Conferences related to Infant Mortality

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2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

The Internet of Things, including wearable devices and smart home products, will again be a big theme. To cater for the technology trends, the theme of IMPACT-IAAC 2016 highlights "IMPACT on the Next Big Things" and will arrange panel sessions, invited talks, industrial sessions and outstanding paper presentations.


2017 22nd IEEE European Test Symposium (ETS)

The scope of the conference is electronic-based circuits and system testing, including VLSI Test, VLSI Reliability, Yield, diagnosis, DFX, Verification, etc.


2017 26th International Conference on Parallel Architectures and Compilation Techniques (PACT)

PACT aims to bring together researchers from architecture, compilers, applications and languages to present and discuss innovative research of common interest.


2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’17) in conjunction with International Biomedical Engineering Conference of KOSOMBE will be held at International Convention Center (ICC), Jeju Island, Korea from July 11 to 15, 2017. The overall theme of the conference is “Smarter Technology for Healthier World” and will cover diverse topics of cutting-edge research in biomedical engineering, healthcare technology R&D, translational clinical research, technology transfer and entrepreneurship, and biomedical engineering education. The conference program will feature high-profile keynote lectures, minisymposia, workshops, invited sessions, oral and poster sessions, sessions for students and young professions, sessions for clinicians and entrepreneurs, and exhibitions.


2017 40th International Spring Seminar on Electronics Technology (ISSE)

The main focus of the ISSE is both directed in bringing deeper knowledge and information ofelectronics technology, and, especially for young researchers, to increase or confirm amotivation for intensifying their engagement in the field of electrical engineering. The conferencewill be accompanied by an exhibition of commercial industrial exhibitors, which gives a greatmarketing opportunity to reach a broad segment of professionals in the field of electronicstechnology. The conference is an effective crucial point for institutions, government officials,pioneering engineers, academics, experienced and young researchers and many otherprofessionals working on relevant fields to discuss the current challenges and to provide up-todateknowledge

  • 2016 39th International Spring Seminar on Electronics Technology (ISSE)

    The main focus of the ISSE is both directed in bringing deeper knowledge and information of electronics technology, and, especially for young researchers, to increase or confirm a motivation for intensifying their engagement in the field of electrical engineering. The conference will be accompanied by an exhibition of commercial industrial exhibitors, which gives a great marketing opportunity to reach a broad segment of professionals in the field of electronics technology. The conference is an effective crucial point for institutions, government officials, pioneering engineers, academics, experienced and young researchers and many other professionals working on relevant fields to discuss the current challenges and to provide up-to-date knowledge.

  • 2015 38th International Spring Seminar on Electronics Technology (ISSE)

    Focus: Novel Trends in Electronics Manufacturing. The International Spring Seminar on Electronics Technology (ISSE) is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world. Topics include experimental and theoretical work in a very wide-spread field of electronics and micro/nanoelectronics technology, manufacturing, packaging and advanced research. Based on a combination of oral and poster presentations as well as individual meetings, professors, industrial participants, students, senior and junior researchers come together in a unique forum to discuss scientific and educational topics and organize international cooperation during the five-day event.

  • 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology (ISSE) is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world. Topics include experimental and theoretical work in a very wide-spread field of electronics and micro/nanoelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors, students, senior and junior researchers come together in a unique forum to discuss scientific and educational topics and organize international cooperation in a convenient atmosphere during the conference days.

  • 2013 36th International Spring Seminar on Electronics Technology (ISSE)

    This international conference focusses on exchange of information between senior and young scientists from academic communities and electronic industries. Since 1977 the conference has been hosted by different Eureopean universities.

  • 2012 35th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2011 34th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2010 33rd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

  • 2009 32nd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide -spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senio

  • 2008 31st International Spring Seminar on Electronics Technology (ISSE)

    he International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senior an

  • 2007 30th International Spring Seminar on Electronics Technology (ISSE)

  • 2006 29th International Spring Seminar on Electronics Technology (ISSE)

  • 2005 28th International Spring Seminar on Electronics Technology (ISSE)

  • 2004 27th International Spring Seminar on Electronics Technology (ISSE)

  • 2003 26th International Spring Seminar on Electronics Technology (ISSE)

  • 2001 24th International Spring Seminar on Electronics Technology (ISSE)


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Periodicals related to Infant Mortality

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computers, IEEE Transactions on

Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...


Design & Test of Computers, IEEE

IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...


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Most published Xplore authors for Infant Mortality

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Xplore Articles related to Infant Mortality

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Guaranteeing quality throughout the product life cycle: on-line test and repair to the rescue

B. Bottoms; J. Chung; B. Koenemann; G. Shirley; L. Spainhower Proceedings 19th IEEE VLSI Test Symposium. VTS 2001, 2001

Summary form only given, as follows. The panel will address the following issues: (1) Many of the defect behaviors in very-deep-sub-micron technologies are complex functions of voltage, temperature and input signals. Many of these defects may be just flaws that can cause earlylife failures. Detecting all these defects during production may increase the test cost in terms of resources (e.g., ...


Resilient and Power-Efficient Multi-Function Channel Buffers in Network-on-Chip Architectures

Dominic DiTomaso; Avinash Karanth Kodi; Ahmed Louri; Razvan Bunescu IEEE Transactions on Computers, 2015

Network-on-Chips (NoCs) are quickly becoming the standard communication paradigm for the growing number of cores on the chip. While NoCs can deliver sufficient bandwidth and enhance scalability, NoCs suffer from high power consumption due to the router microarchitecture and communication channels that facilitate inter-core communication. As technology keeps scaling down in the nanometer regime, unpredictable device behavior due to aging, ...


