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2014 8th International Conference on Integrated Power Electronics Systems (CIPS)
Mechatronic Integration Hybrid System and Ultra High Power Density Integration Systems and Components Reliability
2014 IEEE International Frequency Control Symposium (FCS)
The 2014 IEEE International Frequency Control Symposium is one of the leading international technical conferences for research, development, and applications of frequency control. Topics include, Materials, Filters, Resonators, MEMS, Oscillators, Synthesizers, Noise, Timekeeping, Optical and Microwave Atomic Standards, Sensors and Transducers.
2013 13th International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)
The NUSOD conference intends to connect theory and practice in optoelectronics. Papers are solicited on the modeling, simulation, and analysis of optoelectronic devices including materials, fabrication, and application.
2013 13th International Workshop on Junction Technology (IWJT)
Doping,Activation Annealing, Junction for Novel CMOS Devices,Silicide/Contact,Characterization for Shallow Junction,Modeling/Simulation,Advanced Equipment/Materials/Substrates for Junction Technologies
2013 14th European Conference on Radiation and Its Effects on Components and Systems (RADECS)
The RADECS Conference features a technical program dedicated to the latest developments and experimental observations related to radiation effects on electronic and photonic components.
Hongyun Xiong; Surong Sun; Yan Jiang Computer-Aided Industrial Design and Conceptual Design, 2008. CAID/CD 2008. 9th International Conference on, 2008
Material technology is one of the most important fields in the development of science technology. With the development of science technology, new materials appear and are widely used all over the world, and they give tremendous impetus to product design. At first, the paper describes how these new materials affect the product design. Then the paper discusses about the development ...
Masi, J.V. Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 2001. Proceedings, 2001
The demonstration of organic magnetic materials has offered the challenge of finding polymer (organic) materials in which there is sufficient electronic exchange as well as stability both thermally and chemically. This paper gives an overview of this search past, present, and future and the synthesis of promising new complex polymer building blocks which can yield luminescent, ferro-, ferri-, and super-paramagnetic ...
Wei-Tzuo Lin; De-Shau Huang; Ming-Tzer Lin; Chi-Ming Lai Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on, 2010
Due to the development of high power density and high heat flux of MEMS, IC and LED components and devices, the thermal management of microelectronics has become a very critical issue in Microsystems and optoelectronic industries. This has lead to the requirement of high thermal performance materials. To enhance the thermal performance of current thermal modules, it is very important ...
Masi, J.V. Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings, 1999
The findings of organic materials for electroluminescent devices has opened the door for a wide variety of applications in displays, communications, sensors, and the like. The advent of creating organic electromagnetic materials has raised the challenge of finding polymer (organic) materials in which there is sufficient electronic exchange as well as stability in both the thermal and chemical arena. This ...
Meriakri, V.V. Microwaves, Radar and Wireless Communications. 2000. MIKON-2000. 13th International Conference on, 2000
Properties of different MM wave materials (liquid and solid dielectrics, semiconductors, ferrites, composite, building, natural and common use materials) at millimeter and submillimeter wavelengths are presented. These properties are of great interest for millimeter and submillimeter guiding and antenna systems including passive and active devices inserted in such systems, for millimeter and submillimeter propagation especially for indoor propagation, as well ...
RF Electrical Engineer V - (E5) Applied Materials
Electrical Engineer, Equipment Engineering Applied Materials
Electrical Engineer III - (E3) Applied Materials
Tenure-track assistant professor position in electronic materials UMass Amherst
Faculty Position in Experimental/Theoretical Materials Research University of Utah
Yale University, SEAS, Mechanical Engineering & Materials Science, Faculty Opening Yale University, Dept. of Mechanical Eng.
