Conferences related to On-chip Power Conversion

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2018 31st IEEE International System-on-Chip Conference (SOCC)

System on Chip


2018 31st International Conference on VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID)

This conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, EDA, embedded systems, and enabling technologies. The program will consist of regular paper sessions, special sessions, embedded tutorials, panel discussions, design contest, industrial exhibits and tutorials. This is the premier conference/exhibition in this area in India, attracting designers, EDA professionals, and EDA tool users. The program committee for the conference has a significant representation from the EDA research community and a large fraction of the papers published in this conference are EDA-related


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Periodicals related to On-chip Power Conversion

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


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Most published Xplore authors for On-chip Power Conversion

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Xplore Articles related to On-chip Power Conversion

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Micro-Fabricated Racetrack Inductors with Thin-Film Magnetic Cores for On-Chip Power Conversion

[{u'author_order': 1, u'affiliation': u'Anterra Capital, Amsterdam, Netherlands.', u'full_name': u'Daniel V. Harburg'}, {u'author_order': 2, u'affiliation': u'Massachusetts Institute of Technology, Cambridge, MA 02139 USA.', u'full_name': u'Alex J. Hanson'}, {u'author_order': 3, u'affiliation': u'Tesla, Palo Alto, CA 94304 USA.', u'full_name': u'Jizheng Qiu'}, {u'author_order': 4, u'affiliation': u'Thayer School of Engineering at Dartmouth, Hanover, NH 03755 USA.', u'full_name': u'Bradley A. Reese'}, {u'author_order': 5, u'affiliation': u'Phase Lead Engineering, Rochester, NY 14607 USA.', u'full_name': u'John D. Ranson'}, {u'author_order': 6, u'affiliation': u'Massachusetts Institute of Technology, Cambridge, MA 02139 USA.', u'full_name': u'David Otten'}, {u'author_order': 7, u'affiliation': u'Thayer School of Engineering at Dartmouth, Hanover, NH 03755 USA.', u'full_name': u'Christopher G. Levey'}, {u'author_order': 8, u'affiliation': u'Thayer School of Engineering at Dartmouth, Hanover, NH 03755 USA.', u'full_name': u'Charles R. Sullivan'}] IEEE Journal of Emerging and Selected Topics in Power Electronics, None

This paper presents design methods and electrical performance measurements for micro-fabricated racetrack power inductors. Magnetic components with sputtered Co-Zr-O thinfilm magnetic cores are demonstrated in a multi-megahertz dcdc converter for solid-state lighting applications. The high-powerdensity and high-efficiency dc-dc converter is designed to transfer 25 W of power at switching frequencies between 1 and 30 MHz. Utilizing our magnetic components, the ...


High-Q magnetic inductors for high efficiency on-chip power conversion

[{u'author_order': 1, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Naigang Wang'}, {u'author_order': 2, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Bruce B. Doris'}, {u'author_order': 3, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Andrea Bahgat Shehata'}, {u'author_order': 4, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u"Eugene J. O' Sullivan"}, {u'author_order': 5, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Stephen L. Brown'}, {u'author_order': 6, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Stephen Rossnagel'}, {u'author_order': 7, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'John Ott'}, {u'author_order': 8, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Lynne Gignac'}, {u'author_order': 9, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Maryam Massouras'}, {u'author_order': 10, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Lubomyr T. Romankiw'}, {u'author_order': 11, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598', u'full_name': u'Hariklia Lili Deligianni'}] 2016 IEEE International Electron Devices Meeting (IEDM), None

We experimentally demonstrate high performance magnetic inductors with Q as high as 17 in the frequency range of 50-250 MHz. These inductors meet target requirements for >90% efficient on-chip power converters. Physics-based models were used to understand magnetic losses, design novel magnetic stacks and innovative processes to achieve high Q.


Integrated inductors with magnetic materials for on-chip power conversion

[{u'author_order': 1, u'affiliation': u'Circuits Research Lab & Future Technology Research, Intel Labs Intel Corporation', u'full_name': u'Donald S. Gardner'}, {u'author_order': 2, u'affiliation': u'Circuits Research Lab & Future Technology Research, Intel Labs Intel Corporation', u'full_name': u'Gerhard Schrom'}, {u'author_order': 3, u'affiliation': u'Circuits Research Lab & Future Technology Research, Intel Labs Intel Corporation', u'full_name': u'Fabrice Paillet'}, {u'author_order': 4, u'affiliation': u'Circuits Research Lab & Future Technology Research, Intel Labs Intel Corporation', u'full_name': u'Tanay Karnik'}, {u'author_order': 5, u'affiliation': u'Circuits Research Lab & Future Technology Research, Intel Labs Intel Corporation', u'full_name': u'Shekhar Borkar'}] 2011 IEEE Hot Chips 23 Symposium (HCS), None

This article consists of a collection of slides from the author's conference presentation on the deployment of integrated inductors with magnetic materials for on-chip power conversion. Some of the specific topics discussed include: the special features and processing capabilities of DC voltage converters; the properties of magnetic materials; and key features and processing capabilities of inductors.


