Tungsten

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Tungsten, also known as wolfram, is a chemical element with the chemical symbol W and atomic number 74. (Wikipedia.org)






Conferences related to Tungsten

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2013 26th International Vacuum Nanoelectronics Conference (IVNC)

The IVNC conference is devoted to the science and technology of vacuumelectron sources and their applications.  Discussions will include sourcesbased on vacuum field emission, photo-, and thermal generation, and hotelectron generation via internal tunneling. The conference aims to promoteunderstanding of the physics, structure, chemistry, emission and beamproperties, and fabrication methods of these sources.

  • 2012 25th International Vacuum Nanoelectronics Conference (IVNC)

    IVNC 2012 mainly focuses on fundamentals and appplication on vacuum micro and nano-electronics. The topics include the theory, fabrication, and characterization of vacuum micro/nanoelectronic materials and devices with applications to x-ray sources, lamps, information displays, microwave amplifiers, plasma devices, analytical instruments, satellites, e-beam sources, particle accelerators and sensors.

  • 2011 24th International Vacuum Nanoelectronics Conference (IVNC)

    Actual reports on latest experimental and theoretical advances and recent developments in vacuum micro/nanoelectronics. Topics focus on physics, chemistry, material science and fabrication techniques of cold electron sources for novel device applications. One invited plenary, ten oral and two poster sessions. Several awards for outstanding contributions to young researchers.

  • 2010 23rd International Vacuum Nanoelectronics Conference (IVNC)

    IVNC 2010 will bring together an international body of scientists and engineers to discuss their research in vacuum micro/nano-electronics. Topics discussed include the fabrication, characterizations and theory of vacuum micro/nanoelectronic electron and ion sources. Applications include lithography, flat panel displays, microwave amplifiers, space, plasma devices, analytical instruments and sensors.

  • 2009 22nd International Vacuum Nanoelectronics Conference (IVNC)

    International Vacuum Nanoelectronics Conference (IVNC) is an annual international conference for reports and mutual disucussion of the latest experimental and theoretical advances on recent development in the field of vacuum micor and nanoelectronics.

  • 2008 IEEE 21st International Vacuum Nanoelectronics Conference (IVNC)

    Theory, design, fabrication and application of nano- and micro- devices utilizing ballistic flow of field emited electrons. Theory of field emission, material science of emitting materials, new concepts of devices.

  • 2007 IEEE 20th International Vacuum Nanoelectronics Conference (IVNC)

  • 2006 19th International Vacuum Nanoelectronics Conference (IVNC)


2010 International Conference on Mechanic Automation and Control Engineering (MACE)

Manufacturing Control and Automation Engineering,CAD/CAM/CIM and Simulation, Materials Processing and Control, Instruments and Vibration Control


2008 International Microprocesses and Nanotechnology Conference (MNC)

Lithography, Nanotechnology, Nanoimprint, Bio MEMS, Microsystem



Periodicals related to Tungsten

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Xplore Articles related to Tungsten

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Changes of the physical and mechanical properties of alloys on the base of tungsten carbide exposed by high power ion beams

G. E. Remnev; I. F. Isakov; Y. K. Struts; A. N. Sergeev; S. Y. Rudnev; Y. L. Kutuzov; Yu. Yu. Kulikov; M. N. Ovsyannikov 1994 10th International Conference on High-Power Particle Beams, 1994

This work presents investigated results of the physico-mechanical properties of hard alloys non-resharpened plates' surfaces and alloys, based on tungsten and titanium carbide, treated by 300 ke V high power ion beams. Pulse duration was 60 ns, current density was up to 150 A/cm2. After irradiating the considerable increasing of cobalt concentration of the sirface layers was notable. The pulse ...


Iodine cycle used to eliminate lamp blackening

Electrical Engineering, 1959

None


Multi-channel nerve stimulations using intrafascicular electrodes

K. Yoshida; K. Horch [1990] Proceedings of the Twelfth Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1990

First Page of the Article ![](/xploreAssets/images/absImages/00692235.png)


Colorimetric Analysis for On-Line Arc-Welding Diagnostics by Means of Plasma Optical Spectroscopy

Jesus Mirapeix Serrano; Ruben Ruiz-Lombera; Jose J. Valdiande; Adolfo Cobo; Jose Miguel Lopez-Higuera IEEE Sensors Journal, 2016

In this paper, an analysis on the suitability of employing a colorimetric analysis of the acquired plasma spectra to perform on-line arc-welding quality monitoring will be discussed. Different colorimetric parameters like the color temperature or the parameters associated with the hue, saturation, luminance color space will be evaluated in comparison with the standard approach based on the estimation of the ...


