Manufacturing

View this topic in
Manufacturing is the use of machines, tools and labor to produce goods for use or sale. The term may refer to a range of human activity, from handicraft to high tech, but is most commonly applied to industrial production, in which raw materials are transformed into finished goods on a large scale. (Wikipedia.org)






Conferences related to Manufacturing

Back to Top

2018 IEEE Symposium on VLSI Technology

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2020 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2016 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2014 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2012 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2011 Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2010 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2009 IEEE Symposium on VLSI Technology

    - New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D-system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices

  • 2008 IEEE Symposium on VLSI Technology

  • 2007 IEEE Symposium on VLSI Technology

  • 2006 IEEE Symposium on VLSI Technology


2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2017 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2021 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2015 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2007 IEEE International Electron Devices Meeting (IEDM)

  • 2006 IEEE International Electron Devices Meeting (IEDM)


2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.

  • 2008 8th IEEE Conference on Nanotechnology (IEEE-NANO)

    This conference is the sequel to meetings held in Maui (2001), Washington (2002), San Francisco (2003), Munich (2004), Nagoya (2005), Cinncinati (2006), and Hong Kong (2007). The conference focus will be on engineering and business issues related to nanoelectronics, circuits, architectures, sensor systems, integration, reliability and manufacturing in addition to fundamental issues such as modeling, growth/synthesis, and characterization. The conference will feature plenary, invited, and contributed papers


2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

Control Systems & ApplicationsPower ElectronicsSignal Processing & Computational IntelligenceRobotics & MechatronicsSensors, Actuators & System IntegrationElectrical Machines & DrivesFactory Automation & Industrial InformaticsEmerging Technologies

  • 2012 IEEE 21st International Symposium on Industrial Electronics (ISIE)

    IEEE-ISIE is the largest summer conference of the IEEE Industrial Electronics Society, which is an international forum for presentation and discussion of the state of art in Industrial Electronics and related areas.

  • 2011 IEEE 20th International Symposium on Industrial Electronics (ISIE)

    Industrial electronics, power electronics, power converters, electrical machines and drives, signal processing, computational intelligence, mechatronics, robotics, telecommuniction, power systems, renewable energy, factory automation, industrial informatics.

  • 2010 IEEE International Symposium on Industrial Electronics (ISIE 2010)

    Application of electronics and electrical sciences for the enhancement of industrial and manufacturing processes. Latest developments in intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics.

  • 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009)

    The purpose of the IEEE international conference is to provide a forum for presentation and discussion of the state-of art of Industrial Electronics and related areas.


More Conferences

Periodicals related to Manufacturing

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


More Periodicals

Most published Xplore authors for Manufacturing

Back to Top

Xplore Articles related to Manufacturing

Back to Top

Axial-Field Electrical Machines - Design and Applications

C. C. Chan IEEE Transactions on Energy Conversion, 1987

Axial-field electrical machines offer an alternative to the conventional machines. In the axial-field machine, the airgap flux is axial in direction and the active current carrying conductors are radially positioned. This paper presents the design characteristics, special features, manufacturing aspects and potential applications for axial-field electrical machines. The experimental results from several prototypes, including d.c. machines, synchronous machines and single-phase ...


Performance of five and six block coil geometries in short superconducting dipole models for the LHC

N. Andreev; K. Artoos; L. Bottura; F. Rodriguez-Mateos; S. Russenschuck; N. Sigel; A. Siemko; F. Sonnemann; D. Tommasini; I. Vanenkov Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366), 1999

A series of similar one meter long superconducting dipole models for the LHC is being manufactured and tested since 1995 for exploring design variants and assembly parameters. Until the end of 1997 all magnets of this series were based on a coil geometry subdividing the conductors in five distinctive winding blocks. In order to cope with new requirements of magnetic ...


