Conferences related to Infant Mortality

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 36th International Spring Seminar on Electronics Technology (ISSE)

This international conference focusses on exchange of information between senior and young scientists from academic communities and electronic industries. Since 1977 the conference has been hosted by different Eureopean universities.

  • 2012 35th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2011 34th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2010 33rd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

  • 2009 32nd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide -spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senio


2013 7th Asia Modelling Symposium (AMS)

Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasizing therole of intelligent system and hybrid intelligent systems and soft computing.

  • 2012 6th Asia Modelling Symposium (AMS 2012)

    Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasising the role of intelligent system and hybrid intelligent systems and soft computing.

  • 2011 5th Asia Modelling Symposium (AMS 2011)

    Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasizing the role of intelligent system and hybrid intelligent systems and soft computing.

  • 2010 4th Asia Modelling Symposium (AMS 2010)

    Analytical and mathematical modelling and simulation of a variety of application areas within computing science and technology and systems engineering emphasising the role of intelligent system and hybrid intelligent systems and soft computing.


2013 IEEE 19th International On-Line Testing Symposium (IOLTS)

Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques. These needs have increased dramatically with the introduction of very deep submicron and nanometer technologies which adversely impact noise margins, process, voltage and temperature variations, aging and wearout and make integrating on-line testing and fault tolerance mandatory in many modern ICs. The International On-Line Testing Symposium (IOLTS) is an established forum for presenting novel ideas and experimental data on these areas. The symposium also emphasizes on-line testing in the continuous operation of large applications such as wired, cellular and satellite telecommunication, as well as in secure chips.

  • 2012 IEEE 18th International On-Line Testing Symposium (IOLTS 2012)

    Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques. These needs have increased dramatically with the introduction of very deep submicron and nanometer technologies which adversely impact noise margins, process, voltage and temperature variations, aging and wearout and make integrating on-line testing and fault tolerance mandatory in many modern ICs. The International On-Line Testing Symposium (IOLTS) is an established forum for presenting novel ideas and experimental data on these areas. The symposium also emphasizes on-line testing in the continuous operation of large applications such as wired, cellular and satellite telecommunication, as well as in secure chips.

  • 2011 IEEE 17th International On-Line Testing Symposium (IOLTS 2011)

    Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques. These needs have increased dramatically with the introduction of very deep submicron and nanometer technologies which adversely impact noise margins.

  • 2010 IEEE 16th International On-Line Testing Symposium (IOLTS 2010)

    On-Line Testing Techniques, Fault Tolerance.

  • 2009 15th IEEE International On-Line Testing Symposium (IOLTS 2009)

    On-line testing, reliability, dependability, variability, diagnosis, maintenance, fault-tolerance.

  • 2008 14th IEEE International On-Line Testing Symposium (IOLTS 2008)

    Issues related to on-line testing are increasingly important in modern electronic systems. In particular, the huge complexity of electronic systems has led to growth in reliability needs in several application domains as well as pressure for low cost products. There is a corresponding increasing demand for cost-effective on-line testing techniques.

  • 2007 IEEE International On-Line Testing Symposium (IOLTS 2007)


2013 IEEE 21st International Symposium on Modelling, Analysis & Simulation of Computer and Telecommunication Systems (MASCOTS)

Research discussing methods for simulating and analyzing performance of both computer networks, computer architecture, and storage devices.


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Periodicals related to Infant Mortality

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.


Selected Areas in Communications, IEEE Journal on

All telecommunications, including telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space, and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; communication theory; and wireless communications.




Xplore Articles related to Infant Mortality

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A design reliability methodology for CMOS VLSI circuits

L. Oshiro; R. Radojcic IEEE 1995 International Integrated Reliability Workshop. Final Report, 1995

As integrated circuits become more complex, ensuring product reliability in a timely and efficient manner is becoming more challenging. Historically, the focus has been to manage reliability through robust manufacturing processes. This approach does not address reliability issues associated with IC design. 'Design-for-Reliability' (DFR) methodologies should be incorporated into chip design flow and CAD tools, to meet the submicron challenge. ...


Optimized acoustic microscopy screening for multilayer ceramic capacitors

Andrew D. Kostic; Stanley W. Schwartz 2011 Proceedings - Annual Reliability and Maintainability Symposium, 2011

A program was having a significant number of early life failures due to infant mortality of Multilayer Ceramic Chip Capacitors (MLCC). Board rework was difficult and expensive due to the locations of the MLCC and the complexity of the board. The proposed solution was to develop an improved acoustic microscopy screen for MLCC with latent defects 30 MHz acoustic microscopy ...


