Simulation

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Simulation is the imitation of some real thing, state of affairs, or process. (Wikipedia.org)






Conferences related to Simulation

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2018 IEEE Symposium on VLSI Technology

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2020 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2016 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2014 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2012 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2011 Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2010 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2009 IEEE Symposium on VLSI Technology

    - New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D-system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices

  • 2008 IEEE Symposium on VLSI Technology

  • 2007 IEEE Symposium on VLSI Technology

  • 2006 IEEE Symposium on VLSI Technology


2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2017 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2021 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2015 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2007 IEEE International Electron Devices Meeting (IEDM)

  • 2006 IEEE International Electron Devices Meeting (IEDM)


2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD)

ISPSD is the premier forum for technical discussion in all areas of power semiconductor devices and power integrated circuits. Topics of interest include Device Physics, Device Design, Power Devices, Safe-Operating Area, Reliability, ESD, Process Integration, Modeling, Materials, Circuit Design, Power SoC, Packaging, Thermal Management.


2014 IEEE 40th Photovoltaic Specialists Conference (PVSC)

The PVSC is a technical conference dedicated to the science and application of photovoltaics for solar electricity generation. Technical Program Areas: 1. Fundamentals and New Concepts for Future Technologies 2. Thin Film Polycrystalline Photovoltaics 3. III-V and Concentrator Technologies 4. Crystalline Silicon Technologies 5. Thin Film Silicon Based PV Technologies 6. Organic Photovoltaics 7. Space Technologies 8. Characterization and Measurement Methods 9. PV Modules and Manufacturing 10. PV Systems and Applications 11. PV Velocity Forum


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Periodicals related to Simulation

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for Simulation

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Xplore Articles related to Simulation

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Simulation of thermal-hydraulic transients in the KSTAR PF1 coil using the 4C code

R. Zanino; A. Kholia; L. Savoldi Richard; Y. Chu; S. H. Park; H. J. Lee 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

KSTAR is a fully superconducting tokamak, in operation since 2008 at the National Fusion Research Institute in Korea. All coils are wound using cable- in-conduit conductors and cooled with forced-flow supercritical helium (SHe) at 4.5 K and 5.5 bar. We consider here the central pair, PF1U/L, of the central solenoid coils; during operation these coils are subjected to sharp current ...


Calculation of stray magnetic field effects on the operation of the ITER electron cyclotron system

F. Li; S. Alberti; J. -Ph. Hogge; I. Gr. Pagonakis 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

In a multi-gyrotron system such as the one presently designed for the ITER ECH & ECCD system, stray magnetic fields can significantly alter the operational capabilities of the global system. A numerical study was carried out within the European Gyrotron Consortium (EGYC) to assess the importance of the different effects and their impact on the gyrotron operation. Using the Ariadne++ ...


Broadband CPW-fed RFID Antenna at 2.45/5.80 GHz

D. Ma; W. X. Zhang 2007 International Workshop on Anti-Counterfeiting, Security and Identification (ASID), 2007

A kind of half-ring folded-slot antennas with CPW-fed structure is presented. Two antennas which operate at 2.45 GHz and 5.80 GHz band are designed and fabricated respectively. The 2.45 GHz one with the size of 30 x 36 mm has bandwidth of 17.6 % (VSWR les 2:1) and gain of 1.76~2.21 dBi; the 5.80 GHz one has bandwidth of 26 ...


Individual load impedance specification for a stable DC distributed power system

Xiaogang Feng; Zhihong Ye; Kun Xing; F. C. Lee; D. Borojevic Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual, 1999

This paper continues the effort to define load impedance specification for a stable DC distributed power system. To improve the existing load impedance specification, an alternative forbidden region for Z0/Zi is proposed, based on which individual impedance specification for each load is defined. Theoretical verification, accompanied with simulation results, shows that the proposed impedance specification is a sufficient condition for ...


Deception jamming method for ISAR based on sub-Nyquist sampling technology

Xu Shaokun; Liu Jihong; Fu Yaowen; Li Xiang IEEE 10th INTERNATIONAL CONFERENCE ON SIGNAL PROCESSING PROCEEDINGS, 2010

Fast sampling of wideband RF signal and real time processing of vast data are great difficulties in the engineering implementation of deception jamming to ISAR. This paper proposes a sort of Sub-Nyquist Sampling-Based Method for Jamming ISAR Systems. First introduces the deception jamming technique based on false target for ISAR. Then investigates the jamming principle of sub- Nyquist sampling modulation. ...


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Educational Resources on Simulation

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eLearning

Simulation of thermal-hydraulic transients in the KSTAR PF1 coil using the 4C code

R. Zanino; A. Kholia; L. Savoldi Richard; Y. Chu; S. H. Park; H. J. Lee 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

KSTAR is a fully superconducting tokamak, in operation since 2008 at the National Fusion Research Institute in Korea. All coils are wound using cable- in-conduit conductors and cooled with forced-flow supercritical helium (SHe) at 4.5 K and 5.5 bar. We consider here the central pair, PF1U/L, of the central solenoid coils; during operation these coils are subjected to sharp current ...


