Manufacturability Improvement

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Conferences related to Manufacturability Improvement

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2013 IEEE Applied Power Electronics Conference and Exposition - APEC 2013

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APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term inportance to the participating power electronics engineer.


2013 IEEE International Conference on Mechatronics (ICM)

ICM 2013 aims at providing a multidisciplinary forum between researchers from industry and academia to discuss state-of-the-art topics in mechatronics and present recent research results and prospects for development in this evolving area.

  • 2011 IEEE International Conference on Mechatronics (ICM)

    Mechatronics is defined as the synergistic integration of mechanics, electronics and information processing, which is mostly performed by embedded computer control systems . This evolutionary development in industrial design and manufacturing also brings new goals and challenges that need to be addressed for the effective use of the technology in many new products and systems in the future. Following the success of previous ICMs, the biennial IEEE International Conference on Mechatronics, ICM 2011 aims

  • 2009 IEEE International Conference on Mechatronics (ICM)


2013 IEEE International Reliability Physics Symposium (IRPS)

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Reliability studies and applications related to physics in the areas of electronics and solar


2012 13th International Symposium on Quality Electronic Design (ISQED)

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The International Symposium on Quality Electronic Design (ISQED) the premier Electronic Design conference bridges the gap between Electronic/Semiconductor ecosystem members providing electronic design tools\, integrated circuit technologies\, semiconductor technology\,packaging\, assembly & test to achieve design quality.

  • 2011 International Symposium on Quality Electronic Design (ISQED)

    ISQED is a premier Design & Design Automation conference bridges the gap between electronic design tools and processes\, integrated circuit technologies\, processes & manufacturing\, to achieve design quality. ISQED is the leading conference for design for manufacturability (DFM) and quality (DFQ) issues. It provides a forum to exchange ideas and promote research\, development\, and application of design techniques & methods\, design processes\, and EDA design methodologies and tools that address issues which impa

  • 2010 11th International Symposium on Quality of Electronic Design (ISQED)

    ISQED is the pioneer and leading conference dealing with design for manufacturability and quality issues, front to back.

  • 2009 10th International Symposium on Quality of Electronic Design (ISQED)

    The International Symposium on Quality Electronic Design (ISQED), is a premier Design & Design Automation conference, aimed at bridging the gap between and integration of, electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer and leading conference dealing with design for manufacturability and quality issues, front to back. The conference provides a forum to present and exchange ideas and to promote the research, de

  • 2008 9th International Symposium on Quality of Electronic Design (ISQED)

    The International Symposium on Quality Electronic Design (ISQED), is a premier Design & Design Automation conference, aimed at bridging the gap between and integration of, electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer and leading conference dealing with design for manufacturability and quality issues, front to back. The conference provides a forum to present and exchange ideas and to promote the research.


2012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

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ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers\, equipment and materials suppliers and academics.


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Xplore Articles related to Manufacturability Improvement

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  • Dual Work Function Phase Controlled Ni-FUSI CMOS (NiSi NMOS, Ni2Si or Ni31Si12 PMOS): Manufacturability, Reliability & Process Window Improvement by Sacrificial SiGe Cap

    Veloso, A.; Hoffmann, T.; Lauwers, A.; Brus, S.; de Marneffe, J.-F.; Locorotondo, S.; Vrancken, C.; Kauerauf, T.; Shickova, A.; Sijmus, B.; Tigelaar, H.; Pawlak, M.A.; Yu, H.Y.; Demeurisse, C.; Kubicek, S.; Kerner, C.; Chiarella, T.; Richard, O.; Bender, H.; Niwa, M.; Absil, P.; Jurczak, M.; Biesemans, S.; Kittl, J.A. VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on, 2006

    This work presents the first comprehensive evaluation of the manufacturability and reliability of dual WF phase controlled Ni-FUSI/HfSiON CMOS (NMOS: NiSi; PMOS: Ni<sub>2</sub>Si and Ni<sub>31 </sub>Si<sub>12</sub> evaluated) for the 45 nm node. RTP1 and poly/spacer height were identified as the most critical process control parameters in our flow. We demonstrate that a novel sacrificial SiGe cap addition to the flow ...

  • Topology editing strategies in the subsystem of printed circuit boards manufacturability improvement

    Panchak, R.; Kolesnyk, K.; Lobur, M. CAD Systems in Microelectronics (CADSM), 2011 11th International Conference The Experience of Designing and Application of, 2011

    This paper focuses on the variants of printed circuit boards topology editing strategies implemented in the subsystem of automatic printed circuit boards topology editing. Depending on the requirements for printed circuit board topology, a subsystem user can create variants of editing strategies in order to minimize the amount of the technologically justified places with a minimum clearance between the elements ...

  • Pass transistor designs using pocket implant to improve manufacturability for 256 Mbit DRAM and beyond

    Chatterjee, A.; Liu, J.; Aur, S.; Mozumder, P.K.; Rodder, M.; Chen, I.-C. Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International, 1994

    Pass transistor designs for scaled 256 Mbit DRAM are studied in this paper. It is shown, for the first time, that a L/sub g/=0.25 /spl mu/m and t/sub ox/=85 /spl Aring/ transistor utilizing a pocket implant together with a light V/sub TN/ implant (pocket-with-V/sub TN/) can satisfy the stringent requirements of subthreshold leakage, diode leakage, V/sub T/ during charging, and ...

  • Design rule methodology to improve the manufacturability of the copper CMP process

    Lakshminarayanan, S.; Wright, P.; Pallinti, J. Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International, 2002

    A systematic approach to generate design rules and layout guidelines for damascene metal layers that enhance the robustness and manufacturability of designs is presented. The intra-die sheet resistance variation due to line width and pattern density effects is characterized for single and multi-level interconnects and the feature interaction distance is determined to be about 30 &mu;m. It is shown that ...

  • Determination of parasitic parameters in a high frequency magnetic to improve the manufacturability, performance, and efficiency of a PV inverter

    Shadmand, M.B.; Balog, R.S. Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE, 2012

    The power electronic inverter is an essential element of the photovoltaic systems as it converts the native direct-current (DC) from the photovoltaic cells into grid-compatible alternating current (AC), performs maximum power point tracking, and includes safety control and circuitry. Therefore performance, efficiency, and manufacturability are vitally important in the design, cost, and operation of the PV systems. Magnetic components such ...

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Educational Resources on Manufacturability Improvement

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Standards related to Manufacturability Improvement

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Periodicals related to Manufacturability Improvement

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  • Advanced Packaging, IEEE Transactions on

    The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

  • Components and Packaging Technologies, IEEE Transactions on

    Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

  • Electronics Packaging Manufacturing, IEEE Transactions on

    Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.

  • Proceedings of the IEEE

    The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...

  • Semiconductor Manufacturing, IEEE Transactions on

    Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.