Session Abstract

25th IEEE VLSI Test Symposium (VTS'07), 2007

Is reliability going to be the ultimate barrier to CMOS scaling? Reliability failure modes such as soft errors, erratic bits, transistor aging and infant mortality challenge us now more than ever. Will there be an end to burn-in as we know it? Will system design be able to take some of the load off of the individual IC? This session ...


IDVP (Intra-Die Variation Probe) for System-On-Chip (SoC) Infant Mortality screen

Mohd Azman Abdul Latif; Noohul Basheer Zain Ali; Fawnizu Azmadi Hussin 2011 IEEE International Symposium of Circuits and Systems (ISCAS), 2011

Abstract-Used materials, oxides thicknesses, and ultra-small channel lengths are contributors to the impact of well known reliability issue such as NBTI (Negative Bias Temperature Instability). This paper describes a case study using an Intra-Die Variation Probe (IDVP) test to screen out Infant Mortality (IM) failures. The approach is pursued by applying the learning of yield and reliability on 45 nm ...


Automatic fetal head approximation using Particle Swarm Optimization based Gaussian Elliptical Path

M. Anwar Ma'sum; N. Rahmah; H. R. Sanabila; H. A. Wisesa; W. Jatmiko 2015 International Symposium on Micro-NanoMechatronics and Human Science (MHS), 2015

The number of maternal and infant mortality in Indonesia is high due to the lack of fetal monitoring. In addition, the number of Obstetrics and Gynecology is limited and it centralized in urban area. In order to resolve that problem, we have built fetal head monitoring system. In this work we examine Particle Swarm Optimization for Gaussian Elliptical Path in ...


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Educational Resources on Infant Mortality

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eLearning

Guaranteeing quality throughout the product life cycle: on-line test and repair to the rescue

B. Bottoms; J. Chung; B. Koenemann; G. Shirley; L. Spainhower Proceedings 19th IEEE VLSI Test Symposium. VTS 2001, 2001

Summary form only given, as follows. The panel will address the following issues: (1) Many of the defect behaviors in very-deep-sub-micron technologies are complex functions of voltage, temperature and input signals. Many of these defects may be just flaws that can cause earlylife failures. Detecting all these defects during production may increase the test cost in terms of resources (e.g., ...


Resilient and Power-Efficient Multi-Function Channel Buffers in Network-on-Chip Architectures

Dominic DiTomaso; Avinash Karanth Kodi; Ahmed Louri; Razvan Bunescu IEEE Transactions on Computers, 2015

Network-on-Chips (NoCs) are quickly becoming the standard communication paradigm for the growing number of cores on the chip. While NoCs can deliver sufficient bandwidth and enhance scalability, NoCs suffer from high power consumption due to the router microarchitecture and communication channels that facilitate inter-core communication. As technology keeps scaling down in the nanometer regime, unpredictable device behavior due to aging, ...


Session Abstract

25th IEEE VLSI Test Symposium (VTS'07), 2007

Is reliability going to be the ultimate barrier to CMOS scaling? Reliability failure modes such as soft errors, erratic bits, transistor aging and infant mortality challenge us now more than ever. Will there be an end to burn-in as we know it? Will system design be able to take some of the load off of the individual IC? This session ...


IDVP (Intra-Die Variation Probe) for System-On-Chip (SoC) Infant Mortality screen

Mohd Azman Abdul Latif; Noohul Basheer Zain Ali; Fawnizu Azmadi Hussin 2011 IEEE International Symposium of Circuits and Systems (ISCAS), 2011

Abstract-Used materials, oxides thicknesses, and ultra-small channel lengths are contributors to the impact of well known reliability issue such as NBTI (Negative Bias Temperature Instability). This paper describes a case study using an Intra-Die Variation Probe (IDVP) test to screen out Infant Mortality (IM) failures. The approach is pursued by applying the learning of yield and reliability on 45 nm ...


Automatic fetal head approximation using Particle Swarm Optimization based Gaussian Elliptical Path

M. Anwar Ma'sum; N. Rahmah; H. R. Sanabila; H. A. Wisesa; W. Jatmiko 2015 International Symposium on Micro-NanoMechatronics and Human Science (MHS), 2015

The number of maternal and infant mortality in Indonesia is high due to the lack of fetal monitoring. In addition, the number of Obstetrics and Gynecology is limited and it centralized in urban area. In order to resolve that problem, we have built fetal head monitoring system. In this work we examine Particle Swarm Optimization for Gaussian Elliptical Path in ...


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IEEE-USA E-Books

  • Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.

    Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality. An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The _design of experiments_ statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven-factor design method. This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage. This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment- treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter. * Introduction * Objectives * Stress Overview * Stress Screen Designs * Experiment Overview * The Taguchi Method * Response Variable Results and Conclusions of the Taguchi Experiment * Intra-Experiment Summary * Taguchi Method Conclusion * Terms * Acknowledgments * References



Standards related to Infant Mortality

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IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


IEEE Standard Methodology for Reliability Predictions and Assessment for Electronic Systems Equipment

A standardized medium for developing reliability predictions of electronic systems and equipment.



Jobs related to Infant Mortality

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