Calculation of stray magnetic field effects on the operation of the ITER electron cyclotron system

F. Li; S. Alberti; J. -Ph. Hogge; I. Gr. Pagonakis 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

In a multi-gyrotron system such as the one presently designed for the ITER ECH & ECCD system, stray magnetic fields can significantly alter the operational capabilities of the global system. A numerical study was carried out within the European Gyrotron Consortium (EGYC) to assess the importance of the different effects and their impact on the gyrotron operation. Using the Ariadne++ ...


Broadband CPW-fed RFID Antenna at 2.45/5.80 GHz

D. Ma; W. X. Zhang 2007 International Workshop on Anti-Counterfeiting, Security and Identification (ASID), 2007

A kind of half-ring folded-slot antennas with CPW-fed structure is presented. Two antennas which operate at 2.45 GHz and 5.80 GHz band are designed and fabricated respectively. The 2.45 GHz one with the size of 30 x 36 mm has bandwidth of 17.6 % (VSWR les 2:1) and gain of 1.76~2.21 dBi; the 5.80 GHz one has bandwidth of 26 ...


Individual load impedance specification for a stable DC distributed power system

Xiaogang Feng; Zhihong Ye; Kun Xing; F. C. Lee; D. Borojevic Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual, 1999

This paper continues the effort to define load impedance specification for a stable DC distributed power system. To improve the existing load impedance specification, an alternative forbidden region for Z0/Zi is proposed, based on which individual impedance specification for each load is defined. Theoretical verification, accompanied with simulation results, shows that the proposed impedance specification is a sufficient condition for ...


Deception jamming method for ISAR based on sub-Nyquist sampling technology

Xu Shaokun; Liu Jihong; Fu Yaowen; Li Xiang IEEE 10th INTERNATIONAL CONFERENCE ON SIGNAL PROCESSING PROCEEDINGS, 2010

Fast sampling of wideband RF signal and real time processing of vast data are great difficulties in the engineering implementation of deception jamming to ISAR. This paper proposes a sort of Sub-Nyquist Sampling-Based Method for Jamming ISAR Systems. First introduces the deception jamming technique based on false target for ISAR. Then investigates the jamming principle of sub- Nyquist sampling modulation. ...


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IEEE.tv Videos

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IMS2013 Micro-Apps 2013: Parallel Processing Options for EM Simulation
IMS 2012 Microapps - System Simulation Featuring Signal Processing Blocks
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Micro-Apps 2013: Rapid Simulation of Large Phased Array T/R Module Networks
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Micro-Apps 2013: Class F Power Amplifier Design, Including System-to-Circuit-to-EM Simulation
Micro-Apps 2013: Advances in Load Pull Simulation

IEEE-USA E-Books

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    An individual-based model of the process of niche construction is presented, whereby organisms disturb the environment experienced by their neighbours. This disturbance in local conditions creates a niche that potentially could be filled by another species (which would then create still more niches and so on). The model is unique in allowing the complexity of the organisms--measured by the number of genes they possess in order to be well adapted to their local environment--to evolve over time, and is therefore the first model with which it is possible to study the contribution of niche construction to the evolution of organism complexity. Results of experiments demonstrate that the process of niche construction does indeed introduce an active drive for organisms with more genes. This is the first explicit example of a model which possesses an intrinsic drive for the evolution of complexity.

  • WiCkeD: Analog Circuit Synthesis Incorporating Mismatch

    This paper presents a method to consider local process variations, which crucially influence the mismatch-sensitive analog components, within a new simulation-based analog synthesis tool called WiCkeD. WiCkeD includes tolerance analysis, performance optimization and design centering, and is a university tool used in industry for the design of analog CMOS circuits.

  • Computers and Modeling

    This chapter contains sections titled: The Art of Modeling, Types of Models, Analogue Simulations and Scale Models, Computer Simulation, Techniques of Modeling, Sensitivity Analysis, Models, Computers, and Planning, Systems, Modeling and Process, Postscript, Editors' Postscript

  • Species Abundance Adapted to the Energy Flow in Ecosystem Simulation

    The numerical models featuring energy flow between soil, plant and herbivore are examined. The goal of this work is to observe the relationship between body size and species abundance of the herbivore, resulting from adaptive behavior of population. The species in the simulations are defined by the parameter of energy flux between organisms and replication strategies. Our result shows that the individual behavior builds up the distribution of species abundance resembling that of real ecosystem under the various conditions. This means that the amount of available resources affects not only the number of organisms, but also the adaptive behavior of the population in a local ecosystem. The observed adaptation in the present simulation study therefore indicates that there are more sustainable strategies than one under a given condition. The modelling technique presented here can also be applied to more detailed ecosystem simulations.

