Conferences related to Burn In

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2014 IEEE International Reliability Physics Symposium (IRPS)

reliability, physics, irps


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliab

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling


2012 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 2012

This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.



Periodicals related to Burn In

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.




Xplore Articles related to Burn In

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An experiment of burn-in time reduction based on parametric test analysis

Sumikawa, N.; Wang, L.-C.; Abadir, M.S. Test Conference (ITC), 2012 IEEE International, 2012

Burn-in is a common test approach to screen out unreliable parts. The cost of burn-in can be significant due to long burn-in periods and expensive equipment. This work studies the potential of using parametric test data to reduce the time of burn-in. The experiment focuses on developing parametric test models based on test data collected after 10 hours of burn-in ...


Thermal management of integrated circuits in burn-in environment

Bing Bai; Shaobo Chen; Weiming Wang; Hongwei Hao; Luming Li Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on, 2011

Burn-in screening test technology has been an important method to ensure integrated circuits (IC) quality and reliability. But there are many problems remains to be solved during burn-in and accurate junction temperature of IC during burn-in is one of these problems. Leakage currents are rapidly increasing with CMOS IC technology scaling, and this will lead to high junction temperature of ...


Wafer level burn-in

Conti, D.R.; Van Horn, J. Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th, 2000

Is it the industry's intent to apply wafer-level burn-in (WLBI) to MPUs and ASICs? Package-level burn-in (PLBI) today is facing escalating burn-in power dissipation for these MPU and ASIC devices. The burn-in board (BIB) density (devices/BIB) varies inversely with device power dissipation. However, wafer- level burn-in would indicate the opposite-more devices in a 200 mm diameter. Is it the industry's ...


An device case temperature closed-loop control system during burn-in test

Qingfeng Li; Shaobo Chen; Weiming Wang; Luming Li Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on, 2011

Burn-in is used to force the failure of marginal devices before using into products. Usually devices are placed in a burn-in oven. The burn-in time mainly depends on the device junction temperature, so the junction temperature control is very important during burn-in test. Usually the oven ambient temperature is closed-loop controlled during burn-in, but the device junction temperature is open-loop, ...


On optimal burn-in procedures - a generalized model

Ji Hwan Cha Reliability, IEEE Transactions on, 2005

Burn-in is a manufacturing technique that is intended to eliminate early failures. In this paper, burn-in procedures for a general failure model are considered. There are two types of failure in the general failure model. One is Type I failure (minor failure), which can be removed by a minimal repair or a complete repair; and the other is Type II ...


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Educational Resources on Burn In

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eLearning

Effects of Reliability Mechanisms On VLSI Circuit Functionality

Ellis, Wayne Effects of Reliability Mechanisms On VLSI Circuit Functionality, 2004

This tutorial discusses examples of reliability mechanisms and how these can affect the normal operation of selected VLSI circuits. Large circuit-count ASIC chips use standard digital and analog circuits such as Logic gates, eSRAM, eDRAM and I/O circuits which must function properly under various voltage and thermal environments. These chips are subjected to Reliability Screens such as Burn In to ...


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Standards related to Burn In

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