Conferences related to Fabrication

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


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Periodicals related to Fabrication

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Fabrication

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Xplore Articles related to Fabrication

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Direct and all-dry fabrication of paper-based microfluidic device using parylene-C deposition and maskless microplasma writing

2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018

This paper reports a novel and simple method for direct and all-dry fabrication of paper-based microfluidic devices using parylene-C deposition and maskless atmospheric pressure microplasma writing. Microplasma jet with diameter of about 10 μm was demonstrated to investigate the feasibility of this method in this paper and well defined hydrophilic-hydrophobic contrast channels are fabricated. By controlling the diameter of the ...


Design and fabrication of a TSV interposer for SRAM integration

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011

TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple fabrication process is developed for cost-sensitive application. The mushroomlike Cu/Sn bumps by copper overburden can be directly connected with other substrate, which eliminates a CMP planarization to improve the yield and reduce fabrication cost. ...


Wafer-level fabrication of a triboelectric energy harvester

2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2015

We present a wafer-level fabrication method for triboelectric energy harvester (TEH), which fabricates the TEH completely in batch fabrication process, without any manually assembly step. Finite element method (FEM) simulation was conducted to investigate the open-circuit potential distribution and short- circuit charge distribution. Experimental measurements show that this device can produce 235 mV peak voltage at the frequency of 30 ...


Fabrication of silica opal array with high mechanical strength

The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

This paper focuses on fabrication of opal structures by self-assembling silica spheres, which can be used as an array of high throughput and low cost reactors or micro-filters. The reactors can carry out hundreds different reactions in parallel; while there is about 50 nano-liter reagent consumed in each reactor. It not only provides large surface area for reaction, but also ...


Design and fabrication of a mems capacitive accelerometer based on double-device-layers SOI wafer

2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, 2010

This paper presents a capacitive MEMS accelerometer with highly symmetric sandwich structure (Glass-Si-Glass). In order to get highly symmetric beam- mass structure (silicon middle-layer), a double-device-layer SOI (D-SOI) wafer, which has identical buried oxides (BOX) and device layers on both sides of a thick handle layer was adopted in fabrication. The fabrication process produced proof mass with though wafer thickness ...


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Educational Resources on Fabrication

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IEEE-USA E-Books

  • Direct and all-dry fabrication of paper-based microfluidic device using parylene-C deposition and maskless microplasma writing

    This paper reports a novel and simple method for direct and all-dry fabrication of paper-based microfluidic devices using parylene-C deposition and maskless atmospheric pressure microplasma writing. Microplasma jet with diameter of about 10 μm was demonstrated to investigate the feasibility of this method in this paper and well defined hydrophilic-hydrophobic contrast channels are fabricated. By controlling the diameter of the microplasma jet and the treatment time, the channel width and wettable depth can be tuned.

  • Design and fabrication of a TSV interposer for SRAM integration

    TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple fabrication process is developed for cost-sensitive application. The mushroomlike Cu/Sn bumps by copper overburden can be directly connected with other substrate, which eliminates a CMP planarization to improve the yield and reduce fabrication cost. The electrical and thermal-mechanical behaviors of the 3D system were analyzed. Preliminary fabrication results are demonstrated. The TSV interposer technology is promising for 3D SRAM integration.

  • Wafer-level fabrication of a triboelectric energy harvester

    We present a wafer-level fabrication method for triboelectric energy harvester (TEH), which fabricates the TEH completely in batch fabrication process, without any manually assembly step. Finite element method (FEM) simulation was conducted to investigate the open-circuit potential distribution and short- circuit charge distribution. Experimental measurements show that this device can produce 235 mV peak voltage at the frequency of 30 Hz, under the 100 MΩ external resistance. Compared with previous TEHs, the proposed device can be batch fabricated in CMOS-compatible process and the reduced size allows it to be easily integrated with other electronic devices (e.g., keyboards).

  • Fabrication of silica opal array with high mechanical strength

    This paper focuses on fabrication of opal structures by self-assembling silica spheres, which can be used as an array of high throughput and low cost reactors or micro-filters. The reactors can carry out hundreds different reactions in parallel; while there is about 50 nano-liter reagent consumed in each reactor. It not only provides large surface area for reaction, but also solves the issue of high throughput experiments. The mechanical strength of the opal has to be high enough to withstand fluid flushing during sample loading and cleaning. In this paper, the optimized process is developed to fabricate the robust and crack-less opal membrane.

