Manufacturing

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Manufacturing is the use of machines, tools and labor to produce goods for use or sale. The term may refer to a range of human activity, from handicraft to high tech, but is most commonly applied to industrial production, in which raw materials are transformed into finished goods on a large scale. (Wikipedia.org)






Conferences related to Manufacturing

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2018 IEEE Symposium on VLSI Technology

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2020 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2016 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2014 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2012 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2011 Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2010 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2009 IEEE Symposium on VLSI Technology

    - New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D-system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices

  • 2008 IEEE Symposium on VLSI Technology

  • 2007 IEEE Symposium on VLSI Technology

  • 2006 IEEE Symposium on VLSI Technology


2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2017 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2021 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2015 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2007 IEEE International Electron Devices Meeting (IEDM)

  • 2006 IEEE International Electron Devices Meeting (IEDM)


2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.

  • 2008 8th IEEE Conference on Nanotechnology (IEEE-NANO)

    This conference is the sequel to meetings held in Maui (2001), Washington (2002), San Francisco (2003), Munich (2004), Nagoya (2005), Cinncinati (2006), and Hong Kong (2007). The conference focus will be on engineering and business issues related to nanoelectronics, circuits, architectures, sensor systems, integration, reliability and manufacturing in addition to fundamental issues such as modeling, growth/synthesis, and characterization. The conference will feature plenary, invited, and contributed papers


2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

Control Systems & ApplicationsPower ElectronicsSignal Processing & Computational IntelligenceRobotics & MechatronicsSensors, Actuators & System IntegrationElectrical Machines & DrivesFactory Automation & Industrial InformaticsEmerging Technologies

  • 2012 IEEE 21st International Symposium on Industrial Electronics (ISIE)

    IEEE-ISIE is the largest summer conference of the IEEE Industrial Electronics Society, which is an international forum for presentation and discussion of the state of art in Industrial Electronics and related areas.

  • 2011 IEEE 20th International Symposium on Industrial Electronics (ISIE)

    Industrial electronics, power electronics, power converters, electrical machines and drives, signal processing, computational intelligence, mechatronics, robotics, telecommuniction, power systems, renewable energy, factory automation, industrial informatics.

  • 2010 IEEE International Symposium on Industrial Electronics (ISIE 2010)

    Application of electronics and electrical sciences for the enhancement of industrial and manufacturing processes. Latest developments in intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics.

  • 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009)

    The purpose of the IEEE international conference is to provide a forum for presentation and discussion of the state-of art of Industrial Electronics and related areas.


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Periodicals related to Manufacturing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Manufacturing

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Xplore Articles related to Manufacturing

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Preliminary test and evaluation of non-destructive examination for ITER First Wall development in Korea

Suk-Kwon Kim; Eo Hwak Lee; Jae-Sung Yoon; Hyun-Kyu Jung; Dong Won Lee; Byoung-Yoon Kim 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

ITER First Wall (FW) includes beryllium armour joined to a Cu heat sink with a stainless steel back plate. These first wall panels are one of the critical components in the ITER tokamak with a maximum surface heat flux of 5 MW/m2. So, a qualification test needs to be performed with the goal to qualify the joining technologies required for ...


Lessons learned from designing and manufacturing of the coil support structure of W7-X

Didier Chauvin; Torsten Koppe; Antonio Cardella; Bernd Missal; Dirk Pilopp; Giovanni Di Bartolo; Rocio Camín; Ivan Gonzales; Luca Giordano; Stefano Langone 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

Wendelstein 7-X (W7-X) is a fully optimised low-shear stellarator and shall demonstrate the reactor potential of this fusion plant. It is presently under construction at the Greifswald branch institute of IPP. The W7-X coil system consists of 20 planar and 50 non planar coils. They are supported by a pentagonal 10 m diameter, 2.5 m high called coil support structure ...