Faculty Position in the Department of Applied Physics and Materials Science California Institute of Technology
Electrical Engineering Intern Corning
Assistant / Associate Professor, Mechanical Engineering University of Wisconsin-Madison, Dept. of Mechanical EngineeringEngineering
Faculty Positions in Science, Technology, and Innovation Skolkovo Institute of Science and Technology
Sr. Electrical Engineer Honeywell
Associate Electrical Engineer Orbital Sciences Corporation
Faculty Position Available University of Michigan
Electrical Engineering Intern - Dallas Dematic
Electrical Engineering Intern - Hebron Dematic
Electrical Engineering Intern - Grand Rapids, MI Dematic
Engineering Faculty Alfaisal University
Electrical Engineering Co-Op Student Dematic
Electrical Engineer United Technologies Corporation
Electrical Engineer- MAKKAH Hill International, Inc.
Program Manager Hydroid, Inc
Lectureship in Spintronics/Computer Engineering University of Manchester
CDP - Electrical Engineering Air Products and Chemicals, Inc.
Research Faculty in Superconducting Science and Engineering for High Field Magnet R&D National High Magnetic Field Laboratory
Tsakalakos, Loucas Nanofabrication Essentials for Fabrication of Materials, Structures, and Devices, 2012
In this tutorial Dr. Tsakalakos discusses the fabrication of nanostructures using both top-down and bottom-up approaches. Methods for fabricating zero- dimensional, one-dimensional and two-dimensional nanostructures are also presented. Dr. Tsakalakos reviews the process for creating carbon fullerenes and nanotubes. The various types of lithography used to create nanostructures and the self-assembly of nanostructures are presented. Different properties (structural, chemical, mechanical, ...
Schubert, E. Fred Solid-State Lighting, 2005
This course presents an introduction as well as reference materials for professionals working in solid-state lighting. Course materials include the operating principles, device physics, fabrication, and applications of light- emitting diodes. Course materials also include a detailed discussion of daylight illumination sources, planckian sources, human vision, eye sensitivity, photometric and radiometric quantities, and color rendering capabilities of light sources. After ...
Tsakalakos, Loucas Nanotechnology: An Introduction, 2011
Nanotechnology is concerned with the science and engineering of materials and devices at the sub-100 nm lengths. At the nanoscalethe properties of materials change from bulk values and behavior towards those of atoms, resulting in unique thermal, mechanical, electrical, and optical phenomena. Specific subtopics addressed in this course are: carbon nanotubes, nanowires, self-assembled monolayers, plasmonics (nanoshells), quantum dots, core-shell nanoparticles, ...
Paradiso, Rita Smart Fabrics and Interactive Textile: State of the Art and Future Challenges, 2009
Smart Fabrics and Interactive Textile (SFIT) based systems are conceived as the integration, into textile, of sensors, actuators, computing, and a power source, with the whole being part of an interactive communication network. Such systems could only be envisaged through a combination of advances in fields as fiber and polymer research, advanced material processing, microelectronics, signals processing, nanotechnologies, and telecommunication.Textile ...
Richter, Curt Molecular Electronics (Part 1), 2007
This course will begin by outlining approaching limits of conventional CMOS technology. New architectural requirements and paradigms for future nanoelectronics will be described. .Top-down. and .bottom-up. manufacturing paradigms, particularly self-assembly of organic monolayers will be discussed. Theoretical and experimental realizations of molecular-scale electronic switches will be described. This course will also show nanoscale memory and logic circuits built with these ...
2013 IEEE Corporate Innovation Award
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
Care Innovations: Green Engineering (com legendas em portugues)
Is silicon dead? APEC 2013 Rap Session
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
Next Generation of Batteries
Lithium ION Batteries
EMBC 2012 Theme Speaker: Professor John A. Rogers
2011 IEEE Awards Edison Medal - Isamu Akasaki
APEC 2011 Exhibitor Overview
EMBC 2011-Speaker Highlights-Mary Tolikas, PhD, MBA
What's Out There: Careers for Electrical Engineers and Computer Scientists
IEEE WIE- TryEngineering Ship the Chip
Interview with the TX-0 Computer development team
The Josephson Effect: SQUIDs Then and Now: From SLUGS to Axions
Denmark Solar House
IEEE PELS Webinar Series-Galvanic Isolation for Power Supply Applications
Microfluidic diagnostics and other breakthrough technologies.
This recommended practice provides standard methods for the characterization of carbon nanotubes used as additives in bulk materials.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.