855 resources related to Burn In
- Topics related to Burn In
- IEEE Organizations related to Burn In
- Conferences related to Burn In
- Periodicals related to Burn In
- Most published Xplore authors for Burn In
2015 IEEE International Reliability Physics Symposium (IRPS)
Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components
2013 IEEE International Integrated Reliability Workshop (IIRW)
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.
Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
Sang-Yun Lee; Jeong Choi; Chen, S.; Wen-Shu Liu; McAllister, K. Electron Device Letters, IEEE, 2002
A simple early detection method of defective devices before burn-in test has been discussed when the defect comes from tungsten side-diffusion through seams in premetal dielectric film. Tunneling current through thin remaining premetal dielectric film along seams caused by the tungsten side-diffusion has been measured and analyzed. Using the proposed early detection method, it becomes easy to compare seam formation ...
Holzhauser, S.; Narr, A. Integrated Reliability Workshop Final Report, 1999. IEEE International, 1999
We have found a suitable methodology to establish the influence of Burn In (BI) stress on transistor lifetime with respect to decreasing transistor channel lengths and simultaneously increasing energy of accelerated electrons by higher electric fields during BI. This paper describes the details of the measurement method and a transformation model, which allows us to calculate the BI influence on ...
Way Kuo; Yue Kuo Proceedings of the IEEE, 1983
System screening during electronic equipment manufacturing often cost- effective opportunities to remove and replace defective items. Burn-in is an important screening method used in predicting, achieving, and enhancing field reliability. Based on a simple calculation, we would expect the number of failures in the field to be a decreasing function of burn-in period. Especially, the expected number of failures drops ...
Qiao, Q.; Gordon, M.H.; Schmidt, W.F.; Li, L.; Ang, S.S.; Huang, B. Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th, 2000
Contact beam structures for fine pitch (0.5-mm) test socket that will mate with 95/5 lead/tin solder balls (50±5 μm in diameter) were fabricated by conventional integrated circuit processing technology. A range of dimensions for contact beam structure (cross and bridge) were tested for mechanical behavior and electrical performance. Non-linear finite element models (ANSYS 5.5) were used to predict the force ...
Jiann-Fuh Chen; Ching-Lung Chu; Tsu-Hua Ai; Ching-Lien Huang Power Electronics Specialists Conference, 1993. PESC '93 Record., 24th Annual IEEE, 1993
In the burn-in test of three-phase online uninterruptible power supply (UPS) system, RLC is usually used as a load in the conventional method. For saving energy and decreasing the test cost of UPS, the energy feedback method is proposed to apply the test of the online UPS. In this method, the utility system is used instead of a load. A ...
Ellis, Wayne Effects of Reliability Mechanisms On VLSI Circuit Functionality, 2004
This tutorial discusses examples of reliability mechanisms and how these can affect the normal operation of selected VLSI circuits. Large circuit-count ASIC chips use standard digital and analog circuits such as Logic gates, eSRAM, eDRAM and I/O circuits which must function properly under various voltage and thermal environments. These chips are subjected to Reliability Screens such as Burn In to ...
No standards are currently tagged "Burn In"
- Assistant/Associate Professor of Electrical Computer Engineering
Univ. of MO-Kansas City Sch of Comp & Eng.
- 2nd Shift - Fabricator Operator/Paint Line -Fayetteville, NC
- Site Security Specialist