Conferences related to Power Supplies

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2018 IEEE 18th International Power Electronics and Motion Control Conference (PEMC)

Promote and co-ordinate the exchange and the publication of technical, scientific and economic information in the field of Power Electronics and Motion Control with special focus on countries less involved in IEEE related activities. The main taget is to create a forum for industrial and academic community.

  • 2016 IEEE International Power Electronics and Motion Control Conference (PEMC)

    The IEEE Power Electronics and Motion Control (IEEE-PEMC) conference continues to be the oldest in Europe and is a direct continuation of the conferences held since 1970. Its main goal is to promote and co-ordinate the exchange and publication of technical, scientific and economic information on Power Electronics and Motion Control. One of its main objectives is the cooperation and integration between the long-time divided Western and Eastern Europe, this goal expressed in the conference logo, as well. The conference attracts now a large number (roughly 500+) of participants from the world. An exhibition is organised in parallel with every PEMC Conference, offering space for the industry to present their latest products for Power Electronics and Motion Control. In addition to the regular oral sessions, key notes, round tables, tutorials, workshops, seminars, exhibitions, the dialogue sessions (enlarged “poster” presentations) present to the speakers a better cooperation opportunity.

  • 2014 16th International Power Electronics and Motion Control Conference (PEMC)

    The purpose of the 16th International Power Electronics and Motion Control Conference and Exposition (PEMC) is to bring together researchers, engineers and practitioners from all over the world, interested in the advances of power systems, power electronics, energy, electrical drives and education. The PEMC seeks to promote and disseminate knowledge of the various topics and technologies of power engineering, energy and electrical drives. The PEMC aims to present the important results to the international community of power engineering, energy, electrical drives fields and education in the form of research, development, applications, design and technology. It is therefore aimed at assisting researchers, scientists, manufacturers, companies, communities, agencies, associations and societies to keep abreast of new developments in their specialist fields and to unite in finding power engineering issues.

  • 2012 EPE-ECCE Europe Congress

    Power Electronics and Motion Control.

  • 2010 14th International Power Electronics and Motion Control Conference (EPE/PEMC 2010)

    Semiconductor Devices and Packaging, Power Converters, Electrical Machines, Actuators, Motion Control, Robotics, Adjustable Speed Drives, Application and Design of Power Electronics circuits, Measurements, Sensors, Observing Techniques, Electromagnetic Compatibility, Power Electronics in Transportation, Mechatronics, Power Electronics in Electrical Energy Generation, Transmission and Distribution, Renewable Energy Sources, Active Filtering, Power Factor Correction

  • 2008 13th International Power Electronics and Motion Control Conference (EPE/PEMC 2008)

  • 2006 12th International Power Electronics and Motion Control Conference (EPE/PEMC 2006)


2018 IEEE International Conference on Power Electronics, Drives and Energy Systems (PEDES)

The conference will deal will all aspects of power electronics, motor drives and Power electronics applications to energy systems.


2018 IEEE PES Transmission & Distribution Conference and Exhibition - Latin America (T&D-LA)

The conference will focus on the current state of the art and lessons learned from techniques and practices developed by leading international companies and utilities.


2017 12th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2017 14th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

Devices, Circuits and Systems; Electrical Power Systems; Signal Processing; Computers; Communication Systems; Contrrols, Instrumentation and Measurements; Telecommunications, Information Technology; Electrical Engineering


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Periodicals related to Power Supplies

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Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Industrial Electronics, IEEE Transactions on

Theory and applications of industrial electronics and control instrumentation science and engineering, including microprocessor control systems, high-power controls, process control, programmable controllers, numerical and program control systems, flow meters, and identification systems.


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Most published Xplore authors for Power Supplies

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Xplore Articles related to Power Supplies

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DC-DC converter with fast transient response and high efficiency for low-voltage microprocessor loads

B. Arbetter; D. Maksimovic Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual, 1998

The paper describes a DC-DC power converter for use with low voltage microprocessor loads. The control method is a hysteretic current-mode control in the continuous conduction mode which has fast transient response. At light loads, the power converter operates in the discontinuous conduction mode using a peak current control method which causes the switching frequency to be proportional to load ...


