Conferences related to Testing

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2017 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics


2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2017 IEEE AUTOTESTCON

IEEE AUTOTESTCON is also known as the Systems Readiness Technology Conference. This major conference and exposition provides focus on the maintenance aspects of systems readiness and providing Mission Assurance through Advanced ATE (Automatic Test Equpmenrt/Systems). This includes Maintenance Repair & Overhaul as well as factory and development automated test equipment. This conference brings military and aerospace industry principals together to share new concepts, technologies and applications in this essential field of supportability and sustainability. The conference includes a major exhibit of exciting new products from a wide variety of exhibitors, and provides the opportunity to meet with senior military and aerospace leaders to discuss their future needs and expectations and the ways in which we can satisfy those needs.

  • 2014 IEEE AUTOTEST

    IEEE AUTOTESTCON is the world s only conference that focuses primarily on Automated Test and related technology for military, government and aerospace applications. The conference also has an expanded focus into commercial areas that share a common technical base, including aerospace, vehicle and automotive, and commercial factory test applications. Autotestcon provides a unique opportunity to discuss platform support requirements with all DoD Branches, provides hands-on experience with test equipment, and

  • 2013 IEEE AUTOTESTCON

    Content focused on automatic test systems for US military systems.

  • 2012 IEEE AUTOTESTCON

    Automated Test Systems (ATE) and related technologies such as Test Program Sets for US military and defense equipment

  • 2011 IEEE AUTOTESTCON

    Annual conference of the automatic testing industry.

  • 2010 IEEE AUTOTESTCON

    IEEE AUTOTESTCON, The Support Systems Technology Conference, is the largest conference focused on automatic test systems for military and aerospace systems, and has been held annually since 1965. It features more than 120 quality application-focused papers and 250 Exhibits. Attendance ranges between 650 and 750 registered professionals.

  • 2009 IEEE AUTOTESTCON

    Automated Test, Test Technology, and related Support Systems for Defense Systems.

  • 2008 IEEE AUTOTESTCON

    All theoretical and application aspects for an appropriate topic dealing with system readiness, in general, and automatic test technology, in particular. In keeping with our conference theme "Surpassing the Limits-Forging Ahead" our focus will be on new ideas and concepts, unusual testing solutions, and future technologies, e.g. ATE Architectures, Artificial Intelligence in Test, ATE/TPS Development Techniques, ATE/TPS Management, BIT/BIST

  • 2007 IEEE AUTOTESTCON

  • 2006 IEEE AUTOTESTCON


2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Annual International Symposium and Exhibition for Electromagnetic Compatibility Practitioners

  • 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016

    To provide a forum for networking and exchange of current EMC information.

  • 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015

    The EMC 2015 provides an excellent forum for presentation, discussion and exchange of the latest EMC problems and solutions from universities, research laboratories and industry.

  • 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014

    This conference will cover topics concerning EMC and signal integrity.

  • 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013

    The 2013 IEEE Denver EMC Symposium will cover nearly all aspects of electromagnetic compatibility to offer researchers, practicing engineers, academia, industry, and government agencies to present their progress, discoveries and share their experiences with colleagues and friends from around the globe.

  • 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012

    The 2012 IEEE Pitsburgh EMC Symposium will cover nearly all aspects of electromagnetic compatibility to offer researchers and practicing engineers from academia, industry, and government agencies to present the progress and results of their work, to exchange ideas, and share experiences with colleagues from around the world involved in EMC.

  • 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011

  • 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010

    The annual EMC Society technical symposium that fosters the exchange of current technology, information and networking. The event includes workshops, technical sessions, exhibits, awards banquet, youth and guest programs, technical committee meetings and collateral technical meetings.

  • 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009

    This is the annual conference sponsored by the IEEE EMC Society. There will be workshops, tutorials, special sessions, regular technical paper sessions, exhibitors providing the latest in EMC diagnostic, test and EMC modeling software, student paper contest, student design contest, experiments and demonstrations.

  • 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008

  • 2007 IEEE International Symposium on Electromagnetic Compatibility - EMC 2007

  • 2006 IEEE International Symposium on Electromagnetic Compatibility - EMC 2006


2016 IEEE International Ultrasonics Symposium (IUS)

International Symposium dealing with recent developments on ultrasound, including ultrasound imaging, transducers, non destructuve testing and physical acoustics.