  • Design and fabrication of a mems capacitive accelerometer based on double-device-layers SOI wafer

    This paper presents a capacitive MEMS accelerometer with highly symmetric sandwich structure (Glass-Si-Glass). In order to get highly symmetric beam- mass structure (silicon middle-layer), a double-device-layer SOI (D-SOI) wafer, which has identical buried oxides (BOX) and device layers on both sides of a thick handle layer was adopted in fabrication. The fabrication process produced proof mass with though wafer thickness (1mm) to increase the sensitivity of the accelerometer. Two layers of single crystal silicon beams with highly uniform dimension suspended the proof mass from both sides symmetrically. The highly symmetric beam-mass structure reduced the cross axis sensitivity and rotational influences of the microaccelerometer dramatically. Two glass cap wafers with capacitance electrodes were anodic bonded with middle-layer wafer to form the capacitances. Initial capacitances designed to be 80pF were measured in the range of 75.03~86.94pF. The amplitude of capacitances variation up to 55pF/±1g was measured.

  • 3D ICE printing as a fabrication technology of microfluidics with pre-sealed reagents

    This paper proposes a fast and inexpensive method to fabricate 3D structure by “ice printing”. This “bottom-up” 3D fabrication method is achieved by printing water onto the cold surface and turning into ice structure layer by layer. Through this method, fluid with reagents, such as drugs and nanoparticles, is sealed into microfluidics during fabrication, which is available for drug delivery or other medical care applications. Moreover, complex micro-channels are easily fabricated using 3D ice structure as soft lithography mould, which can be used for microfluidic mixer, three dimensional flow focusing, etc.

  • Design and fabrication of Cu-TSV free-standing specimen for uniaxial micro-tensile test

    A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu- TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro- tensile system are 25.4~32.9GPa and 574~764MPa, respectively.

  • Fabrication of silica nanowire bunch arrays in SiO vapor generated by oxygen plasma etching of silicon

    This paper reports a three-step fabrication method for highly ordered silica nanowire bunch arrays of diversiform shapes. After patterning of organic polymers on Si substrates through photo lithography, oxygen plasma bombardment is applied to fabricate nanowire bunch arrays. On one hand, oxygen plasma exploits Si source from the substrates, and, subsequently, the gaseous Si react with active oxygen to form SiO vapor. On the other hand, oxygen plasma erodes the polymer patterns and, simultaneously, make them electrostatically attract the SiO material to form straight silica nanowire bunches. Based on this approach, standing nanowire bunch arrays of different sizes and different shapes are achieved on selective areas or structures. The nanowire bunches are able to bend toward a gallium focused-ion-beam irradiation, from different positions, in different directions and at different angles.

  • Fabrication and optical characteristics of a hemi-paraboloidal solid immersion mirror and designing of an optical head with the mirror

    A hemi-paraboloidal solid immersion mirror is successfully fabricated with the ELID (electrolytic in-process dressing) grinding technology and the spot size obtained was 150% of that for diffraction limited processes. Small sized optical head would be possible with the HP-SIM, which size is comparable to that of a magnetic head for HDDs.

  • Fabrication and electrochemical comparison of SIROF-AIROF-EIROF microelectrodes for neural interfaces

    Iridium oxide has been widely used in neural recording and stimulation due to its good stability and large charge storage capacity (CSC). In general, the iridium oxide film used in the electrophysiological application can be grouped into three principal classifications: sputtering iridium oxide film (SIROF), activated iridium oxide film (AIROF) and electrodeposited iridium oxide film (EIROF). Although these kinds of iridium oxide all can remarkably reduce the impedance and increase the CSC of the microelectrode, they also exhibit markedly differences in electrochemical performances. After activation, the CSC of EIROF is 68.20 mC/cm<sup>2</sup>, which is 88.7 % larger than that of the SIROF and 67.6 % larger than that of the AIROF. The impedance at 1 kHz of the three kinds of iridium oxide microelectrode is around 4000 ohm, it is acceptable for the neural interface application. The phase at 1 kHz of the AIROF microelectrode is the largest which is -6.1 degree, about 22.6 % of the SIROF and 44.5 % of the EIROF.



Standards related to Fabrication

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