Power noise and its impact on production test and validation of SoC devices

Karim Arabi 2010 28th VLSI Test Symposium (VTS), 2010

Abstract form only given. Power integrity is emerging as a major challenge in deep-submicron SoC designs. The lack of accurate prediction is complicating timing closure, production test, and speed grading of high-performance SoCs. The IC industry is moving quickly to adopt new deep-submicron (DSM) technologies that offer unprecedented integration levels and cost benefits. These advanced technologies pose unexpected challenges to ...


A very high current, wide bandwidth voltage source for microprocessor testing

N. J. Barabas Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual, 1998

The design of a unique, state-of-the-art voltage source (Vs) is described. It is a subsystem of a VLSI tester, and powers the device under test (DUT). It is fully programmable and has extensive measurement capabilities. Its ratings include zero to 6 volts output at 50 amps per circuit board, 300 Amps maximum, with an under 1 μsec response time to ...


Freenet: Spectrum and energy harvesting wireless networks

Nirwan Ansari; Tao Han IEEE Network, 2016

The dramatic growth in mobile data traffic is resulting in spectrum crunch, and is also leading to exorbitant energy consumption. Thus, it is desirable to liberate mobile and wireless networks from the constraint of spectrum scarcity and to rein in growing energy consumption. This article introduces FreeNet, figuratively synonymous with "Free Network," which engineers spectrum and energy harvesting techniques to ...


A constant slew-rate Ethernet line driver

D. S. Nack 2000 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.00CH37103), 2000

A biasing technique is described that facilitates the design of a fast Ethernet line driver. The slew rate is insensitive to temperature and process variations. The core-biasing block consists of three current sources, a resistor, and two transistors. 230 ppm/deg C temperature drift is achieved without trimming.


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Educational Resources on Power Supplies

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eLearning

DC-DC converter with fast transient response and high efficiency for low-voltage microprocessor loads

B. Arbetter; D. Maksimovic Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual, 1998

The paper describes a DC-DC power converter for use with low voltage microprocessor loads. The control method is a hysteretic current-mode control in the continuous conduction mode which has fast transient response. At light loads, the power converter operates in the discontinuous conduction mode using a peak current control method which causes the switching frequency to be proportional to load ...


Power noise and its impact on production test and validation of SoC devices

Karim Arabi 2010 28th VLSI Test Symposium (VTS), 2010

Abstract form only given. Power integrity is emerging as a major challenge in deep-submicron SoC designs. The lack of accurate prediction is complicating timing closure, production test, and speed grading of high-performance SoCs. The IC industry is moving quickly to adopt new deep-submicron (DSM) technologies that offer unprecedented integration levels and cost benefits. These advanced technologies pose unexpected challenges to ...


A very high current, wide bandwidth voltage source for microprocessor testing

N. J. Barabas Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual, 1998

The design of a unique, state-of-the-art voltage source (Vs) is described. It is a subsystem of a VLSI tester, and powers the device under test (DUT). It is fully programmable and has extensive measurement capabilities. Its ratings include zero to 6 volts output at 50 amps per circuit board, 300 Amps maximum, with an under 1 μsec response time to ...


Freenet: Spectrum and energy harvesting wireless networks

Nirwan Ansari; Tao Han IEEE Network, 2016

The dramatic growth in mobile data traffic is resulting in spectrum crunch, and is also leading to exorbitant energy consumption. Thus, it is desirable to liberate mobile and wireless networks from the constraint of spectrum scarcity and to rein in growing energy consumption. This article introduces FreeNet, figuratively synonymous with "Free Network," which engineers spectrum and energy harvesting techniques to ...


A constant slew-rate Ethernet line driver

D. S. Nack 2000 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.00CH37103), 2000

A biasing technique is described that facilitates the design of a fast Ethernet line driver. The slew rate is insensitive to temperature and process variations. The core-biasing block consists of three current sources, a resistor, and two transistors. 230 ppm/deg C temperature drift is achieved without trimming.