A Semiempirical Evaluation of the Thermal Conductivity in Ablated Dense Tungsten Plasma

Toru Sasaki; Takuya Takahashi; Yusuke Amano; Yasutoshi Miki; Takashi Kikuchi; Nobuhiro Harada; Kazuhiko Horioka IEEE Transactions on Plasma Science, 2012

For understanding the properties of ablated dense tungsten, we have proposed a semiempirical evaluation of thermal conductivity based on the Wiedemann-Franz law. The electrical conductivity of ablated dense tungsten has been evaluated by the exploding-wire discharges in water and the isochoric heating of wire in a vacuum. The results indicate that the thermal conductivity derived from the electrical conductivity ranges ...


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Educational Resources on Tungsten

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eLearning

Changes of the physical and mechanical properties of alloys on the base of tungsten carbide exposed by high power ion beams

G. E. Remnev; I. F. Isakov; Y. K. Struts; A. N. Sergeev; S. Y. Rudnev; Y. L. Kutuzov; Yu. Yu. Kulikov; M. N. Ovsyannikov 1994 10th International Conference on High-Power Particle Beams, 1994

This work presents investigated results of the physico-mechanical properties of hard alloys non-resharpened plates' surfaces and alloys, based on tungsten and titanium carbide, treated by 300 ke V high power ion beams. Pulse duration was 60 ns, current density was up to 150 A/cm2. After irradiating the considerable increasing of cobalt concentration of the sirface layers was notable. The pulse ...


Iodine cycle used to eliminate lamp blackening

Electrical Engineering, 1959

None


Multi-channel nerve stimulations using intrafascicular electrodes

K. Yoshida; K. Horch [1990] Proceedings of the Twelfth Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1990

First Page of the Article ![](/xploreAssets/images/absImages/00692235.png)


Colorimetric Analysis for On-Line Arc-Welding Diagnostics by Means of Plasma Optical Spectroscopy

Jesus Mirapeix Serrano; Ruben Ruiz-Lombera; Jose J. Valdiande; Adolfo Cobo; Jose Miguel Lopez-Higuera IEEE Sensors Journal, 2016

In this paper, an analysis on the suitability of employing a colorimetric analysis of the acquired plasma spectra to perform on-line arc-welding quality monitoring will be discussed. Different colorimetric parameters like the color temperature or the parameters associated with the hue, saturation, luminance color space will be evaluated in comparison with the standard approach based on the estimation of the ...


A Semiempirical Evaluation of the Thermal Conductivity in Ablated Dense Tungsten Plasma

Toru Sasaki; Takuya Takahashi; Yusuke Amano; Yasutoshi Miki; Takashi Kikuchi; Nobuhiro Harada; Kazuhiko Horioka IEEE Transactions on Plasma Science, 2012

For understanding the properties of ablated dense tungsten, we have proposed a semiempirical evaluation of thermal conductivity based on the Wiedemann-Franz law. The electrical conductivity of ablated dense tungsten has been evaluated by the exploding-wire discharges in water and the isochoric heating of wire in a vacuum. The results indicate that the thermal conductivity derived from the electrical conductivity ranges ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Electron Emission from Metals

    This chapter contains sections titled: Structure of solids, Electron gas in a metal, Work function; electron escape from a metal, Contact difference of poetntial, Thermionic emission, Measurement of thermionic emission, Thermionic emission from pure tungsten, Thermionic emission from thoriated tungsten, Thermionic emission from oxide-coated cathodes, The Schottky effect, Field emission, Secondary emission, Photoelectric emission, Problems

  • Fabrication of Passive Components for HighTemperature Instrumentation

    Thin-film resistors and capacitors have been fabricated for use in geothermal well-logging tools. The resistors can operate from 25°C-500°C with a temperature coefficient below 100 ppm/°C; capacitors can operate from 25°C-350°C with a similar temperature coefficient. Chemical vapor deposition (CVD) is used to fabricate both resistors and capacitors. The processing is compatible with most microcircuit processes; and resistors, capacitors, interconnecting metallization, and passivation are all produced by CVD and can be integrated on a single substrate. Resistor material is tungsten-silicon, capacitor electrodes and metallization are tungsten, and dielectric material is silicon nitride. Photolithography is used to delineate component geometry.

  • Section 10: Surface Micromachining

    This chapter contains sections titled: Polycrystalline Silicon Micromechanical Beams Integrated Fabrication of Polysilicon Mechanisms Integrated Movable Micromechanical Structures for Sensors and Actuators Polysilicon Microbridge Fabrication Using Standard CMOS Technology Process Integration for Active Polysilicon Resonant Microstructures Fabrication of Micromechanical Devices From Polysilicon Films With Smooth Surfaces Selective Chemical Vapor Deposition of Tungsten for Microelectromechanical Structures

  • The Kenetics of Solution of Tungsten Carbide in Molten Cobalt

    This chapter contains sections titled: Introduction, Previous Work, Experimental Method, Experimental Results, Discussion of Results, Summary, References, Acknowledgements



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