  • 2015 IEEE International Ultrasonics Symposium (IUS)

    Annual meeting of the UFFC Society that is being held regularly. It is focusing on ultrasonics.

  • 2013 IEEE International Ultrasonics Symposium (IUS)

    the joint IUS, ISAF, IFC, and EFTF conference is aimed at bringing the ultrasonics, ferroelectrics, Frequency Control and Time Forum communities around the world together more closely and through discussions on recent research and development of fundamentals, materials, devices, and applications .

  • 2012 IEEE International Ultrasonics Symposium

    The conference will bring together the community of ultrasonics around the world in the center of Europe for discussion and cooperation and to stimulate the research and development in the widespread field of ultrasonic theories and applications


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Periodicals related to Testing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Design & Test of Computers, IEEE

IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...


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Xplore Articles related to Testing

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Invariant Pattern Recognition Using Radial Tchebichef Moments

Bin Xiao; Jian-Feng Ma; Jiang-Tao Cui 2010 Chinese Conference on Pattern Recognition (CCPR), 2010

Radial Tchebichef moments as a discrete orthogonal moment in the polar coordinate have been successfully used in the field of pattern recognition. However, the scaling invariant property of these moments has not been studied due to the complexity of the problem. In this paper, we present a new method to construct a complete set of scaling and rotation invariants extract ...


Production of Tc-99m from naturally occurring molybdenum absent uranium

K. Pagdon; C. Gentile; A. Cohen; G. Ascione; G. Baker 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

Technetium-99m (Tc-99m) is the world's most widely used medical isotope. Current production methods involve the irradiation of highly enriched uranium (HEU) and low enriched uranium (LEU) targets in nuclear reactors. Molybdenum-99 (Mo-99) is then extracted from these targets, which decays to Tc-99m. Currently, this process is centralized, as there are very few companies that manufacture Mo-99. In an effort to ...


Preliminary test and evaluation of non-destructive examination for ITER First Wall development in Korea

Suk-Kwon Kim; Eo Hwak Lee; Jae-Sung Yoon; Hyun-Kyu Jung; Dong Won Lee; Byoung-Yoon Kim 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

ITER First Wall (FW) includes beryllium armour joined to a Cu heat sink with a stainless steel back plate. These first wall panels are one of the critical components in the ITER tokamak with a maximum surface heat flux of 5 MW/m2. So, a qualification test needs to be performed with the goal to qualify the joining technologies required for ...


K Nearest Neighbor Based Local Sparse Representation Classifier

Nan Zhang; Jian Yang 2010 Chinese Conference on Pattern Recognition (CCPR), 2010

The sparse representation-based classifier (SRC) has been developed and shows great potential for pattern classification. SRC is a global representation based method in that a testing sample is represented by all training samples. Thus, it is time-consuming when the training sample size becomes large. This paper presents a local SRC method, called KNN-SRC, which chooses K nearest neighbors of a ...


Turing's Test Revisited

S. Guccione; G. Tamburrini Proceedings of the 1988 IEEE International Conference on Systems, Man, and Cybernetics, 1988

First Page of the Article ![](/xploreAssets/images/absImages/00754236.png)


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Educational Resources on Testing

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eLearning

Invariant Pattern Recognition Using Radial Tchebichef Moments

Bin Xiao; Jian-Feng Ma; Jiang-Tao Cui 2010 Chinese Conference on Pattern Recognition (CCPR), 2010

Radial Tchebichef moments as a discrete orthogonal moment in the polar coordinate have been successfully used in the field of pattern recognition. However, the scaling invariant property of these moments has not been studied due to the complexity of the problem. In this paper, we present a new method to construct a complete set of scaling and rotation invariants extract ...


Production of Tc-99m from naturally occurring molybdenum absent uranium

K. Pagdon; C. Gentile; A. Cohen; G. Ascione; G. Baker 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

Technetium-99m (Tc-99m) is the world's most widely used medical isotope. Current production methods involve the irradiation of highly enriched uranium (HEU) and low enriched uranium (LEU) targets in nuclear reactors. Molybdenum-99 (Mo-99) is then extracted from these targets, which decays to Tc-99m. Currently, this process is centralized, as there are very few companies that manufacture Mo-99. In an effort to ...


