Manufacturing

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Manufacturing is the use of machines, tools and labor to produce goods for use or sale. The term may refer to a range of human activity, from handicraft to high tech, but is most commonly applied to industrial production, in which raw materials are transformed into finished goods on a large scale. (Wikipedia.org)






Conferences related to Manufacturing

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2017 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2021 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2015 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2007 IEEE International Electron Devices Meeting (IEDM)

  • 2006 IEEE International Electron Devices Meeting (IEDM)


2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)


2016 IEEE Symposium on VLSI Technology

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2020 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2018 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2014 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

  • 2012 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2011 Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2010 IEEE Symposium on VLSI Technology

    New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices -

  • 2009 IEEE Symposium on VLSI Technology

    - New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D-system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices

  • 2008 IEEE Symposium on VLSI Technology

  • 2007 IEEE Symposium on VLSI Technology

  • 2006 IEEE Symposium on VLSI Technology


2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.

  • 2008 8th IEEE Conference on Nanotechnology (IEEE-NANO)

    This conference is the sequel to meetings held in Maui (2001), Washington (2002), San Francisco (2003), Munich (2004), Nagoya (2005), Cinncinati (2006), and Hong Kong (2007). The conference focus will be on engineering and business issues related to nanoelectronics, circuits, architectures, sensor systems, integration, reliability and manufacturing in addition to fundamental issues such as modeling, growth/synthesis, and characterization. The conference will feature plenary, invited, and contributed papers


2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

Control Systems & ApplicationsPower ElectronicsSignal Processing & Computational IntelligenceRobotics & MechatronicsSensors, Actuators & System IntegrationElectrical Machines & DrivesFactory Automation & Industrial InformaticsEmerging Technologies

  • 2012 IEEE 21st International Symposium on Industrial Electronics (ISIE)

    IEEE-ISIE is the largest summer conference of the IEEE Industrial Electronics Society, which is an international forum for presentation and discussion of the state of art in Industrial Electronics and related areas.

  • 2011 IEEE 20th International Symposium on Industrial Electronics (ISIE)

    Industrial electronics, power electronics, power converters, electrical machines and drives, signal processing, computational intelligence, mechatronics, robotics, telecommuniction, power systems, renewable energy, factory automation, industrial informatics.

  • 2010 IEEE International Symposium on Industrial Electronics (ISIE 2010)

    Application of electronics and electrical sciences for the enhancement of industrial and manufacturing processes. Latest developments in intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics.

  • 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009)

    The purpose of the IEEE international conference is to provide a forum for presentation and discussion of the state-of art of Industrial Electronics and related areas.


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Periodicals related to Manufacturing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Manufacturing

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Xplore Articles related to Manufacturing

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A toolbox of garment handling techniques

P. M. Taylor Intelligent Automation for Processing Non-Rigid Products, IEE Colloquium on, 1994

Garment manufacturing remains one of the largest labour intensive manufacturing industries. Hard automation is generally not feasible because of the wide range of styles, sizes and fabrics used in clothing, all of which are subject to the whims of fashion. The threat of competition from low labour cost countries has given rise to a number of research programmes in the ...


Position servo control of the slider in double toggle mechanical press using Bezier curve model and fuzzy control

Jia Xie; Shengdun Zhao; Zhenghui Sha; Jintao Liang Automation Science and Engineering (CASE), 2011 IEEE Conference on, 2011

Servo press is more flexible for forming process than conventional press. The position control of the slider is the key technique in the servo presses. In order to achieve an excellent position control performance of the slider, a position servo control strategy of the slider in a servo press - double toggle mechanical press is proposed in this paper. The ...


Engineering foundation

Journal of the American Institute of Electrical Engineers, 1920

None


An IGBT behavioural model based on curve fitting methods

I. Baraia; J. Galarza; J. A. Barrena; J. M. Canales 2008 IEEE Power Electronics Specialists Conference, 2008

In this paper a simple behavioural IGBT model is proposed. Most of the needed parameters to characterise the model (static curves, leakage currents, etc) are available in the data sheets provided by the manufacturers. Curve fitting methods have been used to approach this model to the data sheets values. Other parameters like the interelectrode capacitances and the internal gate resistor ...


Multilevel Lasso applied to Virtual Metrology in semiconductor manufacturing

Simone Pampuri; Andrea Schirru; Giuseppe Fazio; Giuseppe De Nicolao Automation Science and Engineering (CASE), 2011 IEEE Conference on, 2011

In semiconductor manufacturing, the state of the art for wafer quality control is based on product monitoring and feedback control loops; the related metrology operations, that usually involve scanning electron microscopes, are particularly cost-intensive and time-consuming. It is therefore not possible to evaluate every wafer: commonly, a small subset of a productive lot is measured at the metrology station and ...


