Tungsten

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Tungsten, also known as wolfram, is a chemical element with the chemical symbol W and atomic number 74. (Wikipedia.org)






Conferences related to Tungsten

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2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 18th International Workshop on Junction Technology (IWJT)

IWJT is an open forum focused on the needs and interest of the community of a junction formation technology in semiconductors.


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 IEEE 8th International Nanoelectronics Conferences (INEC)

IEEE-INEC 2018 is the 8th in a series of very successful conferences initiated by Nanotech Chapter of IEEE Singapore Section. It provides an international forum for the presentation and discussion of recent advances in the areas of Nanoelectronics, Nanodevices, Nanosystems and IoT.


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Periodicals related to Tungsten

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Tungsten

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Xplore Articles related to Tungsten

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Thermal Conductivity and Interface Thermal Conductance in Films of Tungsten–Tungsten Silicide on Si

[{u'author_order': 1, u'affiliation': u'Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC, USA', u'full_name': u'Kasichainula Jagannadham'}] IEEE Transactions on Electron Devices, 2014

Samples of tungsten film deposited on Si substrate at room temperature by magnetron sputtering were annealed at different temperatures up to 900 °C in argon atmosphere. X-ray diffraction and scanning electron microscopy were used to follow the changes in the film and determine the formation of WSi2phase along the interface. The formation of WSi2phase has been detected in the sample ...


Influence of Tungsten Doping on the Performance of Indium–Zinc–Oxide Thin-Film Transistors

[{u'author_order': 1, u'affiliation': u'Department of Materials Science, National Engineering Laboratory for TFT-LCD Materials and Technologies, Fudan University, Shanghai, China', u'full_name': u'Honglei Li'}, {u'author_order': 2, u'affiliation': u'Department of Materials Science, National Engineering Laboratory for TFT-LCD Materials and Technologies, Fudan University, Shanghai, China', u'full_name': u'Mingyue Qu'}, {u'author_order': 3, u'affiliation': u'Department of Materials Science, National Engineering Laboratory for TFT-LCD Materials and Technologies, Fudan University, Shanghai, China', u'full_name': u'Qun Zhang'}] IEEE Electron Device Letters, 2013

Thin-film transistors (TFTs) with amorphous indium-zinc-tungsten-oxide (a-IZWO) channel layer and aluminum oxide gate insulator were prepared by radio-frequency magnetron sputtering. It was found that tungsten doping ratios had a significant influence on the performance of the TFTs, and the tungsten incorporation acted as an oxygen vacancy suppressor in the IZWO thin film. The X-ray photoelectron spectroscopy of the a-IZWO thin ...


Scanning Tunneling Microscopy Study of the Spin Hall Effect in Platinum and Highly Resistive Tungsten Films

[{u'author_order': 1, u'affiliation': u'Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA', u'full_name': u'Ting Xie'}, {u'author_order': 2, u'affiliation': u'Department of Physics, University of Maryland, College Park, MD, USA', u'full_name': u'Michael Dreyer'}, {u'author_order': 3, u'affiliation': u'Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA', u'full_name': u'Siddharth Tyagi'}, {u'author_order': 4, u'affiliation': u'Laboratory for Physical Sciences, College Park, MD, USA', u'full_name': u'David Bowen'}, {u'author_order': 5, u'affiliation': u'Laboratory for Physical Sciences, College Park, MD, USA', u'full_name': u'Dan Hinkel'}, {u'author_order': 6, u'affiliation': u'Laboratory for Physical Sciences, College Park, MD, USA', u'full_name': u'R. E. Butera'}, {u'author_order': 7, u'affiliation': u'Laboratory for Physical Sciences, College Park, MD, USA', u'full_name': u'Charles Krafft'}, {u'author_order': 8, u'affiliation': u'Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA', u'full_name': u'Isaak Mayergoyz'}] IEEE Magnetics Letters, 2018

The results of a nanoscale experimental study of the spin Hall effect in platinum and highly resistive tungsten films are reported. These results are obtained by using scanning tunneling microscopy based measurements with tungsten and iron-coated tungsten tips. These measurements reveal an appreciable asymmetry of tunneling currents observed by changing the polarity of tunneling voltages or the direction of electric ...