Preliminary test and evaluation of non-destructive examination for ITER First Wall development in Korea

Suk-Kwon Kim; Eo Hwak Lee; Jae-Sung Yoon; Hyun-Kyu Jung; Dong Won Lee; Byoung-Yoon Kim 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

ITER First Wall (FW) includes beryllium armour joined to a Cu heat sink with a stainless steel back plate. These first wall panels are one of the critical components in the ITER tokamak with a maximum surface heat flux of 5 MW/m2. So, a qualification test needs to be performed with the goal to qualify the joining technologies required for ...


K Nearest Neighbor Based Local Sparse Representation Classifier

Nan Zhang; Jian Yang 2010 Chinese Conference on Pattern Recognition (CCPR), 2010

The sparse representation-based classifier (SRC) has been developed and shows great potential for pattern classification. SRC is a global representation based method in that a testing sample is represented by all training samples. Thus, it is time-consuming when the training sample size becomes large. This paper presents a local SRC method, called KNN-SRC, which chooses K nearest neighbors of a ...


Turing's Test Revisited

S. Guccione; G. Tamburrini Proceedings of the 1988 IEEE International Conference on Systems, Man, and Cybernetics, 1988

First Page of the Article ![](/xploreAssets/images/absImages/00754236.png)


More eLearning Resources

IEEE-USA E-Books

  • Appendix B

    The first volume ever to cover all aspects of the subject, Architectural Electromagnetic Shielding Handbook provides the practicing architect/engineer with a comprehensive guide to electromagnetic shielding. This practical handbook is a one-stop source for every form of shielding enclosure now used in commercial and government test laboratories, communication and computer centers, and electromagnetic hardened facilities designed to prevent electromagnetic interference (EMI) from reaching either a sensitive piece of equipment or an unauthorized agency. Additional features include: extensive supporting information on penetrations such as doors, vents, piping, and electromagnetic filters for each type of shielding complete descriptions of modular, welded, and architectural forms of shielding as well as design checklists for shielded enclosure installation detailed descriptions of performance specifications and methods of testing necessary to prove performance Now you can have practical design and manufacturing techniques for solving ESD problems associated with sophisticated equipment used in a home or office environment. This book takes the mystery out of ESD by showing how it is generated and how it affects electronic devices, such as integrated circuits. It provides practical guidelines and the rationale on how ESD solutions can work for you.

  • Quality Management

    This chapter contains sections titled: Overview Quality and Innovation Quality Plan Vendor Management during the Testing Program Summary Appendix

  • Appendix C: Selected Bibliography

    The first volume ever to cover all aspects of the subject, Architectural Electromagnetic Shielding Handbook provides the practicing architect/engineer with a comprehensive guide to electromagnetic shielding. This practical handbook is a one-stop source for every form of shielding enclosure now used in commercial and government test laboratories, communication and computer centers, and electromagnetic hardened facilities designed to prevent electromagnetic interference (EMI) from reaching either a sensitive piece of equipment or an unauthorized agency. Additional features include: extensive supporting information on penetrations such as doors, vents, piping, and electromagnetic filters for each type of shielding complete descriptions of modular, welded, and architectural forms of shielding as well as design checklists for shielded enclosure installation detailed descriptions of performance specifications and methods of testing necessary to prove performance Now you can have practical design and manufacturing techniques for solving ESD problems associated with sophisticated equipment used in a home or office environment. This book takes the mystery out of ESD by showing how it is generated and how it affects electronic devices, such as integrated circuits. It provides practical guidelines and the rationale on how ESD solutions can work for you.

  • Automotive Multichip Modules

    This chapter contains sections titled: Introduction Historical Powertrain Electronics Packaging Strategy Automotive Environmental Conditions Design Options Test Development for Motorola QFP [15.5] EMC Testing [15.7] Cost Analysis Summary This chapter contains sections titled: Acknowledgments References Appendix A15: Laminate MicroInterconnect (LMI)

  • Testing REG Algorithms: The TUNA Experiment

    Dale and Reiter's discussion of REG, which was the topic of chapter 4, opened the door to a very focussed study of reference production. By concentrating on a specific version of the reference task, it became possible to test algorithms. This chapter will discuss how their ideas came to be tested, and what one can learn from these tests.