Ultra-high-Q air-core slab inductors for on-chip power conversion

[{u'author_order': 1, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u'Naigang Wang'}, {u'author_order': 2, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u'David Goren'}, {u'author_order': 3, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u"Eugene O'Sullivan"}, {u'author_order': 4, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u'Xin Zhang'}, {u'author_order': 5, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u'William J. Gallagher'}, {u'author_order': 6, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u'Philipp Herget'}, {u'author_order': 7, u'affiliation': u'IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, United States of America', u'full_name': u'Leland Chang'}] 2014 IEEE International Electron Devices Meeting, None

Air-core slab inductors with specially designed current return paths are proposed to achieve the ultra-high Q required for on-chip power delivery and management at >90% efficiency. Uniquely optimized for buck converter circuits, this CMOS-compatible structure avoids the challenges of thin-film magnetics. Q~25-30 at 200-300MHz is experimentally demonstrated.


3-D Microtransformers for DC–DC On-Chip Power Conversion

[{u'author_order': 1, u'affiliation': u'Laboratory for Microactuators, Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany', u'full_name': u'Ali Moazenzadeh'}, {u'author_order': 2, u'affiliation': u'Laboratory for Microactuators, Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany', u'full_name': u'Fralett Su\xe1rez Sandoval'}, {u'author_order': 3, u'affiliation': u'Freiburg Institute of Advanced Studies, University of Freiburg, Freiburg, Germany', u'full_name': u'Nils Spengler'}, {u'author_order': 4, u'affiliation': u'Laboratory for Microactuators, Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany', u'full_name': u'Vlad Badilita'}, {u'author_order': 5, u'affiliation': u'Laboratory for Microactuators, Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany', u'full_name': u'Ulrike Wallrabe'}] IEEE Transactions on Power Electronics, 2015

We address the miniaturization of power converters by introducing novel 3-D microtransformers with magnetic core for low-megahertz frequency applications. The core is fabricated by lamination and microstructuring of Metglas 2714A magnetic alloy. The solenoids of the microtransformers are wound around the core using a ball-wedge wirebonder. The wirebonding process is fast, allowing the fabrication of solenoids with up to 40 ...


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IEEE.tv Videos

Conversion of Artificial Recurrent Neural Networks to Spiking Neural Networks for Low-power Neuromorphic Hardware - Emre Neftci: 2016 International Conference on Rebooting Computing
APEC Speaker Highlights: Ron Van Dell
Critical Update: KeyTalk with Cian O'Mathuna
Challenges Associated with VHF Power Conversion - Anthony Sagneri at APEC 2016
ECCE Plenary: Pedro Ray, part 2
IEEE WEBINAR SERIES-March 5th, 2014: GaN Crushing Silicon...and Let Me Tell You How
ECCE Plenary: Richard K. Williams, part 1
A 28GHz CMOS Direct Conversion Transceiver with Packaged Antenna Arrays for 5G Cellular Systems: RFIC Industry Showcase 2017
GaN Transistors -- Crushing Silicon in Wireless Energy Transfer
ECCE Plenary: Lennart Jonsson, part 2
The Future of Power Electronics Design - Michael Harrison at APEC 2016
KeyTalk with Conor Quinn: Empowering the Electronics Industry - A Power Technology Roadmap - APEC 2017
KeyTalk with Ljubisa Stevanovic: From SiC MOSFET Devices to MW-scale Power Converters - APEC 2017
ON-CHIP VOLTAGE AND TIMING DIAGNOSTIC CIRCUITS
A 200um x 200um x 100um, 63nW, 2.4GHz Injectable Fully-Monolithic Wireless BioSensing System: RFIC Industry Showcase 2017
Design of Monolithic Silicon-Based Envelope-Tracking Power Amplifiers for Broadband Wireless Applications
ECCE Plenary: Lennart Jonsson, part 1
Does Power Efficiency Improve with Consolidation in the Semiconductor Industry? - Hans Stork, APEC 2018
2015 IEEE Honors: IEEE Medal in Power Engineering - Fred C. Lee
A 10-40GHz Frequency Quadrupler Source with Switchable Bandpass Filters and >30dBc Harmonic Rejection: RFIC Interactive Forum 2017


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