Tungsten

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Tungsten, also known as wolfram, is a chemical element with the chemical symbol W and atomic number 74. (Wikipedia.org)






Conferences related to Tungsten

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2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 IEEE International Power Modulator and High Voltage Conference (IPMHVC)

This conference provides an exchange of technical topics in the fields of Solid State Modulators and Switches, Breakdown and Insulation, Compact Pulsed Power Systems, High Voltage Design, High Power Microwaves, Biological Applications, Analytical Methods and Modeling, and Accelerators.


2018 IEEE-EMBS Conference on Biomedical Engineering and Sciences (IECBES)

IECBES is a series of bi-annual conference since 2010. The conference will provide excellent platform for knowledge exchange between researchers, scientists, academicians and engineers working in the areas of biomedical engineering. It is open for local and international participants.

  • 2016 IEEE EMBS Conference on Biomedical Engineering and Sciences (IECBES)

    IECBES is the flagship conference of EMB Malaysia Chapter. Its scope includes new findings in research areas of Biomedical Engineering with keywords indicated above.

  • 2014 IEEE Conference on Biomedical Engineering and Sciences (IECBES)

    Biomedical Signal and Image Processing:Cardiovascular, Respiratory, Neural, Biomedical Instrumentation & Devices: Sensor, Micro / Nano / Wearable Technology,Biomaterial, Biomimetics, Rehabilitation andTherapeutic Health System, Biomedical Modeling and Simulation, Bioinformatics, Biomechanics and medical robotics, Ergonomics & Human Factors,Healthcare Information System, Telemedicine, eHealth, myHealth.

  • 2012 IEEE EMBS Conference on Biomedical Engineering and Sciences (IECBES 2012)

    Biomedical Signal and Image Processing:Cardiovascular, Respiratory, Neural, Biomedical Instrumentation & Devices: Sensor, Micro / Nano / Wearable Technology,Biomaterial, Biomimetics, Rehabilitation and Therapeutic Health System, Biomedical Modeling and Simulation, Bioinformatics, Biomechanics and medical robotics, Ergonomics & Human Factors,Healthcare Information System, Telemedicine, eHealth, myHealth.

  • 2010 IEEE EMBS Conference on Biomedical Engineering and Sciences (IECBES)

    Biomedical Signal and Image Processing: Cardiovascular, Respiratory, Neural Biomedical Instrumentation & Devices: Sensor, micro/ nano/wearable technology, biomaterial, biomimetic Rehabilitation and Therapeutic Health System Biomedical Modelling and Simulation Bioinformatics Biomechanics and medical robotics Healthcare Information System: Telemedicine, eHealth, mHealth


2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

The Internet of Things, including wearable devices and smart home products, will again be a big theme. To cater for the technology trends, the theme of IMPACT-IAAC 2016 highlights "IMPACT on the Next Big Things" and will arrange panel sessions, invited talks, industrial sessions and outstanding paper presentations.


2017 14th International Conference The Experience of Designing and Application of CAD Systems in Microelectronics (CADSM)

Modeling and simulation of hydro- and gasodynamic processes. New materials in microelectronics. New technology of IC and MEMS industry. Practical realization and industrial application. Problems of technological processes testing. Problems of reliability estimation.Signal processing in radioelectronic systems and telecommunications. Telecommunications and radioelectronic design tools. Electronic and computer tools in biomedical engineering. Methods and tools of digital signal processing.Specialized computer system. Computer system and networks. Data and knowledge bases. Design of MEMS elements. CAD systems for MEMS design.Problemss of optimal design. Object-oriented design methods. Combinatorial and graph tasks of huge size. Constructor design of radioelectronic means. Design solving verification. Thermal problems in microelectronics.Mathematical model of sensors and actuators. Microsystems modeling and design. New microelectronic technologies.


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Periodicals related to Tungsten

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Tungsten

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Xplore Articles related to Tungsten

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IEEE Engineering in Medicine and Biology Group

IEEE Transactions on Biomedical Engineering, 1967

Provides a listing of current staff, committee members and society officers.


Energy Losses in High Current Density Conductors

Rick B. Spielman; Sophie Chantrenne; Dillon H. McDaniel 2007 IEEE 34th International Conference on Plasma Science (ICOPS), 2007

Summary form given only. The Z accelerator at Sandia National Laboratories has reached currents in excess of 20 MA; and the new ZR accelerator, scheduled to come on line later in 2007, will generate currents greater than 26 MA. These very high currents are delivered to loads with characteristic dimensions of ~ 1 cm or less. The resulting linear current ...


Design and performance of a high pressure, flowing liquid dielectric peaking switch

Rainer Bischoff IEEE Transactions on Dielectrics and Electrical Insulation, 2013

A repetitive, high-voltage liquid dielectric switch for high-power microwave (HPM) applications is currently being developed and investigated at the French-German Research Institute of Saint-Louis (ISL). The switch was designed to be implemented in existing coaxial pulse line structures and is being driven by compact modular Marx generators at rise times of about 7 ns and output voltages up to 400 ...


High current density Scandate cathodes

R. Lawrence Ives; George Miram; Lou Falce; Jacob Stiglich; Kim Gunther; Marc Curtis; Steve Schwartzskopf; Ron Witherspoon 2008 IEEE International Vacuum Electronics Conference, 2008

Research is in progress to develop high current density cathodes. Typical M-type cathodes can operate at high current density by elevating the temperature; however, this leads to increased barium diffusion and significantly reduced lifetime. The addition of scandium to the emitter surface lowers the work function and allows high current density operation at lower temperature, thereby, reducing barium diffusion. Unfortunately, ...


