Sensors And Actuators
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2013 10th International Multi-Conference on Systems, Signals & Devices (SSD)
The 2013 International Multi-Conference on Systems, Signals and Devices is a forum for researchers and specialists in different fields of electrical engineering departments from leading research centers and universities around the world to present their research results and to share experiences with other attendees. It is the 10th multi -conference since the founding of SSD in 2001 whichis supported by international organizations such as IEEE, TSS and different scientific journals.
2013 14th International Conference on Electronic Packaging Technology (ICEPT)
ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems.
2013 5th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI)
Provides a forum for exchange of experience among experts actively involved in research, development and evaluation of new concepts, theoretical methods and experimental characterization as well as in testing techniques concerning micro and nano-sensor systems.
2013 IEEE 11th International Conference on Electronic Measurement & Instruments (ICEMI)
ICEMI is invited authors to submit original papers in any but not limited as following areas: Science Foundation of Instrument and Measurement Innovative Designing of Instrument and Test System Applications on Instrument and Testing Signal & Image Processing Sensor and Non-electric Measurement Communication and Network Test Systems Control Theory and Application Condition Monitoring, Fault Diagnosis and Prediction Other Relevant Theories and Technologies
Madni, A.M. Communications, Control and Signal Processing, 2008. ISCCSP 2008. 3rd International Symposium on, 2008
Intelligent wireless sensor-based controls have drawn industry attention on account of reduced costs, better power management, ease in maintenance, and effortless deployment in remote and hard-to-reach areas. They have been successfully deployed in many industrial applications such as Maintenance, monitoring, control, security, etc. This presentation focuses on research that addresses the issues faced by instrumentation systems and predictive maintenance industrial ...
Madni, A.M. Sensors, 2009 IEEE, 2009
Intelligent wireless sensor-based controls have drawn industry attention on account of reduced costs, better power management, ease in maintenance, and effortless deployment in remote and hard-to-reach areas. They have been successfully deployed in many industrial applications such as maintenance, monitoring, control, security, etc. This presentation focuses on research that addresses the issues faced by instrumentation systems and predictive maintenance industrial ...
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on, 1997
The folowing topics were dealt with: actuators; resonant structures; microchemical reactors; process technology; optical microsystems; force and flow sensors; immunosensors; packaging technology; intelligent systems; magnetic sensors; bioanalytical systems; mechanical properties; acoustic devices; analytical systems; bonded and HARM technology; micropumps; AFM and related sensors; gas sensors; bulk micromachining; inertial sensors; biosensors; telemetry systems; device modeling; microfluidic devices; vibratory gyroscopes; chemical sensors; ...
Ko, W.H. CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings., 1989
Although mechanical components, packaging techniques, microprocessors, and application-specific integrated circuits for prosthesis control are available, there is a pressing need for sensors and actuators to complete the system. These devices not only have to be functional, they have to be small in size, consume small amounts of power, and be operable by nontechnical personnel including the patient. They should also ...
Aoki, S.; Kirihara, Y.; Nakazawa, J.; Takashio, K.; Tokuda, H. Networked Sensing Systems (INSS), 2009 Sixth International Conference on, 2009
This paper presents a spinning sensors NW middleware which realizes a distributed sensor actuator network and a Sensor Actuator Network Markup Language (SANML) to write the controlling rules of networked sensors and actuators. In the realization of sensor actuator network architecture, the application developer needs to coordinate sensors and actuators in the network and set the control rules of them. ...
Sr. Electrical Engineer BD (Becton, Dickinson and )
Sr. Electrical Engineer BD (Becton, Dickinson and )
Paradiso, Rita Smart Fabrics and Interactive Textile: State of the Art and Future Challenges, 2009
Smart Fabrics and Interactive Textile (SFIT) based systems are conceived as the integration, into textile, of sensors, actuators, computing, and a power source, with the whole being part of an interactive communication network. Such systems could only be envisaged through a combination of advances in fields as fiber and polymer research, advanced material processing, microelectronics, signals processing, nanotechnologies, and telecommunication.Textile ...
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Life Sciences: Surface Enhanced Raman Spectroscopy, and more
Microfluidic diagnostics and other breakthrough technologies.
This project establishes a standard for wireless communication methods and data format for transducers (sensors and actuators). The standard defines a TEDS based on the IEEE 1451 concept and protocols to access TEDS and transducer data. It adopts necessary wireless interfaces and protocols to facilitate the use of technically differentiated, existing wireless technology solutions. It does not specify transducer design, ...
This project develops a set of common functionality for the family of IEEE 1451 smart transducer interface standards. This functionality is independent of the physical communications media. It includes the basic functions required to control and manage smart transducers, common communications protocols, and media-independent TEDS formats. It defines a set of implementation-independent APIs. This project does not specify signal conditioning ...
This project will develop a standard thqt defines a digital interface for connecting multiple physically separated transducers. It will leverage off the IEEE P1451.1 and IEEE P1451.2 standards. The standard will define the TEDS format, the electrical interface, channel identification protocols, hot swap protocols, time synchronization protocols, and the read and write logic functions used to access the TEDS and ...
This project will establish a standard interface for connecting network capable processors to control networks through the development of a common control network information or object model for smart sensors and actuators. The object model includes transducer block, function block, plysical block, and network block and their underlying structures. This project will not define individual device algorithms or specifics of ...
This project will develop a standard digital interface for connecting transducers (defined here as sensors and actuators) to microprocessors. It will define a transducer electronic data sheet (TEDS) and its data formats. It will define an electrical interface, read and write logic functions to access the TEDS and transducers. This interface will be usable by a wide variety of sensors ...
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.
Applications-oriented material in the field of instrumentation and measurement.
Measurements and instrumentation utilizing electrical and electronic techniques.