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Educational Resources on Manufacturing

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eLearning

A Sub-1W to 2W Low-Power IA Processor for Mobile Internet Devices and Ultra-Mobile PCs in 45nm Hi-Κ Metal Gate CMOS

Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International, 2008

This paper describes a low-power Intel* Architecture (IA) processor specifically designed for Mobile Internet Devices (MID) and Ultra- Mobile PCs (UMPC) where average power consumed is in the order of a few hundred mW (as measured by MobileMark'05 OP @ 60 nits brightness) with performance similar to mainstream Ultra-Mobile PCs. The design consists of an in-order pipeline capable of issuing ...


Contactless testing of printed wiring boards

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00763421.png)


Real-Time Demosaicking for Embedded Systems

Consumer Electronics, 2007. ICCE 2007. Digest of Technical Papers. International Conference on, 2007

We present an effective and efficient demosaicking algorithm for natural images. A new reciprocal table accurately estimates the relation between edges and gradient weights, and it achieves regular, succinct, and fast operations with excellent performance. Flexible and optional procedures adapt to different constraints on embedded systems. Our proposed method has 10.94 dB, 9.14 dB, and 9.05 dB improvements over bilinear ...


Quality, standards and survival

Manufacturing Engineer, 1997

If continuous improvement is such a good thing, why do small companies still shun it in droves? The author looks at the obstacles that small businesses perceive when they think about total quality management (TQM). To investigate the perception of quality within the British engineering base, the study looked at a attitudes to TQM issues 42 small and medium size ...


Effects of neutron irradiation on Nd-Fe-B magnetic properties

Magnetics, IEEE Transactions on, 1988

Nd-Fe-B permanent magnets from two different manufacturers were irradiated in the Omega West reactor at Los Alamos National Laboratory, with fast neutrons at temperatures of 426 K (153 degrees C) and 350 K (77 degrees C) to fluences of 5.0*1016 N/cm2 and 6.1*1016 N/cm2, respectively. At intervals during the irradiation the samples were removed from the reactor and the remanence ...


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IEEE-USA E-Books

  • Appendix F: Factors for Constructing Variables Control Charts

    No abstract.

  • Index

    No abstract.

  • Overview

    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). _The Accelerated Stress Testing Handbook_ delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: * Theoretical basi for AST * General AST best practices * AST design and manufacturing processes * AST equipment and techniques * AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.

  • Synthetic Aesthetics

    Synthetic biology manipulates the stuff of life. For synthetic biologists, living matter is programmable material. In search of carbon-neutral fuels, sustainable manufacturing techniques, and innovative drugs, these researchers aim to redesign existing organisms and even construct completely novel biological entities. Some synthetic biologists see themselves as designers, inventing new products and applications. But if biology is viewed as a malleable, engineerable, designable medium, what is the role of design and how will its values apply?In this book, synthetic biologists, artists, designers, and social scientists investigate synthetic biology and design. After chapters that introduce the science and set the terms of the discussion, the book follows six boundary-crossing collaborations between artists and designers and synthetic biologists from around the world, helping us understand what it might mean to 'design nature.' These collaborations have resulted in biological computers that calculate form; speculative packaging that builds its own contents; algae that feeds on circuit boards; and a sampling of human cheeses. They raise intriguing questions about the scientific process, the delegation of creativity, our relationship to designed matter, and, the importance of critical engagement. Should these projects be considered art, design, synthetic biology, or something else altogether?Synthetic biology is driven by its potential; some of these projects are fictions, beyond the current capabilities of the technology. Yet even as fictions, they help illuminate, question, and even shape the future of the field.

  • Fabrication Examples based on Standard CMOS and MEMS Processes

    This chapter contains sections titled: The Need for Infrastructures Integrated Circuit Manufacturing at CMP Micro - Electromechanical Systems Manufacturing at CMP Other Major Infrastructures ICs and Micro - Electromechanical Systems for Biomedical Applications Conclusions References

  • Appendixes F: ITUT Recommendation Titles

    "This comprehensive book, which provides a succinct-as-possible glossary of the plethora of terms commonly used in communications, is destined to become an indispensable desk-side reference for engineers and others working in the area." - Curtis Siller, Lucent Technologies Are you sometimes overwhelmed by the overabundance of jargon encountered in technical books and articles? Hargrave's Communications Dictionary is a treasure of simplified communications terms, definitions, acronyms, charts, equations, and a wealth of related information amassed over the author's extensive engineering career. From ATM to Zone Paging, this volume includes over ten thousand definitions of key phrases that readers in industry, government, and academia need to understand. Many definitions incorporate basic tools for problem solving not found in other publications-such as drawings, graphs, charts, and references to IEEE standards. Real-world examples associated with voice and data communications are also included, as well as terminology from peripheral disciplines, including optics, computer science, data networks, and the Internet. Hargrave's Communications Dictionary is a fundamental resource for basic to intermediate-level students and practitioners, and is an essential quick reference for more experienced electronic technicians and engineers. This comprehensive dictionary is also an invaluable text for technical schools and universities. About the Author Frank Hargrave has more than 30 years experience in engineering and manufacturing at several major companies, including Multitech, Inc., ITT, and Yale Security, Inc. He is published in a variety of topics, including active filter design, residential telemetry systems, thermal compensation methods in electronic circuits, and telephone line interface methods. Mr. Hargrave currently runs his own consulting business in Charlotte, NC, where he also teaches classes at the Electronic Computer & Programming Institute. He has been issued 12 U.S. patents and has several others disclosed and in process.

