Conferences related to Well Logging

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2019 IEEE Pulsed Power & Plasma Science (PPPS)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference


2018 14th IEEE International Conference on Signal Processing (ICSP)

ICSP2018 includes sessions on all aspects of theory, design and applications of signal processing. Prospective authors are invited to propose papers in any of the following areas, but not limited to: A. Digital Signal Processing (DSP)B. Spectrum Estimation & ModelingC. TF Spectrum Analysis & WaveletD. Higher Order Spectral AnalysisE. Adaptive Filtering &SPF. Array Signal ProcessingG. Hardware Implementation for Signal ProcessingH Speech and Audio CodingI. Speech Synthesis & RecognitionJ. Image Processing & UnderstandingK. PDE for Image ProcessingL.Video compression &StreamingM. Computer Vision & VRN. Multimedia & Human-computer InteractionO. Statistic Learning & Pattern RecognitionP. AI & Neural NetworksQ. Communication Signal processingR. SP for Internet and Wireless CommunicationsS. Biometrics & AuthentificationT. SP for Bio-medical & Cognitive ScienceU


2018 15th International Symposium on Wireless Communication Systems (ISWCS)

The aim of this symposium is to provide a forum for researchers and technologists to present new ideas and contributions in the form of technical papers, panel discussions, as well as real-world evaluation in the field of wireless communications, networking and signal processing.The symposium will bring together various wireless communication systems developers to discuss the current status, technical challenges, standards, fundamental issues, and future services and applications.

  • 2017 International Symposium on Wireless Communication Systems (ISWCS)

    This event will bring together experts from various research and industry fields of wireless communications, as well as representatives of standardization and regulatory bodies. In that context we foresee focusing on highly-innovative and state-of-the-art contributions in the form of original technical papers, demos or products and achievements shown at the accompanying exhibition.

  • 2016 International Symposium on Wireless Communication Systems (ISWCS)

    The Thirteen International Symposium on Wireless Communication Systems (ISWCS’16) will follow the over ten-year long traditionof that event which will bring together experts from various research and industry fields of wireless communications, as well as representatives of standardization and regulatory bodies. In that context we foresee focusing on highly-innovative and state-of-the-art contributions in the form of original technical papers, demos or products and achievements shown at the accompanying exhibition.

  • 2015 International Symposium on Wireless Communication Systems

    The aim of this symposium is to provide a forum for researchers and technologists to present new ideas and contributions in the form of technical papers, panel discussions as well as real-world evaluation of many ideas in wireless communications, networking and signal processing. This twelfth edition of the symposium will bring together various wireless communication systems developers to discuss the current status, technical challenges, standards, fundamental issues, and future services and applications. ISWCS’15 seeks to address and capture highly-innovative and state-of-the-art research from academia and the wireless industry, as well as standardization advances. The scope of the conference includes a wide range of technical challenges encompassing wireless communications, information theory, quality of service support, networking, signal processing, cross-layer design for improved performance, and future wireless broadband systems.

  • 2014 11th International Symposium on Wireless Communications Systems (ISWCS)

    Wireless communications are at the heart of a new field characterized by smart and flexible transceiver concepts, the convergence of systems and technologies, and the development of technologies with a user-centric focus. In this context, the objective of the ISWCS'2014 is to provide a recognized and dynamic forum for researchers and engineers from academia and industry to present and to discuss original ideas and contributions in all fields related to mobile wireless communication systems, and to capture highly-innovative and state-of-the-art research from academia, the wireless industry as well as standardization advances, and to present novel contributions in the form of tutorials, panel discussions, keynote speeches, technical papers, and posters. The scope of the conference includes a wide range of technical challenges encompassing wireless communications and networking, quality of service, signal processing, cross layer design, broadband access, and cooperative communication.

  • 2013 Tenth International Symposium on Wireless Communications Systems (ISWCS)

    wireless communications systems

  • 2012 9th International Symposium on Wireless Communication Systems (ISWCS 2012)

    The scope of the conference includes wireless communications, quality of service support, wireless networking, signal processing, cross layer air interface design and wireless broadband access.

  • 2011 8th International Symposium on Wireless Communication Systems (ISWCS 2011)

    ISWCS'11 seeks to address and capture highly innovative and state-of-the-art research from academia, the wireless industry and standardization bodies. The scope of the conference includes technical challenges encompassing wireless communications, quality of service support, wireless networking, signal processing, cross-layer air interface design, wireless broadband access and cooperative communication.

