Conferences related to Infant Mortality

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 36th International Spring Seminar on Electronics Technology (ISSE)

This international conference focusses on exchange of information between senior and young scientists from academic communities and electronic industries. Since 1977 the conference has been hosted by different Eureopean universities.

  • 2012 35th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2011 34th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2010 33rd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

  • 2009 32nd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide -spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senio


2013 7th Asia Modelling Symposium (AMS)

Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasizing therole of intelligent system and hybrid intelligent systems and soft computing.

  • 2012 6th Asia Modelling Symposium (AMS 2012)

    Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasising the role of intelligent system and hybrid intelligent systems and soft computing.

  • 2011 5th Asia Modelling Symposium (AMS 2011)

    Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasizing the role of intelligent system and hybrid intelligent systems and soft computing.

  • 2010 4th Asia Modelling Symposium (AMS 2010)

    Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasising the role of intelligent system and hybrid intelligent systems and soft computing.


2013 IEEE 19th International On-Line Testing Symposium (IOLTS)

Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques. These needs have increased dramatically with the introduction of very deep submicron and nanometer technologies which adversely impact noise margins, process, voltage and temperature variations, aging and wearout and make integrating on-line testing and fault tolerance mandatory in many modern ICs. The International On-Line Testing Symposium (IOLTS) is an established forum for presenting novel ideas and experimental data on these areas. The symposium also emphasizes on-line testing in the continuous operation of large applications such as wired, cellular and satellite telecommunication, as well as in secure chips.

  • 2012 IEEE 18th International On-Line Testing Symposium (IOLTS 2012)

    Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques. These needs have increased dramatically with the introduction of very deep submicron and nanometer technologies which adversely impact noise margins, process, voltage and temperature variations, aging and wearout and make integrating on-line testing and fault tolerance mandatory in many modern ICs. The International On-Line Testing Symposium (IOLTS) is an established forum for presenting novel ideas and experimental data on these areas. The symposium also emphasizes on-line testing in the continuous operation of large applications such as wired, cellular and satellite telecommunication, as well as in secure chips.

  • 2011 IEEE 17th International On-Line Testing Symposium (IOLTS 2011)

    Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques. These needs have increased dramatically with the introduction of very deep submicron and nanometer technologies which adversely impact noise margins.

  • 2010 IEEE 16th International On-Line Testing Symposium (IOLTS 2010)

    On-Line Testing Techniques, Fault Tolerance.

  • 2009 15th IEEE International On-Line Testing Symposium (IOLTS 2009)

    On-line testing, reliability, dependability, variability, diagnosis, maintenance, fault-tolerance.

  • 2008 14th IEEE International On-Line Testing Symposium (IOLTS 2008)

    Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques.

  • 2007 IEEE International On-Line Testing Symposium (IOLTS 2007)


2013 IEEE 21st International Symposium on Modelling, Analysis & Simulation of Computer and Telecommunication Systems (MASCOTS)

Research discussing methods for simulating and analyzing performance of both computer networks, computer architecture, and storage devices.


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Periodicals related to Infant Mortality

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.


Selected Areas in Communications, IEEE Journal on

All telecommunications, including telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space, and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; communication theory; and wireless communications.



Most published Xplore authors for Infant Mortality

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Xplore Articles related to Infant Mortality

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Guaranteeing quality throughout the product life cycle: on-line test and repair to the rescue

B. Bottoms; J. Chung; B. Koenemann; G. Shirley; L. Spainhower Proceedings 19th IEEE VLSI Test Symposium. VTS 2001, 2001

Summary form only given, as follows. The panel will address the following issues: (1) Many of the defect behaviors in very-deep-sub-micron technologies are complex functions of voltage, temperature and input signals. Many of these defects may be just flaws that can cause earlylife failures. Detecting all these defects during production may increase the test cost in terms of resources (e.g., ...


Microprocessor reliability performance as a function of die location for a 0.25 μ, five layer metal CMOS logic process

W. C. Riordan; R. Miller; J. M. Sherman; J. Hicks 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296), 1999

In this paper, we present the results of multiple correlations between reliability (infant mortality and other reliability metrics) and yield on a die level basis for an advanced microprocessor fabricated using a 0.25 μm, five layer metal CMOS logic process. Traceability information was programmed into each unit; infant mortality of edge die verses center die, effects of unusual sort yield ...


