Manufacturing

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Manufacturing is the use of machines, tools and labor to produce goods for use or sale. The term may refer to a range of human activity, from handicraft to high tech, but is most commonly applied to industrial production, in which raw materials are transformed into finished goods on a large scale. (Wikipedia.org)






Conferences related to Manufacturing

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2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2016 IEEE Symposium on VLSI Technology

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2020 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2018 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2014 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2012 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2011 Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2010 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2009 IEEE Symposium on VLSI Technology

    - New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D-system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices

  • 2008 IEEE Symposium on VLSI Technology

  • 2007 IEEE Symposium on VLSI Technology

  • 2006 IEEE Symposium on VLSI Technology


2015 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2021 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2017 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2007 IEEE International Electron Devices Meeting (IEDM)

  • 2006 IEEE International Electron Devices Meeting (IEDM)


2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.

  • 2008 8th IEEE Conference on Nanotechnology (IEEE-NANO)

    This conference is the sequel to meetings held in Maui (2001), Washington (2002), San Francisco (2003), Munich (2004), Nagoya (2005), Cinncinati (2006), and Hong Kong (2007). The conference focus will be on engineering and business issues related to nanoelectronics, circuits, architectures, sensor systems, integration, reliability and manufacturing in addition to fundamental issues such as modeling, growth/synthesis, and characterization. The conference will feature plenary, invited, and contributed papers


2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

Control Systems & ApplicationsPower ElectronicsSignal Processing & Computational IntelligenceRobotics & MechatronicsSensors, Actuators & System IntegrationElectrical Machines & DrivesFactory Automation & Industrial InformaticsEmerging Technologies

  • 2012 IEEE 21st International Symposium on Industrial Electronics (ISIE)

    IEEE-ISIE is the largest summer conference of the IEEE Industrial Electronics Society, which is an international forum for presentation and discussion of the state of art in Industrial Electronics and related areas.

  • 2011 IEEE 20th International Symposium on Industrial Electronics (ISIE)

    Industrial electronics, power electronics, power converters, electrical machines and drives, signal processing, computational intelligence, mechatronics, robotics, telecommuniction, power systems, renewable energy, factory automation, industrial informatics.

  • 2010 IEEE International Symposium on Industrial Electronics (ISIE 2010)

    Application of electronics and electrical sciences for the enhancement of industrial and manufacturing processes. Latest developments in intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics.

  • 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009)

    The purpose of the IEEE international conference is to provide a forum for presentation and discussion of the state-of art of Industrial Electronics and related areas.


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Periodicals related to Manufacturing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Xplore Articles related to Manufacturing

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On relation of manufacturing system, manufacturing mode and manufacturing technology

Dai, Qinghui Technology and Innovation Conference, 2006. ITIC 2006. International, 2006

Purpose: The contemporary manufacturing engineering is a organic whole to take manufacturing science as basal, from manufacturing mode and manufacturing technology composing of, carrying on process to handle to manufacturing resources and manufacturing information. In order to fully bring into play the effects manufacturing technology, according to the contemporary manufacturing engineering the characteristics of whole process, big scope and high ...


Networked Collaborative Manufacturing Mode Based on Manufacturing Services

Qifeng Wang Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on, 2008

To effectively realize the networked collaborative manufacturing, this paper proposes a manufacturing services-based networked collaborative manufacturing mode based on the analysis of the conception and characteristics of manufacturing services. The collaborative manufacturing mode is composed with collaborative manufacturing object layer, collaborative manufacturing operation layer and collaborative manufacturing supporting layer, which used manufacturing Services as the basic collaborative units. Based above ...


Research on Manufacturing Resources Optimization Deployment for Complicated Parts

Peng Wen-li; Yang Ya-ping; Zhang Wen-ni Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on, 2011

It is believed that the agility can be realized by dynamically optimization deployment of networked manufacturing resources. To solve this problem, logical manufacturing unit (LMU) and logical manufacturing process (LMP) are proposed and defined to decompose and model networked manufacturing task according to the process of complex part. When selecting manufacturing resources for these manufacturing tasks, many factors should be ...