  • 2010 7th International Symposium on Wireless Communication Systems (ISWCS 2010)

    wireless and mobile communications, signal processing, networking, cognitive radio.

  • 2009 6th International Symposium on Wireless Communication Systems (ISWCS 2009)

    ISWCS 09 seeks to address highly-innovative research as well as wireless industry and standardization bodies contributions. The scope of the conference includes a wide range of technical challenges encompassing wireless communications and networking, quality of service support, cross-layer air interface design for improved performance, wireless broadband access, and cooperative networking.

  • 2008 IEEE International Symposium on Wireless Communication Systems (ISWCS 2008)

    Wireless communications is at the centre of a new and passionate era for telecommunications. The IEEE International Symposium on Wireless Communication Systems (ISWCS) positions itself as a recognised and dynamic forum for researchers and technologists to present and discuss original ideas in all fields related to wireless communication systems.

  • 2007 IEEE International Symposium on Wireless Communication Systems (ISWCS 2007)

    Identify and discuss the future technical challenges and business opportunities arising in the path towards the realization of ambient wireless communication networks. Together with the technical sessions, the symposium will feature tutorials and keynote presentations from leading wireless communication experts from industry, academia and regulatory and standardization bodies.

  • 2006 3rd International Symposium on Wireless Communication Systems (ISWCS 2006)

  • 2005 2nd International Symposium on Wireless Communication Systems (ISWCS 2005)

  • 2004 1st International Symposium on Wireless Communication Systems (ISWCS 2004)


2018 20th International Conference on Advanced Communication Technology (ICACT)

With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by GIRI

  • 2017 19th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by

  • 2016 18th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by GiRI.

  • 2015 17th International Conference on Advanced Communication Technology (ICACT)

    With technically co-sponsored by IEEE ComSoc(Communications Society), IEEE ComSoc CISTC(Communications & Information Security Technical Community), and IEEE ComSoc ONTC(Optical Networking Technical Community), the ICACT(International Conference on Advanced Communications Technology) Conference has been providing an open forum for scholars, researchers, and engineers to the extensive exchange of information on newly emerging technologies, standards, services, and applications in the area of the advanced communications technology. The conference official language is English. All the presented papers have been published in the Conference Proceedings, and posted on the ICACT Website and IEEE Xplore Digital Library since 2004. The honorable ICACT Out-Standing Paper Award list has been posted on the IEEE Xplore Digital Library also, and all the Out-Standing papers are subjected to the invited paper of the "ICACT Transactions on the Advanced Communications Technology" Journal issued by GiRI.

  • 2014 16th International Conference on Advanced Communication Technology (ICACT)

    Technology, service, architecture, strategy, and policy in newly emerging system, standard, service, and variety of application on the area of telecommunications. ICACT 2014 provides an open forum for scholar, researcher, engineer, policy maker, network planner, and service provider in the advanced communication technologies.

  • 2013 15th International Conference on Advanced Communication Technology (ICACT)

    Technology, standard, service, architecture, strategy, and policy in newly emerging systems and a variety of applications in the area of communications. ICACT2013 provides an open forum for scholar, researcher, engineer, policy maker, network planner, and service provider in the advanced communications technologies.

  • 2012 14th International Conference on Advanced Communication Technology (ICACT)

    Technology, service, architecture, strategy, and policy in newly emerging systems, standards, service, and a variety of applications in the area of telecommunicatons. ICACT 2012 provides an open forum for scholars, researchers, engineers, policy makers, network planners, and service providers in the advanced communication technologies.

  • 2011 13th International Conference on Advanced Communication Technology (ICACT)

    International Conference on Advanced Communication Technology (ICACT) provides an open forum for researchers, engineers, policy, network planners, and service providers in the advanced communication technologies. Extensive exchange of information will be provided on newly emerging systems, standards, services, and variety of applications on the area of telecommunications.

  • 2010 12th International Conference on Advanced Communication Technology (ICACT)

    ICACT is an annual conference providing an open forum for researchers, engineers, network planners, and service providers in telecommunications. Extensive exchange of information will be provided on newly emerging systems, standards, services, and variety of applications in the area of telecommunications.

  • 2009 11th International Conference on Advanced Communication Technology (ICACT)

    ICACT is an annual conference providing an open forum for researchers, engineers, network planners, and service providers in telecommunications. Extensive exchange of information will be provided on newly emerging systems, standards, services, and variety of applications in the area of telecommunications.