  • Power Cables

    This chapter contains sections titled: Introduction Configurations Design Analysis Challenges Manufacturing Issues Prototypes Summary References

  • Security Management

    "Meet the challenge of protecting your telecommunications network management system with SECURITY FOR TELECOMMUNICATIONS NETWORK MANAGEMENT. Leading expert Moshe Rozenblit explains pertinent security-related features to use in your products and offers practical solutions to enable you to plan, implement, and manage the evolution of your network security mechanisms and to better manage security components from several suppliers to ensure overall security of your network management. This book provides a comprehensive discussion of security for telecommunications network management including these featured topics: * Overview of network management for security professionals * Introduction to security mechanisms for network managers * A complete account of OSI-based security management * In-depth analysis of security operations for telecommunications networks * Insights into how to integrate security of network management, management of security-related information, and network operations * The latest security for all standard protocols used in network management: CMIP, CORBA, EDI, and SNMP * Astute comparison of security options and their tradeoffs. SECURITY FOR TELECOMMUNICATIONS NETWORK MANAGEMENT is intended to assist network architects, operations planners, system designers, software engineers, and operation systems developers in understanding and addressing the security implications of the telecommunications network (TMN) in the telecommunications industry, as well as in finance, large manufacturing, military, and government environments."

  • Circuit Analysis and Optimization Driven by WorstCase Distances

    In this paper, a new methodology for integrated circuit design considering the inevitable manufacturing and operating tolerances is presented. It is based on a new concept for specification analyse that provides exact worst-case transistor model parameters and exact worst-case operating conditions. Corresponding worst-case distances provide a key measure for the performance, the yield, and the robustness of a circuit A new deterministic method for parametric circuit design that is based on worst-case distances is presented: It comprises nominal design, worst-case analysis, yield optimization, and design centering. In contrast to current approaches, it uses standard circuit simulators and at the same time considers deterministic design parameters of integrated circuits at reasonable computational costs. The most serious disadvantage of geometric approaches to design centering is eliminated, as the method's complexity increases only linearly with the number of design variables.

  • Appendixes G: Internet RFCs

    "This comprehensive book, which provides a succinct-as-possible glossary of the plethora of terms commonly used in communications, is destined to become an indispensable desk-side reference for engineers and others working in the area." - Curtis Siller, Lucent Technologies Are you sometimes overwhelmed by the overabundance of jargon encountered in technical books and articles? Hargrave's Communications Dictionary is a treasure of simplified communications terms, definitions, acronyms, charts, equations, and a wealth of related information amassed over the author's extensive engineering career. From ATM to Zone Paging, this volume includes over ten thousand definitions of key phrases that readers in industry, government, and academia need to understand. Many definitions incorporate basic tools for problem solving not found in other publications-such as drawings, graphs, charts, and references to IEEE standards. Real-world examples associated with voice and data communications are also included, as well as terminology from peripheral disciplines, including optics, computer science, data networks, and the Internet. Hargrave's Communications Dictionary is a fundamental resource for basic to intermediate-level students and practitioners, and is an essential quick reference for more experienced electronic technicians and engineers. This comprehensive dictionary is also an invaluable text for technical schools and universities. About the Author Frank Hargrave has more than 30 years experience in engineering and manufacturing at several major companies, including Multitech, Inc., ITT, and Yale Security, Inc. He is published in a variety of topics, including active filter design, residential telemetry systems, thermal compensation methods in electronic circuits, and telephone line interface methods. Mr. Hargrave currently runs his own consulting business in Charlotte, NC, where he also teaches classes at the Electronic Computer & Programming Institute. He has been issued 12 U.S. patents and has several others disclosed and in process.



Standards related to Manufacturing

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IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Ethylene-Propylene Rubber Insulation

This recommended practice establishes requirements for three-conductor new round-and-flat-type oil-well cables used in supplying three-phase ac electric power to submersible pump motors. The three major cables by components are copper conductors, ethylene-propylene diene monomer (EPDM) insulation, nitrile jacket and galvanized armor.


IEEE Recommended Practice for Specifying Electric Submersible Pump Cable - Polypropylene Insulation

This recommended practice establishes requirements for three-conductor round and flat type oil well cable used in supplying three-phase ac electric power to submersible pump motors. The major cable components are copper conductors, polypropylene insulation, polymeric jacket and galvanized armor.


IEEE Standard for Receiver Fixture Interface



Jobs related to Manufacturing

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