Decentralized feedback control of a line of manufacturing machines

Alexander Y. Pogromsky; Boris Andrievsky; Antoinette G. N. Kommer; Jacobus E. Rooda 2009 35th Annual Conference of IEEE Industrial Electronics, 2009

The decentralized feedback control strategy of a line of manufacturing machines is proposed and studied both in continuous-domain and in discrete- event representation. The illustrating example for a line of four machines is presented, showing desired system performance for various conditions.


[Front and back cover]

2010 International Conference on Future Information Technology and Management Engineering, 2010

The following topics are dealt with: artificial intelligence; machine learning; CRM; decision support system; distributed system; database management; e-business; e-commerce; e-learning; enterprise information system; environmental technology management; global production network; green technology; health informatics; human resource management; manufacturing system technology; renewable resource; intellectual property; knowledge management; data mining; new product development; innovation management; security management; ontology management; quality management; supply ...


Modeling and Control of a Manufacturing Flow Line Using Partial Differential Equations

Roel van den Berg; Erjen Lefeber; Koos Rooda IEEE Transactions on Control Systems Technology, 2008

This brief deals with a control framework for manufacturing flow lines. For this framework, a continuous approximation model of the manufacturing system is required, which is computationally feasible and able to accurately describe the dynamics of the system (both throughput and flow time). Often used models, such as discrete-event models and flow models, fail to meet these specifications: the use ...


More Xplore Articles

Educational Resources on Manufacturing

Back to Top

eLearning

Axial-Field Electrical Machines - Design and Applications

C. C. Chan IEEE Transactions on Energy Conversion, 1987

Axial-field electrical machines offer an alternative to the conventional machines. In the axial-field machine, the airgap flux is axial in direction and the active current carrying conductors are radially positioned. This paper presents the design characteristics, special features, manufacturing aspects and potential applications for axial-field electrical machines. The experimental results from several prototypes, including d.c. machines, synchronous machines and single-phase ...


Performance of five and six block coil geometries in short superconducting dipole models for the LHC

N. Andreev; K. Artoos; L. Bottura; F. Rodriguez-Mateos; S. Russenschuck; N. Sigel; A. Siemko; F. Sonnemann; D. Tommasini; I. Vanenkov Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366), 1999

A series of similar one meter long superconducting dipole models for the LHC is being manufactured and tested since 1995 for exploring design variants and assembly parameters. Until the end of 1997 all magnets of this series were based on a coil geometry subdividing the conductors in five distinctive winding blocks. In order to cope with new requirements of magnetic ...


Decentralized feedback control of a line of manufacturing machines

Alexander Y. Pogromsky; Boris Andrievsky; Antoinette G. N. Kommer; Jacobus E. Rooda 2009 35th Annual Conference of IEEE Industrial Electronics, 2009

The decentralized feedback control strategy of a line of manufacturing machines is proposed and studied both in continuous-domain and in discrete- event representation. The illustrating example for a line of four machines is presented, showing desired system performance for various conditions.


[Front and back cover]

2010 International Conference on Future Information Technology and Management Engineering, 2010

The following topics are dealt with: artificial intelligence; machine learning; CRM; decision support system; distributed system; database management; e-business; e-commerce; e-learning; enterprise information system; environmental technology management; global production network; green technology; health informatics; human resource management; manufacturing system technology; renewable resource; intellectual property; knowledge management; data mining; new product development; innovation management; security management; ontology management; quality management; supply ...


Modeling and Control of a Manufacturing Flow Line Using Partial Differential Equations

Roel van den Berg; Erjen Lefeber; Koos Rooda IEEE Transactions on Control Systems Technology, 2008

This brief deals with a control framework for manufacturing flow lines. For this framework, a continuous approximation model of the manufacturing system is required, which is computationally feasible and able to accurately describe the dynamics of the system (both throughput and flow time). Often used models, such as discrete-event models and flow models, fail to meet these specifications: the use ...


