On-chip Power Conversion
52 resources related to On-chip Power Conversion
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2014 IEEE International Symposium on Circuits and Systems (ISCAS)
The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world’s premier networking forum in the highly active fields of theory, design and implementation of circuits and systems.ISCAS 2014 will have a special focus on nano/bio circuits and systems applied to enhancing living and lifestyles, and seeks to address multidisciplinary challenges in healthcare and well-being, the environment and climate change.
2013 IEEE International Symposium on Low Power Electronics and Design (ISLPED)
technology, architecture, circuits, tools, systems, software and applications
2013 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)
RF, analog and mixed-signal circuits, Modeling and simulation, Sensors and interface circuits, Hardware-software co-design, Digital circuits and ASIC, Logic and architecture synthesis, CPU, DSP and multicore architectures, Physical design and verification, Memory circuits and systems, Design for manufacturability, Low power logic and architectures, Power estimation and optimization, Multimedia processing circuits, Design verification, Communication circuits, Test generation and fault simulation, Embedded systems and software, BIST and design for testability, Designs using novel technologies, RF, analog and mixed-signal test, System-in-package design, SOC and system level testing, Electronic System Level Design, System level design automation.
2012 4th Electronic System-Integration Technology Conference (ESTC)
The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.
A-SSCC 2012 is an international forum for presenting the most updated and advanced chips and circuit designs in solid-state and semiconductor fields.
Telemedicine, teleradiology, telepathology, telemonitoring, telediagnostics, 3D animations in health care, health information networks, clinical information systems, virtual reality applications in medicine, broadband technologies, and global information infrastructure design for health care.
Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.
Fundamental technologies used in the control and conversion of electric power. Topics include dc-to- dc converter design, direct off-line switching power supplies, inverters, controlled rectifiers, control techniques, modeling, analysis and simulation techniques, the application of power circuit components (power semiconductors, magnetics, capacitors), and thermal performance of electronic power systems.
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...
Harburg, D.V.; Xuehong Yu; Herrault, F.; Levey, C.G.; Allen, M.G.; Sullivan, C.R. Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, 2012
This paper reports an optimized design and micro-fabrication approach for silicon-integrated elongated-spiral inductors for on-chip power conversion. The inductors are designed for high-power-density and high-efficiency DC-DC converters which transfer 25 W of power at frequencies between 5 and 30 MHz. The predicted power density of the inductors is close to 1 W/mm(exp 2) with predicted overall converter efficiencies exceeding 90%. ...
Herget, P.; Naigang Wang; O'Sullivan, E.J.; Webb, B.C.; Romankiw, L.T.; Fontana, R.; Decad, G.; Gallagher, W.J. Magnetics, IEEE Transactions on, 2013
Successful implementation of on-chip power conversion using ferromagnetic inductors requires both high power efficiency and high power density. The theoretical limits to power density and efficiency possible with thin film ferromagnetic inductors in a buck converter topology with and without coupling are explored. Power density can be related to energy density of the inductor, while efficiency can be related to ...
Herget, P.; Naigang Wang; O'Sullivan, E.J.; Webb, B.C.; Romankiw, L.T.; Fontana, R.; Xiaolin Hu; Decad, G.; Gallagher, W.J. Magnetics, IEEE Transactions on, 2012
Saturation in thin film coupled magnetic inductors was measured as a function of dc current in both windings. A simple mathematical model was created to approximate the inductor saturation level in the presence of the two currents. The model was compared both to FEM calculations of saturation in a linear model and to the experimental findings. Using the mathematical model, ...
Naigang Wang; Goren, D.; O'Sullivan, E.; Xin Zhang; Gallagher, W.J.; Herget, P.; Chang, L. Electron Devices Meeting (IEDM), 2014 IEEE International, 2014
Air-core slab inductors with specially designed current return paths are proposed to achieve the ultra-high Q required for on-chip power delivery and management at >90% efficiency. Uniquely optimized for buck converter circuits, this CMOS-compatible structure avoids the challenges of thin-film magnetics. Q~25-30 at 200-300MHz is experimentally demonstrated.
Moazenzadeh, A.; Suarez Sandoval, F.; Spengler, N.; Badilita, V.; Wallrabe, U. Power Electronics, IEEE Transactions on, 2015
We address the miniaturization of power converters by introducing novel 3-D microtransformers with magnetic core for low-megahertz frequency applications. The core is fabricated by lamination and microstructuring of Metglas 2714A magnetic alloy. The solenoids of the microtransformers are wound around the core using a ball-wedge wirebonder. The wirebonding process is fast, allowing the fabrication of solenoids with up to 40 ...
APEC Speaker Highlights: Ron Van Dell
GaN Transistors -- Crushing Silicon in Wireless Energy Transfer
What is the PSMA Power Technology Roadmap? APEC 2013 KeyTalk with Eric Persson
Critical Update: KeyTalk with Cian O'Mathuna
ECCE Plenary: Richard K. Williams, part 1
ECCE Plenary: Pedro Ray, part 2
ECCE Plenary: Pedro Ray, part 1
IEEE WEBINAR SERIES-March 5th, 2014: GaN Crushing Silicon...and Let Me Tell You How
Design of Monolithic Silicon-Based Envelope-Tracking Power Amplifiers for Broadband Wireless Applications
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
IMS 2011 Microapps - Improved Soldering Techniques for Cylindrical RF Connectors Using HIG Induction Technology
ECCE Plenary Session Question and Answer
ECCE Plenary: Richard K. Williams, part 2
ECCE Plenary: Lennart Jonsson, part 2
ECCE Plenary: Lennart Jonsson, part 1
IEEE WIE- TryEngineering Ship the Chip
ITEC 2014: Electrifying Marine: Full Current Ahead - Clean, Efficient, Reliable and Quiet
Infineon: Innovative Semiconductor Solutions
Transportation Electrification: Smart Grids and Sustainable Generation
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