An infant mortality and long-term failure rate model for electronic equipment

D. P. Holcomb; J. C. North AT&T Technical Journal, 1985

This paper describes the reliability model used by system designers at AT&T Bell Laboratories to predict component and equipment reliability. A decreasing-failure-rate Weibull model describes the high incidence of early- life failures, or infant mortality. This is combined with the constant- failure-rate (exponential) model traditionally and widely used for the long term. Formal modeling of both early-life and long-term reliability ...


Accelerated Life Testing and Reliability of High K Multilayer Ceramic Capacitors

W. Minford IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982

The reliability of high K muitilayer ceramic capacitors was evaluated using accelerated life testing. The degradation in insulation resistance was characterized as a function of voltage (two to eight times rated) and temperature (85 to 170°C). The times to failure at a voltage-temperature stress conformed to a iognormai distribution with a standard deviation typically less than 0.5. A small infant ...


Reliability concerns and packaging issues of non-hermetic VCSEL and LED based transceivers for the enterprise market

W. S. Ring; P. Thambinayagem; W. Hobson; H. Meehan; P. Silbermann; M. Liang 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004

In this paper we describe the lead frame based packaging technology used to produce both LED and VCSEL based transceivers. We review the issue of a nonhermetic environment and its effect on LED, PIN and VCSEL based structures. We show some of the distinct failure modes observed and present data on open lead frame assemblies that have been subjected to ...


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Educational Resources on Infant Mortality

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eLearning

A design reliability methodology for CMOS VLSI circuits

L. Oshiro; R. Radojcic IEEE 1995 International Integrated Reliability Workshop. Final Report, 1995

As integrated circuits become more complex, ensuring product reliability in a timely and efficient manner is becoming more challenging. Historically, the focus has been to manage reliability through robust manufacturing processes. This approach does not address reliability issues associated with IC design. 'Design-for-Reliability' (DFR) methodologies should be incorporated into chip design flow and CAD tools, to meet the submicron challenge. ...


Optimized acoustic microscopy screening for multilayer ceramic capacitors

Andrew D. Kostic; Stanley W. Schwartz 2011 Proceedings - Annual Reliability and Maintainability Symposium, 2011

A program was having a significant number of early life failures due to infant mortality of Multilayer Ceramic Chip Capacitors (MLCC). Board rework was difficult and expensive due to the locations of the MLCC and the complexity of the board. The proposed solution was to develop an improved acoustic microscopy screen for MLCC with latent defects 30 MHz acoustic microscopy ...


An infant mortality and long-term failure rate model for electronic equipment

D. P. Holcomb; J. C. North AT&T Technical Journal, 1985

This paper describes the reliability model used by system designers at AT&T Bell Laboratories to predict component and equipment reliability. A decreasing-failure-rate Weibull model describes the high incidence of early- life failures, or infant mortality. This is combined with the constant- failure-rate (exponential) model traditionally and widely used for the long term. Formal modeling of both early-life and long-term reliability ...


Accelerated Life Testing and Reliability of High K Multilayer Ceramic Capacitors

W. Minford IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982

The reliability of high K muitilayer ceramic capacitors was evaluated using accelerated life testing. The degradation in insulation resistance was characterized as a function of voltage (two to eight times rated) and temperature (85 to 170°C). The times to failure at a voltage-temperature stress conformed to a iognormai distribution with a standard deviation typically less than 0.5. A small infant ...


Reliability concerns and packaging issues of non-hermetic VCSEL and LED based transceivers for the enterprise market

W. S. Ring; P. Thambinayagem; W. Hobson; H. Meehan; P. Silbermann; M. Liang 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004

In this paper we describe the lead frame based packaging technology used to produce both LED and VCSEL based transceivers. We review the issue of a nonhermetic environment and its effect on LED, PIN and VCSEL based structures. We show some of the distinct failure modes observed and present data on open lead frame assemblies that have been subjected to ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.

    Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality. An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven- factor design method. This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage. This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment- treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter. Introduction Objectives Stress Overview Stress Screen Designs Experiment Overview The Taguchi Method Response Variable Results and Conclusions of the Taguchi Experiment Intra-Experiment Summary Taguchi Method Conclusion Terms Acknowledgments References



Standards related to Infant Mortality

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IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


IEEE Standard Methodology for Reliability Predictions and Assessment for Electronic Systems Equipment

A standardized medium for developing reliability predictions of electronic systems and equipment.



Jobs related to Infant Mortality

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