Conferences related to Fabrication

Back to Top

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.


2015 7th International IEEE/EMBS Conference on Neural Engineering (NER)

Neural engineering deals with many aspects of basic and clinical problemsassociated with neural dysfunction including the representation of sensory and motor information, theelectrical stimulation of the neuromuscular system to control the muscle activation and movement, theanalysis and visualization of complex neural systems at multi -scale from the single -cell and to the systemlevels to understand the underlying mechanisms, the development of novel neural prostheses, implantsand wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2013 6th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problems associated with neural dysfunction including the representation of sensory and motor information, the electrical stimulation of the neuromuscular system to control the muscle activation and movement, the analysis and visualization of complex neural systems at multi-scale from the single-cell and to the system levels to understand the underlying mechanisms, the development of novel neural prostheses, implants and wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2011 5th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2009 4th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2007 3rd International IEEE/EMBS Conference on Neural Engineering


2014 5th IEEE RAS & EMBS International Conference on Biomedical Robotics and Biomechatronics (BioRob)

Theoretical and experimental challenges posed by the application of robotics and mechatronics in medicine and biology. Analysis of biological systems from a biomechatronic point of view. Design and fabrication of bio-inspired and biomimetic machines. Robotic and mechatronic devices and systems for prevention, diagnosis, surgery, prosthetics, rehabilitation and personal assistance.


2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors.

  • 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)

    Development of micro -electro mechanical systems (MEMS) focusing on design, simulation and analysis tools, fabrication technologies and processes, integration techniques, and assembly and packaging approaches. Application of MEMS in sensors and actuators, microdevices for opto -mechanical systems, fluidic microsystems, biomedical engineering, wireless communication, power supply and energy harvesting and nano - electro -mechanical devices.

  • 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)

    Premier Conference on MEMS reporting the lastest research results on every aspect of microsystems technology.

  • 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS)

    MEMS 2011 will be held in Cancun, Mexico from 23-27 January 2011 at the Hilton. The MEMS Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. In recent years, it has attracted more than 700 participants, 750+ abstract submissions and has presented over 200 select papers in non-overlapping podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees.

  • 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS)

    Development of micro-electro mechanical systems (MEMS) focusing on design, simulation and analysis tools, fabrication technologies and processes, integration techniques, and assembly and packaging approaches. Application of MEMS in sensors and actuators, microdevices for opto-mechanical systems, fluidic microsystems, biomedical engineering, wireless communication, power supply and energy harvesting and nano-electro-mechanical devices.

  • 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS)

    MEMS 2009 will be held in Sorrento, Italy on 26-29 January 2009 at the Hilton Sorrento Palace. the MEMS Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. In recent years, it has attracted more than 700 participants, 750+ abstract submissions and has presented over 200 select papers in non-overlapping podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, present


2014 IEEE International Conference on Systems, Man and Cybernetics - SMC

SMC2014 targets advances in Systems Science and Engineering, Human-Machine Systems, and Cybernetics involving state-of-art technologies interacting with humans to provide an enriching experience and thereby improving the quality of lives including theories, methodologies, and emerging applications.

  • 2013 IEEE International Conference on Systems, Man and Cybernetics - SMC

    SMC 2013 targets advances in Systems Science and Engineering Human-machine Systems and Cybernetics involving state-of-the-art technologies interacting with humans to provide an enriching experience and thereby improving the quality of lives including theories, methodologies and emerging applications.

  • 2012 IEEE International Conference on Systems, Man and Cybernetics - SMC

    Theory, research and technology advances including applications in all aspects of systems science and engineering, human machine systems, and emerging cybernetics.

  • 2011 IEEE International Conference on Systems, Man and Cybernetics - SMC

    Theory, research, and technology advances including applications in all aspects of systems science and engineering, human machine systems, and emerging cybernetics.

  • 2010 IEEE International Conference on Systems, Man and Cybernetics - SMC

    The 2010 IEEE International Conference on Systems, Man, and Cybernetics (SMC2010) provides an international forum that brings together those actively involved in areas of interest to the IEEE Systems, Man, and Cybernetics Society, to report on up-to-the-minute innovations and developments, to summarize the state-of-the-art, and to exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics.

  • 2009 IEEE International Conference on Systems, Man and Cybernetics - SMC

    The 2009 IEEE International Conference on Systems, Man, and Cybernetics (SMC2009) provides an international forum that brings together those actively involved in areas of interest to the IEEE Systems, Man, and Cybernetics Society, to report on up-to-the-minute innovations and developments, to summarize the state-of-the-art, and to exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics.


More Conferences

Periodicals related to Fabrication

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


More Periodicals

Most published Xplore authors for Fabrication

Back to Top

Xplore Articles related to Fabrication

Back to Top

Aluminum infrared plasmonic perfect absorbers fabricated by colloidal lithography

Thang Duy Dao; Kai Chen; Satoshi Ishii; Akihiko Ohi; Toshihide Nabatame; Masa-hiro Kitajima; Tadaaki Nagao 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

We report on the fabrication of large-area aluminum plasmonic perfect absorber (Al-PA) using colloidal lithography combined with reactive ion etching process. Using the Al-PA, we demonstrate selective thermal emitters and tailor-made molecular vibrational sensing.