  • Effects of Cold Load Pickup at the Distribution Substation Transformer

    The cold load pickup characteristics of electric space heating loads and its effect on the distribution substation transformer and its protective equipment is presented. A computer simulation of cold load pickup characteristics as seen at the substation level is used to determine the tmpact of saturation of electric space heat load on the various thermal and loading limitations of transformers.

  • Evolving Obstacle Avoidance Behavior in a Robot Arm

    Existing approaches for learning to control a robot arm rely on supervised methods where correct behavior is explicitly given. It is difficult to learn to avoid obstacles using such methods, however, because examples of obstacle avoidance behavior are hard to generate. This paper presents an alternative approach that evolves neural network controllers through genetic algorithms. No input/output examples are necessary, since neuroevolution learns from a single performance measurement over the entire task of grasping an object. The approach is tested in a simulation of the OSCAR-6 robot arm which receives both visual and sensory input. Neural networks evolved to effectively avoid obstacles at various locations to reach random target locations.

  • A Model for Exploring Genetic Control of Artificial Amoebae

    We develop a computer simulation of several cellular processes seen in amoebae, including the production and regulation of proteins via a genome; the production, release, and destruction of diffusible chemicals; and regulated chemotaxis through a lattice environment facilitated by the interactions of proteins and diffusible chemicals. We also test this model by adapting biological situations to this model to evaluate its ability to model genetic networks and genetically regulated chemotaxis. The model will be used to simulate evolution in artificial amoebae to produce behavior seen in biological organisms such as Dictyostelium discoideum.

  • Numerical Analysis in Electromagnetics

    EM modeling and simulation (EM-MODSIM) necessitates a good understanding and use of numerical analysis. Built-in MATLAB functions such as roots(), diff(), gradient(), trapz(), and inv() can be used for most of numerical analysis jobs. Although MATLAB makes life easy for engineers, EM-MODSIM people should always depend on their own codes; at least aware of and well understand what is going on behind these built-in commands. This chapter reviews briefly some numerical analysis fundamentals which are essential for EM-MODSIM studies. Taylor's expansion is one of a few important methods for the numerical solution of ordinary differential equations (ODEs). An important topic in numerical analysis is the root finding of a given nonlinear function. Method of moments (MoM) is used to solve linear systems of equations. Multiloop circuits are also solved using linear systems of equations.

  • Basic Reliability Models

    This chapter contains sections titled: What is a Reliability Model? Reliability Model Use Parts-Count Models Computing Serial System Reliability Combinatorial Models Markov Models Petri Nets Monte Carlo Simulation Models Reliability Model Development

  • Model-Based Proprioceptive State Estimation for Spring-Mass Running

    Autonomous applications of legged platforms will inevitably require accurate state estimation both for feedback control as well as mapping and planning. Even though kinematic models and low-bandwidth visual localization may be sufficient for fully-actuated, statically stable legged robots, they are inadequate for dynamically dexterous, underactuated platforms where second order dynamics are dominant, noise levels are high and sensory limitations are more severe. In this paper, we introduce a model based state estimation method for dynamic running behaviors with a simple spring-mass runner. By using an approximate analytic solution to the dynamics of the model within an Extended Kalman filter framework, the estimation accuracy of our model remains accurate even at low sampling frequencies. We also propose two new event-based sensory modalities that further improve estimation performance in cases where even the internal kinematics of a robot cannot be fully observed, such as when flexible materials are used for limb designs. We present comparative simulation results to establish that our method outperforms traditional approaches which rely on constant acceleration motion models and that it eliminates the need for an extensive and unrealistic sensor suite.



Standards related to Simulation

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IEEE Recommended Practice for Distributed Interactive Simulation - Exercise Management and Feedback

This standard is part of a proposed set of standards for Distributed Interactive Simulation (DIS) applications. Each standard in the proposed set describes one or more of the several elements that constitute the DIS environment. As a whole, the set of standards will define an interoperable simulated battle environment. This particular standard addresses the exercise control and feedback stations connected ...


IEEE Recommended Practice for Distributed Interactive Simulation - Verification, Validation and Accreditation

This document has been developed to assist the DIS technician to plan and conduct the Validation and Verification process. This document presents the data flow and connectivity of all proposed Validation and Verification process model steps and provides rationale and justification of each step.


IEEE Standard for Distributed Interactive Simulation - Application Protocols


IEEE Standard for Distributed Interactive Simulation - Communication Services and Profiles

This standard is part of a proposed set of standards for DIS applications. Each standard in the proposed set describes one or more of the several elements that constitute the DIS environment. As a whole, the set of standards will define an interoperable simulated battle environment. This particular standard addresses the communications services to be used to support distributed interactive ...


IEEE Standard for Distributed Interactive Simulation Application Protocols

This standard addresses DIS application protocols to support: Newtonian Collisions, IFF/ATC/NAVAIDS, Underwater Acoustics, Entity Management, Environment, Intercom Communications, Simulation Management with Reliability, and Non Real Time.


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Jobs related to Simulation

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