Microprocessor

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A microprocessor incorporates the functions of a computer's central processing unit (CPU) on a single integrated circuit (IC, or microchip). It is a multipurpose, programmable, clock-driven, register-based electronic device that accepts binary data as input, processes it according to instructions stored in its memory, and provides results as output. (Wikipedia.org)






Conferences related to Microprocessor

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Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 28th International Symposium on Industrial Electronics (ISIE)

The conference will provide a forum for discussions and presentations of advancements inknowledge, new methods and technologies relevant to industrial electronics, along with their applications and future developments.


2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.


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Periodicals related to Microprocessor

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Circuits and Systems Magazine, IEEE


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Most published Xplore authors for Microprocessor

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No authors for "Microprocessor"


Xplore Articles related to Microprocessor

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IEE Colloquium on 'Microprocessor or ASIC - Choice and Implementation' (Digest No.140)

IEE Colloquium on Microprocessor or ASIC - Choice and Implementation, 1988

None


High-performance and low-voltage challenges for sub-45nm microprocessor circuits

2005 6th International Conference on ASIC, 2005

Increasingly aggravated challenges in CMOS technology scaling beyond the 45nm node has resulted in several new design paradigm shifts necessary for high- performance and low-power microprocessors. This paper discusses some of the key technology challenges and the associated design paradigm shifts. High- performance and low-voltage energy-efficient circuit techniques to combat (i) increasing switching and active leakage power dissipation, (ii) poor ...


Design aspects of a microprocessor data cache using 3D die interconnect technology

2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005., 2005

This paper explores an implementation of a new technology called 3D die stacking. 3D die stacking is the bonding of two die either face-to-face or face-to-back in order to construct a 3D structure. In this work a face-to-face bonding is utilized because it yields a higher density die-to-die interconnect than is possible with face-to-back. With sufficiently dense die-to-die interconnect, devices ...


A 10GHz TCP offload accelerator for 10Gb/s Ethernet in 90nm dual-V/sub T/ CMOS

2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC., 2003

This prototype offloads TCP input processing on minimum packet sizes at wire speed for 10Gb/s Ethernet. The design employs a 10GHz core with a specialized instruction set and includes hardware support for dynamically reordering packets. In a 90nm dual-V/sub T/ CMOS process, the 8mm/sup 2/ chip has 260K transistors. Simulation predicts a power dissipation of 1.9W at 1.2V and 10GHz.


An IA-32 processor with a wide voltage operating range in 32nm CMOS

2012 IEEE Hot Chips 24 Symposium (HCS), 2012

This article consists of a collection of slides from the author's conference presentation on the deployment of an Intel IA-32 processor with a wide range of voltage operating ranges in 32nm CMOS technology. Some of the specific topics discussed include: the purpose of near threshold voltage and wide dynamic range capabilities; design challenges; a description of the Intel Claremont prototype; ...


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Educational Resources on Microprocessor

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IEEE-USA E-Books

  • IEE Colloquium on 'Microprocessor or ASIC - Choice and Implementation' (Digest No.140)

    None

  • High-performance and low-voltage challenges for sub-45nm microprocessor circuits

    Increasingly aggravated challenges in CMOS technology scaling beyond the 45nm node has resulted in several new design paradigm shifts necessary for high- performance and low-power microprocessors. This paper discusses some of the key technology challenges and the associated design paradigm shifts. High- performance and low-voltage energy-efficient circuit techniques to combat (i) increasing switching and active leakage power dissipation, (ii) poor leakage tolerance of large-signal cache arrays and register files, and (iii) worsening global on-chip interconnect scaling trend, are presented.

  • Design aspects of a microprocessor data cache using 3D die interconnect technology

    This paper explores an implementation of a new technology called 3D die stacking. 3D die stacking is the bonding of two die either face-to-face or face-to-back in order to construct a 3D structure. In this work a face-to-face bonding is utilized because it yields a higher density die-to-die interconnect than is possible with face-to-back. With sufficiently dense die-to-die interconnect, devices as complex as an iA32 microprocessor can be repartitioned or split between two die in order to simultaneously improve performance and power. The 3D structure of this emerging technology is examined and applied in this paper to a conventional 2D 32KB data cache. In this study, it is shown that a 3D implementation can potentially improve the silicon area, complexity, performance and power of a 2D circuit simultaneously.

