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Conferences related to Mems

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2014 IEEE Symposium on VLSI Circuits

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Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies - Adaptive pow

  • 2020 IEEE Symposium on VLSI Circuits

    Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies - Adaptive pow

  • 2018 IEEE Symposium on VLSI Circuits

    Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies - Adaptive pow

  • 2016 IEEE Symposium on VLSI Circuits

    circuit design to address challenges of deeply scaled technologies - e.g. dfm, variability, reliability - digital circuit techniques - analog and mixed signal circuits such as data converters and amp

  • 2012 IEEE Symposium on VLSI Circuits

    Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation

  • 2011 IEEE Symposium on VLSI Circuits

    Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies - Adaptive pow

  • 2010 IEEE Symposium on VLSI Circuits

    Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies - Adaptive pow

  • 2009 Symposium on VLSI Circuits

    Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability - Digital circuit techniques - Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability - Complex SOC systems describing new architectures and implementations - Circuit approaches for clock generation and distribution - Advances in memory circuits; especially for embedded memories in scaled technologies = Adaptive power techniques and power management for analog and digital circuits - Techniques for digitally-assisted analog and analog-assisted digital including digital implementation of previously analog functions - RF and wireless communications with emphasis on system architecture and implementation - Circuits for sensors and displays - Wireline transceiver and I/O design optimized for high bandwidth and low-power

  • 2008 IEEE Symposium on VLSI Circuits

  • 2007 IEEE Symposium on VLSI Circuits


2013 Annual Conference on Magnetism and Magnetic Materials (MMM)

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All aspects of theory, experiments and applications of magnetism, magnetic materials and devices.


2013 Annual Reliability and Maintainability Symposium - Product Quality & Integrity (RAMS)


2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)

Development of micro -electro mechanical systems (MEMS) focusing on design\, simulation and analysis tools\, fabrication technologies and processes\, integration techniques\, and assembly and packaging approaches. Application of MEMS in sensors and actuators\, microdevices for opto -mechanical systems\, fluidic microsystems\, biomedical engineering\, wireless communication\, power supply and energy harvesting and nano - electro -mechanical devices.

  • 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

    This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years\, the IEEE MEMS Conference has attracted more than 700 participants\, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees\, presenters and exhibitors.

  • 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)

    Premier Conference on MEMS reporting the lastest research results on every aspect of microsystems technology.

  • 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS)

    MEMS 2011 will be held in Cancun, Mexico from 23-27 January 2011 at the Hilton. The MEMS Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. In recent years, it has attracted more than 700 participants, 750+ abstract submissions and has presented over 200 select papers in non-overlapping podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees.

  • 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS)

    Development of micro-electro mechanical systems (MEMS) focusing on design, simulation and analysis tools, fabrication technologies and processes, integration techniques, and assembly and packaging approaches. Application of MEMS in sensors and actuators, microdevices for opto-mechanical systems, fluidic microsystems, biomedical engineering, wireless communication, power supply and energy harvesting and nano-electro-mechanical devices.

  • 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS)

    MEMS 2009 will be held in Sorrento, Italy on 26-29 January 2009 at the Hilton Sorrento Palace. the MEMS Conference series has evolved into the premier annual event reporting research results on every aspect of microsystems technology. In recent years, it has attracted more than 700 participants, 750+ abstract submissions and has presented over 200 select papers in non-overlapping podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, present


2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

premier components\, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components\, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components\, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components\, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components\, packaging and technology

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging\, components and microelectronic systems science\, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


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Xplore Articles related to Mems

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  • Challenges in the packaging of MEMS

    O'Neal, C.B.; Malshe, A.P.; Singh, S.B.; Brown, W.D.; Eaton, W.P. Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on, 1999

    Unlike IC packaging, MEMS dice must interface with the environment for sensing, interconnection, and/or actuation. MEMS packaging is application specific and the package provides the physical interface of the MEMS device to the environment. In the case of a fluid mass flow control sensor, the medium flows into and out of the package. This type of packaging is referred to ...