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IEEE-USA E-Books

  • Energy Efficiency in Ethernet

    For many years, energy efficiency has only been a priority in communication systems when it directly affected system cost or performance. For example in mobile communications, energy consumption directly impacts battery life and therefore systems are designed to minimize it. In wireline systems, power normally comes from the mains and the focus has been on reducing the peak power consumption of the systems. The peak consumption limits the integration of components on the same integrated circuit or equipment thus impacting the system cost. In addition, many individual system elements such as packaging, ventilation, power supplies, and other components have to be dimensioned for the peak power consumption. This was the case in Ethernet for many years. In the last decade, this situation has changed and energy efficiency has been incorporated as an objective when designing wireline communication systems. Ethernet has been one of the technologies that drove this change for greater energy efficiency with the Energy‐Efficient Ethernet standard "IEEE Std 802.3az: Energy‐Efficient Ethernet‐2010" for which savings are likely to exceed $250 million/year in the United States alone. In this chapter, an overview of energy efficiency in Ethernet is presented covering the existing Energy‐Efficient Ethernet standard as well as ongoing standardization efforts and future directions.

  • Practical Design of Magnetics

    This chapter contains sections titled: * Fundamentals of Magnetics * The Ideal Transformer * Real Transformers * Practical Design of a DC Inductor * Practical Design of a Flyback Transformer * Flux Density: Two Formulas? * Practical Design of a Forward Transformer * Practical Design of a Current Transformer * Tips for Designing Manufacturable Magnetics * Concluding Comments * References

  • Main¿¿¿Circuit Design

    This chapter provides an understanding of various design choices for different parts of the main circuit of modular multilevel converters (MMCs). This includes power semiconductors, submodule capacitors, arm inductors, submodule design, redundant submodules, auxiliary power supplies, and start¿¿¿up procedures. The design of the main circuit of an MMC involves several steps, ranging from dimensioning of main¿¿¿circuit components to issues with auxiliary power supplies and start¿¿¿up procedures. The chapter starts with a presentation of the power semiconductors used in MMCs today, and possible future alternatives. Submodule capacitors are voluminous and costly, and as such they deserve considerable attention. It describes arm inductors and different possible submodule configurations. The chapter provides an insight into the main physical properties of power semiconductor devices without going into all details of the underlying semiconductor physics. Arm inductors for MMCs in HVDC applications are typically dry¿¿¿type air¿¿¿core reactors. The gate¿¿¿drive units of these devices, however, require a significantly higher power supply.

  • Practical WorstCase Analysis

    This chapter contains sections titled: * Introduction * An Exhausting Example * Some Concluding Thoughts

  • Coil Design and Temperature Calculations

    Magnetic actuators and sensors are often components of large systems, such as automobiles. The actuators and sensors must perform reliably in the system environment and interface properly with the system. To interface properly with system power supplies, the coils of the magnetic components must be properly designed. As part of the coil design, the temperatures developed by the coils and the components must be predicted. This chapter discusses the coil design and temperature calculations for magnetic actuators and sensors. The concepts discussed in the chapter are wire size determination for direct current (DC) currents, coil time constant and impedance, skin effects and proximity effects for alternating current (AC) currents, and finite-element computation of temperatures.

  • Practical Feedback Design

    This chapter contains sections titled: * Introduction * Refresher * Transfer Functions * Basic Control Theory * How to Stabilize a Voltage Mode Buck Converter * Current Mode Control * Non-Minimum-Phase Systems * Some Concepts of System Stability * Some Thoughts on the Role of Simulations * References

  • Resistance Spot Welding:Fundamentals and Applications for the Automotive Industry

    The early chapters of this book provide thorough coverage of resistance spot welding fundamentals and principles. Topics covered include lobe and current range curves, contact resistance vs. electrode force, dynamic resistance, heat balance, nugget growth, etc. Equipment issues such as machine types, power supplies, and electrodes are addressed. Subsequent chapters focus on specific spot welding challenges to modern automotive manufacturing. Approaches to welding modern materials including advanced high strength steels, coated steels, and aluminum alloys are covered in much detail. The final chapters focus on many common production and quality control issues, such as electrode wear, monitoring and testing, computational modeling, and welding codes. The overall goal of the book is to provide a comprehensive resource for automotive engineers and technicians who work with modern spot welding equipment and automotive materials.

  • Fundamentals of Electric Power

    Since most students, including many who have had a good first course in electrical engineering, have not been exposed to anything related to electric power, we present a practical orientation to such topics as power factor, transmission lines, three-phase power, power supplies, and power quality.