Alloy plasmonic materials

Yoshiaki. Nishijima; Yoshikazu. Hashimoto; Seniutinas Gediminas; Armandas Balcytis; Saulius Juodkazis 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

We focused on the Au, Ag and Cu alloy systems and the experimental determination of their optical permittivity using optical transmission and reflection measurements with thin metal films. The optical constants define the plasmon resonance frequency and the electro-magnetic field intensity localized around the nanoparticles. However it is less known how the alloy metals perform in the field enhancement. Due ...


Preliminary test and evaluation of non-destructive examination for ITER First Wall development in Korea

Suk-Kwon Kim; Eo Hwak Lee; Jae-Sung Yoon; Hyun-Kyu Jung; Dong Won Lee; Byoung-Yoon Kim 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

ITER First Wall (FW) includes beryllium armour joined to a Cu heat sink with a stainless steel back plate. These first wall panels are one of the critical components in the ITER tokamak with a maximum surface heat flux of 5 MW/m2. So, a qualification test needs to be performed with the goal to qualify the joining technologies required for ...


Slow Wave Structures for Miniature Antennas

John L. Volakis; Kubilay Sertel 2007 International Workshop on Anti-Counterfeiting, Security and Identification (ASID), 2007

Engineered materials, such as new composites, electromagnetic bandgap, and periodic structures have attracted considerable interest in recent years due to their remarkable and unique electromagnetic properties. Among this class of media are the magnetic photonic (MPC) and degenerate band edge (DBE) crystals. These periodic media have the concurrent characteristics of wave slow down and impedance matching at their dielectric interface. ...


Strong plasmonic coupling in rod-dimer/ring nanostructure

Jia-Yu Lin; Chia-Yang Tsai; Pin-Tso Lin; Tse-En Hsu; Po-Tsung Lee 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

A rod-dimer/ring (RDR) plasmonic nanostructure with different gap distances is investigated in both experiment and simulation. Compared to rod-dimer and ring, the localized near-field intensity of RDR can be significantly enhanced and further increased in smaller gap distance owing to stronger coupling effect.


More Xplore Articles

Educational Resources on Fabrication

Back to Top

eLearning

Aluminum infrared plasmonic perfect absorbers fabricated by colloidal lithography

Thang Duy Dao; Kai Chen; Satoshi Ishii; Akihiko Ohi; Toshihide Nabatame; Masa-hiro Kitajima; Tadaaki Nagao 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

We report on the fabrication of large-area aluminum plasmonic perfect absorber (Al-PA) using colloidal lithography combined with reactive ion etching process. Using the Al-PA, we demonstrate selective thermal emitters and tailor-made molecular vibrational sensing.


Alloy plasmonic materials

Yoshiaki. Nishijima; Yoshikazu. Hashimoto; Seniutinas Gediminas; Armandas Balcytis; Saulius Juodkazis 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

We focused on the Au, Ag and Cu alloy systems and the experimental determination of their optical permittivity using optical transmission and reflection measurements with thin metal films. The optical constants define the plasmon resonance frequency and the electro-magnetic field intensity localized around the nanoparticles. However it is less known how the alloy metals perform in the field enhancement. Due ...


Preliminary test and evaluation of non-destructive examination for ITER First Wall development in Korea

Suk-Kwon Kim; Eo Hwak Lee; Jae-Sung Yoon; Hyun-Kyu Jung; Dong Won Lee; Byoung-Yoon Kim 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

ITER First Wall (FW) includes beryllium armour joined to a Cu heat sink with a stainless steel back plate. These first wall panels are one of the critical components in the ITER tokamak with a maximum surface heat flux of 5 MW/m2. So, a qualification test needs to be performed with the goal to qualify the joining technologies required for ...


Slow Wave Structures for Miniature Antennas

John L. Volakis; Kubilay Sertel 2007 International Workshop on Anti-Counterfeiting, Security and Identification (ASID), 2007

Engineered materials, such as new composites, electromagnetic bandgap, and periodic structures have attracted considerable interest in recent years due to their remarkable and unique electromagnetic properties. Among this class of media are the magnetic photonic (MPC) and degenerate band edge (DBE) crystals. These periodic media have the concurrent characteristics of wave slow down and impedance matching at their dielectric interface. ...


Strong plasmonic coupling in rod-dimer/ring nanostructure

Jia-Yu Lin; Chia-Yang Tsai; Pin-Tso Lin; Tse-En Hsu; Po-Tsung Lee 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015

A rod-dimer/ring (RDR) plasmonic nanostructure with different gap distances is investigated in both experiment and simulation. Compared to rod-dimer and ring, the localized near-field intensity of RDR can be significantly enhanced and further increased in smaller gap distance owing to stronger coupling effect.