Proposal of an Evolutional Architecture for Metabolic Computing

Minoru Uehara 2011 Third International Conference on Intelligent Networking and Collaborative Systems, 2011

In our previous paper, we proposed metabolic computing model in order to realize sustainable information system. We think that metabolic computing model has high fault tolerance and sustainability. We also proposed a realistic architecture of metabolic computing model. Metaboloid is a processing unit in this architecture. A set of metaboloids is organized as mesh connected NORMA. However, in simple metabolism, ...


Design and Development Control System for Deep-Fertilization Variable Liquid Fertilizer Applicator

Chunling Lang; Jinwu Wang; Yeqiong Shi; Xiaohuan Xi 2011 Second International Conference on Digital Manufacturing & Automation, 2011

In order to improve Liquid fertilizer efficiency, Liquid variable fertilizing control system was designed with two working modes: a manual control and an automatic control mode. Taking the S3C44B0X microprocessor of ARM7 series as the core device, according to the fertilizing amount of the current location, the system was able to combined together for the machine speed and access to ...


Via-minimization expert for multilayer switchbox routing

D. Gu; C. H. Lee Proceedings of the 32nd Midwest Symposium on Circuits and Systems,, 1989

An expert system which deals with the multilayer switchbox routing problem is presented. The system, based on ExperOPS5, minimizes the number of vias by graph-theoretic approach. The early results of tests show that this algorithm finds the layer assignment with a significantly smaller number of vias in the multilayer switchbox


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Educational Resources on Manufacturing

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eLearning

Preliminary test and evaluation of non-destructive examination for ITER First Wall development in Korea

Suk-Kwon Kim; Eo Hwak Lee; Jae-Sung Yoon; Hyun-Kyu Jung; Dong Won Lee; Byoung-Yoon Kim 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

ITER First Wall (FW) includes beryllium armour joined to a Cu heat sink with a stainless steel back plate. These first wall panels are one of the critical components in the ITER tokamak with a maximum surface heat flux of 5 MW/m2. So, a qualification test needs to be performed with the goal to qualify the joining technologies required for ...


Lessons learned from designing and manufacturing of the coil support structure of W7-X

Didier Chauvin; Torsten Koppe; Antonio Cardella; Bernd Missal; Dirk Pilopp; Giovanni Di Bartolo; Rocio Camín; Ivan Gonzales; Luca Giordano; Stefano Langone 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

Wendelstein 7-X (W7-X) is a fully optimised low-shear stellarator and shall demonstrate the reactor potential of this fusion plant. It is presently under construction at the Greifswald branch institute of IPP. The W7-X coil system consists of 20 planar and 50 non planar coils. They are supported by a pentagonal 10 m diameter, 2.5 m high called coil support structure ...


Proposal of an Evolutional Architecture for Metabolic Computing

Minoru Uehara 2011 Third International Conference on Intelligent Networking and Collaborative Systems, 2011

In our previous paper, we proposed metabolic computing model in order to realize sustainable information system. We think that metabolic computing model has high fault tolerance and sustainability. We also proposed a realistic architecture of metabolic computing model. Metaboloid is a processing unit in this architecture. A set of metaboloids is organized as mesh connected NORMA. However, in simple metabolism, ...


Design and Development Control System for Deep-Fertilization Variable Liquid Fertilizer Applicator

Chunling Lang; Jinwu Wang; Yeqiong Shi; Xiaohuan Xi 2011 Second International Conference on Digital Manufacturing & Automation, 2011

In order to improve Liquid fertilizer efficiency, Liquid variable fertilizing control system was designed with two working modes: a manual control and an automatic control mode. Taking the S3C44B0X microprocessor of ARM7 series as the core device, according to the fertilizing amount of the current location, the system was able to combined together for the machine speed and access to ...