  • 2008 10th International Conference Advanced Communication Technology (ICACT)

  • 2007 9th International Conference Advanced Communication Technology (ICACT)

  • 2006 8th International Conference Advanced Communication Technology (ICACT)

  • 2005 7th International Conference Advanced Communication Technology (ICACT)

  • 2004 6th International Conference Advanced Communication Technology (ICACT)


2018 25th IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE Signal Processing Society, is the premier forum for the presentation of technological advances and research results in the fields of theoretical, experimental, and applied image and video processing. ICIP 2018, the 25th in the series that has been held annually since 1994, brings together leading engineers and scientists in image and video processing from around the world.


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Periodicals related to Well Logging

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


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Most published Xplore authors for Well Logging

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Xplore Articles related to Well Logging

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Compact pseudoanalytic formulations of coaxial coil antennas in a cylindrically multilayered medium for well-logging applications

[{u'author_order': 1, u'affiliation': u"Jilin University, People's Republic of China", u'full_name': u'Decheng Hong'}, {u'author_order': 2, u'affiliation': u"Harbin Institute of Technology, People's Republic of China", u'full_name': u'Yang Yu'}, {u'author_order': 3, u'affiliation': u"Chongqing University of Posts and Telecommunication, People's Republic of China", u'full_name': u'Yi Ren'}, {u'author_order': 4, u'affiliation': u'Duke University, USA', u'full_name': u'Wei-Feng Huang'}, {u'author_order': 5, u'affiliation': u'Duke University, USA', u'full_name': u'Qing Huo Liu'}] IET Microwaves, Antennas & Propagation, 2018

In this study, the authors present a set of compact and no-overflow formulations to calculate the response of logging tools with coaxial coil antennas in a concentric cylindrically multilayered formation. It can be applied to fast forward computation and the inverse problem for electromagnetic well-logging. The tool mandrel can be cylindrically multilayered, and the electrical parameters of each layer are ...


Some recent improvements in modeling of electromagnetic well-logging sensors via numerical mode-matching

[{u'author_order': 1, u'affiliation': u'Engineering Center, Federal University of Pelotas, Pelotas, RS 96010-020, Brazil', u'full_name': u'Maiquel S. Canabarro'}, {u'author_order': 2, u'affiliation': u'Center for Telecommunications Studies, Pontifical Catholic University of Rio de Janeiro, Rio de Janeiro, RJ 22451-900, Brazil', u'full_name': u'Guilherme S. Rosa'}, {u'author_order': 3, u'affiliation': u'Center for Telecommunications Studies, Pontifical Catholic University of Rio de Janeiro, Rio de Janeiro, RJ 22451-900, Brazil', u'full_name': u'Jos\xe9 R. Bergmann'}, {u'author_order': 4, u'affiliation': u'ElectroScience Laboratory, The Ohio State University, Columbus, OH 43212, USA', u'full_name': u'Fernando L. Teixeira'}] 2017 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC), None

The numerical mode-matching (NMM) technique is a very efficient method to solve the electromagnetic problem of logging-while-drilling (LWD) sensors for geophysical prospecting. In this paper we present recent trends that have improved the numerical efficiency of the traditional NMM. Two NMM formulations are discussed here, with focus on its main relevant upgrades compared to previous approaches. We present numerical results ...


A Perturbation Method to Model Electromagnetic Well-Logging Tools in Curved Boreholes

[{u'author_order': 1, u'affiliation': u'Department of Electrical Engineering, Center for Telecommunications Studies, Pontifical Catholic University of Rio de Janeiro, Rio de Janeiro, Brazil', u'full_name': u'Guilherme S. Rosa'}, {u'author_order': 2, u'affiliation': u'Department of Electrical Engineering, Center for Telecommunications Studies, Pontifical Catholic University of Rio de Janeiro, Rio de Janeiro, Brazil', u'full_name': u'Jos\xe9 R. Bergmann'}, {u'author_order': 3, u'affiliation': u'Department of Electrical and Computer Engineering, Electroscience Laboratory, The Ohio State University, Columbus, OH, USA', u'full_name': u'Fernando L. Teixeira'}] IEEE Transactions on Geoscience and Remote Sensing, 2018

Logging-while-drilling (LWD) or measuring-while-drilling tools are routinely used to guide well placement during exploration of hydrocarbons reservoirs. These tools have become fundamental for directional and horizontal drilling operations. In this paper, we present a perturbation method to model electromagnetic fields produced by time-harmonic sources in radially stratified and axially toroidal structures describing LWD tools inside curved boreholes (i.e., boreholes with ...


