equipotential Surfaces The Electric Force Field between Two Conducting Plates Electric Field Patterns The Energy Stored in an Electric Field Dielectrics The D Field Capacitance Mutual Capacitance Displacement Current Energy Stored in a Capacitor Forces in the Electric Field Capacitors

  • Review of Generator???converter Configurations for Wecs

    This chapter discusses the basics for wind energy and examines enough background to select wind generator???power converter configuration for modeling and predictive control. Power converters in first generation of wind turbines (WTs) (Type 1) are used only for smooth grid connections, which are disconnected from the circuit once the generator is tied to the grid. Power converters that are identical on the generator???side and grid???side and are linked through a DC link are classified as back???to???back (BTB) connected converters. Parallel power converters increase power handling capacity but with the drawbacks of circulating currents and the subsequent power converter derating. The semiconductor device switching frequency is limited to few hundred hertz to minimize the switching losses and allow proper heat dissipation. The minimization of AC circulating currents and balancing of capacitors voltage between submodules is required to ensure the proper operation of the modular multilevel converter (MMC).

  • Processing Integrated Capacitors

    This chapter contains sections titled: Sputtering CVD, PECVD and MOCVD Anodization Sol-Gel and Hydrothermal Ferroelectrics Thin- and Thick-Film Polymers Thick-Film Dielectrics Interlayer Insulation Interdigitated Capacitors Capacitor Plate Materials Trimming Integrated Capacitors Commercialized Integrated Capacitor Technologies Summary References

  • Tail Current Noise Suppression in RF CMOS VCOs

    This paper presents the experimental results of two different techniques, inductive degeneration and capacitive filtering, for reducing the phase noise in tail-biased RF CMOS voltage-controlled oscillators (VCOs). Both techniques prevent the low-frequency tail current noise from being converted into phase noise. The techniques are applied to two distinct VCO designs, showing that the largest phase noise reduction (up to 6-7 dB at 3-MHz offset frequency from the carrier) is achieved via inductive degeneration. Capacitive filtering, however, also substantially reduces the phase noise at high offset frequencies and may therefore become a valid alternative to inductive degeneration, as discrete capacitors are or more common use than discrete inductors.



Standards related to Capacitors

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Guide for Application and Specification of Harmonic Filters

Provide guidelines for the application and specification of passive shunt harmonic fileters for use on 50 and 60 Hz power systems at 216 volts and above.


IEEE Standard for Shunt Power Capacitors

This standard applies to capacitors rated 216V or higher, 2.5 kvar or more, and designed for shunt connection to alternating current transmission and distribution systems operating at a nominal frequency of 50 or 60 Hz.


IEEE Standard Requirements for Capacitor Switches for AC Systems (1 kV to 38 kV)

This standard applies to single- or multi-pole ac switches for rated maximum voltage above 1 kV to 38 kV for use in switching shunt capacitor banks (see the note in this clause). This standard covers the application of capacitive load switching wherein the capacitive loads are separated by sufficient inductance to limit the high-frequency transient-making peak current to the peak ...



Jobs related to Capacitors

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