  • Ultra¿¿¿Slim Power Rail (S¿¿¿type)

    As a further step to go forward to a more improved performance on the inductive power transfer system (IPTS) for road¿¿¿powered electric vehicles (RPEVs), an ultra¿¿¿slim S¿¿¿type power supply rail, which has a width of only 4 cm, is explained in this chapter. The cross¿¿¿section of the core has a thin S¿¿¿shape, and a vertical¿¿¿wound multiturn coil is displaced inside the core. Therefore, this design provides a very slim power supply rail, which is crucial for the commercialization of RPEVs. The construction of roadway infrastructure, which is responsible for more than 80% of the total deployment cost for RPEVs, can be much easier when the width of the power supply rail is so small. To increase portability and to minimize construction time, a foldable power supply module is also proposed in which flexible power cables connect each foldable power supply module such that no connectors are needed during deployment. An effective winding method for minimizing cable length is proposed, and an optimum core thickness of the proposed power supply rail is determined by FEA simulations and verified by a prototype power supply module. By virtue of the ultra¿¿¿slim shape, a large lateral displacement of 30 cm at an airgap of 20 cm was experimentally obtained, which is 6 cm larger than that of the I¿¿¿type power supply rail. In addition to the larger lateral displacement, it is estimated that the S¿¿¿type one has a lower EMF than the I¿¿¿type one because the width of the S¿¿¿type one is narrower than that of the I¿¿¿type one. The maximum efficiency, excluding the inverter, was 91% and the pick¿¿¿up power was 22 kW.This chapter is written from the paper by S.Y. Choi, B.W. Gu, S.Y. Jeong, G.C. Lim, and Chun T. Rim, ¿¿¿Ultra slim S¿¿¿type power supply rails for road powered electric vehicles,¿¿¿ _IEEE Trans. on Power Electronics_, vol. 30, no. 11, pp. 6456¿¿¿6468, November 2015. Readers will be able to see not only how to make the power supply rail slim but also how important the modularity design is to carry and deploy.

  • PSpice for Circuit Theory and Electronic Devices

    PSpice for Circuit Theory and Electronic Devices is one of a series of five PSpice books and introduces the latest Cadence Orcad PSpice version 10.5 by simulating a range of DC and AC exercises. It is aimed primarily at those wishing to get up to speed with this version but will be of use to high school students, undergraduate students, and of course, lecturers. Circuit theorems are applied to a range of circuits and the calculations by hand after analysis are then compared to the simulated results. The Laplace transform and the s-plane are used to analyze CR and LR circuits where transient signals are involved. Here, the Probe output graphs demonstrate what a great learning tool PSpice is by providing the reader with a visual verification of any theoretical calculations. Series and parallel-tuned resonant circuits are investigated where the difficult concepts of dynamic impedance and selectivity are best understood by sweeping different circuit parameters through a range of values. O taining semiconductor device characteristics as a laboratory exercise has fallen out of favour of late, but nevertheless, is still a useful exercise for understanding or modelling semiconductor devices. Inverting and non-inverting operational amplifiers characteristics such as gain-bandwidth are investigated and we will see the dependency of bandwidth on the gain using the performance analysis facility. Power amplifiers are examined where PSpice/Probe demonstrates very nicely the problems of cross-over distortion and other problems associated with power transistors. We examine power supplies and the problems of regulation, ground bounce, and power factor correction. Lastly, we look at MOSFET device characteristics and show how these devices are used to form basic CMOS logic gates such as NAND and NOR gates.



Standards related to Power Supplies

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IEEE Recommended Practice for Electric Power Systems in Commercial Buildings


IEEE Recommended Practice for Emergency and Standby Power Systems for Industrial and Commercial Applications

As presently stated in IEEE Std 446-1987.


IEEE Standard for Transformers and Inductors in Electronic Power Conversion Equipment

This standard pertains to transformers and inductors of both the saturating and nonsaturating type that are used in electronic power conversion equipment. Power conversion equipment includes items known as inverters, converters, power conditioners, switching power supplies, switched mode power supplies, and the like. These items are mostly devices used to change dc power from one voltage to another, to change ...


Standard for Utility Industry End Device Data Tables

To develop a standard for utility end device application layer communications protocol and the functional data structures which it transports. It is to allow operation of end devices for utility distribution and customer applications.