Automatic Stratification Strategy of Well Logging Curves Based on Wavelet Transform

[{u'author_order': 1, u'affiliation': u'Inst. of Sedimentary Basin, China Univ. of Geosci. (Beijing), Beijing, China', u'full_name': u'Ying Pan'}, {u'author_order': 2, u'affiliation': u'Inst. of Sedimentary Basin, China Univ. of Geosci. (Beijing), Beijing, China', u'full_name': u'Xianghua Meng'}, {u'author_order': 3, u'affiliation': u'Inst. of Sedimentary Basin, China Univ. of Geosci. (Beijing), Beijing, China', u'full_name': u'Ming Ge'}, {u'author_order': 4, u'affiliation': u'Inst. of Sedimentary Basin, China Univ. of Geosci. (Beijing), Beijing, China', u'full_name': u'Shuping Liu'}] 2017 International Conference on Smart Grid and Electrical Automation (ICSGEA), None

Based on the feature analysis of well logging signal noise, we try to establish a well logging noise model in this paper. The problems focus on the implementation of Symlet wavelet and cubic spline wavelet on curves stratification of well logging signal. According to the specialty of well logging signals, we adopt discrete wavelet transform and wavelet packet to be ...


Pseudoanalytical modeling of electromagnetic well-logging sensors inside directional wells

[{u'author_order': 1, u'affiliation': u'Center for Telecommunications Studies, PUC-Rio, Rio de Janeiro, RJ, Brazil', u'full_name': u'Guilherme S. Rosa'}, {u'author_order': 2, u'affiliation': u'Center for Telecommunications Studies, PUC-Rio, Rio de Janeiro, RJ, Brazil', u'full_name': u'Jos\xe9 R. Bergmann'}, {u'author_order': 3, u'affiliation': u'ElectroScience Laboratory, The Ohio State University, Columbus, OH, USA', u'full_name': u'Fernando L. Teixeira'}] 2017 XXXIInd General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), None

Logging-while-drilling (LWD) electromagnetic sensors provide real-time resistivity data of the geophysical Earth formation for oilfield exploration. Proactive geosteering allows the exploration of deviated and horizontal wells by means of real-time adjustments in the drilling direction to steer the well towards a target region. In this paper, we describe a new pseudoanalytical technique to analyze LWD tools inside directional wells by ...


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Educational Resources on Well Logging

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eLearning

No eLearning Articles are currently tagged "Well Logging"

IEEE-USA E-Books

  • Present and Future Needs in High Temperature Electronics for the Well Logging Industry

  • Fabrication of Passive Components for HighTemperature Instrumentation

    Thin-film resistors and capacitors have been fabricated for use in geothermal well-logging tools. The resistors can operate from 25¿¿C-500¿¿C with a temperature coefficient below 100 ppm/¿¿C; capacitors can operate from 25¿¿C-350¿¿C with a similar temperature coefficient. Chemical vapor deposition (CVD) is used to fabricate both resistors and capacitors. The processing is compatible with most microcircuit processes; and resistors, capacitors, interconnecting metallization, and passivation are all produced by CVD and can be integrated on a single substrate. Resistor material is tungsten-silicon, capacitor electrodes and metallization are tungsten, and dielectric material is silicon nitride. Photolithography is used to delineate component geometry.

  • A Summary of HighTemperature Electronics Research and Development

    Current and future needs in automotive, aircraft, space, military, and well logging industries require operation of electronicsat higher temperaturesthan today's accepted limit of 395 K. Without the availability of high-temperature electronics, many systems must operate under derated conditions or must accept severe mass penalties required by coolant systems to maintain electronic temperatures below critical levels. This paper presents ongoing research and development in the electronics community to bring high-temperature electronics to commercial realization. Much of this work was recently reviewed at the FIRST International High-Temperature Electronics Conference held 16-20 June 1991 in Albuquerque, New Mexico.

  • Hybrid A/D Converter for 200C Operation

    This paper describes the design and development of a high performance hybrid 12 bit analog to digital converter, which will operate reliably at 200¿¿C. A product of this type was found to be necessary in areas such as geothermal probing, oil-well logging, jet engine and nuclear reactor monitoring, and other appl ications where the environments may reach temperatures of up to 200¿¿C. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical re1 iabil ity of hybrid circuits at 200¿¿C. Because the circuit design of the A/D converter involved both digital and linear circuitry, this produced an opportunity to evaluate the performance of both technologies at 200¿¿C. Initial mechanical failure modes led to researching more reliable methods of wire bonding and die attachment. The result of this work was a 12 bit A/D converter which will operate at 200¿¿C with .05% linearity, 1% accuracy, 350 ?>Sec conversion time, and only 455mW power consumption. This product also necessitated the development oof a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This sytem totally eliminates the formation of intermetallics at the bonding interface which can lead to bond failure.

