Accelerated Testing

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Conferences related to Accelerated Testing

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2013 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)


2013 IEEE International Reliability Physics Symposium (IRPS)

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Reliability studies and applications related to physics in the areas of electronics and solar


2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012)

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Devoted to fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield\, especially those related to advanced process technologies.

  • 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011)

    IPFA 2011 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies

  • 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010)

    Devoted to fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies

  • 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009)

    The 16th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter in co-operation with IEEE Nanjing Section in China. The Symposium is technically co-sponsored by the IEEE Electron Device Society, IEEE Reliability Society.

  • 2008 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008)

    IPFA 2008 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.

  • 2007 14th International Symposium on Physical & Failure Analysis of ICs (IPFA 2007)

    The Symposium is devoted to the fundamental understanding of the physical mechanisms of device failures and issues related to device reliability, especially those related to advanced process technologies.


2012 6th International Conference on Software Security and Reliability (SERE)

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Focuses on software security\, safety\, reliability\, and quality assurance for researchers and practitioners to exchange ideas and best-of-breed practices for developing trustworthy software in a more effective and efficient way.


2012 IEEE International Integrated Reliability Workshop (IIRW)

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The IRW focuses on ensuring electronic device reliability through fabrication\, design\, testing\, characterization\, and simulation\, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.


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Xplore Articles related to Accelerated Testing

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  • Software reliability accelerated testing based on the combined testing method

    Erqiang Feng; Chang Liu; Jun Zheng Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on, 2011

    For increasing the effectiveness and efficiency of the software reliability testing, a two-stage combined software reliability accelerated testing is proposed. The combined testing method combines representative testing and directed testing, and it is able to test some operations or program modules with low operation frequency to satisfy the coverage criteria if the number of the test cases is the same ...

  • Statistical analysis of accelerated experiments in mechanics using a mechanical accelerated life model

    Tebbi, O.; Guerin, F.; Dumon, B. Reliability and Maintainability Symposium, 2003. Annual, 2003

    Accelerated testing of mechanical products offers great potential for development in reliability life testing. Unfortunately, difficulties met in accelerated life testing have limited its applications and acceptance. This paper presents a discussion of the different approaches to accelerate life of mechanical materials. The importance of failure mechanism models and the separate treatment of failure mechanisms during accelerated life tests are ...

  • Software reliability accelerated testing method based on mixed testing

    Yumei Wu; Yongqi Zhang; Minyan Lu Reliability and Maintainability Symposium (RAMS), 2010 Proceedings - Annual, 2010

    This study is conducted by solving these four key questions: the key points of the whole testing process; the data and information to be collected during the testing process; the model to estimate the software reliability; the verification of the testing method and the estimation model. Software reliability accelerated testing (SRAT) based on mixed testing is proposed. SRAT increases the ...

  • On the life prediction and accelerated testing of solder joints

    Zhengfang Qian; Sheng Liu Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on, 1998

    Summary form only given. A critical review of the life prediction and accelerated testing of solder joints, including the role of constitutive modeling and the factors of accelerated testing, is presented in this paper. As a perfect example, a Ford solder joint specimen was used to investigate accelerated testing factors under various accelerated testing conditions in terms of thermal fatigue ...

  • Accelerated testing of Shaft Seals as components with complex failure modes

    Klein, B.; Kirschmann, D.; Haas, W.; Bertsche, B. Reliability and Maintainability Symposium (RAMS), 2010 Proceedings - Annual, 2010

    Radial Shaft Seals (RSS) are widely used in all fields of mechanical engineering for sealing of rotating elements. Up to now there has been no possibility to include Radial Shaft Seals adequately into the lifetime calculation of mechanical systems. In this paper the difficulties in accelerated life testing of RSS are presented and discussed. First of all, this involves the ...

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Jobs related to Accelerated Testing

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Software Test Engineer Qualcomm, Inc.
Software Test Manager (Seattle, WA) Qualcomm, Inc.
Software Test Engineer - Sensors Qualcomm, Inc.
Quality Assurance & Testing Engineer -- Consumer Electronics (consumer product testing and eval) Company Confidential
Electrical Engineer - Cable Assemblies - Automated Production Testing Molex
Staff Engineer/Manager - Validation of WLAN Products (Wi-Fi testing) Qualcomm, Inc.
Server Software Test Engineer - Austin, TX Qualcomm, Inc.
Software Test Engineer Positions @ Qualcomm : Experienced SW Test & Integration Eng - Apply Here Qualcomm, Inc.
Software Test - Microprocessor Characterization and Test Engineer - Raleigh, NC (RTP) Qualcomm, Inc.
Software Test Engineer Positions @ Qualcomm : New Grad SW Test & Integration Eng - Apply Here Qualcomm, Inc.
Electrical Engineer I (Contract) Textron
Electrical Engineer, Staff Roche
Electrical Engineer, Staff Ventana
Electrical Engineer Roche
Electrical Engineer Ventana
Verification CAD Engineer Qualcomm, Inc.
Software Engineer/Software Developer ODVA, Inc.
Staff display test engineer Qualcomm, Inc.
Reliability Device Physics Lead Qualcomm, Inc.
Hyderabad Careers for Senior Engineering Professionals - Sr. Staff / Principal / Director Qualcomm, Inc.
Security Architect / Design Engineer (Raleigh, NC) Qualcomm, Inc.
Security Architect / Design Engineer (Austin, TX) Qualcomm, Inc.
Multimedia Display SW Engineer Qualcomm, Inc.
Engineering Manager-Industrial Network Technology ODVA, Inc.
Project Analyst Qualcomm, Inc.

Educational Resources on Accelerated Testing

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  • Fuzzy Cluster Analysis in Very Large Data Sets

    Bezdek, James C. Fuzzy Cluster Analysis in Very Large Data Sets, 2009

    This last module in the series discusses just one approach to the interesting and important problem of clustering in very large (VL) data. The target audience is graduate students majoring in engineering and science, and practicing engineers and scientists interested in either research about or applications of clustering applied to very large real world problems that occur in data mining, ...

Standards related to Accelerated Testing

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Periodicals related to Accelerated Testing

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  • Electron Devices, IEEE Transactions on

    Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.

  • Reliability, IEEE Transactions on

    Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.