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2014 8th International Conference on Integrated Power Electronics Systems (CIPS)
Mechatronic Integration Hybrid System and Ultra High Power Density Integration Systems and Components Reliability
All aspects of theory, experiments and applications of magnetism. magnetic materials and devices.
2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD)
ISPSD is the premier forum for technical discussion in all areas of power semiconductor devices and power integrated circuits. Topics of interest include Device Physics, Device Design, Power Devices, Safe-Operating Area, Reliability, ESD, Process Integration, Modeling, Materials, Circuit Design, Power SoC, Packaging, Thermal Management.
This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors.
2014 IEEE 40th Photovoltaic Specialists Conference (PVSC)
The PVSC is a technical conference dedicated to the science and application of photovoltaics for solar electricity generation. Technical Program Areas: 1. Fundamentals and New Concepts for Future Technologies 2. Thin Film Polycrystalline Photovoltaics 3. III-V and Concentrator Technologies 4. Crystalline Silicon Technologies 5. Thin Film Silicon Based PV Technologies 6. Organic Photovoltaics 7. Space Technologies 8. Characterization and Measurement Methods 9. PV Modules and Manufac
No Xplore Articles are currently tagged "Materials"
Materials Specialist Eaton
Postdoctoral Researcher IMDEA Materials
Electrical Engineer IV - (37) Applied Materials
Electrical Engineer III - (E3) Applied Materials
Electrical Engineer III - (E3) Applied Materials
RF Electrical Engineer V - (E5) Applied Materials
Electrical Engineer Applied Materials
Electrical Engineer III Senior - (E3) Applied Materials
W2 Professorship for Materials and Components of Electrical Distribution Systems FAU Erlangen-Nuernberg
Manager Supply Chain Eaton
Postdoctoral Appointee in Nanowires, Nanostructures Sandia National Laboratories
Research Scientist, LED Chips R&D Cree, Inc.
Marie Curie Early Stage Researcher (ESR) http://www.qub.ac.uk/jobs
Intern: Asst. Electrical Engineer Metra
Faculty Positions in Science, Technology, and Innovation Skolkovo Institute of Science and Technology
Packaging Engineer Princeton Lightwave, Inc.
Software Engineer - Autonomous Experimentation UES, Inc.
Associate Electrical Engineer Orbital Sciences
Electrical Engineer - Senior Process Control Engineer Honeywell
Electrical Engineering Intern - Hebron Dematic
Global Commodity Manager Eaton
Senior Electrical Engineer - Basra - Iraq Hill International, Inc.
Principal Electrical Engineer * Honeywell
Integration/Product Engineer - LED Chips Cree, Inc.
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
2013 IEEE Corporate Innovation Award
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Care Innovations: Green Engineering (com legendas em portugues)
A Low-Cost Open-Source Metal 3-D Printer
Is silicon dead? APEC 2013 Rap Session
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
Next Generation of Batteries
EMBC 2012 Theme Speaker: Professor John A. Rogers
Lithium ION Batteries
2011 IEEE Awards Edison Medal - Isamu Akasaki
APEC 2011 Exhibitor Overview
EMBC 2011-Speaker Highlights-Mary Tolikas, PhD, MBA
Transphorm: GaN Champions
Nanotechnology For Electrical Engineers
What's Out There: Careers for Electrical Engineers and Computer Scientists
IEEE WIE- TryEngineering Ship the Chip
Interview with the TX-0 Computer development team
Denmark Solar House
This recommended practice provides standard methods for the characterization of carbon nanotubes used as additives in bulk materials.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.