Conferences related to Fabrication

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power

2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

2018 11th Global Symposium on Millimeter Waves (GSMM)

The main theme of the GSMM2018 is Millimeter-wave Propagation: Hardware, Measurements and Systems. It covers millimeter-wave and THz devices, circuits, systems, and applications, with a special focus on mmWave propagation. The conference will include keynote talks, technical sessions, panels, and exhibitions on the listed topics.

  • 2017 10th Global Symposium on Millimeter-Waves (GSMM)

    The main theme of the symposium is Millimeter-Wave and Terahertz Sensing and Communications. It covers millimeter- wave and THz antennas, circuits, devices, systems and applications.

  • 2016 Global Symposium on Millimeter Waves (GSMM) & ESA Workshop on Millimetre-Wave Technology and Applications

    The main theme of the conference is millimeter-wave and terahertz sensing and communications and the conference covers different topics related to millimeter-wave and terahertz technologies, such as: antennas and propagation, passive and active devices, radio astronomy, earth observation and remote sensing, communications, wireless power transfer, integration and packaging, photonic systems, and emerging technologies.

  • 2015 Global Symposium On Millimeter Waves (GSMM)

    The main theme of the GSMM 2015 is “Future Millimeter-wave and Terahertz Wireless and Wireline”. It will cover all emerging and future millimeter wave and terahertz software and hardware aspects ranging from communicating devices, circuits, systems and applications to passive and active sensing and imaging technologies and applications. The GSMM 2015 will feature world-class keynote speeches, technical sessions, panel discussions and industrial exhibitions in the following (but not limited to) topics listed below.In addition to the regular program, the GSMM 2015 will organize a unique industrial forum for presenting and discussing future wireless technologies and trends including 5G and Terahertz Wireless Systems.

  • 2012 5th Global Symposium on Millimeter Waves (GSMM 2012)

    The aim of the conferences is to bring together people involved in research and development of millimeter-wave components, equipment and systems, and to explore common areas.

  • 2009 Global Symposium On Millimeter Waves (GSMM 2009)

    The GSMM2009 will be held in Sendai, Japan from April 20 to April 22, 2009. The GSMM2009 is the second international conference in its name after the three conferences of TSMMW, MINT-MIS, and MilliLab Workshop on Millimeter-wave Technology and Applications were integrated into GSMM (Global Symposium on Millimeter Waves) in 2007. The main theme of the GSMM2009 is "Millimeter Wave Communications at Hand" and it will focus on millimeter wave devices and systems to realize Giga-bit wireless applications. The

  • 2008 Global Symposium On Millimeter Waves (GSMM 2008)

    Frequency Management and Utilization, Millimeter-Wave Communication Systems, Devices and Circuit Technologies, Wireless Access Systems, Mobile Access Systems, Satellite Communications, LANs and PANs, Home Link Systems, Photonics, Antennas and Propagation, Phased Array Antennas, Signal Processing, Wearable Devices and Systems, Automotive Radars and Remote Sensing, Supporting and Related Technologies

2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies

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Periodicals related to Fabrication

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission

Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...

Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...

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Most published Xplore authors for Fabrication

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Xplore Articles related to Fabrication

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Direct Write Fabrication of Platinum-Based Thick-Film Resistive Temperature Detectors

[{u'author_order': 1, u'affiliation': u'Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, USA', u'full_name': u'Alan Shen'}, {u'author_order': 2, u'affiliation': u'Physical Sciences Department, United Technologies Research Center, East Hartford, CT, USA', u'full_name': u'Seung Bum Kim'}, {u'author_order': 3, u'affiliation': u'Physical Sciences Department, United Technologies Research Center, East Hartford, CT, USA', u'full_name': u'Callum Bailey'}, {u'author_order': 4, u'affiliation': u'Department of Chemical and Biomolecular Engineering and Polymer Program, University of Connecticut, Storrs, CT, USA', u'full_name': u'Anson W. K. Ma'}, {u'author_order': 5, u'affiliation': u'Physical Sciences Department, United Technologies Research Center, East Hartford, CT, USA', u'full_name': u'Sameh Dardona'}] IEEE Sensors Journal, 2018

This paper investigates the feasibility and performance of platinum thick-film resistance temperature detectors (RTDs) fabricated using extrusion-based direct write (DW). A platinum (Pt) layer of micron-level thickness was directly deposited onto a planar alumina substrate and was physically and electrically characterized. A four-wire electrical configuration was used to eliminate the effects of contact resistance and increase measurement accuracy. The resistance-temperature ...