Via-minimization expert for multilayer switchbox routing

D. Gu; C. H. Lee Proceedings of the 32nd Midwest Symposium on Circuits and Systems,, 1989

An expert system which deals with the multilayer switchbox routing problem is presented. The system, based on ExperOPS5, minimizes the number of vias by graph-theoretic approach. The early results of tests show that this algorithm finds the layer assignment with a significantly smaller number of vias in the multilayer switchbox


More eLearning Resources

IEEE.tv Videos

IMS 2011 Microapps - Volume Manufacturing Trends for Automotive Radar Devices
U.S. Department of Energy Advanced Manufacturing Overview - Dev Shenoy: 2016 International Conference on Rebooting Computing
Care Innovations: Toxics In Electronics (com legendas em portugues)
Niobium Manufacturing for Superconductivity - ASC-2014 Plenary series - 5 of 13 - Tuesday 2014/8/12
Integrated Photonics Manufacturing Initiative - Michael Liehr Plenary from the 2016 IEEE Photonics Conference
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
All You Wanted to Know About Chinese Manufacturing But Were Afraid to Ask
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
2013 IEEE Robert N. Noyce Medal
Care Innovations: Green Engineering (com legendas em portugues)
DROP: The Durable Reconnaissance and Observation Platform
Care Innovations: Responsibility For Being Green (com legendas em portugues)
2011 IEEE Awards Ernst Weber Engineering Leadership Recognition - Tze-Chiang Chen
Cafe: Cloud Appliances for Enterprises
2013 IEEE Jun-Ichi Nishizawa Medal
Kaizad Mistry of Intel accepts the IEEE Corporate Innovation Award - Honors Ceremony 2016
2013 IEEE Corporate Innovation Award
New paradigm in Power Measurements for Satellite Thermal Vacuum Test: MicroApps 2015 - Keysight Technologies
Q&A Government Agencies Panel: 2016 International Conference on Rebooting Computing
Micro-Apps 2013: How to Make Your Designs More Robust

IEEE-USA E-Books

  • Appendix B

    The first volume ever to cover all aspects of the subject, Architectural Electromagnetic Shielding Handbook provides the practicing architect/engineer with a comprehensive guide to electromagnetic shielding. This practical handbook is a one-stop source for every form of shielding enclosure now used in commercial and government test laboratories, communication and computer centers, and electromagnetic hardened facilities designed to prevent electromagnetic interference (EMI) from reaching either a sensitive piece of equipment or an unauthorized agency. Additional features include: extensive supporting information on penetrations such as doors, vents, piping, and electromagnetic filters for each type of shielding complete descriptions of modular, welded, and architectural forms of shielding as well as design checklists for shielded enclosure installation detailed descriptions of performance specifications and methods of testing necessary to prove performance Now you can have practical design and manufacturing techniques for solving ESD problems associated with sophisticated equipment used in a home or office environment. This book takes the mystery out of ESD by showing how it is generated and how it affects electronic devices, such as integrated circuits. It provides practical guidelines and the rationale on how ESD solutions can work for you.

  • An Industry Perspective on MCMD

    This chapter contains sections titled: Introduction MCM Definition: Pre-Design Laundry List Design Packaging Substrate Manufacturing Assembly Test Summary This chapter contains sections titled: References

  • Appendix C: Selected Bibliography

    The first volume ever to cover all aspects of the subject, Architectural Electromagnetic Shielding Handbook provides the practicing architect/engineer with a comprehensive guide to electromagnetic shielding. This practical handbook is a one-stop source for every form of shielding enclosure now used in commercial and government test laboratories, communication and computer centers, and electromagnetic hardened facilities designed to prevent electromagnetic interference (EMI) from reaching either a sensitive piece of equipment or an unauthorized agency. Additional features include: extensive supporting information on penetrations such as doors, vents, piping, and electromagnetic filters for each type of shielding complete descriptions of modular, welded, and architectural forms of shielding as well as design checklists for shielded enclosure installation detailed descriptions of performance specifications and methods of testing necessary to prove performance Now you can have practical design and manufacturing techniques for solving ESD problems associated with sophisticated equipment used in a home or office environment. This book takes the mystery out of ESD by showing how it is generated and how it affects electronic devices, such as integrated circuits. It provides practical guidelines and the rationale on how ESD solutions can work for you.