Immersive Virtual Reality Deployment in a Lean Manufacturing Environment

Gamlin, A.; Breedon, P.; Medjdoub, B. Interactive Technologies and Games (iTAG), 2014 International Conference on, 2014

This paper debates the necessity of implementing Virtual Reality Technology as a training tool within Lean Manufacturing Environments (LME). The topic for discussion surrounding this area is the need for a user friendly package that utilizes game and advanced Virtual Reality (VR) Technology to encompass the principles of the Lean approach to manufacturing. Fundamental principles adopted by video game developers ...


Manufacturing-driven design

Jangha Cho; Hsu, C. Systems, Man, and Cybernetics, 1997. Computational Cybernetics and Simulation., 1997 IEEE International Conference on, 1997

The past decades have seen significant research and practice on new information technology for manufacturing enterprises, including computer- integrated manufacturing (CIM), concurrent engineering (CE), and agile manufacturing. The ideal is always a pursuit of adaptively integrated design, manufacturing, and business processes linking the parts fabrication, factory production, and product development cycles for the enterprise. The linkage developed thus far, however, ...


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Educational Resources on Manufacturing

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eLearning

Wind Turbine Manufacturing, Assembly, Test and Maintenance Challenges

Ranky, Paul Wind Turbine Manufacturing, Assembly, Test and Maintenance Challenges, 2011

The entire world is seeking more energy, including energy generated by wind power. In this tutorial the basic components of a wind turbine are illustrated and explained. The integration of CAD with computer-aided manufacturing (CAM) and numerically- controlled machining coupled with computer coordinated measuring machine inspection has led to great advances in manufacturing parts for wind turbines. We will also ...


Top-Down Micro and Nano Manufacturing Miniaturization at the Micro and Nano Scale

Loucas Tsakalakos Top-Down Micro and Nano Manufacturing Miniaturization at the Micro and Nano Scale, 2013

Miniaturization is a major technological driver for many industries, and provides significant advantages in addition to enhanced performance. Applications that have benefitted from miniaturization include smart phone and tablets, as well as televisions and displays. The ability to make smaller devices significantly impacts product features, including size and weight. All of these developments are enabled by miniaturization of electronic, mechanical, ...


An Introduction to windmill and Wind Turbine Design and Manufacturing Processes

Ranky, Paul An Introduction to windmill and Wind Turbine Design and Manufacturing Processes, 2011

The entire world is seeking more energy, including energy generated by wind power. In this tutorial the basic components of a wind turbine are illustrated and explained. The authors discuss the challenges of wind energy economics and conventional versus alternative energy sources. They illustrate how wind power physics and related mathematics guide the design and the manufacturing processes of wind ...


Fundamentals of Fiber Optics - Fiber Theory, Manufacturing and Dispersion

Johnson, Larry Fundamentals of Fiber Optics - Fiber Theory, Manufacturing and Dispersion, 2009

In this tutorial, you will learn about the advantages and benefits that optical fiber provides to bandwidth, signal attenuation, noise immunity, size and weight. Light basics will also be reviewed along with fiber structures and attenuation. Fiber manufacturing will also be examined followed by multimode and singlemode dispersion.


Fiber Optic Cable - Fiber Optic Cables, Applications, and Manufacturing

Johnson, Larry Fiber Optic Cable - Fiber Optic Cables, Applications, and Manufacturing, 2009

In this tutorial we will begin with an introduction to the cabling process and the variations in cable structures that have been developed for the physical protection of the internal fiber structures. You will learn about cable structures for aerial, ducted, buried, underground premise and industrial environments. Next, loose buffered cables and tight buffered cables will be reviewed. Finally, the ...


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IEEE-USA E-Books

No IEEE-USA E-Books are currently tagged "Manufacturing"



Standards related to Manufacturing

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IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Ethylene-Propylene Rubber Insulation

This recommended practice establishes requirements for three-conductor new round-and-flat-type oil-well cables used in supplying three-phase ac electric power to submersible pump motors. The three major cables by components are copper conductors, ethylene-propylene diene monomer (EPDM) insulation, nitrile jacket and galvanized armor.


IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Polypropylene Insulation

This recommended practice establishes requirements for three-conductor round and flat type oil well cable used in supplying three-phase ac electric power to submersible pump motors. The major cable components are copper conductors, polypropylene insulation, polymeric jacket and galvanized armor.


IEEE Standard for Receiver Fixture Interface