More eLearning Resources

IEEE.tv Videos

IMS 2011 Microapps - Volume Manufacturing Trends for Automotive Radar Devices
U.S. Department of Energy Advanced Manufacturing Overview - Dev Shenoy: 2016 International Conference on Rebooting Computing
Care Innovations: Toxics In Electronics (com legendas em portugues)
Niobium Manufacturing for Superconductivity - ASC-2014 Plenary series - 5 of 13 - Tuesday 2014/8/12
Integrated Photonics Manufacturing Initiative - Michael Liehr Plenary from the 2016 IEEE Photonics Conference
All You Wanted to Know About Chinese Manufacturing But Were Afraid to Ask
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
2013 IEEE Robert N. Noyce Medal
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
Care Innovations: Green Engineering (com legendas em portugues)
DROP: The Durable Reconnaissance and Observation Platform
Care Innovations: Responsibility For Being Green (com legendas em portugues)
2011 IEEE Awards Ernst Weber Engineering Leadership Recognition - Tze-Chiang Chen
Cafe: Cloud Appliances for Enterprises
Sir James Dyson receives the IEEE Honorary Membership - Honors Ceremony 2017
2013 IEEE Jun-Ichi Nishizawa Medal
Kaizad Mistry of Intel accepts the IEEE Corporate Innovation Award - Honors Ceremony 2016
2013 IEEE Corporate Innovation Award
New paradigm in Power Measurements for Satellite Thermal Vacuum Test: MicroApps 2015 - Keysight Technologies
Micro-Apps 2013: How to Make Your Designs More Robust

IEEE-USA E-Books

  • Implementation

    The Tenth International Conference on Logic Programming, sponsored by the Association for Logic Programming, is a major forum for presentations of research, applications, and implementations in this important area of computer science. Logic programming is one of the most promising steps toward declarative programming and forms the theoretical basis of the programming language Prolog and it svarious extensions. Logic programming is also fundamental to work in artificial intelligence, where it has been used for nonmonotonic and commonsense reasoning, expert systems implementation, deductive databases, and applications such as computer-aided manufacturing.David S. Warren is Professor of Computer Science at the State University of New York, Stony Brook.Topics covered: Theory and Foundations. Programming Methodologies and Tools. Meta and Higher-order Programming. Parallelism. Concurrency. Deductive Databases. Implementations and Architectures. Applications. Artificial Intelligence. Constraints. Partial Deduction. Bottom-Up Evaluation. Compilation Techniques.

  • An Environment for Simulating Kinematic Self-Replicating Machines

    A simulation framework is described in which a collection of particles moving in continuous two-dimensional space can be put together to build machines. A self replicating machine has been designed in this environment. lt is proposed that an environment such as this may facilitate the fabrication of self- replicating manufacturing systems.

  • Thermionic Integrated Micromodules: TIMMS

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

  • FEDERAL AND STATE INCENTIVES HEIGHTEN CONSUMER INTEREST IN ELECTRIC VEHICLES

    Since mid¿¿?1970s, the federal government has provided funding for research into battery and vehicle technologies that could provide an alternative to the gasoline¿¿?powered engine. Federal tax credits for purchasing an electric vehicle, grants and loans to vehicle and parts manufacturers, and greenhouse gas (GHG) regulations have contributed to the evolution of federal support for electric vehicles. Despite major advancements in electric vehicles in the past 40 years, one factor remains elusive: a safe, inexpensive, high energy density battery. The federal role in seeking such a battery technology supplements similar research by domestic (and foreign) automakers. This chapter reviews federal and state efforts to the advance the U.S. electric vehicle and vehicle battery industries. It also reviews government efforts to spur interest in a range of electric vehicles, including hybrid electric vehicles (HEVs), plug¿¿?in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), extended range electric vehicles (EREVs), fuel cell electric vehicles (FCEVs).

