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2014 IEEE Symposium on VLSI CircuitsVisit website
Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies - Adaptive pow
2013 Annual Conference on Magnetism and Magnetic Materials (MMM)Visit website
All aspects of theory, experiments and applications of magnetism, magnetic materials and devices.
2013 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)
2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)
Development of micro -electro mechanical systems (MEMS) focusing on design\, simulation and analysis tools\, fabrication technologies and processes\, integration techniques\, and assembly and packaging approaches. Application of MEMS in sensors and actuators\, microdevices for opto -mechanical systems\, fluidic microsystems\, biomedical engineering\, wireless communication\, power supply and energy harvesting and nano - electro -mechanical devices.
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)
premier components\, packaging and technology conference
O'Neal, C.B.; Malshe, A.P.; Singh, S.B.; Brown, W.D.; Eaton, W.P. Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on, 1999
Unlike IC packaging, MEMS dice must interface with the environment for sensing, interconnection, and/or actuation. MEMS packaging is application specific and the package provides the physical interface of the MEMS device to the environment. In the case of a fluid mass flow control sensor, the medium flows into and out of the package. This type of packaging is referred to ...
Perlmutter, M.; Robin, L. Position Location and Navigation Symposium (PLANS), 2012 IEEE/ION, 2012
The latest advances in MEMS inertial sensors for applications where size, weight, power, and cost are key considerations are having profound effects on the market place. MEMS industrial and tactical-grade sensors are the most dynamic technology in the high-performance inertial industry. Vole Development sees the market growing from $381.8M in 2011 to $638.8M in 2017 for single MEMS accelerometers and ...
Pieters, P.; Qi, D.; Witvrouw, A. High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on, 2007
Summary form only given. The majority of current MEMS products on the market still use a hybrid approach for the MEMS and the processing circuitry. The disadvantage of a hybrid approach is on the one hand the higher assembly and packaging cost and on the other hand the fact that the interconnections between the MEMS and the processing circuitry induce ...
Pieters, P. Microelectronics and Packaging Conference, 2009. EMPC 2009. European, 2009
For fast and cost effective development of novel MEMS devices, it is advantageous to start from advanced and stable MEMS technology platforms. IMEC offers such platforms for post-CMOS MEMS integration, RF-MEMS, MEMS interconnection and packaging and for Si-photonics. In this paper these versatile MEMS technology platforms together with various examples are described. In IMEC's CMORE offering, not only technology development ...
Velten, T.; Ruf, H.H.; Barrow, D.; Aspragathos, N.; Lazarou, P.; Jung, E.; Malek, C.K.; Richter, M.; Kruckow, J.; Wackerle, M. Advanced Packaging, IEEE Transactions on, 2005
Biomicroelectromechanical systems (bio-MEMS) are MEMS which are designed for medical or biological applications. As with other MEMS, bio-MEMS frequently, have to be packaged to provide an interface to the macroscale world of the user. Bio-MEMS can be roughly divided in two groups. Bio-MEMS can be pure technical systems applied in a biological environment or technical systems which integrate biological materials ...
Assembly Technician Qualcomm, Inc.
Electrical Engineer Teradyne
Digital Hardware Design Engineer (Sensors) Qualcomm, Inc.
Analog IC Design Engineer - CONTRACT ROLE Qualcomm, Inc.
Senior Director, Systems Engineering Qualcomm, Inc.
Sr. Staff Display Backplane Circuit Design Lead Qualcomm, Inc.
Embedded Software Engineer (Sensors) Qualcomm, Inc.
Systems Integration and Test Engineer/Manager Qualcomm, Inc.
Hardware Test & Design Engineer - Probe Card Design and Development Qualcomm, Inc.
Augmented Reality Engineer - SYSTEMS (Qualcomm Research San Diego) Qualcomm, Inc.
Audio Systems Engineer, Senior Level and Above Qualcomm, Inc.
Senior Electrical Engineer Digital Sport Nike
Senior Electrical Engineer- Digital Sport Nike
System Integration Lead - Sensors Integration and Verification (San Diego) Qualcomm, Inc.
Manager, Microelectronics Fabrication Laboratory MIT Lincoln Laboratory
Electrical Engineer ITT Exelis
Digital IC Design Engineer - CONTRACT ROLE Qualcomm, Inc.
Electronics Engineer Assistant Electronic Instrumentation Systems Job in MOUNTAIN VIEW, CA Federal Government Jobs
Borses, Dwight Wireless Sensor Networks and Applications, 2004
A Wireless Sensor Network (WSN) is made up of a large number of sensors which are extremely small, low-cost, and low-power devices that collect environmental data (acoustics, light, temperature, humidity, imaging, etc.) that is then communicated through radio or optical means to infrastructure processing nodes. WSNs may consist of up to thousands of nodes, which can be deployed in very ...
Buus, Jens Tunable Semiconductor Lasers, 2006
This course describes the state-of-the-art of tunable lasers, tunable laser technologies and control of tunable lasers. It also includes a brief introduction to the basics of semiconductor lasers, as well as background on DFB lasers, in particular how a grating works as a wavelength selective element in DFB and DBR lasers. Tuning mechanisms and tuning properties will be described, and ...
Campbell, Joe C. Optoelectronic Devices for Fiber Optics, 2005
This course provides an introductory, tutorial-type overview of key optoelectronic devices for optical communication systems, specifically, semiconductor lasers, photodetectors, optical modulators, and some WDM components. The course covers a broad range of devices with an emphasis on fundamental device physics and operating principles. Important performance parameters including design tradeoffs will also be discussed. The laser section will discuss applications and ...
Recommended practices for gyroscope and accelerometer testing are discussed, ranging from the equipment and instrumentation employed to the way that tests are carried out and data are acquired and analyzed.
Generate errata and/or revisions to the existing Std. 836-1991.
To review all of the definitions included in the standard and to revise them as required. New terminology will be added to bring the document up to date with current technology.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.