  • An Overview of HighTemperature Electronic Device Technologies and Potential Applications

    High-temperature electronics applications are found in combustion systems, well logging, industrial processes, air stagnation points in supersonic aircraft, vehicle brakes, nuclear reactors, and dense electronic packages. We summarize physical effects and materials issues important for reliable operation of semiconductor device technologies at high temperatures (>125¿¿C). We review the high-temperature potential of Si, GaAs, other III-V compounds, and SiC. For completeness, we also comment on nitrides, diamond, and vacuum microelectronics. We conclude that Si on insulator (SOI) technology can be developd readily for small signal operation up to about 300¿¿C. There is some ongoing work in this area. GaAs offers little advantage over Si because of poor device isolation and the lack of reliable contacts above 250¿¿C. Other III-V compounds could be developed for operation to ?>600¿¿C, using processes similar to those used for optoelectronics. There may be a market niche for III-V power devices above 200¿¿C. There is considerable activity in semiconducting SiC, and device functionality has been demonstrated above 600¿¿C. SiC is promising for operation above 300¿¿C, and for power devices at frequencies from de to ?>10 GHz, but it faces numerous challenges to achieve manufacturable status. We attempt to match technologies with application areas.

  • Hybrid Microcircuitry for 300 Operation

    Microelectronic instrumentation for geothermal well logging must operate in ambient temperatures up to 300¿¿C for several hundred hours. This study involved an extensive survey of 25 to 300¿¿C operation of resistors, capacitors, conductors, interconnections, and active devices. Three major selection criteria were: 1) part lifetime of at least 1000 h at 300¿¿C; 2) minimum change in electrical parameters from 25 to 300¿¿C; 3) availability to the common circuit builder (no one of a kind). Certain thick film resistors, capacitors, and conductors were found compatible with such high-temperature operation. In addition, reconstituted mica and aluminum solid electrolytic capacitors were found useful up to 300¿¿C. Simple circuits for a geothermal temperature logging tool have been fabricated using these hybrid materials, components, and Si MOS and JFET devices. Oven tests show satisfactory stability from 25 to 300¿¿C and at least 100-h circuit operation at 300¿¿C.

  • A 55C to +200C 12bit AnalogtoDigital Converter

    This paper describes the design of a 12-bit successive-approximation hybrid analog-to-digital (A/D) converter that is specified to operate over a temperature range of - 55¿¿C to +200¿¿C. This is an important development, especially for the oil well logging industry, since it is now possible to digitize the signal output from a transducer while it is downhole and thereby make the transmitted digital signal less susceptible to noise and interference. Details of the design and construction of the device as well as 1000-h life test data are presented.

  • Scaling CMOS Design Rules for HighTemperature Latchup Immunity

    Existing and emerging needs in the automotive, aircraft, space, and well- logging industries call for operation of electronics at higher temperatures than the traditional 125¿¿C. Temperature requirements for many of these applications, however, do not exceed 250¿¿C. Extending the operation of low- cost junction-isolated CMOS to this temperature is feasible through straightforward changes in process technology, circuit styles, and layout design rules. The greatest challenge in using bulk CMOS at high temperature is latchup, which can be triggered by junction leakage. This article presents an empirical model for the holding voltage of CMOS latchup, which can be used to scale the design rules in a way that maintains latchup robustness at higher temperatures.

  • Service Company Needs

    This presentation considers the high temperature electronics and instrumentation needs of a logging service company. The following topics are addressed: 1) The Well-Logging Function 2) Evolution of the Techniques 3) Problems Due to Market Size 4) Identification of the Key Technologies 5) CMOS and Dielectric Isolation - A Review 6) Passive Components 7) Future Requirements

  • A ZeroInsertionForce Hybrid Circuit Connector for Severe Environments

    A new packaging technology has been developed for complex electronic circuits used in the high-temperature high-vibration environment of oil-well logging instrumentation. Specifically, the design and testing of a 72-pin connector that operates with large area ceramic substrates carryiDg leadless chip- carrier (LCC) devices and other thick film components is considered. The emphasis is on achieving high mechanical and electrical integrity during exposure to severe stress, while allowing easy field replacement of defective hybrid circuits without the need for any special tools to opente the release mechanism. A combination of mechanical shock (100 g levels) aDd vibration (10 g) with an extreme operating temperature range ( - 55 to +200¿¿ C) requires care in the choice of materials and the solution of some special design problems.



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