Break arcs in inductive circuits and the minimum arc current

K. Suhara Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

A simulation method for voltage and current waveforms of break arcs in inductive circuits was developed. This method is based on Holm's diagrammatical method. The minimum arc current (Imin) plays an important role, limiting the lowest value of the arc current. The calculation was carried out for a tungsten contact and compared with experimental results. The comparison has made it ...


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Educational Resources on Tungsten

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eLearning

IEEE Engineering in Medicine and Biology Group

IEEE Transactions on Biomedical Engineering, 1967

Provides a listing of current staff, committee members and society officers.


Energy Losses in High Current Density Conductors

Rick B. Spielman; Sophie Chantrenne; Dillon H. McDaniel 2007 IEEE 34th International Conference on Plasma Science (ICOPS), 2007

Summary form given only. The Z accelerator at Sandia National Laboratories has reached currents in excess of 20 MA; and the new ZR accelerator, scheduled to come on line later in 2007, will generate currents greater than 26 MA. These very high currents are delivered to loads with characteristic dimensions of ~ 1 cm or less. The resulting linear current ...


Design and performance of a high pressure, flowing liquid dielectric peaking switch

Rainer Bischoff IEEE Transactions on Dielectrics and Electrical Insulation, 2013

A repetitive, high-voltage liquid dielectric switch for high-power microwave (HPM) applications is currently being developed and investigated at the French-German Research Institute of Saint-Louis (ISL). The switch was designed to be implemented in existing coaxial pulse line structures and is being driven by compact modular Marx generators at rise times of about 7 ns and output voltages up to 400 ...


High current density Scandate cathodes

R. Lawrence Ives; George Miram; Lou Falce; Jacob Stiglich; Kim Gunther; Marc Curtis; Steve Schwartzskopf; Ron Witherspoon 2008 IEEE International Vacuum Electronics Conference, 2008

Research is in progress to develop high current density cathodes. Typical M-type cathodes can operate at high current density by elevating the temperature; however, this leads to increased barium diffusion and significantly reduced lifetime. The addition of scandium to the emitter surface lowers the work function and allows high current density operation at lower temperature, thereby, reducing barium diffusion. Unfortunately, ...


Break arcs in inductive circuits and the minimum arc current

K. Suhara Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts, 1990

A simulation method for voltage and current waveforms of break arcs in inductive circuits was developed. This method is based on Holm's diagrammatical method. The minimum arc current (Imin) plays an important role, limiting the lowest value of the arc current. The calculation was carried out for a tungsten contact and compared with experimental results. The comparison has made it ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Design, Construction, and Manufacture of Squirrel Cage Rotors

    This chapter presents the essential features of the design, construction, and manufacture of squirrel cage induction rotors. It provides knowledge for industrial engineers, who use Motor Current Signature Analysis (MCSA) to determine if there are any cage winding breaks in their squirrel cage induction motors (SCIMs). Die¿¿¿cast windings are used because they are much less expensive to manufacture and more intricate and variable bar shapes can be obtained, since the bars take the form of the slots in the rotor core. The bars in copper or copper alloy windings are most commonly connected to the shorting rings by brazing them together, but some manufacturers have used a tungsten inert gas (TIG) welding process. The chapter summarizes squirrel cage winding design and manufacturing features that should minimize catastrophic failures that can cause consequential damage to other motor parts, including the stator winding.

  • Section 10: Surface Micromachining

    This chapter contains sections titled: * Polycrystalline Silicon Micromechanical Beams * Integrated Fabrication of Polysilicon Mechanisms * Integrated Movable Micromechanical Structures for Sensors and Actuators * Polysilicon Microbridge Fabrication Using Standard CMOS Technology * Process Integration for Active Polysilicon Resonant Microstructures * Fabrication of Micromechanical Devices From Polysilicon Films With Smooth Surfaces * Selective Chemical Vapor Deposition of Tungsten for Microelectromechanical Structures

  • Electron Emission from Metals

    This chapter contains sections titled: Structure of solids, Electron gas in a metal, Work function; electron escape from a metal, Contact difference of poetntial, Thermionic emission, Measurement of thermionic emission, Thermionic emission from pure tungsten, Thermionic emission from thoriated tungsten, Thermionic emission from oxide-coated cathodes, The Schottky effect, Field emission, Secondary emission, Photoelectric emission, Problems

  • The Kenetics of Solution of Tungsten Carbide in Molten Cobalt

    This chapter contains sections titled: Introduction, Previous Work, Experimental Method, Experimental Results, Discussion of Results, Summary, References, Acknowledgements

  • Fabrication of Passive Components for HighTemperature Instrumentation

    Thin-film resistors and capacitors have been fabricated for use in geothermal well-logging tools. The resistors can operate from 25¿¿C-500¿¿C with a temperature coefficient below 100 ppm/¿¿C; capacitors can operate from 25¿¿C-350¿¿C with a similar temperature coefficient. Chemical vapor deposition (CVD) is used to fabricate both resistors and capacitors. The processing is compatible with most microcircuit processes; and resistors, capacitors, interconnecting metallization, and passivation are all produced by CVD and can be integrated on a single substrate. Resistor material is tungsten-silicon, capacitor electrodes and metallization are tungsten, and dielectric material is silicon nitride. Photolithography is used to delineate component geometry.



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