An approach to developing an infant mortality requirement for fiber optic transport systems

C. M. Hamilton; B. R. Lewin IEEE Journal on Selected Areas in Communications, 1988

The approach used in developing an infant mortality requirement for fiber optic transport systems used in Bellcore client networks is described. Two generic parameters are considered: failure rate ratio, which is the ratio of the instantaneous failure rate to the steady-state failure rate, and infant mortality factor, which is the ratio of the expected number of failures in the first ...


A failure-time model for infant-mortality and wearout failure modes

V. Chan; W. Q. Meeker IEEE Transactions on Reliability, 1999

Some populations of electronic devices or other system components are subject to both infant-mortality and wearout failure modes. Typically, interest is in the estimation of reliability metrics such as distribution-quantiles or fraction-failing at a point in time for the population of units. This involves: (1) modeling the failure time; and (2) estimating the parameters of the failure-time distributions, for the ...


Failure analysis of the space Stirling cryocoolers

Xinguang Liu; Yinong Wu; Guohua Lu The Proceedings of 2011 9th International Conference on Reliability, Maintainability and Safety, 2011

With extensive application of infrared detective techniques, Stirling cryocooler, used as an active cooling source, has gained a good chance to prosper because of its special advantages, such as the variability of cooling capacity, compact configuration and non-sensitivity for the satellite attitude. After the cooler's cooling performance can satisfy the mission's request, its reliability level is crucial for its application. ...


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Educational Resources on Infant Mortality

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eLearning

Guaranteeing quality throughout the product life cycle: on-line test and repair to the rescue

B. Bottoms; J. Chung; B. Koenemann; G. Shirley; L. Spainhower Proceedings 19th IEEE VLSI Test Symposium. VTS 2001, 2001

Summary form only given, as follows. The panel will address the following issues: (1) Many of the defect behaviors in very-deep-sub-micron technologies are complex functions of voltage, temperature and input signals. Many of these defects may be just flaws that can cause earlylife failures. Detecting all these defects during production may increase the test cost in terms of resources (e.g., ...


Microprocessor reliability performance as a function of die location for a 0.25 μ, five layer metal CMOS logic process

W. C. Riordan; R. Miller; J. M. Sherman; J. Hicks 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296), 1999

In this paper, we present the results of multiple correlations between reliability (infant mortality and other reliability metrics) and yield on a die level basis for an advanced microprocessor fabricated using a 0.25 μm, five layer metal CMOS logic process. Traceability information was programmed into each unit; infant mortality of edge die verses center die, effects of unusual sort yield ...


An approach to developing an infant mortality requirement for fiber optic transport systems

C. M. Hamilton; B. R. Lewin IEEE Journal on Selected Areas in Communications, 1988

The approach used in developing an infant mortality requirement for fiber optic transport systems used in Bellcore client networks is described. Two generic parameters are considered: failure rate ratio, which is the ratio of the instantaneous failure rate to the steady-state failure rate, and infant mortality factor, which is the ratio of the expected number of failures in the first ...


A failure-time model for infant-mortality and wearout failure modes

V. Chan; W. Q. Meeker IEEE Transactions on Reliability, 1999

Some populations of electronic devices or other system components are subject to both infant-mortality and wearout failure modes. Typically, interest is in the estimation of reliability metrics such as distribution-quantiles or fraction-failing at a point in time for the population of units. This involves: (1) modeling the failure time; and (2) estimating the parameters of the failure-time distributions, for the ...


Failure analysis of the space Stirling cryocoolers

Xinguang Liu; Yinong Wu; Guohua Lu The Proceedings of 2011 9th International Conference on Reliability, Maintainability and Safety, 2011

With extensive application of infrared detective techniques, Stirling cryocooler, used as an active cooling source, has gained a good chance to prosper because of its special advantages, such as the variability of cooling capacity, compact configuration and non-sensitivity for the satellite attitude. After the cooler's cooling performance can satisfy the mission's request, its reliability level is crucial for its application. ...


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IEEE-USA E-Books

  • Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.

    Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality. An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven- factor design method. This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage. This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment- treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter. Introduction Objectives Stress Overview Stress Screen Designs Experiment Overview The Taguchi Method Response Variable Results and Conclusions of the Taguchi Experiment Intra-Experiment Summary Taguchi Method Conclusion Terms Acknowledgments References



Standards related to Infant Mortality

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IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


IEEE Standard Methodology for Reliability Predictions and Assessment for Electronic Systems Equipment

A standardized medium for developing reliability predictions of electronic systems and equipment.



Jobs related to Infant Mortality

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