Initial testing results of scandia-doped tungsten dispenser cathodes

[{u'author_order': 1, u'affiliation': u'Spectra-Mat, Inc, 100 Westgate Dr., Watsonville, CA 95076', u'full_name': u'John Paff'}, {u'author_order': 2, u'affiliation': u'Spectra-Mat, Inc, 100 Westgate Dr., Watsonville, CA 95076', u'full_name': u'Greg Rudd'}, {u'author_order': 3, u'affiliation': u'Spectra-Mat, Inc, 100 Westgate Dr., Watsonville, CA 95076', u'full_name': u'Rob Brox'}, {u'author_order': 4, u'affiliation': u'e beam, Inc, 21070 SW Tile Flat Road, Beaverton, Oregon 97007', u'full_name': u'Bernard Vancil'}] IEEE International Vacuum Electronics Conference, 2014

Spectra-Mat, Inc has developed a kilogram-scalable process for manufacturing scandia-doped tungsten powder for tungsten matrices for high current density cathodes. To validate the powder, diode testing has been performed, with multiple cathodes from a single lot and multiple powder lots. Performance results of that testing as well as initial life test data will be presented. Cathodes are consistently providing 5 ...


Fluorine-free tungsten films as low resistance liners for tungsten fill applications

[{u'author_order': 1, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Jonathan Bakke'}, {u'author_order': 2, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Yu Lei'}, {u'author_order': 3, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Yi Xu'}, {u'author_order': 4, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Kazuya Daito'}, {u'author_order': 5, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Xinyu Fu'}, {u'author_order': 6, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Guoqiang Jian'}, {u'author_order': 7, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Kai Wu'}, {u'author_order': 8, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Raymond Hung'}, {u'author_order': 9, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Rajkumar Jakkaraju'}, {u'author_order': 10, u'affiliation': u'Applied Materials, Inc., Sunnyvale, Ca, USA', u'full_name': u'Nicolas Breil'}] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016

Tungsten (W) chemical vapor deposition (CVD) fill has many applications in the semiconductor industry. As the industry continues to scale feature sizes, many challenges arise as features fall below 20 nm. For several device generations, the standard process scheme has included a TiN adhesion layer to dielectrics and a nucleation W layer for CVD W, but these layers consume most ...


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Educational Resources on Tungsten

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IEEE-USA E-Books

  • The Kenetics of Solution of Tungsten Carbide in Molten Cobalt

    This chapter contains sections titled: Introduction, Previous Work, Experimental Method, Experimental Results, Discussion of Results, Summary, References, Acknowledgements

  • III Technological and Scientific Impact

    None

  • 13 The Age of Algorithms

    I was in Singapore in June 2016 for a week of discussions at the Grand Challenges for Science in the 21st Century conference held by the Nanyang Technological University. The discussions were wide ranging, from cosmology and evolution to science policy.1W. Brian Arthur, an economist with an abiding interest in technology,2pointed out that, in the past, technology was driven by the laws of physics: in the twentieth century, we sought to understand the physical world using differential equations and the mathematics of continuous variables, which vary smoothly across time and space. In contrast, today's technology is driven by algorithms: in the twenty-first century, we seek to understand the nature of complexity in computer science and biology using discrete mathematics and algorithms. Arthur is on the faculty of the Santa Fe Institute in New Mexico, which is one of many centers that sprung up in the twentieth century to investigate complex systems.

  • Electron Emission from Metals

    This chapter contains sections titled: Structure of solids, Electron gas in a metal, Work function; electron escape from a metal, Contact difference of poetntial, Thermionic emission, Measurement of thermionic emission, Thermionic emission from pure tungsten, Thermionic emission from thoriated tungsten, Thermionic emission from oxide-coated cathodes, The Schottky effect, Field emission, Secondary emission, Photoelectric emission, Problems

  • Design, Construction, and Manufacture of Squirrel Cage Rotors

    This chapter presents the essential features of the design, construction, and manufacture of squirrel cage induction rotors. It provides knowledge for industrial engineers, who use Motor Current Signature Analysis (MCSA) to determine if there are any cage winding breaks in their squirrel cage induction motors (SCIMs). Die‐cast windings are used because they are much less expensive to manufacture and more intricate and variable bar shapes can be obtained, since the bars take the form of the slots in the rotor core. The bars in copper or copper alloy windings are most commonly connected to the shorting rings by brazing them together, but some manufacturers have used a tungsten inert gas (TIG) welding process. The chapter summarizes squirrel cage winding design and manufacturing features that should minimize catastrophic failures that can cause consequential damage to other motor parts, including the stator winding.



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