Sensors And Actuators
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2017 IEEE AUTOTESTCON
IEEE AUTOTESTCON is also known as the Systems Readiness Technology Conference. This major conference and exposition provides focus on the maintenance aspects of systems readiness and providing Mission Assurance through Advanced ATE (Automatic Test Equpmenrt/Systems). This includes Maintenance Repair & Overhaul as well as factory and development automated test equipment. This conference brings military and aerospace industry principals together to share new concepts, technologies and applications in this essential field of supportability and sustainability. The conference includes a major exhibit of exciting new products from a wide variety of exhibitors, and provides the opportunity to meet with senior military and aerospace leaders to discuss their future needs and expectations and the ways in which we can satisfy those needs.
2015 IEEE International Radar Conference (RadarCon)
The scope of the IEEE 2015 International Radar Conference includes all aspects of civil and military radar. Topics range from fundamental theory to cutting-edge applications, from signal processing, modeling, simulation to hardware implementation and experimental results.
2015 IEEE International Ultrasonics Symposium (IUS)
Annual meeting of the UFFC Society that is being held regularly. It is focusing on ultrasonics.
2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)
Control Systems & ApplicationsPower ElectronicsSignal Processing & Computational IntelligenceRobotics & MechatronicsSensors, Actuators & System IntegrationElectrical Machines & DrivesFactory Automation & Industrial InformaticsEmerging Technologies
This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.
Applications-oriented material in the field of instrumentation and measurement.
Measurements and instrumentation utilizing electrical and electronic techniques.
Eddy, David S.; Sparks, D.R. Proceedings of the IEEE, 1998
Sensors and actuators are the critical system components that collect and act on information in the analog environment and link it to the world of digital electronics. The functional groups of sensors, software, controller hardware, and actuators from the backbone of present and future automotive systems. Unit volumes for sensors and actuators in the automotive industry are measured in millions ...
Varadan, V.K.; Hong, S.-Y.; Varadan, V.V. Ultrasonics Symposium, 1990. Proceedings., IEEE 1990, 1990
Light-weight, rapid, multimode control of a vibrating structure is possible by the use of piezoelectric sensors and actuators and feedback control algorithms. The results of vibration control experiments on a prototype structure such as a cantilever beam using PZT sensors and actuators are presented. Different types of position feedback control and steady-state quadratic optimal control were implemented. Particular attention was ...
Luo, R.C. Industrial Electronics Society, 2001. IECON '01. The 27th Annual Conference of the IEEE, 2001
The key aspect of mechatronic products is to add intelligent components and systems which combine an optimum use of multidisciplinary technologies to shorten the development cycle with reduced cost and increased quality. Advances in microelectromechanical systems (MEMS) have a profound impact in the field of sensors and actuators for intelligent mechatronic systems. Miniature sensors and actuators are fabricated using technologies ...
Isogai, M.; Arai, F.; Fukuda, T. Industrial Electronics Society, 2000. IECON 2000. 26th Annual Confjerence of the IEEE, 2000
In this paper, we describe the fault detection and identification system for sensors and actuators in vibration control system of flexible structures. Various investigations have been carried out on the fault detection and identification. But, conventional fault detection and identification systems, using sensor output signals, cannot function in the case that sensors and actuators are serially connected in the system ...
Loueipour, M.; Hadian, H. Control, Instrumentation and Automation (ICCIA), 2011 2nd International Conference on, 2011
This paper presents the effect of sensors and actuators modeling on the design of PID controller for an Autonomous underwater vehicle (AUV). In order to investigate the effect of those modeling on the behavior of AUV, a PID control scheme is developed by considering two different models, i.e., with sensors and actuators modeling which is called actual model and without ...
Loucas Tsakalakos Introduction to MEMS & NEMS: Micro and Nanoscale Electro Mechanical Systems, 2013
Microelectromechanical systems (MEMS) include a whole class of devices built at the microscale that couple mechanical motion to electrical signals, and vice versa. These include sensors, actuators, and resonators. NEMS is the nanoscale equivalent of MEMS, namely, nanoelectromechanical systems. NEMS provide several advantages over MEMS for certain applications, including higher frequencies and better accuracy. In this tutorial Dr. Tsakalakos discusses ...
Worms, Waves, and Robots
Skillful Manipulation Based on High-Speed Sensory-Motor Fusion
Yuan-ting Zhang AMA EMBS Individualized Health
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
Living the Future Now: The challenges and promise of pervasive computing
MicroApps: Simplifying Microwave Power Amplifer Characterization using Power Meter & Sensors (Agilent Technologies)
Lighting the Way: Optical Sensors in the Life Sciences
IEEE Magnetics 2014 Distinguished Lectures - JONATHAN COKER
ASC-2014 SQUIDs 50th Anniversary: 5 of 6 - Ronny Stolz - SQUIDs in Geophysics
ASC-2014 SQUIDs 50th Anniversary: 3 of 6 - Bob Fagaly
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 3 of 7 - MEG and ULF-MRI
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 4 of 7 - MRI at 130 Microtesla
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 6 of 7 - A high sensitive magnetometer system for natural magnetic field measurements
The DLR MiroSurge, a Robotic System for Surgery
The Design of Wearable Robots for Lower-Extremity Human Augmentation
Critical Skills in the Engineering Workforce
2013 IEEE Dennis J. Picard Medal
Dr. Scott Fish
APEC 2011- Methode Electronics at APEC 2011
This project establishes a standard for wireless communication methods and data format for transducers (sensors and actuators). The standard defines a TEDS based on the IEEE 1451 concept and protocols to access TEDS and transducer data. It adopts necessary wireless interfaces and protocols to facilitate the use of technically differentiated, existing wireless technology solutions. It does not specify transducer design, ...
This project develops a set of common functionality for the family of IEEE 1451 smart transducer interface standards. This functionality is independent of the physical communications media. It includes the basic functions required to control and manage smart transducers, common communications protocols, and media-independent TEDS formats. It defines a set of implementation-independent APIs. This project does not specify signal conditioning ...
This project will develop a standard thqt defines a digital interface for connecting multiple physically separated transducers. It will leverage off the IEEE P1451.1 and IEEE P1451.2 standards. The standard will define the TEDS format, the electrical interface, channel identification protocols, hot swap protocols, time synchronization protocols, and the read and write logic functions used to access the TEDS and ...
This project will establish a standard interface for connecting network capable processors to control networks through the development of a common control network information or object model for smart sensors and actuators. The object model includes transducer block, function block, plysical block, and network block and their underlying structures. This project will not define individual device algorithms or specifics of ...
This project will develop a standard digital interface for connecting transducers (defined here as sensors and actuators) to microprocessors. It will define a transducer electronic data sheet (TEDS) and its data formats. It will define an electrical interface, read and write logic functions to access the TEDS and transducers. This interface will be usable by a wide variety of sensors ...