  • A 10GHz TCP offload accelerator for 10Gb/s Ethernet in 90nm dual-V/sub T/ CMOS

    This prototype offloads TCP input processing on minimum packet sizes at wire speed for 10Gb/s Ethernet. The design employs a 10GHz core with a specialized instruction set and includes hardware support for dynamically reordering packets. In a 90nm dual-V/sub T/ CMOS process, the 8mm/sup 2/ chip has 260K transistors. Simulation predicts a power dissipation of 1.9W at 1.2V and 10GHz.

  • An IA-32 processor with a wide voltage operating range in 32nm CMOS

    This article consists of a collection of slides from the author's conference presentation on the deployment of an Intel IA-32 processor with a wide range of voltage operating ranges in 32nm CMOS technology. Some of the specific topics discussed include: the purpose of near threshold voltage and wide dynamic range capabilities; design challenges; a description of the Intel Claremont prototype; design strategies and methodologies; and key areas of product and system improvement.

  • 32-bit High Performance Embedded Microprocessor

    The Aviation Microelectronic Center of NPU (Northwestern Polytechnical University) has recently completed the development of a 32-bit superscalar RISC microprocessor, called "Longtium" R2. In this paper the architecture of "Longtium" R2 is presented. Firstly, the whole architecture of the "Longtium" R2 microprocessor is presented in section 2. Fig 1 gives the schematic diagram of the architecture of the "Longtium" R2. Then the design and implement are discussed in Section 3. Finally, the conclusions of "Longtium" R3 microprocessor is concluded in section 4. The "longtium"R2 CPU is fabricated in a 0.18μ CMOS process. The die size of the chip is 4.1 mmǒ 5.2 mm and the CPU operating frequency is at least 233MHz.

  • IEE Colloquium on 'Interference and Design for EMC in Microprocessor Based Systems' (Digest No.104)

    None

  • IEE Colloquium on 'Living with Microprocessor Controlled Traction Systems' (Digest No.056)

    None

  • Performance evaluation of modern broadwell architecture of a parallel & distributed microprocessor

    In this paper, we have discussed an overview of the modern architectures which were introduced recently and broadly used nowadays. We have evaluated the overall performance of a modern Broadwell architecture using a distributed and shared memory system. The performance has been tested based on the speedup gained after running the parallelized form of the various sequential programs. The analysis has been performed using the benchmark programs of an open source Parmibench suite. The speedups obtained by the parallel distribution of the processor cores compared to the sequential distribution have been observed. The key simulation prospects and features which need to be enhanced in the future products of the low power microprocessor family have been identified. Simulation results show that the low clock frequency processors provide both efficient processing capabilities along with reduced power consumption, after we compared them with a high clock frequency microprocessor.

  • Implementation of FPGA technology as human-machine interface to Z80 microprocessor learning module

    Microprocessor system is a must know subject in electrical engineering. Despite of learning through simulation, student, especially in polytechnic, have to be more involved in the hands on practice. Z80 is one of the simplest microprocessor system for studied. Many of existing Z80 learning board came with tons of user friendly interfaces, such as a keypad and alphanumerical LCD, however, the most important basic of this subject, the data transfer signaling, is sometime difficult to show. In this paper, we present a Z80 microprocessor module as learning facility with a HMI chip that is designed using FPGA chip, which is allow us to gate and control the microprocessor signals. The HMI chip implanted several control functions; the STEP unit, DMA unit, control memory unit, I/O control unit, address and data control unit, and system reset unit. Units in the HMI chip works very structured, and interconnected. With the signal controlled from the HMI chip units, the microprocessor work process becomes more easily to be manipulated and observed. The process of storing and reading program using DMA also can be easier to understand. Simple layout of the main board greatly facilitate student in operate and analyze a running program. Since the HMI chip built on an LVCMOS technology, while the classic Z80 CPU is still a CMOS, two-way bus logic level converters from 3.3V to 5V have to be used. Working frequency achieved is from 3MHz to 10MHz.



Standards related to Microprocessor

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IEEE Recommended Practice for Microprocessor-Based Protection Equipment Firmware Control

The scope of this recommended practice is to identify the means for timely and efficient exchange of information between manufacturers and users of protection-related equipment with respect to (1) changes in device firmware and (2) the impact of those changes. It will also include an examination of the technical and operational ramifications resulting from changes in the device firmware. Only ...


IEEE Standard for a 32-bit Microprocessor Architecture


IEEE Standard for a Versatile Backplane Bus: VMEbus


IEEE Standard for an 8-Bit Microcomputer Bus System: STD Bus


IEEE Standard for Mechanical Core Specifications for Microprocessors