Modeling and Fabrication of a Multi-Axial Piezoelectric Energy Harvester Based on a Metamaterial-Inspired Structure

[{u'author_order': 1, u'affiliation': u'Mechanical Engineering Department, University of South Carolina, Columbia, SC, USA', u'full_name': u'Mohammadsadegh Saadatzi'}, {u'author_order': 2, u'affiliation': u'Mechanical Engineering Department, University of South Carolina, Columbia, SC, USA', u'full_name': u'Fariha Mir'}, {u'author_order': 3, u'affiliation': u'Electrical Engineering Department, University of Louisville, Louisville, KY, USA', u'full_name': u'Mohammad Nasser Saadatzi'}, {u'author_order': 4, u'affiliation': u'Mechanical Engineering Department, University of South Carolina, Columbia, SC, USA', u'full_name': u'Sourav Banerjee'}] IEEE Sensors Journal, 2018

Due to the limited availability and high depletion rates of nonrenewable energy sources as well as environmental concerns, the scientific community is urged to explore and harness alternative, clean energy sources. In this paper, a novel piezoelectric energy harvester based on a metamaterial structure is proposed, which is capable of scavenging energy from low-frequency, multi- axial ambient vibrations. The proposed ...

Fabrication and Sensitivity Analysis of Guided Beam Piezoelectric Energy Harvester

[{u'author_order': 1, u'affiliation': u'Department of Electronics and Communication Engineering, Malaviya National Institute of Technology, Jaipur, India', u'full_name': u'Shanky Saxena'}, {u'author_order': 2, u'affiliation': u'Department of Electronics and Communication Engineering, Malaviya National Institute of Technology, Jaipur, India', u'full_name': u'Ritu Sharma'}, {u'author_order': 3, u'affiliation': u'Council of Scientific and Industrial Research-Central Electronics Engineering Research Institute, Pilani, India', u'full_name': u'B. D. Pant'}] IEEE Transactions on Electron Devices, 2018

This paper reports the fabrication of MEMS-based guided two-beam piezoelectric energy harvester for low-frequency operation. A highly c-axis-oriented zinc oxide thin film of 2.5- $mu text{m}$ thickness covered with 0.5- $mu text{m}$ plasma-enhanced chemical vapor deposition SiO2 is sandwiched between the aluminum electrodes to form split electrodes on the two beams. A pyramidal- shaped seismic mass that gives a higher ...

Fabrication and Studies of Silicide-Based Superconducting Nanowires

[{u'author_order': 1, u'affiliation': u'Espoo, VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, VTT, FI-02044, Finland', u'full_name': u'J. S. Lehtinen'}, {u'author_order': 2, u'affiliation': u'Espoo, VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, VTT, FI-02044, Finland', u'full_name': u'E. Mykkanen'}, {u'author_order': 3, u'affiliation': u'Espoo, VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, VTT, FI-02044, Finland', u'full_name': u'A. Kemppinen'}, {u'author_order': 4, u'affiliation': u'Espoo, VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, VTT, FI-02044, Finland', u'full_name': u'M. Prunnila'}, {u'author_order': 5, u'affiliation': u'Espoo, VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, VTT, FI-02044, Finland', u'full_name': u'A. J. Manninen'}] 2018 Conference on Precision Electromagnetic Measurements (CPEM 2018), None

Several silicide compounds are promising materials for studies and applications of quantum phase slips (QPS) in superconducting nanowires (SNWs). This paper describes two nanofabrication processes, which were applied to manufacture silicide SNWs. Experiments on MoSi nanowires indicate size dependent crossover from conventional superconductivity to transport influenced by thermal and quantum fluctuations. Results of the first experiments on other silicide SNWs ...

Development and Fabrication of Improved Josephson Series Arrays with NbSi Barrier for AC Voltage Standards

[{u'author_order': 1, u'affiliation': u'Physikalisch-Technische Bundesanstalt (PTB), Bundesallee 100, Braunschweig, 38116, Germany', u'full_name': u'J. Kohlmann'}, {u'author_order': 2, u'affiliation': u'Physikalisch-Technische Bundesanstalt (PTB), Bundesallee 100, Braunschweig, 38116, Germany', u'full_name': u'O. Kieler H. Tian'}, {u'author_order': 3, u'affiliation': u'Physikalisch-Technische Bundesanstalt (PTB), Bundesallee 100, Braunschweig, 38116, Germany', u'full_name': u'R. Wendisch'}, {u'author_order': 4, u'affiliation': u'Physikalisch-Technische Bundesanstalt (PTB), Bundesallee 100, Braunschweig, 38116, Germany', u'full_name': u'B. Egeling'}, {u'author_order': 5, u'affiliation': u'Physikalisch-Technische Bundesanstalt (PTB), Bundesallee 100, Braunschweig, 38116, Germany', u'full_name': u'R. Behr'}] 2018 Conference on Precision Electromagnetic Measurements (CPEM 2018), None

Series arrays of overdamped Josephson junctions compose the basis of AC Josephson voltage standards. Presently, an advanced technology is based on Josephson junctions consisting of an NbxSi-xbarrier. Using junction stacks containing five Josephson junctions, series arrays of 15,000 junctions have been successfully fabricated at PTB for the pulse-driven Josephson Arbitrary Waveform Synthesizer (JAWS). The operation of eight arrays simultaneously enable ...