More eLearning Resources

IEEE-USA E-Books

  • Plasma Chemistry

    This chapter contains sections titled: Introduction Definitions of Terms Chemical Reactions The Chemical Reaction Chain Plasma Surface Interactions Questions References

  • Plasma Reactors

    This chapter contains sections titled: Plasma Systems DC Reactors RF Reactors Microwave Reactors ECR Reactors Magnetically Enhanced Reactors Remote PECVD Reactors Reactor Clusters Questions References

  • Plasma Diagnostics

    This chapter contains sections titled: Mass Spectrometry Electrostatic Probes Optical Methods Questions References

  • Emerging Nanotechnology for Integration of Nanostructures in Nanoelectronic Devices

    This chapter contains sections titled: Introduction Diblock copolymer technology for nano-objects fabrication Chemical vapor deposition of nanodots and nanowires Integration of nanoobjects Conclusions

  • Microfabrication

    This chapter contains sections titled: Bulk and Surface Micromachining Lithography Layer Deposition Layer Etching Fabrication Process Design Problems

  • Textile Antennas for Body Area Networks: Design Strategies and Evaluation Methods

    This chapter presents the design, development, and evaluation procedures for textile antennas. It overviews the types of textiles (conductive and non- conductive) and explains the characterization procedure using a commercial setup prior to the proposal of a systematic antenna fabrication procedure. In experiments, measurement of the reflection coefficient is performed using a vector network analyzer (VNA), whereas radiation characteristics, that is, patterns, gain, and efficiency are evaluated in an anechoic chamber. Antenna performance is assessed in the proximity of either a human user or a phantom and must lead to sufficient design information to guarantee this performance in the simulation-based design process, where the proximity of the human body also has to be taken into account. Finally, the chapter also describes the evaluation methods used for the fabricated antenna prototypes, that is, in terms of reflection coefficient, radiation characteristics, efficiency, and specific absorption rates (SAR).

  • No title

    <p>In recent years, transmitarray antennas have attracted growing interest with many antenna researchers. Transmitarrays combines both optical and antenna array theory, leading to a low profile design with high gain, high radiation efficiency, and versatile radiation performance for many wireless communication systems. In this book, comprehensive analysis, new methodologies, and novel designs of transmitarray antennas are presented.</p> <p><ul> <li>Detailed analysis for the design of planar space-fed array antennas is presented. The basics of aperture field distribution and the analysis of the array elements are described. The radiation performances (directivity and gain) are discussed using array theory approach, and the impacts of element phase errors are demonstrated.</li> <li>The performance of transmitarray design using multilayer frequency selective surfaces (M-FSS) approach is carefully studied, and the transmission phase imit which are generally independent from the selection of a specific element shape is revealed. The maximum transmission phase range is determined based on the number of layers, substrate permittivity, and the separations between layers.</li> <li>In order to reduce the transmitarray design complexity and cost, three different methods have been investigated. As a result, one design is performed using quad-layer cross-slot elements with no dielectric material and another using triple-layer spiral dipole elements. Both designs were fabricated and tested at X-Band for deep space communications. Furthermore, the radiation pattern characteristics were studied under different feed polarization conditions and oblique angles of incident field from the feed.</li> <li>New design methodologies are proposed to improve the bandwidth of transmitarray antennas through the control of the transmission phase range of the elements. These design techniques are validated th ough the fabrication and testing of two quad-layer transmitarray antennas at Ku-band.</li> <li>A single-feed quad-beam transmitarray antenna with 50 degrees elevation separation between the beams is investigated, designed, fabricated, and tested at Ku-band.</li></ul> </p> <p>In summary, various challenges in the analysis and design of transmitarray antennas are addressed in this book. New methodologies to improve the bandwidth of transmitarray antennas have been demonstrated. Several prototypes have been fabricated and tested, demonstrating the desirable features and potential new applications of transmitarray antennas.</p>

  • A Monolithic 10b DigitaltoAnalog Convertor Using Ion Implantation

    The design and fabrication of a self-contained 10-b monolithic digital-to- analog converter is described. To overcome the limitations of standard bipolar processing and to achieve a circuit with reasonably low process sensitivities, a new process incorporating ion implantation is used. The circuit has been designed in a manner to fully utilize the characteristics of this process with the objective of high performance along with simple wafer processing. System considerations as well as the design of each component block are discussed.

  • Cold Plasma Processes for Surface Modification

    This chapter contains sections titled: Introduction Surface Modification of Polymers Surface Cleaning and Ashing Oxidation Surface Hardening Questions References

  • Issues and Implications

    This chapter contains sections titled: Why Consider Petaflops Now?, Role of a Petaflops Computer, Side-effect Products, Impact of Exotic Technologies, Performance Versus Efficiency, Programming Paradigms, U.S. Capabilities in Memory Fabrication, Special Widgets, Where to Invest, A Range of Architectures, Far-side Architectures, Latency Hiding Techniques, Long versus Short Latency Machines, SIA Predictions, I/O Scaling



Standards related to Fabrication

Back to Top

No standards are currently tagged "Fabrication"