  • BoardLevel Solder Joint Reliability of HighPerformance Computers Under Mechanical Loading

    This chapter contains sections titled: Introduction Establishing PWB Strain Limits for Manufacturing SMT Component Fracture Strength Characterization PWB Fracture Strength Characterization PWB Strain Characterization Solder Joint Fracture Prediction - Modeling Fracture Strength Optimization Conclusions Acknowledgments Note References

  • Index

    The first volume ever to cover all aspects of the subject, Architectural Electromagnetic Shielding Handbook provides the practicing architect/engineer with a comprehensive guide to electromagnetic shielding. This practical handbook is a one-stop source for every form of shielding enclosure now used in commercial and government test laboratories, communication and computer centers, and electromagnetic hardened facilities designed to prevent electromagnetic interference (EMI) from reaching either a sensitive piece of equipment or an unauthorized agency. Additional features include: extensive supporting information on penetrations such as doors, vents, piping, and electromagnetic filters for each type of shielding complete descriptions of modular, welded, and architectural forms of shielding as well as design checklists for shielded enclosure installation detailed descriptions of performance specifications and methods of testing necessary to prove performance Now you can have practical design and manufacturing techniques for solving ESD problems associated with sophisticated equipment used in a home or office environment. This book takes the mystery out of ESD by showing how it is generated and how it affects electronic devices, such as integrated circuits. It provides practical guidelines and the rationale on how ESD solutions can work for you.

  • Alloy Selection

    This chapter contains sections titled: Introduction Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability R&D Issues Remaining in Lead-Free Solder Implementation Summary References

  • Industry-Related Applications

    This chapter contains sections titled: 8.1 Business-to-Business E-Commerce, 8.2 Manufacturing, 8.3 Background

  • Semantic Unification

    The goal of enterprise integration is the development of computer-based tools that facilitate coordination of work and information flow across organizational boundaries. These proceedings, the first on EI modeling technologies, provide a synthesis of the technical issues involved; describe the various approaches and where they overlap, complement, or conflict with each other; and identify problems and gaps in the current technologies that point to new research.The leading edge of a movement that began with computer- aided design/computer-aided manufacturing (CAD/CAM), EI now seeks to engage the development of computer-based tools to control not only manufacturing but the allied areas of materials supply, accounting, and inventory control. EI technology is pushing forward research in areas such as distributed AI, concurrent engineering, task coordination, human-computer interaction, and distributed planning and scheduling. These proceedings provide the first common technical ground for comparing, evaluating, or coordinating these efforts.Charles J. Petrie, Jr., is Senior Member of Technical Staff at MCC in Austin, Texas.Topics include: Computer Integrated Manufacturing. Open System Architecture Standards. The results of five workshops on EI modeling topics: Model Integration, Model/Application Namespace, Heterogeneous Execution Environments, Metrics and Methodologies, and Coordination Process Models.

  • Extruded SolidDielectric Power Transmission Cables

    This chapter contains sections titled: Introduction Design and Construction Manufacturing Methods Testing Accessories Concluding Remarks This chapter contains sections titled: References

  • Continuous Monitoring

    This chapter contains sections titled: Introduction Continuous Contamination Monitoring Continuous Monitoring of Manufacturing Evaluation of In Situ Monitoring in an Aqueous Cleaning Application Antennas for Electrostatic Charge Monitoring References and Notes



Standards related to Manufacturing

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IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Ethylene-Propylene Rubber Insulation

This recommended practice establishes requirements for three-conductor new round-and-flat-type oil-well cables used in supplying three-phase ac electric power to submersible pump motors. The three major cables by components are copper conductors, ethylene-propylene diene monomer (EPDM) insulation, nitrile jacket and galvanized armor.


IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Polypropylene Insulation

This recommended practice establishes requirements for three-conductor round and flat type oil well cable used in supplying three-phase ac electric power to submersible pump motors. The major cable components are copper conductors, polypropylene insulation, polymeric jacket and galvanized armor.


IEEE Standard for Receiver Fixture Interface



Jobs related to Manufacturing

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