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Educational Resources on Fabrication

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No eLearning Articles are currently tagged "Fabrication"


  • Personal Fabrication

    While fabrication technologies have been in use in industry for several decades, expiring patents have recently allowed the technology to spill over to technology-enthusiastic ¿¿¿makers¿¿?. The big question now is whether the technology will further progress towards consumers, which would allow the technology to scale from hundreds of thousands of users to hundreds of millions of users. Such a transition would enable consumers to use computing not just to process data, but physical matter. This holds the promise of democratizing a whole range of fields preoccupied with physical objects, from product design to interior design, to carpentry, and some areas of mechanical and structural engineering. Personal Fabrication analyzes similar trends in the history of computing that made the transition from industry to consumers, such as desktop publishing and home video editing, and comes to the conclusion that such a transition is likely. The analysis also reveals, however, that any transition to consumers first requires a hardware and software system that embodies the skills and expert knowledge that consumers lack. These are: (1) hardware and materials that allow fabricating the intended objects, (2) software that embodies domain knowledge, (3) software that embodies the know- how required to operate the machinery, and (4) software that provides immediate feedback and supports interactive exploration. At the same time, sustained success will only be possible if we also consider future implications, in particular (5) sustainability and (6) intellectual property. Personal Fabrication argues that researchers in HCI and computer graphics are well equipped to tackle these six challenges. It surveys the already existing work and derives an actionable research agenda. While the main focus is on human-computer interaction and computer graphics, it also includes selected works from adjacent fields such as mechanical engineering, material science, and robotics.

  • Digital Optics Fabrication Techniques

    This chapter contains sections titled: Holographic Origination Diamond Tool Machining Photo‐reduction Microlithographic Fabrication of Digital Optics Micro‐refractive Element Fabrication Techniques Direct Writing Techniques Gray‐scale Optical Lithography Front/Back Side Wafer Alignments and Wafer Stacks A Summary of Fabrication Techniques

  • OLED Fabrication Process

    This chapter describes the fabrication processes of OLED devices. In general, OLEDs are fabricated by either a dry process or a wet process. The commonly used dry process is vacuum evaporation. Three types of vacuum evaporation techniques are reviewed. In wet processes, there are processes for coating without fine patterning and processes for making fine patterns.In addition to deposition techniques of each organic layer, RGB patterning technologies are important. These RGB patterning technologies are vacuum deposition using fine metal masks, wet processes such as ink¿¿¿jet, nozzle printing, relief printing, etc., and laser patterning process.

  • Modeling, Analysis, Scheduling, and Control of Cluster Tools in Semiconductor Fabrication

    Most of the wafer fabrication processes are chemical processes, and wafers are traditionally processed in batches for high throughput. One of the important innovations in semiconductor fabrication is the adoption of single-wafer processing by using cluster tools. Each cluster tool integrates several processing modules (PMs) within a closed environment such that the wafers are processed one by one in a cassette without leaving out of the tool. In cluster tool operations, wafer processing times and robot task times are rather deterministic and can be regarded as constant in the normal condition. For the effective operation of cluster tools, important efforts are made for modeling and performance analysis. In multi-cluster tools, one or more processing PMs are used as a buffer to link two single-cluster tools. Cluster tools in semiconductor fabrication adopt the single-wafer processing technique and represent one of the important innovations in the semiconductor industry.

  • Tissue Fabrication Technology

    In this chapter, we describe current state of the art to support tissue and organ fabrication. We describe several technologies, some of which self- organization technology and cell sheet engineering. We also describe cell and organ printing as it applies to tissue engineering. Scaffold based tissue engineering approaches are also described. During the course of this chapter we also introduce the concepts of soft-lithography, micro-fluidics and organ- on-a-chip models.