  • Multi-Rule-Set Decision-Making Schemes for A Genetic Algorithm Learning Environment for Classification Tasks

    Over the last three years, we developed an inductive learning environment called DELVAUX for classification tasks that learns PROSPECTOR-style, Bayesian rules from sets of examples, using a genetic algorithm to evolve a population consists of rule-sets. Several problems complicate the search for the best rule-set. First, the search space that is explored by DELVAUX is enormously large, which makes it difficult to predict if a particular solution is a good solution. The second problem is the problem of convergence with outliers that perform well in training but not in testing. This paper describes efforts to alleviate these two problems centering on multi-ruleset learning techniques that learn multiple rule-sets and proposes several decision-making schemes that are employed by the multi-rule-set learning environment to derive a decision. Empirical results are presented that compare the single rule-set learning environment of DELVAUX with several multi-rule-set learning environments that use different decision-making schemes. Moreover, a more sophisticated fitness function for the multi-ruleset learning approach is introduced, and a genetic algorithm approach that finds the "best" multi-rule- set for a given set of rule-sets is discussed.

  • Index

    The first volume ever to cover all aspects of the subject, Architectural Electromagnetic Shielding Handbook provides the practicing architect/engineer with a comprehensive guide to electromagnetic shielding. This practical handbook is a one-stop source for every form of shielding enclosure now used in commercial and government test laboratories, communication and computer centers, and electromagnetic hardened facilities designed to prevent electromagnetic interference (EMI) from reaching either a sensitive piece of equipment or an unauthorized agency. Additional features include: extensive supporting information on penetrations such as doors, vents, piping, and electromagnetic filters for each type of shielding complete descriptions of modular, welded, and architectural forms of shielding as well as design checklists for shielded enclosure installation detailed descriptions of performance specifications and methods of testing necessary to prove performance Now you can have practical design and manufacturing techniques for solving ESD problems associated with sophisticated equipment used in a home or office environment. This book takes the mystery out of ESD by showing how it is generated and how it affects electronic devices, such as integrated circuits. It provides practical guidelines and the rationale on how ESD solutions can work for you.

  • New Machine Winding and Rewind Specifications

    One of the most important factors to achieve long rotor and stator winding life is the purchase specification of the machine, or in the case of an older machine, the specification of the rewind. This chapter focuses on what could also be considered for inclusion in a purchase specification to achieve the desired life and reliability. Technical specifications for new stator and rotor windings and for the refurbishment/repair of existing stator and rotor windings should have some basic content other than technical requirements. The specific requirements that could be included in a technical specification for a new form-wound stator winding rated 3.3 kV and above, which should give assurance of reliable service over the required life is discussed in the chapter. It talks about the possible requirements for inclusion in technical specifications for new and replacement round rotor and salient pole rotor windings.

  • How to FTP Our Software

    Although Inductive Logic Programming (ILP) is generally thought of as a research area at the intersection of machine learning and computational logic, Bergadano and Gunetti propose that most of the research in ILP has in fact come from machine learning, particularly in the evolution of inductive reasoning from pattern recognition, through initial approaches to symbolic machine learning, to recent techniques for learning relational concepts. In this book they provide an extended, up-to-date survey of ILP, emphasizing methods and systems suitable for software engineering applications, including inductive program development, testing, and maintenance.Inductive Logic Programming includes a definition of the basic ILP problem and its variations (incremental, with queries, for multiple predicates and predicate invention capabilities), a description of bottom-up operators and techniques (such as least general generalization, inverse resolution, and inverse implication), an analysis of top-down methods (mainly MIS and FOIL-like systems), and a survey of methods and languages for specifying inductive bias.Logic Programming series

  • Testing and Defect Prevention

    This chapter contains sections titled: Introduction Best Practices for Testing and Code Review Defect Analysis and Prevention Policy for Use of Problem Tracking System Policy for Use of Regression Testing System Examples Acronyms Glossary References Exercises




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