  • High-performance, low cost inertial MEMS: A market in motion!

    Perlmutter, M.; Robin, L. Position Location and Navigation Symposium (PLANS), 2012 IEEE/ION, 2012

    The latest advances in MEMS inertial sensors for applications where size, weight, power, and cost are key considerations are having profound effects on the market place. MEMS industrial and tactical-grade sensors are the most dynamic technology in the high-performance inertial industry. Vole Development sees the market growing from $381.8M in 2011 to $638.8M in 2017 for single MEMS accelerometers and ...

  • Integration and Packaging MEMS Directly Above Active CMOS

    Pieters, P.; Qi, D.; Witvrouw, A. High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on, 2007

    Summary form only given. The majority of current MEMS products on the market still use a hybrid approach for the MEMS and the processing circuitry. The disadvantage of a hybrid approach is on the one hand the higher assembly and packaging cost and on the other hand the fact that the interconnections between the MEMS and the processing circuitry induce ...

  • Versatile MEMS and mems integration technology platforms for cost effective MEMS development

    Pieters, P. Microelectronics and Packaging Conference, 2009. EMPC 2009. European, 2009

    For fast and cost effective development of novel MEMS devices, it is advantageous to start from advanced and stable MEMS technology platforms. IMEC offers such platforms for post-CMOS MEMS integration, RF-MEMS, MEMS interconnection and packaging and for Si-photonics. In this paper these versatile MEMS technology platforms together with various examples are described. In IMEC's CMORE offering, not only technology development ...

  • Packaging of bio-MEMS: strategies, technologies, and applications

    Velten, T.; Ruf, H.H.; Barrow, D.; Aspragathos, N.; Lazarou, P.; Jung, E.; Malek, C.K.; Richter, M.; Kruckow, J.; Wackerle, M. Advanced Packaging, IEEE Transactions on, 2005

    Biomicroelectromechanical systems (bio-MEMS) are MEMS which are designed for medical or biological applications. As with other MEMS, bio-MEMS frequently, have to be packaged to provide an interface to the macroscale world of the user. Bio-MEMS can be roughly divided in two groups. Bio-MEMS can be pure technical systems applied in a biological environment or technical systems which integrate biological materials ...

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Educational Resources on Mems

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  • Wireless Sensor Networks and Applications

    Borses, Dwight Wireless Sensor Networks and Applications, 2004

    A Wireless Sensor Network (WSN) is made up of a large number of sensors which are extremely small, low-cost, and low-power devices that collect environmental data (acoustics, light, temperature, humidity, imaging, etc.) that is then communicated through radio or optical means to infrastructure processing nodes. WSNs may consist of up to thousands of nodes, which can be deployed in very ...

  • Tunable Semiconductor Lasers

    Buus, Jens Tunable Semiconductor Lasers, 2006

    This course describes the state-of-the-art of tunable lasers, tunable laser technologies and control of tunable lasers. It also includes a brief introduction to the basics of semiconductor lasers, as well as background on DFB lasers, in particular how a grating works as a wavelength selective element in DFB and DBR lasers. Tuning mechanisms and tuning properties will be described, and ...

  • Optoelectronic Devices for Fiber Optics

    Campbell, Joe C. Optoelectronic Devices for Fiber Optics, 2005

    This course provides an introductory, tutorial-type overview of key optoelectronic devices for optical communication systems, specifically, semiconductor lasers, photodetectors, optical modulators, and some WDM components. The course covers a broad range of devices with an emphasis on fundamental device physics and operating principles. Important performance parameters including design tradeoffs will also be discussed. The laser section will discuss applications and ...

Standards related to Mems

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Periodicals related to Mems

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  • Advanced Packaging, IEEE Transactions on

    The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

  • Aerospace and Electronic Systems Magazine, IEEE

    The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.

  • Antennas and Propagation, IEEE Transactions on

    Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

  • Antennas and Wireless Propagation Letters, IEEE

    IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.

  • Components and Packaging Technologies, IEEE Transactions on

    Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

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