  • Metallizations for Semiconductor Devices

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

  • APPLAUSE: Applications Using the ElipSys Parallel CLP System

    This chapter contains sections titled: Introduction, Manufacturing Planning: Dassault Aviation, Tourist Advisory Systems: Expert Systems International & the University of Athens, Molecular Biology: Imperial Cancer Research Fund, Environmental Monitoring and Control: Systems & Management, Acknowledgements,

  • Factories of the Future

    This chapter contains sections titled: Here Comes the Automatic Factory, The Robots Have Arrived, Computer-Aided Design and Manufacturing, Flexible Manufacturing Systems, Japan's Productivity Challenge to America and Europe, Factory Automation: Vision and Reality

  • No title

    High-Speed Digital System Design bridges the gap from theory to implementation in the real world. Systems with clock speeds in low megahertz range qualify for high-speed. Proper design results in quality digital transmissions and lowers the chance for errors. This book is for computer and electrical engineers who may or may not have learned electromagnetic theory. The presentation style allows readers to quickly begin designing their own high- speed systems and diagnosing existing designs for errors. After studying this book, readers will be able to: Design the power distribution system for a printed circuit board to minimize noise Plan the layers of a PCB for signals, power, and ground to maximize signal quality and minimize noise Include test structures in the printed circuit board to easily diagnose manufacturing mistakes Choose the best PCB design parameters such a trace width, height,and routed path to ensure the most stable characteristic impedance Determine the correct terminati n to minimize reflections Predict the delay caused by a given PCB trace Minimize driver power consumption using AC terminations Compensate for discontinuities along a PCB trace Use pre-emphasis and equalization techniques to counteract lossy transmission lines Determine the amount of crosstalk between two traces Diagnose existing PCBs to determine the sources of errors

  • Index

    High-performance message-based supercomputers have only recently emerged from the research laboratory. The commercial manufacturing of such products as the Intel iPSC, the Ametek s/14, the NCUBE/ten, and the FPS T Series - all based on multicomputer network technology - has sparked lively interest in high- performance computation, and particularly in the message-passing paradigm for parallel computation.This book makes readily available information on many aspects of the design and use of multicomputer networks, including machine organization, system software, and application programs. It provides an introduction to the field for students and researchers and a survey of important recent results for practicing engineers. The emphasis throughout is on design principles and techniques; however, there are also descriptions and comparison of research and commercial machines and case studies of specific applications.Multicomputer Networks covers such major design areas as communication hardware, operating systems, fault tolerance, algorithms, and the selection of network topologies. The authors present results in each of these areas, emphasizing analytic models of interconnection networks, VLSI constraints and communication, communication paradigms and hardware support, multicomputer operating systems, and applications for distributed simulation and for partial differential equations. They survey the hardware designs and the available software and present a comparative performance study of existing machines.

  • Program Synthesis

    The Tenth International Conference on Logic Programming, sponsored by the Association for Logic Programming, is a major forum for presentations of research, applications, and implementations in this important area of computer science. Logic programming is one of the most promising steps toward declarative programming and forms the theoretical basis of the programming language Prolog and it svarious extensions. Logic programming is also fundamental to work in artificial intelligence, where it has been used for nonmonotonic and commonsense reasoning, expert systems implementation, deductive databases, and applications such as computer-aided manufacturing.David S. Warren is Professor of Computer Science at the State University of New York, Stony Brook.Topics covered: Theory and Foundations. Programming Methodologies and Tools. Meta and Higher-order Programming. Parallelism. Concurrency. Deductive Databases. Implementations and Architectures. Applications. Artificial Intelligence. Constraints. Partial Deduction. Bottom-Up Evaluation. Compilation Techniques.



Standards related to Manufacturing

Back to Top

IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Ethylene-Propylene Rubber Insulation

This recommended practice establishes requirements for three-conductor new round-and-flat-type oil-well cables used in supplying three-phase ac electric power to submersible pump motors. The three major cables by components are copper conductors, ethylene-propylene diene monomer (EPDM) insulation, nitrile jacket and galvanized armor.


IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Polypropylene Insulation

This recommended practice establishes requirements for three-conductor round and flat type oil well cable used in supplying three-phase ac electric power to submersible pump motors. The major cable components are copper conductors, polypropylene insulation, polymeric jacket and galvanized armor.


IEEE Standard for Receiver Fixture Interface



Jobs related to Manufacturing

Back to Top