  • Design and Fabrication of Vibration-Induced Electromagnetic Microgenerators

    This work presents design and fabrication technologies on vibration-induced electromagnetic micro-generators using LTCC (Low temperature co-fire ceramic) processes. LTCC fabrication with some special advantages has simplistically processes and multilayer stack procedure, resulting in a micro-inducer can consist of the multilayer induction micro-coils and a helical ceramic micro- spring. Multilayer micro-coil structures can enhance the power output of generators. There are two types of microgenerator structures: the magnetic core-type generator (MCTG) and sided magnet-type generator (SMTG). In an MCTG, the magnetic field is generated by the interaction of a magnetic core element and a magnet in the center hole, whereas in an SMTG the magnetic field is generated by the microinduction coil on the sides of the magnetic element. The results confirmed that this fabrication procedure of the inducer using LTCC is valid. The fired microspring has a 100-¿¿m beam width, a 100-¿¿m beam interspace, a 1.7-mm innermost loop radius, and 5.5 unequal radius loops. In addition, the fired microcoil has a cross-sectional area of 90-¿¿m (line- width) ? 10-¿¿m (line-thickness). The entire volume of the meso-generator is 10 mm ? 10 mm ? 7.18 mm (approximately 718 mm3). The measurements were performed at a natural frequency of 69 Hz with maximal amplitude of 0.03 mm. The safe design of the double supporting beam was confirmed: the supporting beam has a maximal bending stress of 32 MPa and a lifetime of 1.95 ? 108 cycles when the vibration amplitude is at its maximum.

  • Design and Fabrication of Rotary Electromagnetic Microgenerator

    This study focuses on the design, fabrication, test and application of in- plane rotary electromagnetic micro-generator to obtain a high power output. The micro-generator comprises multilayer planar low temperature co-fired ceramics (LTCC) Ag micro-coil and multipole hard magnet of Nd/Fe/B. Finite element simulations have been carried out to observe electromagnetic information. The study also establishes analytical solutions for the micro- generator to predict the induced voltage. The experimental results show that the micro-generator with sector-shaped micro-coil has the highest power output of 1.89 mW, and the effective value of the induced voltage of 205.7 mV at 13,325 rpm is achieved. In application, this study designed and fabricated a planar rotary electromagnetic energy harvester with a low rotary speed for use in bicycle dynamos. LTCC technology was applied to fabricate Ag planar multilayer coils with 20 layers. A 28-pole magnet Nd/Fe/B with an outer diameter of 50 mm and a thickness of 2 mm was also sintered and magnetized. This harvester system was approximately 50¿¿50¿¿3 mm3 in volume. The experimentally induced voltages for 20-layer coils were 1.539 V at the rotary speeds of 300 rpm. The power output was 0.788 mW with an external resistance load of 740 O, and the efficiency was 26.62%. This harvester is capable of powering a minimum of 200 light emitted diodes (LEDs) (forward voltage (VF) <2.2 V and 20 mA) using a rotary speed of 250 rpm, and can be used for bicycle dynamo lighting.

  • Design and Fabrication of Flexible Piezoelectric Generators Based on ZnO Thin Films

    The piezoelectric transducer for vibration-energy harvesting is constructed of a piezoelectric layer, bottom electrode and a top electrode. In order to obtain an appropriate transducer for the low-frequency operating; environmentally-friendly and long-term, the flexible substrate, the piezoelectric layer, and the additional mass-loading have been investigated thoroughly. Firstly, flexible piezoelectric harvesters based on ZnO (Zinc Oxide) thin films for self-powering and broad bandwidth applications. The design and simulation of a piezoelectric cantilever plate was described by using commercial software ANSYS FEA (finite element analysis) to determine the optimum thickness of PET substrate, internal stress distribution, operation frequency and electric potential. A modified design of a flexible piezoelectric energy-harvesting system with a serial bimorph of ZnO piezoelectric thin film was presented to enhance significantly higher power generation. This high-output system was examined at 15 Hz. The maximum DC (direct current) voltage output voltage with loading was 3.18 V, and the maximum DC power remained at 2.89 ¿¿W/cm2. Secondly, this investigation fabricates double-sided piezoelectric transducers for harvesting vibration- power. The double-sided piezoelectric transducer is constructed by depositing piezoelectric thin films. The Ti (titanium) and Pt (platinum) layers were deposited using a dual-gun DC sputtering system between the piezoelectric thin film and the back side of the SUS304 substrate. The maximum open circuit voltage of the double-sided ZnO power transducer is approximately 18 V. After rectification and filtering through a 33 nF capacitor, a specific power output of 1.3 ¿¿W/cm2 is obtained from the double-sided ZnO transducer with a load resistance of 6 M?>

  • Design and Fabrication of Electrospun PVDF Piezo-Energy Harvesters

    Nanogenerators capable of converting energy from mechanical sources to electricity with high effective efficiency using low-cost, nonsemiconducting, organic nanomaterials are attractive for many applications, including energy harvesters. In this work, near-field electrospinning is used to direct-write poly(vinylidene fluoride) (PVDF) nanofibers with in situ mechanical stretch and electrical poling characteristics to produce piezoelectric properties. Under mechanical stretching, nanogenerators have shown repeatable and consistent electrical outputs with energy conversion efficiency an order of magnitude higher than those made of PVDF thin films. The early onset of the nonlinear domain wall motions behavior has been identified as one mechanism responsible for the apparent high piezoelectricity in nanofibers, rendering them potentially advantageous for sensing and actuation applications.

  • An Alternative Path for the Fabrication of Self-Assembled III-Nitride Nanowires

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