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2012 Design\, Automation & Test in Europe Conference & Exhibition (DATE 2012)Visit website
DATE is the complete event for the European electronic system and test community. A leading world conference and exhibition\, DATE unites 2\,000 professionals with some 60 exhibiting companies\, cutting edge R&D\, industrial designers and technical managers from around the world.
2011 International Conference on Field Programmable Logic and Applications (FPL)
FPL is the first and largest conference covering the rapidly growing area of field-programmable logic. Its objective is to bring together researchers and industry from all over the world for a wide ranging discussion on FPGAs\, including\, but not limited to: applications\, advanced electronic design automation (EDA)\, novel system architectures\, embedded processors\, arithmetic\, and dynamic reconfiguration.
Minsu Choi; Nohpill Park; Lombardi, Fabrizio; Piuri, V. Instrumentation and Measurement, IEEE Transactions on, 2002
This paper evaluates the quality effectiveness of redundancy utilization in reconfigurable multichip mode (RMCM) systems. Due to reconfigurability, the RMCM system can implement a device with different redundancy levels. A redundancy level is determined by the requirement of fault tolerance (FT) of the device under implementation which can be realized through reconfiguration. No previous work has adequately investigated the effect ...
Yung, M.W.; Little, M.J.; Etchells, R.D.; Nash, J.G. Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on, 1989
A prototype 3-D Computer which demonstrates the feasibility of the stacked wafer approach is discussed. The wafer-scale integrated circuits of the 3-D Computer have been carefully partitioned to enable redundancy to be used to insure high yields. Redundancy approaches, implementation issues, and testability both for the schemes used in the prototype and in future generations of the 3-D Computer are ...
Ganapathy, K.N.; Singh, A.D.; Pradhan, D.K. Solid-State Circuits, IEEE Journal of, 1991
The authors present and analyze large RAM architectures with hierarchical redundancy and determine the optimal redundancy organization for yield enhancement. A two-level redundancy scheme is used for defect tolerance, and the defect distribution is modeled using the compounded Poisson model. The tree random access memory (TRAM), which has been proposed as a design methodology for future multimegabit memories (N. Jarwala ...
Gagnon, Y.; Savaria, Y.; Meunier, M.; Thibeault, C. Defect and Fault Tolerance in VLSI Systems, 1997. Proceedings., 1997 IEEE International Symposium on, 1997
Yield enhancement for fault tolerant circuits with redundancy has been widely studied during the last years. Recent manufacturing technologies have brought out steady and significant improvement regarding contamination and defect density and have forced us to re-evaluate the economical advantages of circuits with redundancy. The main goal of this paper is to propose a realistic cost model for fault tolerant ...
Sharma, D.D.; Meyer, F.J.; Pradhan, D.K. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 1993
To determine the optimal redundancy organization for yield enhancement, redundant and modular memories are analyzed using the center-satellite model. The model suggests that the degree of redundancy for a memory module be determined according to its distance from the periphery of the wafer since the defect density increases as the periphery is neared. Analytical expressions are formulated for the yield ...
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Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...
Measurements and instrumentation utilizing electrical and electronic techniques.
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...
Integrated circuits and systems;VLSI based Architecture and applications; highspeed circuits and interconnect; mixed-signal SoC; speed/area/power/noise tradeoffs in CMOS circuits.